JPS58144463A - Electroless copper plating method - Google Patents

Abstract

PURPOSE:To suppress the lowering in the mechanical characteristics and the precipitation speed of a plating film, by a method wherein a gas is sent into an electroless copper plating liquid to which a surfactant is added and plating is carried out while floated gas bubbles are removed. CONSTITUTION:A surfactant with foamability of 10mm. or more and foam stability of 30% or more having a polyoxyethylene chain-(CH2CH2O)n- in the molecule thereof is added to an electroless copper plating liquid in an amount of 0.01- 10wt% and a gas is sent into the obtained electroless plating liquid to form gas bubbles and plating is carried out while floated gas bubbles are removed. As the surfactant, one wherein the mole number (n) of the polyoxyethylene chain is 10 or more such as polyethylene glycol monooleyl ether is pref. used. Said gas bubbles are formed by continuously or intermittently sending air or an H2-gas to a gas sending pipe having plural small pores in the plating liquid.

Description

【発明の詳細な説明】 小児間に無電解銅めっきによって回路ケ形成する１リン
ト配勝板の表厄に筐用妊７１．る無電屏＠のっさ法に関
丁ゐもので、評しくａめつさ献り宅化に工っておこるの
つき反族の・滅燻的舟′狂の低−ドυよびめっき析出連
Ｉｆす１広下ケ州Ｊ市１」シて、安定し１ヒｊｔ９注會
もつめっさ皮膜υよひりっさ全１出込度會狗らｎる無電
掛銅めっさ伝に関する〇無電Ｍ鋼めっき＆１よって回路
ｒ形戟丁ゐ）°リント自己細板υ衣】宜ｒＪ、促米のエ
ッチフグ沃Ｖｃ↓るｌＬ！回路形戚力汰に比べて、必資
ｌ■Ｓガり吟・ＶＣ舞ｊめっさ丁ゐためｖＬ礪資碑でり
るＣと、スルポール部分と半１ｆＯ１！２Ｉ紐Ｓ分のの
っさか同時にｉこなわ７ＬるためＶｔ工程が短か（７２
ゐことなとＶ０工っ−（、世コスト化がｌ：ＩＪＭＬ　
’ｆｚたのＶＣＣ近年輻幅伸ひてさている技術でめる。DETAILED DESCRIPTION OF THE INVENTION [Detailed Description of the Invention] A 1-lint distribution board in which circuits are formed between children by electroless copper plating is used for the housing 71. It is said that it is related to the non-electronic screen @ Nossa method, and is praised for the low-density and plating deposits of the anti-zoku and anti-smoking boat mania that occur in the construction of houses. Continuing If 1 Hironoshita Gashu J City 1'', stable 1 day jt9 injection also Tsumesa film υyohirissa all 1 outgoing meeting 〇 Regarding the electricityless copper plating story Non-electro M steel plating & 1 circuit r-type cutting ゐ) ° lint self-thin plate υ cloth] YirJ, promotion rice's etch blowfish Vc↓rulL! Compared to the circuit type, it is necessary to use the S Garigin, VC Maij Messa Ding, VL 礪Investment monument, and the S part and half 1 f O 1! 2 I string S part. Is the Vt process short because 7L is completed at the same time? (72
Ikotona and V0 engineering (, world cost is l: IJML
'fz' VCC is made using technology whose convergence width has been increasing in recent years.

ところか、焦電Ｐ！Ｉ＃銅めっき故ａめっき処理τ場゛
Ｃ々っでいく内ｖＣめっき液か汚栄をｎ老化し易く、よ
尺そりめっき欣から得らｎるりつき皮膜の俄４承的椅注
お工びめっき析出速度がりつき欣汚染の影響を父けて低
下する胡１ｆ’Ｊかある。By the way, Pyroden P! I # Copper plating is a plating process in which the vC plating solution or stains are easily aged, and the slick coating obtained from the warping plating process is difficult to achieve. There is a possibility that the plating deposition rate will be reduced due to the influence of stick contamination.

