TW404645U - Treatment tank structure with bubble elimination device - Google Patents

Treatment tank structure with bubble elimination device

Info

Publication number
TW404645U
TW404645U TW87216422U TW87216422U TW404645U TW 404645 U TW404645 U TW 404645U TW 87216422 U TW87216422 U TW 87216422U TW 87216422 U TW87216422 U TW 87216422U TW 404645 U TW404645 U TW 404645U
Authority
TW
Taiwan
Prior art keywords
treatment tank
tank structure
elimination device
bubble elimination
bubble
Prior art date
Application number
TW87216422U
Other languages
Chinese (zh)
Inventor
Jin-Shing Ju
Original Assignee
U Tah Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by U Tah Ind Co Ltd filed Critical U Tah Ind Co Ltd
Priority to TW87216422U priority Critical patent/TW404645U/en
Publication of TW404645U publication Critical patent/TW404645U/en

Links

TW87216422U 1998-10-02 1998-10-02 Treatment tank structure with bubble elimination device TW404645U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87216422U TW404645U (en) 1998-10-02 1998-10-02 Treatment tank structure with bubble elimination device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87216422U TW404645U (en) 1998-10-02 1998-10-02 Treatment tank structure with bubble elimination device

Publications (1)

Publication Number Publication Date
TW404645U true TW404645U (en) 2000-09-01

Family

ID=21636605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87216422U TW404645U (en) 1998-10-02 1998-10-02 Treatment tank structure with bubble elimination device

Country Status (1)

Country Link
TW (1) TW404645U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113873774A (en) * 2021-09-15 2021-12-31 江苏贺鸿电子有限公司 Horizontal copper deposition device for manufacturing printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113873774A (en) * 2021-09-15 2021-12-31 江苏贺鸿电子有限公司 Horizontal copper deposition device for manufacturing printed circuit board
CN113873774B (en) * 2021-09-15 2023-08-29 江苏贺鸿电子有限公司 Horizontal copper deposition device for manufacturing printed circuit board

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees