CN211047455U - PCB copper deposition device - Google Patents
PCB copper deposition device Download PDFInfo
- Publication number
- CN211047455U CN211047455U CN202020054632.7U CN202020054632U CN211047455U CN 211047455 U CN211047455 U CN 211047455U CN 202020054632 U CN202020054632 U CN 202020054632U CN 211047455 U CN211047455 U CN 211047455U
- Authority
- CN
- China
- Prior art keywords
- pcb
- copper deposition
- copper
- reagent
- reagent container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 86
- 239000010949 copper Substances 0.000 title claims abstract description 86
- 230000008021 deposition Effects 0.000 title claims abstract description 61
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 44
- 238000003756 stirring Methods 0.000 claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000001556 precipitation Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000011259 mixed solution Substances 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Chemically Coating (AREA)
- Mixers Of The Rotary Stirring Type (AREA)
Abstract
A PCB copper deposition device comprises a copper deposition pool, a PCB placing basket, a lifting mechanism and a reagent adding mechanism, wherein the PCB placing basket is provided with a plurality of PCB inserting frames, the PCB inserting frames are uniformly arranged at intervals, and an ultrasonic generator is arranged between the PCB inserting frames; the lifting mechanism comprises a bracket and a lifting motor, the bracket is erected above the copper deposition pool, the lifting motor is arranged on the bracket, the PCB placing basket is connected with the lifting motor through a hinge, and the hinge is wound on a driving shaft of the lifting motor; the reagent adding mechanism comprises a stirring device, a reagent container, a water pump and a flow valve, the reagent container is arranged beside the copper deposition pool, the stirring device is arranged at the bottom of the copper deposition pool, the reagent container is communicated with the copper deposition pool through a water pipe, and the water pump and the flow valve are arranged on the water pipe. The utility model provides a PCB copper deposition device can make the downthehole bubble of PCB board broken by shaking for hole on the PCB board can be covered by the copper, makes copper deposition thickness on the PCB board face even, and can guarantee that the solution in the copper deposition pond is in suitable concentration range.
Description
Technical Field
The utility model relates to a PCB board production field especially relates to a PCB sinks copper device.
Background
The PCB is named as a printed circuit board in Chinese, is an important electronic component, is a support body of an electronic component, and is a carrier for electrical connection of the electronic component. The copper deposition is short for chemical copper plating and is also called a plated through hole, and the PCB after drilling is subjected to oxidation-reduction reaction in a copper deposition cylinder to form a copper layer so as to metallize the hole, so that copper is deposited on the surface of the original insulating base material to achieve electrical communication between layers.
However, the existing copper deposition process has many problems.
Firstly, the copper deposition thickness of the PCB surface can not be ensured to be consistent in the copper deposition process, so that the performance of the PCB has defects. The main reason for causing the problems is that the copper deposition solution of the PCB is not uniformly distributed in the copper deposition process, and the PCB is positioned at different depths of the copper deposition solution in the copper deposition process;
secondly, the small holes in the PCB in the copper deposition cylinder can not be covered by copper due to the existence of small bubbles, so that the produced PCB has the problems of incapability of use and poor quality;
and finally, along with the continuous putting in and taking out of the PCB, the copper ions in the copper deposition tank are continuously consumed by reaction, the concentration of the solution in the copper deposition tank is reduced, and the quality of the PCB is influenced.
SUMMERY OF THE UTILITY MODEL
Based on this, there is a need to design a PCB copper deposition apparatus capable of solving the above problems.
A PCB copper deposition device comprises: a copper deposition pool, a PCB placing basket, a lifting mechanism and a reagent adding mechanism,
the PCB placing basket is provided with a plurality of PCB inserting frames, the PCB inserting frames are uniformly arranged at intervals, and ultrasonic generators are arranged among the PCB inserting frames;
the lifting mechanism comprises a bracket and a lifting motor, the bracket is erected above the copper deposition pool, the lifting motor is arranged on the bracket, the PCB placing basket is connected with the lifting motor through a hinge, and the hinge is wound on a driving shaft of the lifting motor;
the reagent adding mechanism comprises a stirring device, a reagent container, a water pump and a flow valve, wherein the reagent container is arranged beside the copper deposition tank, the bottom of the copper deposition tank is provided with the stirring device, the reagent container is communicated with the copper deposition tank through a water pipe, and the water pump and the flow valve are arranged on the water pipe.