燕４牌鋼めつきの′１更用していく内ＶＣおこる上配し
７ζ注目ヒの低下μ、１劉として仄弐にボ丁工りｌ無′
胤屏銅めつさ反応に孟って生°ｒるへａオＳＯ４お・よ
びＨｃｔ＋ｏＮａ　ｎどの副生成物の蓄積ｙｔよる影＃
が考えらｊＬる０ ＣｕＳ０４　・５８ｓＯ＋２ＣＨ＊０＋４ＮａＯＨ−＋
Ｃｕ’＋Ｎａ＊ＳＯ４十２ＨＣＯＯＮａ　十Ｈ重↑＋７
ｆ（、＋ＯＬかしｈ％つとλ′＠な原因としてに、グリ
ント配線丞板およびのりさレジストなどの材料から、め
る柚の成分がめっ１！ｇ甲に佃出さｎて、そｎらの？＃
＆が増大してよ配特注に影響を与える揚台の刀が多い。As the 4th Tsubame steel plated '1 is reused, VC occurs and the attention level of 7ζ decreases μ, and as 1 Liu, there is no bottoming in the 2nd place.
The shadow caused by the accumulation of by-products such as SO4, Hct+Na, and Hct+oNa, which are produced during the reaction.
I can think of 0 CuS04 ・58sO+2CH*0+4NaOH-+
Cu'+Na*SO4 12HCOONa 10H heavy ↑+7
f(,+OL+h% and λ'@) As a cause, the ingredients of meruyu from materials such as glint wiring boards and laminated resists are very much exposed to 1!gA, and so on. of?#
There are many swords of Yangtai where & increases and affects the custom order.

厚付は用無ａ′Ｍ鋼めっき敵に大抵敵崗が６０℃以上の
筒編であり田も１１以上と茜い０次輪のめっき）！Ｖ、
ざる侍るためｒＣｌ　プリント自己巌孜用泰＠ｉ　ｌ　
Ｏ時間〜３０時間めっ＠欣に陵漬される。でのために羽
科からめっ＠赦ＶＣ佃出さｎる一ｐｊ染成分も無視で＠
ない＃度にｌゐ〇従来からの方法でに、こ扛らの問題ン
少なくするために、めっき浴がバッチ方式の）Ｍ甘は候
品のめっき１〜叙サイクルで糾しいめっき敵と父侠して
いる０他方めっき慣會連続便用する揚せａ１めっき液の
１部分τ遅続的に併出しなから、純水および楽ａの電力
ＩＩｔめっき反膜、で消費ざｎる運表工９も多く２こな
い、絶え丁ν丁しい欣とメニ侯さｎる工うにして行−７
ている。Thick plated steel plated steel is mostly cylindrical knitted with a temperature of 60℃ or higher, and the plated plate is 11 or higher and has a red 0th ring)! V,
Zaru Attendance rCl Print Self Iwao Kei Yoyasu @i l
O hour ~ 30 hours @ Kin pickles. For the sake of it, I'm ignoring the pj dyeing ingredients from Haneshina.
In order to reduce these problems in conventional methods, the plating bath is batch-type). On the other hand, during the plating session, a portion of the plating solution used for continuous plating is drawn out slowly, so pure water and the electric power of the plating film are consumed. There were not many workers 9, and the Marquis of Meni was going to work with great sadness.-7
ing.

しかし、このような方法においても、めっき皮膜■倣械
的％性の低下およびめっき析出連層の低下が間趙となる
Ｊ！ｈ甘がめり、箇ためつき液の父侯や多１の粟液補光
ａ触揖的にも不都合でン）　６　。However, even in such a method, there is a problem of a decrease in the mechanical % of the plating film and a decrease in the plating precipitation interlayer. It is also inconvenient to use the succulent, boiling liquid fathers and many millet liquid supplements (a) 6.

本兄明はこり↓９な点に鑑みてなき扛たもので無′−解
銅のつき故ＶＣ１匙泡性がｌＱｍｒ＋＋以上、亀体安連
性が３０％以上υ、分子中にポリオキシエチレン鎖−＋
　ＣＨ諺Ｃｌ　ｍ　Ｏ＋　全ｔつ界囲箔性剤會ｕ、０１
〜１０厘ｆｉＬ％繞カロし、この無′亀解銅めっ酪歇ｒ
Ｃ′Ｊｆｓ気して気ｍｋ形成ざぜ、浮上した気。My brother's Akira is stiff ↓ It is a product that has not been made in view of 9 points, and because of the absence of copper decomposition, the foaming property of VC1 is more than lQmr++, the stability of the body is more than 30% υ, and polyoxyethylene in the molecule. chain −+
CH proverb Cl m O+ all t surrounding foil agent association u, 01
~ 10 liters of carbon, this free copper plated lamp
C'Jfs ki mk formation, ki surfaced.

