CN113873774B - Horizontal copper deposition device for manufacturing printed circuit board - Google Patents
Horizontal copper deposition device for manufacturing printed circuit board Download PDFInfo
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- CN113873774B CN113873774B CN202111082928.5A CN202111082928A CN113873774B CN 113873774 B CN113873774 B CN 113873774B CN 202111082928 A CN202111082928 A CN 202111082928A CN 113873774 B CN113873774 B CN 113873774B
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- horizontal copper
- printed circuit
- circuit board
- barrel
- copper deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of printed circuit board manufacturing, in particular to a horizontal copper deposition device for manufacturing a printed circuit board, which comprises a horizontal copper deposition liquid tank, wherein a liquid suction pipe is arranged at the bottom of the horizontal copper deposition liquid tank, one end of the liquid suction pipe, which is far away from the horizontal copper deposition liquid tank, is connected with a liquid inlet end of a circulating pump, a liquid outlet end of the circulating pump is provided with a liquid delivery pipe, one end of the liquid delivery pipe, which is far away from the circulating pump, extends to the lower part position in a cylinder body, the upper end of the cylinder body is in an opening shape and is fixedly connected with a horn mouth with a wide upper part and a narrow lower part, a conical cover with a wide upper part and a narrow lower part is sleeved on the horn mouth, a floating plate capable of sliding up and down along the cylinder body is sleeved on the cylinder body, and thick vinylon cloth blocks are paved on the floating plate. The method prevents bubbles from being generated due to too high backflow speed of the horizontal copper deposition liquid, reduces the influence on the horizontal copper deposition processing effect of the printed circuit board to the maximum extent, and reduces the reject ratio of the printed circuit board.
Description
Technical Field
The invention relates to a horizontal copper deposition device for manufacturing a printed circuit board, and belongs to the technical field of manufacturing of printed circuit boards.
Background
The horizontal copper deposition process is widely used in the production and processing of printed circuit boards, and is mainly aimed at depositing a layer of copper on a non-conductive substrate by a series of chemical treatment methods, and then thickening the non-conductive substrate by a subsequent electroplating method to achieve a designed specific thickness. At present, in order to fully contact the horizontal copper deposition liquid with the printed circuit board, a circulating pump is often utilized to circulate the horizontal copper deposition liquid in the horizontal copper deposition liquid tank, but the horizontal copper deposition liquid flowing into the horizontal copper deposition liquid tank again is easy to generate bubbles in the horizontal copper deposition liquid tank due to the large flow velocity, thereby influencing the effect of horizontal copper deposition processing of the printed circuit board and increasing the reject ratio of the printed circuit board.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a horizontal copper deposition device for manufacturing a printed circuit board so as to solve the problems in the prior art.
In order to achieve the above object, the present invention is realized by the following technical scheme: the utility model provides a horizontal copper deposition device of printed circuit board preparation, includes horizontal copper deposition cistern, the drawing liquid pipe is installed to horizontal copper deposition cistern bottom, the circulating pump feed liquor end is connected to the one end that the drawing liquid pipe kept away from horizontal copper deposition cistern, the transfer line is installed to the circulating pump feed liquor end, the transfer line is kept away from the one end of circulating pump and is extended to the barrel interior lower part position, barrel diameter is greater than the diameter of transfer line and vertical arrangement in horizontal copper deposition cistern, the barrel upper end is wide down narrow horn mouth in opening form and fixedly connected with, the cover is equipped with wide taper cover in upper and lower narrow, taper cover and barrel fixed connection, taper cover upper end is closed form and taper cover tip and barrel surface have the clearance that is used for horizontal copper deposition to flow, the cover is equipped with the kickboard that can slide from top to bottom along the barrel on the barrel, thick vinylon the kickboard has laid thick vinylon the piece cover is established on the barrel.
