CN210966139U - Circuit board electroplating processing belt cleaning device - Google Patents
Circuit board electroplating processing belt cleaning device Download PDFInfo
- Publication number
- CN210966139U CN210966139U CN201921885100.1U CN201921885100U CN210966139U CN 210966139 U CN210966139 U CN 210966139U CN 201921885100 U CN201921885100 U CN 201921885100U CN 210966139 U CN210966139 U CN 210966139U
- Authority
- CN
- China
- Prior art keywords
- butterfly valve
- circuit board
- cleaning device
- washing tank
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 36
- 238000009713 electroplating Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005406 washing Methods 0.000 claims description 48
- 239000007788 liquid Substances 0.000 claims description 34
- 239000004744 fabric Substances 0.000 claims description 10
- 239000003651 drinking water Substances 0.000 claims description 5
- 235000020188 drinking water Nutrition 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 27
- 239000013049 sediment Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model provides a circuit board electroplating processing cleaning device, which comprises a base and a cleaning tank, wherein a conical cover is fixed at the lower end of the cleaning tank, a connecting pipe is fixed at the lower end of the conical cover, the lower end of the connecting pipe is connected with a first butterfly valve through a bolt, the other end of the first butterfly valve is connected with a barrel through a bolt, the lower end of the barrel is connected with a second butterfly valve through a bolt, a water suction pipe is arranged at one side of the cleaning tank, the other end of the water suction pipe is connected with the water inlet end of a circulating pump, the water outlet end of the circulating pump is provided with a water return pipe, the other end of the water return pipe penetrates through the cleaning tank extending from the cleaning tank, a baffle is fixed at the lower part inside the cleaning tank, a plurality of first through holes are uniformly arranged on the upper end surface, the utility model discloses following beneficial effect has: prevent the impurity of sediment from rising, improve the convenience of impurity clearance.
Description
Technical Field
The utility model relates to a circuit board electroplating process belt cleaning device belongs to circuit board processing equipment field.
Background
Since electroplating enhances the corrosion resistance, increases the hardness, prevents abrasion, improves the conductivity, smoothness, heat resistance and surface beauty of the circuit board, certain impurities exist on the surface after the electroplating and need to be cleaned. For improving cleaning efficiency, often utilize the circulating pump to stir the washing liquid in the washing tank, nevertheless the washing liquid in shaking leads to the impurity of sediment to be general again easily, and impurity is attached to on the circuit board easily when taking out the circuit board, influences the cleaning performance of circuit board, when needing the impurity of clearance sediment simultaneously, needs the washing liquid in the washing tank of discharging completely, and the impurity clearance convenience is not enough.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art existence, the utility model aims at providing a circuit board electroplating process belt cleaning device to propose in solving above-mentioned background art and often utilize the circulating pump to stir the washing liquid in the washing tank, nevertheless shake the washing liquid in and lead to the impurity of sediment to rise once more easily, impurity adheres to on the circuit board easily when taking out the circuit board, influences the cleaning performance of circuit board, when needing the impurity of clearance sediment simultaneously, need the washing liquid in the complete discharge washing tank, the not enough problem of impurity clearance convenience, the utility model discloses prevent that the impurity of sediment rises widely, improves the convenience of impurity clearance.
In order to achieve the above purpose, the present invention is realized by the following technical solution: a cleaning device for electroplating processing of a circuit board comprises a base and a cleaning tank, wherein supporting rods are respectively arranged at four corners of the upper end surface of the base, the supporting rod is fixedly connected with the cleaning tank, a conical cover is fixed at the lower end of the cleaning tank, a connecting pipe is fixed at the lower end of the conical cover, the lower end of the connecting pipe is connected with a first butterfly valve through a bolt, the other end of the first butterfly valve is connected with the cylinder through a bolt, the lower end of the cylinder body is connected with a second butterfly valve through a bolt, one side of the cleaning tank is provided with a water pumping pipe, the other end of the water pumping pipe is connected with the water inlet end of a circulating pump, the water outlet end of the circulating pump is provided with a water return pipe, the other end of the water return pipe penetrates through the cleaning tank and extends into the middle cleaning tank, a clapboard is fixed at the lower part inside the cleaning tank, a plurality of first through holes are uniformly arranged on the upper end surface of the clapboard, a rubber pad is laid at the upper end of the partition plate, and a plurality of second through holes aligned with the first through holes are uniformly formed in the upper end face of the rubber pad.
Further, the middle position of the upper end face of the base is provided with a groove, the groove is arranged under the second butterfly valve, the inner wall of the groove is provided with a round hole, and a rubber plug is inserted into the round hole.