旭τ無亀解銅めっき欣から従云しながらめっきｔ付なう
ことを籍埴とするものでわる。Asahi τ is a type of copper plated with copper plating.

丁なわち、不発＃３Ａ＋”ｘ　ｓめつき液の老化會防ぎ
での粕釆めっさ皮膜の慎械的軸性の低下およびめっき析
出速農のｉａｌ’會迎制でさる無ｔ４．屏銅りっきぬ全
提供するもので、無電解銅めりき敵に、匙Ｎ性が１Ｑｍ
ｒｎ以上、泡沫女疋性か６０％以上の、分子中にポリオ
キシエチレン鎖、ｔもつ界＋１゜活性沖］ｉｕ、ｏ＋　
〜＋ｏｎ電７ｏ硲刀口し１　この熊゛鴫牌鋼めつＩ！准
に送気して気泡全形成ざぜ、浮上した気ｒｒｅ１１［Ｊ
つき液から除去しながらめっきをおこなうことＶＬｔｂ
る〇 こｎ４ＪＪＨｔ理的にはめっ＠液に伯≦刀口したポリオ
キシエチレン鎖ｔもつ界Ｉ１１［］ｒＩ５性刑か、下式
に示すように、ポリオキシエチレン鎖の叡個のば索とカ
チオンか戊ＪＣ，Ｉ　してオキンニ２ムイオンを生じて
、その粕米ポリオキシエチレン順がオキソニクムカチオ
ンとして挙動することにｌり、そのために対イオンでめ
るアニオンとＭ台すると（ＨＵＣｆ（ｇ・ＣＣＨオ・６
・ＣＨＭ）、（Ｃ山・０・Ｃ）１　ｆｆｉ　）、−Ｃ１
４＊ＯＨＪ〔アニオン〕５ このポリオキシエチレン鎖の作用會フリント配解板用り
裁板である紙−２エノール基板について考えてみゐと、
めっ＠ａｒＸ罰配し′ｆｃＬうにＬ１！６鴎、島アルカ
リであるために、少量ではめるが水反応りフェノールや
〃ｉ水分屏によってフェノール倒加胡％１１都浴屏して
めっき欣に佃田ざ５− γしているとｆ想ざｆＬる０まためつき液にはＯＨ詠と
して水酸化アルカリを１史川するりで多１ｔυアルカリ
カチオンが伴在する０そりために、めっさ牧甲でに上式
のカチオンの個所にアルカリカナオンか＃甘し、アニオ
ンｖ１向／′５１ｆ１７ｃ佃１１ｊ成分η為姑台すると
考えらｎる〇 ポリオキシエチレン鎖を言む界囲浩性沖］μ上ＦＩＢシ
ｆＣ工９にめっき歇老化成分を取り込むｆＵ用かめる。In other words, it is possible to reduce the mechanical axis of the plating film by preventing aging of the plating solution, and to improve the plating precipitation speed. It provides all copper plating, and the N property is 1Qm compared to electroless copper plating.
rn or more, foamy or 60% or more, polyoxyethylene chain in the molecule, t + 1゜active oki] iu, o+
~+on Den 7o Kantoguchishi 1 This bear, Shikappai Haganetsu I! Air was supplied to the air, all the bubbles were formed, and the air rre11 [J
Performing plating while removing from the coating solution VLtb
ru〇kon4JJHtTheoretically, it is a field I11[]rI5 with a polyoxyethylene chain t that has a liquid ≦ t, as shown in the formula below, the polyoxyethylene chain has a number of strands and a cation. JC, I generate oxygen ions, and the lees polyoxyethylene behaves as an oxygen cation, and therefore, when the counter ion forms an anion and M units, (HUCf (g・CCH O・6
・CHM), (C mountain・0・C)1 ffi), -C1
4*OHJ [Anion] 5 Let us consider the effect of this polyoxyethylene chain on a paper-2 enol substrate, which is a cutting board for a flint distributing board.
Me @ ar Tsukudaza 5- When you use γ, you will think that the eyelash solution contains alkali hydroxide as an OH compound. It is thought that the cation in the above formula is an alkali canon or an anion v1 direction/'51f17c Tsukuda 11j component η, so it is considered to be a polyoxyethylene chain. [Oki] FIB on μ FIB fC machine 9 for fU to incorporate plating aging components.

上記作用ａホリオ干シエナレン頼＋Ｃｉ（よｃ昭へのｎ
叡が１０以上でめｆＬは好ましい。汚染成分を取ｖ込ん
だホリオキシエテレン＠會せむ界曲随性網をめっき液の
糸外に連続的ｒｃ取り出丁には、めっ＠液に送気して、
汚染成分子、堆９込んだ上記界面γ占性刑の′：ｉＬ翻
倉形成させ、浮上しん気泡’ａ＝ｌｌｆ、云することが
賊も部付の良い方法である。The above action a Horio dry Siena Ren + Ci (yo c Akira to n
It is preferable that the value is 10 or more. Continuously remove the phosphoryoxyethylene containing contaminant components from the plating solution by rc, and then blow air into the plating solution.
A good method is to form contaminant molecules and sediment at the interface γ:iL, and to form floating bubbles 'a=llf.

こり刀体りためには、めっき准に送気し′ｆｃ礪猶り起
准筐が尚くて、しかも生じた気泡會除去丁／ｂためｙｃ
泡泳女足性の動いことか必賛てめる。In order to restore the stiffness of the sword body, air must be supplied to the plated surface to remove the air bubbles that have formed.
I can't help but admire the movement of the bubble swimming woman's feet.

６− 起ｍ１住ｒＪ旧住１２關の試験管に無′亀屏銅のつき准
２５　ｍｌと９、分子中ｒｃホリオキシェテレン順を甘
む界囲后性剤を１１倉％添〃［１してよく分散させた懐
、栓をしで上下に５回振盪ちゼた貝恢υ重体ノーの灸式
奮読みとゐこと＆（Ｌより側建丁ゐ。6- Add 25 ml of copper-free and 11% of a surrounding agent that sweetens the rc-phoryoxeterene order in the molecule to a test tube of the original residence 12. 1. Disperse the shellfish well, cap it and shake it up and down 5 times.

重体１曽の＊さか佼いものほと望ましいかｌＱｍｍ以よ
ぉｊＬは艮い。重体安定性は浮上した泡沫の仮馴しにく
δであり１界ｌ］］１ｒ占性剤ＶＣと９込んだ汚東成分
紫泡床状悪で泳云する（１）でめゐから、デボであるほ
ど良い。ｌ￥ｉ１体女足注ａ起泡江とＦＪ妹の方法で振
盪し、垂直ｒＣ立て、６０分間靜直しでυさ最初の削泳
ノー長さと６０分俊のＮ諏ノー焚ざを耽みとる。泡沫層
の消削り少ないものが積ｌしく、破初の尺延の３０％以
上あγしは艮い。Is it really desirable to have someone with a serious condition? The stability of the body is δ, which is the temporary incompatibility of the bubbles that have surfaced, and the 1r occulting agent VC and the 9-containing septic component are swimming in a purple foam bed (1). The more debo the better. Shake using the method of Awae and FJ Imouto, set the body vertically, and sit quietly for 60 minutes to enjoy the first swim length and the 60 minute short N suwa no burn. There is a large amount of foam layer that has not been eroded, and the extent of the foam layer is not more than 30% of the initial elongation.

本発明で好適なｎ−［ＭＩ油性卸Ｊとしてはｂ　ｙｔ＋
えは次のＬ′：）なものかある。In the present invention, suitable n-[MI oil wholesaler J is byt+
E is the following L':).