Specifically, barrel surface fixedly connected with is followed barrel length direction and is arranged spacing, the kickboard is disc hollow structure, first spacing groove with spacing matched with is seted up to kickboard internal surface, thick vinylon piece is disc hollow structure, thick vinylon piece internal surface processing has the second spacing groove that coincides with first spacing groove, spacing runs through first spacing groove, second spacing groove.
Specifically, three first round holes are formed in the upper surface of the floating plate at equal intervals, three second round holes which are coincident with the first round holes are formed in the upper surface of the thick vinylon cloth at equal intervals, an upper sleeve is fixed in the first round holes, the lower end of the upper sleeve is in an opening shape, the upper end of the upper sleeve penetrates through the second round holes to extend to the upper side of the thick vinylon cloth, the lower end of the upper sleeve extends to the lower side of the floating plate and is provided with external threads, the lower end of the upper sleeve is in threaded connection with a lower sleeve, the lower end of the lower sleeve is in a closed shape, and internal threads matched with the external threads are formed in the inner surface of the lower sleeve.
Specifically, the upper surface of the upper cylinder sleeve is fixedly connected with a vent pipe fixedly connected with the upper cylinder sleeve, and the upper end of the vent pipe is connected with a threaded cover in a threaded manner.
Specifically, lower barrel casing open end fixedly connected with seal cover, the seal cover is established on last barrel casing, the seal cover is facing down the one side of barrel casing evenly is fixed with a plurality of round pin poles, down the barrel casing facing the one side of seal cover evenly offered a plurality of with round pin pole matched with pinhole, the round pin pole is fixed in the pinhole.
Specifically, the middle position of the inner top of the conical cover is fixedly connected with a vertically arranged stud, the stud is connected with a threaded sleeve in a threaded manner, the threaded sleeve is arranged in the cylinder body, two supporting rods are symmetrically and fixedly connected to the outer surface of the threaded sleeve, and one end of each supporting rod, far away from the threaded sleeve, is fixedly connected with the inner wall of the cylinder body.
Specifically, lower part position is equipped with the annular expansion pipe that the volume is expandable in the toper cover, the expansion pipe pastes with the toper cover mutually, the expansion pipe surface links to each other with the connecting pipe and communicates with each other, the one end that the expansion pipe was kept away from to the connecting pipe links to each other with the inflator and communicates with each other, the inflator is vertical form and arranges and the one end fixedly connected with connecting rod that the connecting pipe was kept away from to the inflator surface, the one end that the connecting rod kept away from the inflator and toper cover fixed connection, slidable mounting has the piston in the inflator, the screw rod is installed to piston upper surface middle part position, the screw rod upper end extends to the inflator upside and with inflator threaded connection.
Specifically, one end of the infusion tube at the bottom in the cylinder body is connected and communicated with the cylinder for dispersing the horizontal copper precipitation solution, both ends of the cylinder are closed, and a plurality of liquid outlet holes are uniformly formed in the outer surface of the cylinder.
Specifically, the bottom of horizontal heavy copper cistern is opening form and fixedly connected with upper width and lower narrow dovetail groove, the both sides of dovetail groove all are equipped with two vertical layout's extension board, the extension board back is away from the one side lower part edge fixedly connected with foraminiferous bottom plate of dovetail groove, a plurality of weight-reducing mouths have evenly been seted up to the extension board towards the one side of dovetail groove, the fluid-discharge tube is installed to dovetail groove one side lower part position, the fluid-discharge valve is installed to the one end that the dovetail groove was kept away from to the fluid-discharge tube.
