CN104005077A - Electroplating device with optimized temperature field distribution and electroplating method thereof - Google Patents
Electroplating device with optimized temperature field distribution and electroplating method thereof Download PDFInfo
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- CN104005077A CN104005077A CN201410203254.3A CN201410203254A CN104005077A CN 104005077 A CN104005077 A CN 104005077A CN 201410203254 A CN201410203254 A CN 201410203254A CN 104005077 A CN104005077 A CN 104005077A
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Abstract
The invention provides an electroplating device with optimized temperature field distribution and an electroplating method thereof. The electroplating device comprises elements of an electroplating power supply and the like; both a workpiece to be plated and an insoluble anode are connected with an output end of the electroplating power supply; the workpiece to be plated and the insoluble anode are located inside a working groove; a liquid discharging pump is connected with a liquid discharging pipe; a liquid overflow groove is located outside the working groove; a bottom liquid feeding device is located below the working groove; a liquid overflow port is located at the top of the wall of the working groove; a liquid storing groove is located at one side of the liquid overflow groove; the electroplating power supply is used for supplying power between the insoluble anode and the workpiece to be plated for electroplating process; the working groove contains an electrolyte and is a main place for electroplating; the insoluble anode is immersed in the electrolyte and carries out an anode reaction when power is on; the bottom liquid feeding device is an inlet for the electrolyte to enter the working groove; the liquid overflow groove is a place for collecting the electrolyte flowing out from the liquid overflow port when the electroplating process is completed. The electroplating device of the invention is simple in structure, and has the characteristics of low construction cost and optimized temperature field.
Description
Technical field
The present invention relates to a kind of electroplanting device and electro-plating method thereof, particularly, relate to electroplanting device and electro-plating method thereof that a kind of optimized temperature field distributes.
Background technology
The temperature field of plating tank plays vital effect to workpiece quality of coating.Fluoroborate lead plating is a kind of conventional lead plating technique, and bath temperature is too high, and coating can roughen.Electrodeposited chromium is very strict to temperature controlled requirement, because temperature not only affects sedimentation effect, also affects coating surface quality and hardness.Obtain bright chromium coating, must strictly control temperature variation.The impact that the variation alloy of temperature is electroplated is larger.Research to nickel tungsten shows, the W content in coating is very responsive to temperature, and W content can increase along with the rising of temperature.When electrodepositing zinc-nickel alloy coating, under given current density, increase linear the increasing of nickel content in coating with temperature.If excess Temperature, also will cause cathode efficiency to reduce, cause sedimentation velocity to reduce.Research to Rhometal shows, temperature rising, and the sedimentation velocity of nickel slows down, and the iron level in coating raises, coating crystallization chap.
When plating, because the resistance of electrolytic solution can produce joule heating, cause the temperature of electrolytic solution to raise.For miniature workpiece, because the electric current adopting is less, if add strong mixing and solution circulated, the problem of local temperature rise just can not be projected into the degree that affects quality of coating.And for some larger-size workpiece, the electric current of employing is generally very large, local temperature rise is just very important, once temperature of electroplating solution field distribution is inhomogeneous, very easily cause workpiece surface thickness of coating inhomogeneous, composition is inconsistent, degradation problem under surface quality variation and coating mechanical property.
Numerous investigators have proposed to comprise swap cathode method, rotating cathode method, and pneumatic blending method etc. solves this problem.Swap cathode method be negative electrode in moving process, by disturbance electrolytic solution change temperature field distribute, accelerate mass transfer in liquid phase, less concentration polarization.In movable cathode process, the gas producing at negative electrode can also be overflowed in time, has avoided the generation of surface pinholes.Rotating cathode method is applicable to the plating of rotator, and negative electrode is in rotary course, and the tangential direction of rotating on its surface, to the raw disturbance of liquid miscarriage, reaches the object of optimized temperature field with this.Pneumatic blending method is also the method for improving plating tank temperature field of commonly using.But these methods are all unsuitable for the plating occasion of larger-size workpiece.In addition, applying these three kinds of methods all needs special equipment, and first stage of construction must have larger fund input.In equipment work, no matter be wheelwork or air compression plant, running will have very large power consumption for a long time.