In one embodiment, the ultrasonic frequency of the ultrasonic generator is 600Hz to 50 KHZ.
In one embodiment, the stirring device comprises a stirring motor and a stirring blade, and the stirring blade is arranged on a rotating shaft of the stirring motor.
In one embodiment, the reagent container is provided with a reagent feeding port, and the reagent feeding port is arranged at the top of the reagent container.
In one embodiment, the copper deposition device further comprises a heater, and the heater is arranged in the copper deposition pool.
Further, still include temperature sensor and display, temperature sensor set up in the heavy copper bath, temperature sensor is connected with the display electricity.
The utility model has the advantages that: according to the PCB copper deposition device, the ultrasonic generator is arranged on the side face of the PCB, and releases ultrasonic waves, so that small bubbles in holes of the PCB in the copper deposition pool are broken by vibration, and the holes of the PCB can be covered by copper; the lifting mechanism drives the PCB placing basket to move up and down in the copper deposition pool, so that the thickness of the deposited copper on the PCB surface is uniform; the reagent adding mechanism can quantitatively put reagents required by reaction into the copper precipitation tank, and ensures that the solution in the copper precipitation tank is in a proper concentration range.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a PCB copper deposition apparatus of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the PCB electroless copper plating apparatus of the present invention.
Reference numerals:
a PCB copper deposition device 10 comprises a copper deposition pool 100, a PCB placing basket 200, a lifting mechanism 300, a reagent adding mechanism 400, a PCB 500, a stirring device 410, a reagent container 420, a water pipe 421, a PCB inserting frame 210, an ultrasonic generator 220, a bracket 310, a lifting motor 320, a hinge 330, a water pump 430 and a flow valve 440.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a PCB copper deposition apparatus 10 includes a copper deposition tank 100, a PCB basket 200, a lifting mechanism 300, and a reagent adding mechanism 400,
the PCB placing basket 200 is provided with a plurality of PCB inserting frames 210, the PCB inserting frames 210 are uniformly arranged at intervals, and ultrasonic generators 220 are arranged among the PCB inserting frames 210;
specifically, PCB board 500 is put into in the PCB inserted frame 210, PCB places the basket and can places a plurality of PCB boards 500 simultaneously, processes a plurality of PCB boards 500 simultaneously, and production efficiency is high, supersonic generator 220 sets up between two PCB boards 500, supersonic generator 220 carries out ultrasonic vibration to the PCB board 500 of both sides simultaneously to destroy the tiny bubble on the PCB board 500 hole.
The lifting mechanism 300 comprises a bracket 310 and a lifting motor 320, wherein the bracket 310 is erected above the copper deposition tank 100, the lifting motor 320 is arranged on the bracket 310, the PCB placement basket 200 is connected with the lifting motor 320 through a hinge 330, and the hinge 330 is wound on a driving shaft of the lifting motor 320;
specifically, referring to fig. 2, the lifting motor rotates in a forward and reverse direction, and drives the PCB placing basket to lift up and down through the hinge, so that the PCB moves up and down in the copper deposition tank, the mixed solution in the copper deposition tank can uniformly perform copper deposition reaction on the board surface of the PCB, and the copper deposition thickness of the board surface is uniform.
The reagent adding mechanism 400 comprises a stirring device 410, a reagent container 420, a water pump 430 and a flow valve 440, wherein the reagent container 420 is arranged beside the copper precipitation tank 100, the stirring device 410 is arranged at the bottom of the copper precipitation tank 100, the reagent container 420 is communicated with the copper precipitation tank 100 through a water pipe 421, and the water pump 430 and the flow valve 440 are arranged on the water pipe 421.
Specifically, by starting the water pump, the water pump conveys the reagent in the reagent container into the copper precipitation tank to complete the addition of the reagent, so that the mixed solution in the copper precipitation tank is in the optimal reaction concentration range, the flow valve is used for controlling the flow rate of the reagent, and the stirring device enables the solution in the copper precipitation tank to be uniformly mixed.
In one embodiment, the ultrasonic frequency of the ultrasonic generator is 600HZ to 50 KHZ.
Specifically, in order to break the bubbles in the different size apertures on the PCB board, different ultrasonic frequencies are used to generate vibrations of different intensities.
