CN214142586U - Improved circuit board electroplating equipment - Google Patents
Improved circuit board electroplating equipment Download PDFInfo
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- CN214142586U CN214142586U CN202120016694.3U CN202120016694U CN214142586U CN 214142586 U CN214142586 U CN 214142586U CN 202120016694 U CN202120016694 U CN 202120016694U CN 214142586 U CN214142586 U CN 214142586U
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- fixedly connected
- circuit board
- organism
- motor
- electroplating
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Abstract
The utility model discloses a circuit board electroplating device of improvement, which comprises a bod, the first motor of lower surface intermediate position fixedly connected with of organism, and the drive end of first motor run through organism diapire fixedly connected with threaded rod, the equal fixedly connected with gag lever post in both sides that the diapire is close to the threaded rod in the organism, and the surface screw thread of threaded rod has cup jointed the elevator, the equal fixedly connected with lifter plate in both sides of elevator, two the inside of lifter plate all is provided with a plurality of heating rods of the equal fixedly connected with of second motor and lower surface, two the drive end of second motor all runs through the lifter plate roof and the fixed surface of surface has cup jointed the driving gear. The utility model discloses in, a plurality of circuit boards can be electroplated to the single, and comparatively stable security is higher, and the plating bath can rotate and promote electroplating efficiency, can detect organism inside temperature and self-heating simultaneously, makes the temperature maintain at the constant range, further promotes electroplating effect and energy saving.
Description
Technical Field
The utility model relates to an electroplating device technical field especially relates to a circuit board electroplating device of improvement.
Background
The circuit board electroplating is to electroplate the through holes or blind holes of the circuit board, so that the thickness of copper in the through holes or blind holes can reach a required range, and the electroplating is an essential link in the manufacturing process of the printed circuit board, along with the rapid development of scientific technology, the demand of people on electronic products is increased day by day, and the printed circuit board is a necessary carrier of elements in the electronic products, so the demand of the printed circuit board is increased;
the bubble can be filled into in the plating bath among the current electroplating process usually, because the thickness of circuit board is thinner and fixed unstably, take place to rock very easily, can lead to circuit board distortion when serious, use ordinary electroplating jig to press from both sides tight circuit board simultaneously and electroplate, pressure is comparatively concentrated, the contact surface is impaired very easily, lead to the circuit board surface to appear damaging easily and increase the material loss, and in the vibration of electroplating device, the circuit board drops easily and influences the electroplating effect, make follow-up operation more loaded down with trivial details, the work load of electroplating has been increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an improved circuit board electroplating device.
In order to achieve the above purpose, the utility model adopts the following technical scheme: an improved circuit board electroplating device comprises a machine body, wherein a first motor is fixedly connected to the middle position of the lower surface of the machine body, a drive end of the first motor penetrates through the bottom wall of the machine body and is fixedly connected with a threaded rod, both sides of the bottom wall in the machine body, which are close to the threaded rod, are fixedly connected with limit rods, outer surface threads of the threaded rod are sleeved with lifting blocks, both sides of each lifting block are fixedly connected with lifting plates, a second motor is arranged inside each lifting plate, the lower surfaces of the two lifting plates are fixedly connected with a plurality of heating rods, the drive ends of the two second motors penetrate through the top wall of each lifting plate, driving gears are fixedly sleeved on the outer surfaces of the two lifting plates, rotating shafts are rotatably connected to the upper surfaces of the two lifting plates, plating baths are fixedly connected to the top ends of the two rotating shafts, driven gears are fixedly sleeved on the outer surfaces of the two rotating shafts, and a plurality of U-shaped grooves are fixedly connected to the two inner side walls of the two plating baths, and two inside walls and the bottom wall of the electroplating bath are both penetrated and provided with a plurality of strip-shaped openings, the inner wall of one side of the machine body is provided with a temperature sensor, and the top wall of the machine body is provided with operation openings on two sides close to the electroplating bath.
As a further description of the above technical solution:
and the threaded rod and the bottom ends of the outer surfaces of the two limiting rods are fixedly sleeved with a limiting plate together.
As a further description of the above technical solution:
the two sides of the lifting block are both in sliding sleeve joint with the outer surface of the limiting rod.
As a further description of the above technical solution:
and the two driving gears are respectively meshed with the two driven gears.
As a further description of the above technical solution:
the temperature sensor is electrically connected with the heating rod.
As a further description of the above technical solution:
a plurality of the inner side wall of the U-shaped groove is provided with a rubber pad.
As a further description of the above technical solution:
two slots are formed in two sides of the inner bottom wall of the electroplating bath, inserting blocks are arranged inside the two slots, and baffles are fixedly connected to the upper surfaces of the inserting blocks.