Furthermore, a fixing plate is fixed on the outer peripheral surface of the base, and a ground pin hole is formed in the upper end surface of the fixing plate.
Further, first flanges are fixed on the outer surfaces of the two ends of the cylinder, and the first butterfly valve and the second butterfly valve are fixedly connected with the first flanges through bolts.
Furthermore, a second flange is fixed on the outer surface of the lower end of the connecting pipe, and the first butterfly valve is fixedly connected with the second flange through bolts.
Further, the one end that the circulating pump was kept away from to the wet return is connected the cloth liquid pipe, the cloth liquid pipe sets up in the washing tank, and a plurality of level form outage have been seted up to cloth liquid pipe surface.
The utility model has the advantages that: the utility model discloses an installation sets up the baffle of first through-hole in the washing tank, and the impurity that washs the circuit board and produce deposits in the conical cover through first through-hole, and then the baffle plays the effect that slows down the conical cover washing liquid and rock the degree, prevents that the impurity that deposits is general to play once more, lays the rubber pad of seting up the second through-hole on the baffle, prevents circuit board and baffle rigid collision when not influencing impurity and deposit.
The utility model discloses open first butterfly valve, and then the impurity that deposits in the conical cover goes into the barrel under self action of gravity in, when needing to clear up the impurity in the barrel, close first butterfly valve, then open the second butterfly valve, and then the impurity in the discharge barrel, the mode clearance of washing liquid in the washing tank that need not adopt discharging completely improves the convenience that impurity cleared up.
The utility model discloses a set up the recess on the base to set up the outage on recess inner wall, realize collecting the residual washing liquid of drippage in the barrel, the random drippage of anti-wash liquid trickles in operational environment.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural view of a cleaning device for electroplating processing of circuit boards according to the present invention;
FIG. 2 is a schematic view of the assembly of the partition board, the rubber pad and the cleaning tank in the cleaning device for electroplating circuit board of the present invention;
FIG. 3 is a perspective view of a liquid distribution tube of the cleaning device for electroplating processing of circuit board according to the present invention;
in the figure: 1-base, 2-water return pipe, 3-support rod, 4-cleaning tank, 5-water pumping pipe, 6-conical cover, 7-connecting pipe, 8-first butterfly valve, 9-barrel, 10-circulating pump, 11-fixing plate, 12-ground pin hole, 13-groove, 14-second butterfly valve, 15-partition plate, 16-rubber pad, 17-first through hole, 18-second through hole, 19-liquid distribution pipe and 20-liquid discharge hole.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a circuit board electroplating process belt cleaning device, including base 1 and washing tank 4, branch 3 is all installed to four edges and corners department of 1 up end of base, branch 3 and 4 fixed connection of washing tank, 4 lower end fixed cone cover 6 of washing tank, 6 lower extreme fixed connection pipe 7 of cone cover, 7 lower extremes of connecting pipe pass through bolted connection first butterfly valve 8, the first butterfly valve 8 other end passes through bolted connection barrel 9, barrel 9 lower extreme passes through bolted connection second butterfly valve 14, open first butterfly valve 8, and then the impurity of settling in the cone cover 6 falls into barrel 9 under self action of gravity, when needing to clear up the impurity in the barrel 9, close first butterfly valve 8, then open second butterfly valve 14, and then the impurity in the discharge barrel 9, need not adopt the mode clearance of the interior washing liquid of the 4 washing tanks of discharging completely, improve the convenience of impurity clearance.
4 an installation drinking-water pipe 5 of washing tank, circulating pump 10 is connected to the 5 other ends of drinking-water pipe, circulating pump 10 goes out water end installation wet return 2, in washing tank 4 in the washing tank 4 extension is run through to the 2 other ends of wet return, switch on the circuit between circulating pump 10 and the external power supply, receive circulating pump 10 work influence, washing liquid in washing tank 4 flows to wet return 2 in through drinking-water pipe 5, washing liquid in wet return 2 flows into washing tank 4 once more afterwards, thereby reach the purpose of stirring washing liquid in the washing tank 4.
Inside lower part position fixed baffle 15 of washing tank 4, a plurality of first through-holes 17 have evenly been seted up to baffle 15 up end, rubber pad 16 is laid to baffle 15 upper end, a plurality of second through-holes 18 that align with first through-hole 17 have evenly been seted up to rubber pad 16 up end, baffle 15 through set up first through-hole 17 in washing tank 4, the impurity that the washing circuit board produced deposits in conical cover 6 through first through-hole 17, and then baffle 15 plays the effect that slows down conical cover 6 washing liquid rocking degree, prevent that the impurity that deposits is general again, lay the rubber pad 16 who sets up second through-hole 18 on baffle 15, prevent circuit board and 15 rigid collision of baffle when not influencing impurity and deposit.