Summary of the invention
For defect of the prior art, the object of this invention is to provide electroplanting device and electro-plating method thereof that a kind of optimized temperature field distributes, it is simple in structure, have that construction cost is low, the feature of optimized temperature field, do not need the complicated mechanical means such as movement, rotation, can be in whole workpiece surface deposition thin and thick evenly, uniform component, the good coating of surface quality.
According to an aspect of the present invention, the electroplanting device that provides a kind of optimized temperature field to distribute, it is characterized in that, it comprises electroplating power supply, plating workpiece, insoluble anode, work nest, Pump for giving-out, reservoir, bottom liquid inlet device, polyrrhea groove, liquid spill-way, drain pipe, plating workpiece, insoluble anode is all connected with electroplating power supply output terminal, plating workpiece and insoluble anode are all positioned at work nest inside, Pump for giving-out is connected on drain pipe, polyrrhea groove is positioned at the outside of work nest, bottom liquid inlet device is positioned at the below of work nest, liquid spill-way is positioned at the top of work nest wall, reservoir is positioned at a side of polyrrhea groove, electroplating power supply carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece, work nest has electrolytic solution and is to electroplate the main place of implementing, insoluble anode is immersed in electrolytic solution and anodic reaction occurs when energising, bottom liquid inlet device is the entrance that electrolytic solution enters work nest, polyrrhea groove has been electrolytic solution concentrated place from liquid spill-way flows out of electroplating process.
Preferably, the bottom of described bottom liquid inlet device is provided with a fluid inlet, and fluid inlet is connected with reservoir by a liquid-inlet pipe, and liquid outlet is positioned in bottom one side of polyrrhea groove, and a liquid feeding pump is installed on liquid-inlet pipe.
Preferably, described work nest adopts variable section structure, the bottom section area maximum of work nest, the topside area minimum of work nest.
Preferably, the angle between wall and the bottom surface of described work nest is 30 ° to 89 °.
Preferably, described insoluble anode surface has the hole that multiple width between centers and diameter all equate, the diameter in hole is 5 millimeters to 40 millimeters.
Preferably, described insoluble anode should and plating workpiece between distance be 10 millimeters to 80 millimeters.
Preferably, the central structure of described bottom liquid inlet device is groove, and the bottom of bottom liquid inlet device is pyramidal structure.
Preferably, the angle of the cone angle of described pyramidal structure is 90 ° to 160 °.
Preferably, the top of described bottom liquid inlet device or side are evenly provided with multiple mouth sprays.
The present invention also provides a kind of electro-plating method of electroplanting device of optimized temperature field distribution, it is characterized in that, this electro-plating method comprises the following steps: electrolytic solution is adjusted after concentration and temperature in reservoir, enters in work nest by liquid feeding pump; The flow direction of electrolytic solution in work nest is for from bottom to up; When the liquid level of work nest is during higher than liquid spill-way, the higher electrolytic solution of temperature that completes electroplating process overflows, and enters in polyrrhea groove; Liquid stream is taken the bubble of plating workpiece and insoluble anode generation out of simultaneously, avoids gas to be detained on plating workpiece and forms needle pore defect; Electrolytic solution in polyrrhea groove enters into reservoir through Pump for giving-out, starts new circulation after adjusting temperature and concentration.
Compared with prior art, the present invention has following beneficial effect: the present invention is simple in structure, have that construction cost is low, the feature of optimized temperature field, do not need the complicated mechanical means such as movement, rotation, can be in whole workpiece surface deposition thin and thick evenly, uniform component, the good coating of surface quality.The present invention is applicable to larger-size pipe, rod, roll etc. and electroplates application.