The utility model discloses following beneficial effect has:
1. this equipment is electroplated to circuit board of improvement, threaded rod through setting up, the gag lever post, first motor, the elevator, the plating bath, U type groove, baffle and bar mouth, a plurality of circuit boards can be placed to the single and electroplate, replace anchor clamps through the plating bath and fix, it is fixed comparatively stable, the lift of being convenient for simultaneously is electroplated, avoid the circuit board to appear rocking the condition that warp even displacement drops, the overall operation of electroplating has been simplified, single operating efficiency has been promoted, the security has promoted the electroplating effect simultaneously and has reduced the raw materials loss.
2. This equipment is electroplated to circuit board of improvement, axis of rotation through setting up, the driving gear, driven gear and second motor, when electroplating polylith circuit board simultaneously, can make the plating bath rotate, the area of contact of rivers increase circuit board and plating solution with higher speed, it is even more quick to make the electroplating, through the temperature sensor who sets up, heating rod and limiting plate, can detect the inside plating solution temperature of organism and heat automatically, make the temperature maintain at the constant range, avoid the temperature to cross low influence electroplating effect, further promote electroplating effect and energy saving.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of the plating bath of the present invention;
FIG. 3 is an enlarged view of a partial cross-sectional view of the plating bath according to the present invention.
Illustration of the drawings:
1. a body; 2. a first motor; 3. a threaded rod; 4. a limiting rod; 5. a limiting plate; 6. a lifting block; 7. a lifting plate; 8. a heating rod; 9. a second motor; 10. a rotating shaft; 11. an electroplating bath; 12. a driven gear; 13. a driving gear; 14. a temperature sensor; 15. a U-shaped groove; 16. a rubber pad; 17. a strip-shaped opening; 18. a baffle plate; 19. a slot; 20. inserting a block; 21. and an operation port.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides an embodiment: an improved circuit board electroplating device comprises a machine body 1, wherein a first motor 2 is fixedly connected to the middle position of the lower surface of the machine body 1, the driving end of the first motor 2 penetrates through the bottom wall of the machine body 1 and is fixedly connected with a threaded rod 3, two sides of the bottom wall of the machine body 1, which are close to the threaded rod 3, are fixedly connected with limiting rods 4, outer surface threads of the threaded rod 3 are sleeved with a lifting block 6, two sides of the lifting block 6 are fixedly connected with lifting plates 7, a second motor 9 is arranged inside each lifting plate 7, the lower surfaces of the two lifting plates are fixedly connected with a plurality of heating rods 8, the driving ends of the two second motors 9 penetrate through the top wall of each lifting plate 7, the outer surfaces of the two lifting plates 7 are fixedly sleeved with driving gears 13, the upper surfaces of the two lifting plates 7 are rotatably connected with rotating shafts 10, two inside walls of two plating baths 11 are fixedly connected with a plurality of U-shaped grooves 15, the two inside walls and the bottom wall of the plating bath 11 are provided with a plurality of strip-shaped openings 17, one side inner wall of the machine body 1 is provided with a temperature sensor 14, and the top wall of the machine body 1 is provided with operation openings 21 by both sides of the plating bath 11.
The threaded rod 3 and the bottom ends of the outer surfaces of the two limiting rods 4 are fixedly sleeved with the limiting plate 5, so that the descending distance of the lifting plate 7 can be limited, and the heating rod 8 is prevented from being damaged due to the fact that the lifting plate 7 descends too low;
the two sides of the lifting block 6 are sleeved with the outer surface of the limiting rod 4 in a sliding manner, so that the lifting block 6 can move directionally while keeping stable, and the height of the electroplating bath 11 is adjusted up and down to complete electroplating;
the two driving gears 13 are respectively meshed with the two driven gears 12, the driven gears 12 are driven by the rotation meshing of the driving gears 13, so that the electroplating bath 11 can automatically rotate at a constant speed, the water flow can be accelerated in the electroplating process, the contact surface between the electroplating bath and the electroplating solution can be increased, and the electroplating effect and efficiency can be improved;
the temperature sensor 14 is electrically connected with the heating rod 8, and the electroplating solution in the machine body 1 can be automatically heated by detecting the temperature through the temperature sensor 14, so that the temperature of the electroplating solution is maintained in a constant range, and the electroplating effect is prevented from being influenced by too low temperature;