Ｎｏ（Ｃ１（＊ＣＨ＊０）　　ｋｌ　　　　　Ｒ’アル
キル示盪たμＣＨ，ＵＣＯＲ ＣＨ，ｕ（ＣＨｘｃＨヨ０几Ｈ Ｃｔ（、＋Ｕ　（Ｃ）ｉｍｃＨｎＯ）　ｒＩ　Ｈ碌）Ａ
ＩＭはめっ＠液Ｖｔ送気した時に気泡が生成すｔＬ４ｓ
Ｗ−’Ｌ”ｈｔ”ＬｔｆｌＬ　＜　０．０１〜１０！ｉ
ｔ％で良く、十４的にに１厘重％が適当でおる〇送気す
る気体は窒気お工ひテラ累カスなどが用いら７’Ｌる。No(C1(*CH*0) kl R'alkyl indicated μCH, UCOR CH, u(CHxcHYO0几H Ct(,+U (C)imcHnO) rI H碌)A
IM @liquid Vt Bubbles are generated when air is supplied tL4s
W-'L"ht"LtflL < 0.01~10! i
t % is sufficient, and 1 liter weight % is suitable. The gas to be supplied may be nitrogen gas or the like.

一般ににめっ＠欲の安屋化方法としてｒ”ｃｖｃ公知の
エアレーションと求ねることができる。送気の方法とし
てｒＬ′空気ポンプ、尚比カスなとが便用過しる。気泡
ケつくる方法としてｒ、＋めっ＠液中に送気バイア°ｆ
：収け、このパイプＶＣ小すしケ必げてｐくかあるいｒ
ユ多孔敏ｌとをｔＸ、さこ扛Ｖｃ送気して気削會つくる
０送気時「ｉ」と浮上した泡沫層の除去は連続でも艮く
ｌた間けつ的″′ｒ：も艮い（。In general, the aeration method known as r"cvc can be used as a method to make the air bubbles. As a method of air supply, the rL' air pump, and the kasunato are commonly used. To create air bubbles. The method is r, +metal @ air supply via °f
:Settle, this pipe VC small sushi must be p or i r
The removal of the foam layer that has surfaced as ``i'' when air is blown is continuous or intermittent. (.

本発明において′改用されゐ無′也解銅めっさ准はとく
に％殊な配付のものでにない。＠堰、シｄ化却ｊ％還元
剤２工びＦＩ（脚贅剤とから成る一般の無篭屏鋼めっき
漱が用いら扛る０銅塙としては、句１ｃ［銅、ハロゲン
化鋼、硝ｍｌ’１１４ｓ　Ｂ［％］等か。The decomposed copper plating material that has been modified in the present invention is not particularly special. ＠Weir, oxidation, oxidation, j% reducing agent, 2nd process FI (leg baldness agent). Nitrogen ml'114s B [%] etc.?

蛤化剤としては、エチレンシアεン四酢ば、ロッシェル
編寺が還元剤としてはホルマリン、バラホルムアルデヒ
ド寺が、ｍＸｕ刑としてａ水酸化ナトリウム等が１史用
ざｎる０代表的な無′岨′Ｓ＋めっき赦としては、硫酸
銅６〜２０　ｇ／ｌ。Ethylene cyanide vinegar is used as a chlorinating agent, formalin and formaldehyde are used as reducing agents, and sodium hydroxide, etc. are used as reducing agents. 6 to 20 g/l of copper sulfate for S+ plating.

エチレンジアミン四酢販、銅基ｌ＃度ノ１．２〜３倍モ
ル績度菫、３７％のホルマリン水浴性２〜２５１１１１
／Ｌ田１１．５〜１ｊ口のものが好ましい。渦匿に９０
℃以下で竹うのが良い。Ethylenediaminetetra vinegar sold, copper base 1.2 to 3 times the molar degree violet, 37% formalin water bathability 2 to 251111
/L field 11.5~1j mouth is preferable. 90 in Uzuhime
It is best to store bamboo at temperatures below ℃.

央ＩＮＡ例１ めっ＠計として、硫酸銅０．０４モル／ｌ。Central INA case 1 Copper sulfate: 0.04 mol/l.