The invention has the beneficial effects that:
1. according to the horizontal copper precipitation device for manufacturing the printed circuit board, when the horizontal copper precipitation liquid in the infusion tube flows into the tube body under the action of the circulating pump, the diameter of the tube body is larger than that of the infusion tube, so that the purpose of slowing down the flow rate of the horizontal copper precipitation liquid in the first step is achieved, the horizontal copper precipitation liquid overflows from the horn mouth along with the increase of the horizontal copper precipitation liquid in the tube body, and under the action of the horn mouth, the horizontal copper precipitation liquid falls into the inner surface of the conical cover, then flows downwards along the outer wall of the tube body, the purpose of slowing down the flow rate of the horizontal copper precipitation liquid in the second step is achieved, the horizontal copper precipitation liquid flowing along the tube body is permeated into the thick vinylon cloth after being contacted with the thick vinylon cloth, the purpose of slowing down the flow in the third step is achieved, then the horizontal copper precipitation liquid flows back into the horizontal copper precipitation liquid groove from the thick vinylon cloth at a small flow rate, bubbles are prevented from being generated due to the too fast backflow speed of the horizontal copper precipitation liquid, the influence on the horizontal copper precipitation effect of the printed circuit board is reduced to the maximum extent, and the reject ratio of the printed circuit board is reduced.
2. According to the horizontal copper precipitation device for manufacturing the printed circuit board, the relative positions of the lower cylinder sleeve and the upper cylinder sleeve are adjusted according to the requirement, and then the volume formed by the upper cylinder sleeve and the lower cylinder sleeve is increased or reduced until half of the thick vinylon cloth is in the horizontal copper precipitation liquid, so that the buoyancy of the floating plate is adjusted, and the thick vinylon cloth can conveniently rise or fall along with the liquid level of the horizontal copper precipitation liquid, even if half of the thick vinylon cloth is immersed in the horizontal copper precipitation liquid.
3. According to the horizontal copper precipitation device manufactured by the printed circuit board, the screw is screwed, and the screw drives the piston to descend or ascend in the air cylinder, so that air in the air cylinder flows into the expansion pipe or air in the expansion pipe flows into the air cylinder, the size of the expansion pipe is adjusted, the purpose of conveniently adjusting the size of a gap between the conical cover and the cylinder is achieved, and the horizontal copper precipitation liquid can flow along the surface of the cylinder.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a horizontal copper deposition device for manufacturing a printed circuit board according to the present invention;
FIG. 2 is an enlarged view of the position A of a horizontal copper deposition device for manufacturing a printed circuit board according to the present invention;
FIG. 3 is a schematic diagram showing the assembly of a circulation pump and a horizontal copper precipitation tank in a horizontal copper precipitation device for manufacturing a printed circuit board according to the present invention;
FIG. 4 is a schematic view showing the assembly of a conical hood and a cylinder in a horizontal copper deposition apparatus for manufacturing a printed circuit board according to the present invention;
FIG. 5 is a schematic diagram showing the assembly of a limiting bar, a bell mouth and a cylinder in a horizontal copper deposition device made of a printed circuit board according to the present invention;
FIG. 6 is a perspective view of a floating plate in a horizontal copper deposition apparatus made of a printed circuit board according to the present invention;
FIG. 7 is a perspective view of a thick vinylon cloth in a horizontal copper sinking apparatus made of a printed circuit board according to the present invention;
FIG. 8 is a perspective view of an upper sleeve in a horizontal copper deposition apparatus made of a printed circuit board according to the present invention;
FIG. 9 is a perspective view of the lower sleeve of the horizontal copper deposition device made of the printed circuit board;
FIG. 10 is a schematic diagram of the assembly of the inflator, expansion tube and conical shield in a horizontal copper deposition apparatus made of a printed circuit board according to the present invention;
in the figure: 1. the device comprises a horizontal copper precipitation liquid tank, 2, a trapezoid groove, 3, a liquid discharge valve, 4, a liquid discharge pipe, 5, a support plate, 6, a bottom plate, 7, a weight reduction port, 8, a liquid conveying pipe, 9, a conical cover, 10, a threaded cover, 11, a vent pipe, 12, an upper cylinder sleeve, 13, a lower cylinder sleeve, 14, a cylinder body, 15, a floating plate, 16, a thick vinylon cloth, 17, a circulating pump, 18, a liquid suction pipe, 19, a stud, 20, a horn mouth, 21, a supporting rod, 22, a threaded sleeve, 23, a limiting strip, 24, a first limiting groove, 25, a first round hole, 26, a second limiting groove, 27, a second round hole, 28, a sealing sleeve, 29, a cylinder, 30, a liquid outlet hole, 31, an expansion pipe, 32, a connecting pipe, 33, a gas cylinder, 34, a piston, 35 and a screw.