The working principle is as follows: when the improved circuit board electroplating equipment is used, the baffles 18 on two sides of the electroplating bath 11 are taken down, a plurality of circuit boards are sequentially placed in the two U-shaped grooves 15 for fixation, after the placement is finished, the insertion blocks 20 are sequentially placed in the insertion grooves 19, the baffles 18 and the electroplating bath 11 are installed and fixed, then the first motor 2 is started to enable the threaded rod 3 to rotate, the lifting block 6 and the lifting plate 7 are driven to descend, the electroplating bath 11 is descended to a proper height through the operation opening 21, the two second motors 9 are started, the driving gear 13 is rotationally meshed to drive the driven gear 12 to rotate, the electroplating bath 11 is enabled to rotate at a constant speed, the contact area between the circuit boards and the electroplating solution is increased by accelerated water flow, the temperature of the electroplating solution is immediately detected by the temperature sensor 14, when the temperature is lower than a preset value, the temperature sensor 14 sends a signal to enable the heating rod 8 to start the internal electroplating solution, and the internal temperature of the machine body 1 is maintained in a constant range, the quality and the efficiency of electroplating are guaranteed, after the electroplating is finished, the first motor 2 is made to rotate reversely, the threaded rod 3 is made to rotate to drive the lifting block 6 and the lifting plate 7 to ascend, the electroplating bath 11 penetrates through the operation opening 21 to move out to the outside of the machine body 1, and electroplating solution is discharged from the strip-shaped opening 17 at the bottom to facilitate subsequent operation.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides a circuit board electroplating device of improvement, includes organism (1), its characterized in that: the lower surface intermediate position fixedly connected with first motor (2) of organism (1), and the drive end of first motor (2) runs through organism (1) diapire fixedly connected with threaded rod (3), the equal fixedly connected with gag lever post (4) in both sides that the diapire is close to threaded rod (3) in organism (1), and the surface screw thread of threaded rod (3) has cup jointed elevator (6), the equal fixedly connected with lifter plate (7) in both sides of elevator (6), two the inside of lifter plate (7) all is provided with a plurality of heating rods (8) of second motor (9) and the equal fixedly connected with in lower surface, two the drive end of second motor (9) all runs through lifter plate (7) roof and the fixed surface cup joints driving gear (13), two the upper surface of lifter plate (7) all rotates and is connected with axis of rotation (10), two the equal fixedly connected with plating bath (11) in top and the equal fixed surface of axis of rotation (10) cup joint and have driving gear (13), two There are driven gear (12), two equal fixedly connected with a plurality of U type grooves (15) of two inside walls of plating bath (11), and two inside walls of plating bath (11) all run through with the diapire and seted up a plurality of bar mouths (17), one side inner wall of organism (1) is provided with temperature sensor (14), and operation mouth (21) have all been seted up to the roof of organism (1) both sides by plating bath (11).
2. An improved circuit board plating apparatus as recited in claim 1, wherein: and the threaded rod (3) and the bottom ends of the outer surfaces of the two limiting rods (4) are fixedly sleeved with a limiting plate (5) together.
3. An improved circuit board plating apparatus as recited in claim 1, wherein: the two sides of the lifting block (6) are both in sliding sleeve joint with the outer surface of the limiting rod (4).
4. An improved circuit board plating apparatus as recited in claim 1, wherein: the two driving gears (13) are respectively meshed with the two driven gears (12).
5. An improved circuit board plating apparatus as recited in claim 1, wherein: the temperature sensor (14) is electrically connected with the heating rod (8).
6. An improved circuit board plating apparatus as recited in claim 1, wherein: and rubber pads (16) are arranged on the inner side walls of the U-shaped grooves (15).
7. An improved circuit board plating apparatus as recited in claim 1, wherein: slots (19) are formed in two sides of the inner bottom wall of each electroplating bath (11), inserting blocks (20) are arranged inside the slots (19), and baffles (18) are fixedly connected to the upper surfaces of the inserting blocks (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120016694.3U CN214142586U (en) | 2021-01-06 | 2021-01-06 | Improved circuit board electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120016694.3U CN214142586U (en) | 2021-01-06 | 2021-01-06 | Improved circuit board electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214142586U true CN214142586U (en) | 2021-09-07 |
Family
ID=77546300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120016694.3U Active CN214142586U (en) | 2021-01-06 | 2021-01-06 | Improved circuit board electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214142586U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113873774A (en) * | 2021-09-15 | 2021-12-31 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN114333598A (en) * | 2022-01-10 | 2022-04-12 | 业成科技（成都）有限公司 | Display panel processing device |
-
2021
- 2021-01-06 CN CN202120016694.3U patent/CN214142586U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113873774A (en) * | 2021-09-15 | 2021-12-31 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN113873774B (en) * | 2021-09-15 | 2023-08-29 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN114333598A (en) * | 2022-01-10 | 2022-04-12 | 业成科技（成都）有限公司 | Display panel processing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An improved electroplating equipment for circuit boards Effective date of registration: 20230818 Granted publication date: 20210907 Pledgee: Industrial and Commercial Bank of China Limited Jiangmen Jianghai sub branch Pledgor: Jiangmen Chenghe Electronics Co.,Ltd. Registration number: Y2023980052788 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |