CN214218885U - Device for local tinning by liquid flow method - Google Patents
Device for local tinning by liquid flow method Download PDFInfo
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- CN214218885U CN214218885U CN202120072356.1U CN202120072356U CN214218885U CN 214218885 U CN214218885 U CN 214218885U CN 202120072356 U CN202120072356 U CN 202120072356U CN 214218885 U CN214218885 U CN 214218885U
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Abstract
The utility model provides a local tinned device of liquid flow method, including rectifier, filter, circulation tank, circulating pump, aqueduct, connect the inlet tube between filter and the aqueduct, be connected the circulating pipe between filter and the circulating pump, between circulating pump and the circulation tank, be connected the back flow between circulation tank and the aqueduct set up in the aqueduct and be less than the inside groove of aqueduct, the inlet tube extends to from filter department in the inside groove set up the metal frame between aqueduct and the inside groove, metal frame four corners department installation adjusting screw, the aqueduct four corners sets up the triangle fixed plate, be equipped with in the middle of the fixed plate with adjusting screw matched with screw, anode plate meet with aqueduct both sides, connect the rectifier positive pole after establishing ties, the rectifier negative pole is connected to the metal frame. The device realizes mild and stable liquid medicine exchange and adjustable electroplating height, can effectively control the electroplating part and greatly improves the production efficiency.
Description
Technical Field
The utility model relates to an electroplate technical field, concretely relates to local tinned device of liquid stream method.
Background
The common method is adopted for plating tin and silver, the parts which do not need to be plated are also plated, metal and chemical raw materials are wasted, and the subsequent processing procedures are influenced. However, the traditional local electroplating can carry out insulation shielding on the parts which do not need to be electroplated, such as making a special die shield and coating insulation glue, stripping the glue after electroplating, and other customers have welding requirements on the parts which do not need to be electroplated, the subsequent welding can be influenced by the glue coating, the liquid flow local electroplating tin is adopted, the metallic tin and chemical raw materials can be saved, the production efficiency can be improved, and the maximum allowable current density of the common electroplating tin is 0.5-1A/dm2The maximum cathode current density of the method can reach 1-4A/dm2This is because: the liquid flow method has small distance between the tin-plated cathode and anode, and the electrolyte circulates between the cathode and the anode. In a flowing state, so that a larger cathode current density can be used, thereby achieving the purpose of rapid local electroplating.
The ordinary single-groove overflow cannot control proper flow rate, and the liquid level is unstable and suddenly high or low due to too high or too low flow rate; the common single-groove cathode is fixed on two sides of the groove edge, the required electroplating height is controlled by adjusting the height of the liquid medicine, and the liquid medicine can only be in a static state when the liquid medicine can not flow during production. After several production tanks, the circulation of the liquid medicine is stopped, and the liquid level height is adjusted, so that the production efficiency is influenced.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a liquid flow method local tinned device, liquid medicine exchange is mild, stable, electroplates height-adjustable, can carry out effective control to electroplating the position, realizes freely shielding and need not influence production efficiency not electroplating the position.
Based on the above problem, the utility model provides a technical scheme provides a local tinned device of liquid flow method, including rectifier, filter, recycle tank, circulating pump, aqueduct, connect the inlet tube between filter and the aqueduct, between filter and the circulating pump, be connected the circulating pipe between circulating pump and the recycle tank, be connected the back flow between recycle tank and the aqueduct set up in the aqueduct and be less than the inside groove of aqueduct, the inlet tube extends to from filter department in the inside groove.
A metal frame is arranged between the aqueduct and the inner groove, adjusting screws are arranged at four corners of the metal frame, triangular fixing plates are arranged at four corners of the aqueduct, and screw holes matched with the adjusting screws are arranged in the middle of the fixing plates.
The anode plate is connected with the anode of the rectifier, and the metal frame is connected with the cathode of the rectifier.
And the lower end of the adjusting screw is fixedly connected with four corners of the metal frame.
Furthermore, the four corners of the metal frame are provided with screw holes matched with the adjusting screws, and the adjusting screws are in threaded connection with the metal frame.
Furthermore, the four corners of the metal frame are provided with through holes matched with the adjusting screws, and the adjusting screws are connected with the metal frame in a welding mode.
Wherein, a plurality of shunt tubes are arranged at the end part of the water inlet pipe positioned in the inner groove.
Furthermore, a water outlet with a downward opening is formed in the bottom of the flow dividing pipe.
The utility model has the advantages and beneficial effect:
the device of the utility model realizes gentle and stable liquid medicine exchange, can effectively control the electroplating position, has adjustable electroplating height, and realizes free shielding without influencing the production efficiency on the electroplating position. Wherein, the inner groove is arranged in the outer groove, so that the stability of the concentration of the liquid medicine in the inner groove during production and the effective control of the electroplating part during electroplating are realized; the height of the metal frame can be changed conveniently by setting the adjusting screw, so that the free adjustment of the electroplating height required by a product can be realized on the premise of not stopping circulating the liquid medicine repeatedly due to the fact that the height of the liquid medicine liquid level needs to be changed, the production efficiency is greatly improved, and the electroplating device is suitable for local electroplating of workpieces in various shapes without concave-convex surfaces.
Drawings
Fig. 1 is a plan view of the present invention.
Fig. 2 is a left side view of the present invention.