Detailed Description
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a horizontal copper deposit device of printed circuit board preparation, includes horizontal copper deposit cistern 1, and the drawing liquid pipe 18 is installed to horizontal copper deposit cistern 1 bottom, and the one end that drawing liquid pipe 18 kept away from horizontal copper deposit cistern 1 is connected circulating pump 17 feed liquor end, and circulating pump 17 goes out the liquid end and installs transfer line 8, and when operating circulating pump 17, under circulating pump 17 work effect, horizontal copper deposit liquid flows into transfer line 8 through drawing liquid pipe 18, and then horizontal copper deposit liquid flows back to in the horizontal copper deposit cistern 1 from transfer line 8.
One end of the infusion tube 8 far away from the circulating pump 17 extends to the lower part of the cylinder 14, the diameter of the cylinder 14 is larger than that of the infusion tube 8 and is vertically arranged in the horizontal copper precipitation tank 1, the upper end of the cylinder 14 is opened and is fixedly connected with a horn mouth 20 with wide upper part and narrow lower part, a conical cover 9 with wide upper part and narrow lower part is sleeved on the horn mouth 20, the conical cover 9 is fixedly connected with the cylinder 14, the upper end of the conical cover 9 is closed, a gap for the horizontal copper precipitation liquid to flow is reserved between the small end of the conical cover 9 and the outer surface of the cylinder 14, a floating plate 15 capable of sliding up and down along the cylinder 14 is sleeved on the cylinder 14, thick vinylon cloth 16 is paved on the floating plate 15, the thick vinylon cloth 16 is sleeved on the cylinder 14, when the horizontal copper precipitation liquid in the infusion tube 8 flows into the cylinder 14 under the action of the circulating pump 17, because the diameter of the cylinder 14 is larger than that of the infusion tube 8, therefore, the purpose of slowing down the flow rate of the horizontal copper deposition liquid in the first step is achieved, along with the increase of the horizontal copper deposition liquid in the cylinder 14, the horizontal copper deposition liquid overflows from the horn mouth 20, and under the action of the horn mouth 20, the horizontal copper deposition liquid falls into the inner surface of the conical cover 9, then the horizontal copper deposition liquid flows downwards along the outer wall of the cylinder 14, the purpose of slowing down the flow rate of the horizontal copper deposition liquid in the second step is achieved, the horizontal copper deposition liquid flowing along the cylinder 14 is in contact with the thick vinylon cloth 16 and then permeates into the thick vinylon cloth 16, the purpose of slowing down the flow in the third step is achieved, then the horizontal copper deposition liquid flows back into the horizontal copper deposition liquid tank 1 from the thick vinylon cloth 16 at a small flow rate, bubbles are prevented from being generated due to the too fast backflow speed of the horizontal copper deposition liquid, the influence on the horizontal copper deposition processing effect of a printed circuit board is reduced to the greatest extent, and the reject ratio of the printed circuit board is reduced.
As an embodiment of the present invention: referring to fig. 2, 5, 6 and 7, the outer surface of the cylinder 14 is fixedly connected with a limiting strip 23 arranged along the length direction of the cylinder 14, the floating plate 15 is of a disc-shaped hollow structure, the inner surface of the floating plate 15 is provided with a first limiting groove 24 matched with the limiting strip 23, the thick vinylon cloth piece 16 is of a disc-shaped hollow structure, and the inner surface of the thick vinylon cloth piece 16 is provided with a second limiting groove 26 overlapped with the first limiting groove 24, so that the limiting strip 23 penetrates through the first limiting groove 24 and the second limiting groove 26, and further the floating plate 15 is prevented from rotating around the cylinder 14.