ＥＤＴＡＵ、０５モル／１％ホルムアルデヒド４１、０
５　＝ル／　ｌ　、　ＮａＣＮ　Ｏ，０００５モル／ｌ
お工ひＰＨ１０，８からｈｙる組織のも［Ｆ］を１史用
した。EDTAU, 05 mol/1% formaldehyde 41,0
5 = l/l, NaCN O, 0005 mol/l
[F] was used for the first time in a tissue whose pH ranged from 10.8.

ルーツっさＦｆｉｍ　Ｉｊｔ　ｔ、Ｉ　７１１±１℃で
バッチ方式で２０なった。Rootssa Ffim Ijt t, I 711 ± 1°C and became 20 in batch mode.

フリントｎ己勝板用基板り戯−ノエノール基板？閏用し
、めっき回路と基板との密層付与のために、丞板衣ｌ用
にＮＢｋ−フェノール禾の銀漕創忙６０μｍ渓４１ｉ−
竣化した俊其刻祖化し罠も（／Ｊ釦用いた。めっ＠故へ
のフリント配勝似用基懐ｖ、）反漬電μ、丞叡衣ｌ槙で
衣わして３００Ｊ／βで！り心。Flint n's board play - Noenol board? In order to provide a dense layer between the plating circuit and the board, we applied a 60μm layer of NBk-phenol to the plate.
The completed Shunki engraved trap (I used the /J button. Me @ Late Flint distribution similar use base v,) anti-dukeden μ, Jo Ei l Maki and clothed with 300J / β ! heart.

介萌を占１王７１］ネボリエテレ／グリコールモノオレ
イルニーアル 束水化紙表）　ｆｆｉ　１　ｇ／ｌ冷加した０めつき赦
への送気力法Ｆｕボリグロヒレンバイフに杓２軸の穴ｋ
　１　５　１１１１１１間肯Ｖ（あけた送気バイブｒめ
っき憎低■に付設し２て、めっき？＆　１　ｒｎ’あた
９１分間に１０ＬＩＪＶＪ空気紫送気した。71] Neborietere/Glycol monooleyl Nial hydration paper table) ffi 1 g/l Cooled air supply method Fu Borigurohirenbaifu with two ladle holes k
1 5 111111 interval V (attached to the open air supply vibrator R plating hate low ■ 2, plating? & 1 rn' 10 LIJVJ air was supplied for 91 minutes.

浮上し罠旭体膚を除去しながらめっき？おこなった。Plating while removing the floating trap Asahi skin? I did it.

実施ＶＵ２ 夫施？１１１の界囲を占住却］り代わ９に、ホリエチレ
ンタリコールモノーハラーノニルフェニルエーテル（Ｎ
ｏ（Ｃ）ｉ、ｃｔｉ＊０）１（ＰＭ＜ＣｖＭ＋ｅ、　ｎ
　＝　Ｉ　。Implementation VU2 Husei? 111] Instead, polyethylene tallycol monohalanolylphenyl ether (N
o(C)i,cti*0)1(PM<CvM+e, n
= I.

米宛化ｈｙ、表）１ｒＡｇ／ｌ亦〃１１シて、凹イ求Ｖ
こめっさｔ為ゝこなっｌζ０ 実施例６ 表施１ｙｉｌ　１の介曲ｒ古注卸ｊの代イフシＶＣ１ボ
リエナレンクリコールＱＪリン敵エステルでｌ＞　６　
ＧＡＩＣ。hy, table) 1rAg/l 亦11, concave request V
Example 6 Expression 1yil 1's intermediary r old note wholesaler j's representative VC1 bolienalencricol QJ rin enemy ester l> 6
G.A.I.C.