In one embodiment, the stirring device includes a stirring motor and a stirring blade, and the stirring blade is disposed on a rotating shaft of the stirring motor.
Specifically, the stirring motor drives the stirring blades to rotate, and the solution in the copper precipitation tank is stirred, so that the solution in the copper precipitation tank is uniformly mixed, and preferably, the number of the rotating blades is multiple.
In one embodiment, the reagent container is provided with a reagent feeding port, and the reagent feeding port is arranged on the top of the reagent container.
Specifically, a reagent for reaction is put into the reagent container through the reagent putting port, and the reagent for reaction in the copper deposition tank is usually a copper sulfate solution, a sodium hydroxide solution, a reducing agent, a complexing agent, an accelerator and a stabilizer.
In one embodiment, the copper deposition device further comprises a heater, wherein the heater is arranged in the copper deposition pool.
Specifically, in order to ensure that the copper deposition reaction is smoothly performed, the mixed solution in the copper deposition tank needs to be heated to accelerate the efficiency of the chemical reaction.
Further, still include temperature sensor and display, temperature sensor set up in the heavy copper bath, temperature sensor is connected with the display electricity.
Specifically, the temperature sensor transmits the temperature parameter to the display, the temperature parameter is displayed by the display, and a worker monitors the temperature of the mixed solution in the copper deposition tank through the display at any time so as to adjust the heating degree of the mixed solution in the copper deposition tank by the heater.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above embodiments are only intended to illustrate some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A PCB copper deposition device is characterized by comprising: a copper deposition pool, a PCB placing basket, a lifting mechanism and a reagent adding mechanism,
the PCB placing basket is provided with a plurality of PCB inserting frames, the PCB inserting frames are uniformly arranged at intervals, and ultrasonic generators are arranged among the PCB inserting frames;
the lifting mechanism comprises a bracket and a lifting motor, the bracket is erected above the copper deposition pool, the lifting motor is arranged on the bracket, the PCB placing basket is connected with the lifting motor through a hinge, and the hinge is wound on a driving shaft of the lifting motor;
the reagent adding mechanism comprises a stirring device, a reagent container, a water pump and a flow valve, wherein the reagent container is arranged beside the copper deposition tank, the stirring device is arranged in the copper deposition tank, the reagent container is communicated with the copper deposition tank through a water pipe, and the water pump and the flow valve are arranged on the water pipe.
2. The PCB copper deposition device of claim 1, wherein the ultrasonic frequency of the ultrasonic generator is 600 Hz-50 KHZ.
3. The PCB copper deposition device of claim 1, wherein the stirring device comprises a stirring motor and a stirring blade, and the stirring blade is arranged on a rotating shaft of the stirring motor.
4. The PCB copper deposition device of claim 1, wherein the reagent container is provided with a reagent feeding port, and the reagent feeding port is arranged at the top of the reagent container.
5. The PCB copper deposition device of claim 1, further comprising a heater disposed in the copper deposition bath.
6. The PCB copper deposition device of claim 5, further comprising a temperature sensor and a display, wherein the temperature sensor is disposed in the copper deposition pool, and the temperature sensor is electrically connected with the display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020054632.7U CN211047455U (en) | 2020-01-12 | 2020-01-12 | PCB copper deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020054632.7U CN211047455U (en) | 2020-01-12 | 2020-01-12 | PCB copper deposition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211047455U true CN211047455U (en) | 2020-07-17 |
Family
ID=71530520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020054632.7U Expired - Fee Related CN211047455U (en) | 2020-01-12 | 2020-01-12 | PCB copper deposition device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211047455U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179593A (en) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
| CN113873774A (en) * | 2021-09-15 | 2021-12-31 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN115003032A (en) * | 2022-06-21 | 2022-09-02 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
-
2020
- 2020-01-12 CN CN202020054632.7U patent/CN211047455U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179593A (en) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
| CN113179593B (en) * | 2021-03-26 | 2022-09-06 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
| CN113873774A (en) * | 2021-09-15 | 2021-12-31 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN113873774B (en) * | 2021-09-15 | 2023-08-29 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN115003032A (en) * | 2022-06-21 | 2022-09-02 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
| CN115003032B (en) * | 2022-06-21 | 2023-03-07 | 东莞市国盈电子有限公司 | Motor drive control circuit board and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200717 |