As an embodiment of the present invention: referring to fig. 1, fig. 2, fig. 6, fig. 7 and fig. 8, three first round holes 25 are formed on the upper surface of the floating plate 15 at equal intervals in an annular shape, three second round holes 27 overlapping with the first round holes 25 are formed on the upper surface of the thick vinylon cloth piece 16 at equal intervals in an annular shape, an upper cylinder sleeve 12 is fixed in the first round holes 25, the lower end of the upper cylinder sleeve 12 is opened, the upper end of the upper cylinder sleeve 12 extends to the upper side of the thick vinylon cloth piece 16 through the second round holes 27, the lower end of the upper cylinder sleeve 12 extends to the lower side of the floating plate 15 and is provided with external threads, the lower end of the upper cylinder sleeve 12 is connected with a lower cylinder sleeve 13 in a threaded manner, the lower end of the lower cylinder sleeve 13 is in a closed shape, internal threads matched with the external threads are formed on the inner surface of the lower cylinder sleeve 13, the relative positions of the lower cylinder sleeve 13 and the upper cylinder sleeve 12 are adjusted according to requirements, and then the volume formed by the upper cylinder sleeve 12 and the lower cylinder sleeve 13 is increased or decreased until the thick vinylon cloth piece 16 is in a horizontal copper bath, the size of the thick vinylon cloth piece 16 is adjusted, the thickness of the floating plate 15 is subjected to the buoyancy of the copper bath, and the copper bath is convenient to dip in the horizontal bath, and the copper bath is immersed in the bath even if the thick vinylon the cloth piece 16.
As an embodiment of the present invention: referring to fig. 1, 2 and 8, the upper surface of the upper sleeve 12 is fixedly connected with a vent pipe 11 fixedly connected with the upper sleeve 12, the upper end of the vent pipe 11 is in threaded connection with a threaded cover 10, and after the threaded cover 10 is removed, air is convenient to enter and exit the space formed by the upper sleeve 12 and the lower sleeve 13 through the vent pipe 11.
As an embodiment of the present invention: referring to fig. 9, the opening end of the lower sleeve 13 is fixedly connected with a sealing sleeve 28, the sealing sleeve 28 is sleeved on the upper sleeve 12, a plurality of pin rods are uniformly fixed on one surface of the sealing sleeve 28 facing the lower sleeve 13, a plurality of pin holes matched with the pin rods are uniformly formed on one surface of the lower sleeve 13 facing the sealing sleeve 28, the pin rods are fixed in the pin holes, the reliability of connection between the sealing sleeve 28 and the lower sleeve 13 is improved, and the sealing sleeve 28 plays a role in preventing horizontal copper precipitation liquid from entering a space formed by the lower sleeve 13 and the upper sleeve 12.
As an embodiment of the present invention: referring to fig. 4, a vertically arranged stud 19 is fixedly connected to the middle position of the inner top of the conical cover 9, a threaded sleeve 22 is connected to the stud 19 in a threaded manner, the threaded sleeve 22 is arranged in the cylinder 14, two struts 21 are symmetrically and fixedly connected to the outer surface of the threaded sleeve 22, one end of each strut 21, which is far away from the threaded sleeve 22, is fixedly connected with the inner wall of the cylinder 14, the stud 19 is screwed into the threaded sleeve 22, connection between the conical cover 9 and the cylinder 14 is completed, and the conical cover 9 is convenient to disassemble and assemble.