Ｒｈ；−６１０（ｎ＝　Ｉ　０以上、束部１シ、′４ｍ
　）　ｘ　＋ｇｌｄ石Ｘ力口して、１司休にυつき紮お
こなった０比教′丙 拠施例１にνいて、９気り然気１−４分こなったが浮上
したｎ３１床増ｔ、Ｔ除去しｌいでめつさｔ３こなつ７
迦０ 以上の谷実施劉において、のっさ弔１サイタルふ・よひ
第５＋ｊイタルについて、僧らｌした納めっき皮膜の耐
？１披労強腿おＬひのっさ型丁出速肢の結末を衣＋　Ｖ
ＣＣボロ耐セ「肢労独凝り測カヱσＪＩＳ−）’８１１
５に１憚したｖＲ近鼓労賦秋習でυこなつ尺Ｑ析り曲け
■のＩｆｔｈＩ牟ｅＪ千住２１１１１１１のもＶ）τ役
用し７ｔｏこのｉＡ−器にＬｌシは、耐折疲労５９ｉ度
〃）試Ｐ＋仮耐ｌでの竹り曲は１欽でボさ２’ＬるＯｐ
　甲ｙｃ　６−ｘ、Ｋ）ツさ１良厚２５　ｐｍ　Ｖ’Ｃ
侠葬し７’ｃ　１１Ｍ　’＃ンＪく丁Ｏ 表　　１ 以上ｍｌ明しπ１うＶＬ本発明に於てμ１分壬申に小す
オキシエチレン顧τもつ界面粘性剤紫黒゛…、屏のり＠
故に酪〃ｌし、こＯめっ′ｆ！ｅ、ＶＣ込気【−で気送
気ｔ形成させ、浮上した気削ｔめつさ漱から除去しな力
ふらのっさτイ丁々９ことによって。Rh; -610 (n = I 0 or more, bundle part 1, '4m
) x +gld stone T, T removed and l Metsusa t3 Konatsu 7
迦0 In the above-mentioned Tani Jitsuryu, what is the resistance of the plating film used by the monks regarding Nossa's funeral 1st and 5th +j ital? 1 The end of the strong thighs, L Hinosa type, and fast limbs + V
CC Boro Taisei "Exercise Measurement KaeσJIS-)'811
I was worried about vR near drum training in 5, and the υ Konatsu shaku Q analysis and bending ■ Ifth I MU e J Senju 2111111 was also V) τ, and 7 to this iA- device was Ll shi, bending fatigue 59i. degree) Bamboo song with trial P + provisional resistance l is 1 kin and 2'L Op
K yc 6-x, K) Tsusa 1 good thickness 25 pm V'C
7'c 11M'#nJkudingO Table 1 In the present invention, an interfacial viscosity agent having an oxyethylene concentration τ that is smaller than μ1 min. @
That's why I'm so depressed! e, VC air [-] is used to form air supply, and the surfaced air is removed from the surface by the force of the air.

めっき皮膜の僚慎的性責お工ひめつき析出速度かめっ＠
液−贅初期の置注を維う守できる。Deposition speed due to plating film
It is possible to maintain fluid injections in the early stages of swelling.

代理人弁鹿士　看　林　邦　彦 １６−Agent Benkashi Kunihiko Hayashi 16-

Claims (1)

【特許請求の範囲】 １、　無菟簿廟のつさ版に、赳層江がｌＩＪＩＩ１ｍ以
上、剋床安建注〃）６０％以止り１分子中にポリオ−ｖ
−７エナレン刺モＣｄ　＊　Ｃ１（ｚ　Ｕす　葡ｔつ界
囲后ｇ、浄１１ａ、ｏ＋〜１０厘Ｉ殖角≧力ｌし、この
無電Ｐ＃銅のつさ故に送気して気帛て層成さぞ、仔土し
た気層を無電解銅めつさ故〃１ら除云しなからのつきｔ
行ｌンことｔ待猷とする無電解ｗＵのつ＠法０ ２、界囲ｒ５！ｌＥ沖」のホリ万干ンエテレン届の七ル
畝ｎか１０以上である有針請求の範囲第１項記載の無電
Ｍ納めっき法。[Scope of Claims] 1. In the Tsusa version of the Wuxiao Temple, there is more than 1m of polio-V in one molecule, and more than 60%
-7 Enalen Stimulation Cd * C1 (z Usu Gradient world surrounding g, pure 11a, o + ~ 10 rin I angle ≧ force l, and because of this non-electrified P# copper string, air is blown and air is blown) As the layer is formed, the air layer formed by the soil is removed because of the electroless copper layer.
Row lun also known as t maiyu and electroless wU @ method 0 2, Kaiki r5! 1. Electroless M plating method according to claim 1, which has needles of 7 or more ridges (n) or more than 10.