Wherein: 1. aqueduct; 2. an inner tank; 3. a metal frame; 4. an anode plate; 5. a fixing plate; 6. adjusting screws; 7, a rectifier; 8. a circulation tank; 9. a circulation pump; 10. a filter; 11. a water inlet pipe; 12. a shunt tube; 13. a circulation pipe; 14. a return pipe.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1-2, the utility model provides a device of liquid flow method local tin-plating, including aqueduct 1, rectifier 7, filter 10, circulation tank 8, circulating pump 9, connect inlet tube 11 between filter 10 and the aqueduct 1, between filter 10 and the circulating pump 9, connect circulating pipe 13 between circulating pump 9 and the circulation tank 8, connect back flow 14 between circulation tank 8 and the aqueduct 1 set up in the aqueduct 1 and be less than aqueduct 1's inside groove 2, inlet tube 11 extends to from filter 10 in the inside groove 2, is located in the inside groove 2 the 11 tip of inlet tube sets up a plurality of shunt tubes 12, shunt tubes 12 bottom is provided with the downward apopore of opening, guarantees that liquid medicine gets into gently. The arrangement of the aqueduct 1 and the inner tank 2 leads the liquid medicine to form larger liquid level difference, and leads the liquid medicine overflowed from the inner tank 2 to quickly flow back to the circulating tank 8 through the return pipe 14 connected with the outer tank, thus ensuring the quick and gentle exchange of the liquid medicine in the inner tank 2 and ensuring the stability of the liquid medicine concentration in the inner tank 2 during production and the effective control of the electroplating part during the electroplating.
A metal frame 3 is arranged between the aqueduct 1 and the inner groove 2, adjusting screws 6 are arranged at four corners of the metal frame 3, triangular fixing plates 5 are arranged at four corners of the aqueduct 1, and screw holes matched with the adjusting screws 6 are arranged in the middle of the fixing plates 5. Wherein, the lower end of the adjusting screw 6 is fixedly connected with four corners of the metal frame 3, and the fixedly connected form is as follows: the four corners of the metal frame 3 are provided with screw holes matched with the adjusting screws 6, the adjusting screws 6 are in threaded connection with the metal frame 3, or the four corners of the metal frame 3 are provided with through holes matched with the adjusting screws 6, and the adjusting screws 6 are in welded connection with the metal frame 3. The metal frame 3 is mainly used for carrying a cathode, the adjusting screw 6 is rotated to drive the metal frame 3 to move up and down, the height of the product to be electroplated can be freely adjusted, and the height of the liquid level of the liquid medicine can be continuously changed.
The electroplating device is characterized by further comprising an anode plate 4, the anode plate 4 transversely arranged is connected with two sides of the aqueduct 1, the anode plate 4 longitudinally arranged is fixed on the anode plate 4 transversely arranged oppositely side by side, the anode plate 4 is connected with the anode of the rectifier 7, the metal frame 3 is connected with the cathode of the rectifier 7, when the electroplating device works, a product is hung on the anode plate 4 longitudinally arranged, and when the electroplating height of the product needs to be controlled, only the adjusting screw 6 needs to be adjusted to a proper position.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (6)
1. The utility model provides a device of local tin-plating of liquid flow method, includes rectifier, filter, circulation tank, circulating pump, aqueduct, connects the inlet tube between filter and the aqueduct, between filter and the circulating pump, is connected the circulating pipe between circulating pump and the circulation tank, is connected the back flow between circulation tank and the aqueduct, its characterized in that: an inner groove lower than the aqueduct is arranged in the aqueduct, and the water inlet pipe extends into the inner groove from the filter;
a metal frame is arranged between the aqueduct and the inner groove, adjusting screws are arranged at four corners of the metal frame, triangular fixing plates are arranged at four corners of the aqueduct, and screw holes matched with the adjusting screws are arranged in the middle of the fixing plates;
the anode plate is connected with the anode of the rectifier, and the metal frame is connected with the cathode of the rectifier.
2. The apparatus for localized tin plating according to claim 1, wherein: the lower end of the adjusting screw is fixedly connected with four corners of the metal frame.
3. The apparatus for localized tin plating according to claim 2, wherein: and screw holes matched with the adjusting screws are formed in the four corners of the metal frame, and the adjusting screws are in threaded connection with the metal frame.
4. The apparatus for localized tin plating according to claim 2, wherein: the four corners of the metal frame are provided with through holes matched with the adjusting screws, and the adjusting screws are connected with the metal frame in a welding mode.
5. The apparatus for localized tin plating according to claim 1, wherein: and a plurality of shunt pipes are arranged at the end part of the water inlet pipe positioned in the inner groove.
6. The apparatus for localized tin plating according to claim 5, wherein: and a water outlet with a downward opening is formed in the bottom of the flow dividing pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120072356.1U CN214218885U (en) | 2021-01-12 | 2021-01-12 | Device for local tinning by liquid flow method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120072356.1U CN214218885U (en) | 2021-01-12 | 2021-01-12 | Device for local tinning by liquid flow method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214218885U true CN214218885U (en) | 2021-09-17 |
Family
ID=77709767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120072356.1U Active CN214218885U (en) | 2021-01-12 | 2021-01-12 | Device for local tinning by liquid flow method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214218885U (en) |
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2021
- 2021-01-12 CN CN202120072356.1U patent/CN214218885U/en active Active
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