As an embodiment of the present invention: referring to fig. 10, an annular expansion tube 31 with an expandable volume is arranged at the lower part in the conical cover 9, the expansion tube 31 is adhered to the conical cover 9, the outer surface of the expansion tube 31 is connected with a connecting tube 32, one end of the connecting tube 32 far away from the expansion tube 31 is connected with an air tube 33, the air tube 33 is vertically arranged, one end of the outer surface of the air tube 33 far away from the connecting tube 32 is fixedly connected with a connecting rod, one end of the connecting rod far away from the air tube 33 is fixedly connected with the conical cover 9, a piston 34 is slidably mounted in the air tube 33, a screw rod 35 is mounted at the middle part of the upper surface of the piston 34, the upper end of the screw rod 35 extends to the upper side of the air tube 33 and is in threaded connection with the air tube 33, the screw rod 35 is screwed, and then the screw rod 35 drives the piston 34 to descend or ascend in the air tube 33, so that air in the air tube 33 flows into the expansion tube 31 or the air tube 31 flows into the air tube 33, the volume of the expansion tube 31 is adjusted, the purpose of conveniently adjusting the size of the gap between the conical cover 9 and the cylinder 14 is achieved, and the horizontal copper deposition solution can flow along the surface of the cylinder 14 is facilitated.
As an embodiment of the present invention: referring to fig. 4, one end of the infusion tube 8 at the bottom of the cylinder 14 is connected and communicated with a cylinder 29 for dispersing the horizontal copper precipitation solution, both ends of the cylinder 29 are closed, a plurality of liquid outlet holes 30 are uniformly formed in the outer surface of the cylinder 29, and the cylinder 29 with the liquid outlet holes 30 is arranged on the infusion tube 8 to uniformly disperse the horizontal copper precipitation solution in the cylinder 14.
As an embodiment of the present invention: referring to fig. 1, the bottom of a horizontal copper precipitation tank 1 is in an opening shape and is fixedly connected with a trapezoid tank 2 with a wide upper part and a narrow lower part, two sides of the trapezoid tank 2 are respectively provided with two support plates 5 which are vertically arranged, a bottom plate 6 with holes is fixedly connected to the edge of the lower part of one surface of the support plates 5, which faces the trapezoid tank 2, a plurality of weight reducing ports 7 are uniformly formed in the surface of the support plates 5, a liquid discharge pipe 4 is arranged at the lower part of one side surface of the trapezoid tank 2, a liquid discharge valve 3 is arranged at one end of the liquid discharge pipe 4, which is far away from the trapezoid tank 2, the bottom plate 6 is fixed at a required position, and the fixing of the position of the support plates 5 is completed, namely, the position of the horizontal copper precipitation tank 1 is limited, and when the liquid discharge valve 3 is opened, the horizontal copper precipitation solution is converged in the trapezoid tank 2 and is discharged through the liquid discharge pipe 4.
The specific embodiment is as follows: under the action of the circulating pump 17, when the horizontal copper deposition liquid in the infusion tube 8 flows into the barrel 14, the diameter of the barrel 14 is larger than that of the infusion tube 8, so that the purpose of slowing down the flow rate of the horizontal copper deposition liquid in the first step is achieved, along with the increase of the horizontal copper deposition liquid in the barrel 14, the horizontal copper deposition liquid overflows from the horn mouth 20, and falls into the inner surface of the conical cover 9 under the action of the horn mouth 20, then the horizontal copper deposition liquid flows downwards along the outer wall of the barrel 14, the purpose of slowing down the flow rate of the horizontal copper deposition liquid in the second step is achieved, the horizontal copper deposition liquid flowing along the barrel 14 is in contact with the thick vinylon cloth 16 and then permeates into the thick vinylon cloth 16, the purpose of slowing down the flow in the third step is achieved, then the horizontal copper deposition liquid flows back into the horizontal copper deposition liquid tank 1 from the thick vinylon cloth 16 at a small flow rate, bubbles are prevented from being generated due to the too fast reflux speed of the horizontal copper deposition liquid, the influence on the horizontal copper deposition processing effect of a printed circuit board is reduced to the maximum, and the reject ratio of the printed circuit board is reduced.