Brief description of the drawings
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 is the structural representation of the electroplanting device of optimized temperature field distribution of the present invention.
Fig. 2 is the structural representation of work nest and polyrrhea groove in the present invention.
Fig. 3 is the structural representation of insoluble anode in the present invention.
Fig. 4 is the perspective view of the first bottom liquid inlet device in the present invention.
Fig. 5 is the side structure schematic diagram of the first bottom liquid inlet device in the present invention.
Fig. 6 is the structural representation of the second bottom liquid inlet device in the present invention.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art further to understand the present invention, but not limit in any form the present invention.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, can also make some distortion and improvement.These all belong to protection scope of the present invention.
As shown in Figures 1 to 6, the electroplanting device that optimized temperature field of the present invention distributes comprises electroplating power supply 1, plating workpiece 2, insoluble anode 3, work nest 4, Pump for giving-out 5, reservoir 6, bottom liquid inlet device 7, polyrrhea groove 8, liquid spill-way 9, drain pipe 11, plating workpiece 2, insoluble anode 3 is all connected with electroplating power supply 1 output terminal, plating workpiece 2, insoluble anode 3 is all positioned at the inside of work nest 4, Pump for giving-out 5 is connected on drain pipe 11, reservoir 6 is positioned at a side of discharge 8 grooves, bottom liquid inlet device 7 is positioned at the below of work nest 4, polyrrhea groove 8 is positioned at the outside of work nest 4, liquid spill-way 9 is positioned at the top of work nest 4 walls, electroplating power supply 1 carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece, plating workpiece 2 is negative electrodes, work nest 4 has electrolytic solution and is to electroplate the main place of implementing, insoluble anode 3 is immersed in electrolytic solution and anodic reaction occurs when energising, bottom liquid inlet device 7 is entrances that electrolytic solution enters work nest, and polyrrhea groove has been electrolytic solution concentrated place from liquid spill-way flows out of electroplating process.Electrolytic solution just can flow out equably from overflow port, has avoided the inconsistent temperature field that causes of fluid field inconsistent.The solution overflowing from work nest enters polyrrhea groove, and turns back in reservoir through Pump for giving-out suction.
The bottom of bottom liquid inlet device 7 is provided with a fluid inlet 14, fluid inlet 14 is connected with reservoir 6 by a liquid-inlet pipe 12, liquid outlet 10 is positioned in bottom one side of polyrrhea groove 8, and a liquid feeding pump 13 is installed on liquid-inlet pipe 12, and the positive pole of electroplating power supply 1 output terminal is connected with conducting rod 15.
The electro-plating method of the electroplanting device that optimized temperature field of the present invention distributes comprises the following steps: electrolytic solution is adjusted after concentration and temperature in reservoir 6, enters in work nest 4 by liquid feeding pump 13; The flow direction of electrolytic solution in work nest is for from bottom to up; When the liquid level of work nest is during higher than liquid spill-way, the higher electrolytic solution of temperature that completes electroplating process overflows, and enters in polyrrhea groove, thereby has maintained the stable of temperature field in whole work nest; Liquid stream is taken the bubble of plating workpiece and insoluble anode generation out of simultaneously, avoids gas to be detained on plating workpiece and forms needle pore defect; Electrolytic solution in polyrrhea groove enters into reservoir through Pump for giving-out 5, starts new circulation after adjusting temperature and concentration; Liquid spill-way 9 should keep good parallelism with the bottom surface of work nest, and electrolytic solution will overflow equably from liquid spill-way like this, avoids the inconsistent temperature field causing of fluid field to distribute inconsistent.