The recess 13 has been seted up to base 1 up end middle part position, recess 13 sets up under second butterfly valve 14, the round hole has been seted up to recess 13 inner wall, the rubber buffer has been inserted to the ann in the round hole, through set up recess 13 on base 1, and set up outage 20 on recess 13 inner wall, the realization is collected from the residual cleaning liquid of drippage in barrel 9, the anti-cleaning liquid drips at will and trickles in operational environment, extract the rubber buffer, and then the washing liquid in the recess 13 passes through the round hole and discharges.
The fixed plate 11 is fixed on the outer peripheral surface of the base 1, the upper end surface of the fixed plate 11 is provided with the foot hole 12, and the fixed plate 11 is installed on a required position by utilizing the foot hole 12 to complete the fixation of the position of the base 1.
First flange is all fixed to the both ends surface of barrel 9, and first butterfly valve 8, second butterfly valve 14 pass through bolt and first flange fixed connection, and the design of first flange is convenient for barrel 9 and first butterfly valve 8, second butterfly valve 14's fixed connection.
7 lower extreme surface mounting second flanges of connecting pipe, first butterfly valve 8 passes through bolt and second flange fixed connection, and the design of second flange is convenient for connecting pipe 7 and first butterfly valve 8 fixed connection.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiments, and although the present invention has been disclosed with the preferred embodiments, it is not limited to the present invention, and any skilled person in the art can make some modifications or equivalent embodiments without departing from the scope of the present invention, but all the technical matters of the present invention are within the scope of the present invention.
Claims (6)
1. The utility model provides a circuit board electroplates processing belt cleaning device, includes base and washing tank, its characterized in that: branch is all installed to four edges of base up end, branch and washing tank fixed connection, the fixed conical cover of washing tank lower extreme, conical cover lower extreme fixed connection pipe, the first butterfly valve of bolted connection is passed through to the connecting pipe lower extreme, the first butterfly valve other end passes through the bolted connection barrel, the barrel lower extreme passes through bolted connection second butterfly valve, the drinking-water pipe is installed to washing tank one side, the circulating pump end of intaking is connected to the drinking-water pipe other end, circulating pump water outlet end installation wet return, the wet return other end runs through in the washing tank extends, the inside lower part fixed position baffle of washing tank, a plurality of first through-holes have evenly been seted up to the baffle up end, the rubber pad is laid to the baffle upper end, a plurality of second through-holes that align with first through-hole have evenly been seted up to the terminal surface.
2. The cleaning device for electroplating processing of circuit board according to claim 1, wherein: the base up end middle part position is seted up flutedly, the recess sets up under the second butterfly valve, the round hole has been seted up to the recess inner wall, the rubber buffer has been inserted to the ann in the round hole.
3. The cleaning device for electroplating processing of circuit board according to claim 1, wherein: the outer peripheral surface of the base is fixed with a fixing plate, and the upper end surface of the fixing plate is provided with a ground pin hole.
4. The cleaning device for electroplating processing of circuit board according to claim 1, wherein: the outer surfaces of the two ends of the cylinder body are both fixedly provided with first flanges, and the first butterfly valve and the second butterfly valve are fixedly connected with the first flanges through bolts.
5. The cleaning device for electroplating processing of circuit board according to claim 1, wherein: and a second flange is fixed on the outer surface of the lower end of the connecting pipe, and the first butterfly valve is fixedly connected with the second flange through a bolt.
6. The cleaning device for electroplating processing of circuit board according to claim 1, wherein: the one end that the circulating pump was kept away from to the wet return is connected the cloth liquid pipe, the cloth liquid pipe sets up in the washing tank, and the outage of a plurality of levels form is seted up to cloth liquid pipe surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921885100.1U CN210966139U (en) | 2019-11-04 | 2019-11-04 | Circuit board electroplating processing belt cleaning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921885100.1U CN210966139U (en) | 2019-11-04 | 2019-11-04 | Circuit board electroplating processing belt cleaning device |
Publications (1)
Publication Number | Publication Date |
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CN210966139U true CN210966139U (en) | 2020-07-10 |
Family
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Family Applications (1)
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CN201921885100.1U Expired - Fee Related CN210966139U (en) | 2019-11-04 | 2019-11-04 | Circuit board electroplating processing belt cleaning device |
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CN (1) | CN210966139U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113873774A (en) * | 2021-09-15 | 2021-12-31 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
-
2019
- 2019-11-04 CN CN201921885100.1U patent/CN210966139U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113873774A (en) * | 2021-09-15 | 2021-12-31 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
CN113873774B (en) * | 2021-09-15 | 2023-08-29 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200710 |