The relative positions of the lower cylinder sleeve 13 and the upper cylinder sleeve 12 are adjusted according to the requirement, and then the volume formed by the upper cylinder sleeve 12 and the lower cylinder sleeve 13 is increased or reduced until half of the thick vinylon cloth piece 16 is in the horizontal copper precipitation liquid, so that the buoyancy of the floating plate 15 is adjusted, and the thick vinylon cloth piece 16 is convenient to rise or fall along with the liquid level of the horizontal copper precipitation liquid, even if half of the thick vinylon cloth piece 16 is immersed in the horizontal copper precipitation liquid.
The screw rod 35 is screwed, and then the screw rod 35 drives the piston 34 to descend or ascend in the air cylinder 33, so that air in the air cylinder 33 flows into the expansion pipe 31 or air in the expansion pipe 31 flows into the air cylinder 33, the volume of the expansion pipe 31 is adjusted, the purpose of conveniently adjusting the gap between the conical cover 9 and the cylinder 14 is achieved, and the horizontal copper deposit liquid can flow along the surface of the cylinder 14.
Although the present disclosure describes embodiments, not every embodiment is described in terms of a single embodiment, and such description is for clarity only, and one skilled in the art will recognize that the embodiments described in the disclosure as a whole may be combined appropriately to form other embodiments that will be apparent to those skilled in the art.
Claims (9)
1. The utility model provides a horizontal copper deposit device of printed circuit board preparation, includes horizontal copper deposit cistern (1), its characterized in that: the utility model provides a copper liquid sedimentation tank, including barrel (14), suction pipe (18) are installed to copper liquid sedimentation tank (1) bottom, suction pipe (18) keep away from the one end of copper liquid sedimentation tank (1) and connect circulating pump (17) feed liquor end, circulating pump (17) play liquid end and install transfer line (8), transfer line (8) keep away from the one end of circulating pump (17) and extend to barrel (14) interior lower part position, barrel (14) diameter is greater than the diameter of transfer line (8) and vertical arrangement in copper liquid sedimentation tank (1), barrel (14) upper end is opening form and fixedly connected with horn mouth (20) of being wide from top to bottom, horn mouth (20) upper cover is equipped with wide cone cover (9) of being wide from top to bottom, cone cover (9) and barrel (14) fixed connection, cone cover (9) upper end is closed form and cone cover (9) tip and barrel (14) surface have the clearance that is used for copper liquid sedimentation tank flow, barrel (14) are equipped with on the cover can be along barrel (14) diameter and vertical layout in copper liquid sedimentation tank (1), boss (16) are laid on boss (16) thick, boss (16) are laid on boss (16).
2. The horizontal copper deposition device for manufacturing a printed circuit board according to claim 1, wherein: the utility model discloses a barrel, including barrel (14), barrel (14) surface fixedly connected with is followed spacing (23) that barrel (14) length direction arranged, floating plate (15) are disc hollow structure, first spacing groove (24) with spacing (23) matched with are seted up to floating plate (15) internal surface, thick vinylon piece (16) are disc hollow structure, thick vinylon piece (16) internal surface processing has second spacing groove (26) with first spacing groove (24) looks coincidence, spacing (23) run through first spacing groove (24), second spacing groove (26).
3. A horizontal copper deposition device for printed circuit board manufacture according to claim 2, wherein: the floating plate is characterized in that three first round holes (25) are formed in the upper surface of the floating plate (15) at equal intervals, three second round holes (27) which are coincident with the first round holes (25) are formed in the upper surface of the thick vinylon cloth (16) at equal intervals, an upper sleeve (12) is fixedly arranged in the first round holes (25), the lower end of the upper sleeve (12) is in an opening shape, the upper end of the upper sleeve (12) penetrates through the second round holes (27) to extend to the upper side of the thick vinylon cloth (16), the lower end of the upper sleeve (12) extends to the lower side of the floating plate (15) and is provided with external threads, the lower end of the upper sleeve (12) is in threaded connection with a lower sleeve (13), the lower end of the lower sleeve (13) is in a closed shape, and the inner surface of the lower sleeve (13) is provided with internal threads matched with the external threads.