The design of work nest inclined wall is the key of optimizing plating tank temperature field.Work nest shown in Fig. 2 adopts variable section structure, the bottom section area maximum of work nest, and the topside area minimum of work nest, by reaching the control to whole cell body temperature field to the control of different positions flow stream velocity.Work nest bottom area maximum, electrolyte flow rate is the slowest.More up, along with work nest reduced cross-sectional area, electrolyte flow rate also will be more and more faster.The higher electrolytic solution of temperature producing at plating workpiece surface is taken away rapidly, and leaves work nest, to reach the object of optimizing plating tank temperature field.Angle design between work nest wall and bottom surface should be considered its control to whole cell body temperature field, considers again from the condition of actual field.For example, in the situation that plating workpiece size is larger, if angle choosing is little, the floor space of whole plating tank will be very large; And angle choosing is excessive, the electrolytic solution that temperature is higher can not overflow from work nest in time, causes electrolytic solution thermograde from bottom to top, thereby the surface quality of plating workpiece is had a negative impact.Usually, this angle is selected 30 ° to 89 °, and more preferably, this angle is set as 45 ° to 80 °.If this angle is less than 30 °, in the situation that plating workpiece size is larger, the area of work nest bottom surface will be very large, and whole plating tank cell body will occupy very large area.If this angle is greater than 89 °, the electrolytic solution that temperature is higher can accumulate on top, causes electrolytic solution thermograde from bottom to top, and the quality of coating on plating workpiece is had a negative impact.If do not adopt this work nest variable section structure, due to electrodeposition process heat release, near solution plating workpiece can produce thermograde from bottom to up, is so just difficult to ensure that coating thin and thick on whole workpiece is even, uniform component, and surface quality is good.Electrolytic solution, after the water conservancy diversion of feeding device, enters in work nest equably, and flows out through the liquid spill-way parallel with work nest bottom surface.Electrolytic solution dispersed, can make near the temperature field whole plating workpiece reach unanimity.
Insoluble anode 3 surfaces shown in Fig. 3 have the hole 31 that multiple width between centers and diameter all equate, these holes are regularly arranged, and these holes have strengthened the exchange of the inside and outside electrolytic solution of anode.Electrolytic solution between variable section structure compressing wall and the anode of work nest, to the migration of plating workpiece surface, has promoted the exchange of substance of whole cell body, has optimized the temperature field of whole cell body.These regularly arranged hole width between centers are equal, and the diameter in hole 31 is 5 millimeters to 40 millimeters, and width between centers is greater than diameter.If diameter is too small, as be less than 5 millimeters, the exchange of electrolyte inside and outside anode is insufficient, causes near the excess Temperature of plating workpiece surface, affects cell body temperature field.If diameter is excessive, as be greater than 40 millimeters, anode real work area is little, and anodic current density is too high, causes anodic reaction aggravation, affects stability of solution.Insoluble anode should and plating workpiece between distance be 10 millimeters to 80 millimeters.If distance is less than 10 millimeters, anode and plating workpiece liberated heat cannot be evacuated in time, cause plating workpiece surface temperature too high.If distance is greater than 80 millimeters, bath voltage raises, and increases power consumption.
Conducting rod 15 should adopt the material identical with insoluble anode, avoids conducting rod and anode contact part to rupture because of galvanic corrosion.Conducting rod preferably adopts the mode of the direct processing such as cutting.For what should not directly shape, adopt argon arc welding technology that conducting rod and anodic bonding are connected together.