4. A horizontal copper deposition device for printed circuit board manufacture according to claim 3, wherein: the upper surface of the upper cylinder sleeve (12) is fixedly connected with a vent pipe (11) fixedly connected with the upper cylinder sleeve (12), and the upper end of the vent pipe (11) is connected with a threaded cover (10) in a threaded manner.
5. A horizontal copper deposition device for printed circuit board manufacture according to claim 3, wherein: the utility model discloses a sealing sleeve structure for a bicycle, including lower barrel casing (13) open end fixedly connected with seal cover (28), seal cover (28) cover is established on last barrel casing (12), seal cover (28) face down barrel casing (13) one side evenly is fixed with a plurality of round pin poles, down barrel casing (13) face seal cover (28) one side evenly set up a plurality of and round pin pole matched with pinhole, the round pin pole is fixed in the pinhole.
6. The horizontal copper deposition device for manufacturing a printed circuit board according to claim 1, wherein: the novel conical cover is characterized in that a stud (19) which is vertically arranged is fixedly connected to the middle position of the inner top of the conical cover (9), a thread bush (22) is connected to the stud (19) in a threaded mode, the thread bush (22) is arranged in the cylinder body (14), two supporting rods (21) are symmetrically and fixedly connected to the outer surface of the thread bush (22), and one end, far away from the thread bush (22), of each supporting rod (21) is fixedly connected with the inner wall of the cylinder body (14).
7. The horizontal copper deposition device for manufacturing a printed circuit board according to claim 6, wherein: the utility model discloses a gas cylinder, including cone cover (9), cylinder (33), piston (34) are installed in cone cover (9), cylinder (33) are kept away from in cone cover (9), lower part position is equipped with annular expansion pipe (31) that the volume is expandable in, expansion pipe (31) are pasted mutually with cone cover (9), expansion pipe (31) surface links to each other with connecting pipe (32), one end that expansion pipe (31) were kept away from to connecting pipe (32) links to each other with inflator (33), inflator (33) are vertical form arrangement and one end fixedly connected with connecting rod that inflator (33) surface kept away from connecting pipe (32), one end that inflator (33) were kept away from to the connecting rod and cone cover (9) fixed connection, slidable mounting has piston (34) in inflator (33), screw rod (35) are installed to piston (34) upper surface middle part position, screw rod (35) upper end extends to inflator (33) upside and with inflator (33) threaded connection.
8. The horizontal copper deposition device for manufacturing a printed circuit board according to claim 1, wherein: one end of the infusion tube (8) positioned at the inner bottom of the cylinder body (14) is connected and communicated with a cylinder (29) for dispersing horizontal copper precipitation liquid, two ends of the cylinder (29) are closed, and a plurality of liquid outlet holes (30) are uniformly formed in the outer surface of the cylinder (29).
9. The horizontal copper deposition device for manufacturing a printed circuit board according to claim 1, wherein: the bottom of horizontal heavy copper cistern (1) is opening form and fixedly connected with upper width and lower narrow dovetail groove (2), the both sides of dovetail groove (2) all are equipped with two vertically arranged extension boards (5), one side lower part edge fixedly connected with foraminiferous bottom plate (6) of extension board (5) deviating from dovetail groove (2), a plurality of weight reduction mouth (7) have evenly been seted up towards one side of dovetail groove (2) to extension board (5), fluid-discharge tube (4) are installed to dovetail groove (2) side lower part position, fluid-discharge valve (3) are installed to one end that dovetail groove (2) were kept away from to fluid-discharge tube (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111082928.5A CN113873774B (en) | 2021-09-15 | 2021-09-15 | Horizontal copper deposition device for manufacturing printed circuit board |
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| CN113873774A (en) | 2021-12-31 |
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