What Fig. 4 and Fig. 5 represented is the first bottom liquid inlet device.The central structure of the first bottom liquid inlet device is groove 71, and the lower end of plating workpiece directly sinks in this groove.This groove both can play effective shielding effect without the part of electroplating to workpiece, can be used as again the locating device of workpiece; The bottom of the first bottom liquid inlet device is pyramidal structure 72.The angle of the cone angle of pyramidal structure is generally 90 ° to 160 °, and more preferably, cone angle is 100 ° to 150 °.If the angle of cone angle is less than 90 °, limited to the speed adjustment of electrolytic solution, the flow velocity in work nest is too fast, also can optimize although temperature field distributes, and has increased solution circulated number of times in work nest within the identical plating cycle, has increased the burden of recycle pump.If the angle of cone angle is greater than 150 °, the speed of supplying with the electrolytic solution in work nest is excessively slow, causes electrolytic solution thermograde from bottom to top, to the mass formation disadvantageous effect of plating workpiece coating.Electrolytic solution enters into pyramidal structure from fluid inlet 14, and solution flow velocity in this structure is cushioned.The top of the first bottom liquid inlet device is evenly provided with multiple mouth sprays 73.Electrolytic solution, from mouth spray ejection at a high speed, arrives near plating workpiece surface, and the electroplate liquid of plating workpiece surface is produced to disturbance, and then optimizes the temperature field of plating workpiece surface.Electrolytic solution spouting velocity relies on the flow control of liquid feeding pump to adjust.The first bottom liquid inlet device is particularly suitable for the more electroplating process of heat release.
The second bottom liquid inlet device that Fig. 6 represents.It is with the difference of the bottom liquid inlet device that Fig. 4 and Fig. 5 represent, mouth spray is or not top and at sidepiece.Electrolytic solution mouth spray from the side sprays uniformly, then, under the promotion of follow-up electrolytic solution, raises gradually to liquid spill-way 9, finally enters polyrrhea groove.Electrolytic solution dispersed, can optimize the temperature field of plating workpiece surface.
Above specific embodiments of the invention are described.It will be appreciated that, the present invention is not limited to above-mentioned specific embodiment, and those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (10)
1. the electroplanting device that optimized temperature field distributes, it is characterized in that, it comprises electroplating power supply, plating workpiece, insoluble anode, work nest, Pump for giving-out, reservoir, bottom liquid inlet device, polyrrhea groove, liquid spill-way, drain pipe, plating workpiece, insoluble anode is all connected with electroplating power supply output terminal, plating workpiece and insoluble anode are all positioned at work nest inside, Pump for giving-out is connected on drain pipe, polyrrhea groove is positioned at the outside of work nest, bottom liquid inlet device is positioned at the below of work nest, liquid spill-way is positioned at the top of work nest wall, reservoir is positioned at a side of polyrrhea groove, electroplating power supply carries out electroplating process for energising between above-mentioned insoluble anode and plating workpiece, work nest has electrolytic solution and is to electroplate the main place of implementing, insoluble anode is immersed in electrolytic solution and anodic reaction occurs when energising, bottom liquid inlet device is the entrance that electrolytic solution enters work nest, polyrrhea groove has been electrolytic solution concentrated place from liquid spill-way flows out of electroplating process.
2. the electroplanting device that optimized temperature field according to claim 1 distributes, it is characterized in that, the bottom of described bottom liquid inlet device is provided with a fluid inlet, fluid inlet is connected with reservoir by a liquid-inlet pipe, liquid outlet is positioned in bottom one side of polyrrhea groove, and a liquid feeding pump is installed on liquid-inlet pipe.
3. the electroplanting device that optimized temperature field according to claim 1 distributes, is characterized in that, described work nest adopts variable section structure, the bottom section area maximum of work nest, the topside area minimum of work nest.
4. the electroplanting device that optimized temperature field according to claim 1 distributes, is characterized in that, the angle between wall and the bottom surface of described work nest is 30 ° to 89 °.
5. the electroplanting device that optimized temperature field according to claim 1 distributes, is characterized in that, described insoluble anode surface has the hole that multiple width between centers and diameter all equate, the diameter in hole is 5 millimeters to 40 millimeters.
6. the electroplanting device that optimized temperature field according to claim 1 distributes, is characterized in that, described insoluble anode should and plating workpiece between distance be 10 millimeters to 80 millimeters.
7. the electroplanting device that optimized temperature field according to claim 1 distributes, is characterized in that, the central structure of described bottom liquid inlet device is groove, and the bottom of bottom liquid inlet device is pyramidal structure.
8. the electroplanting device that optimized temperature field according to claim 7 distributes, is characterized in that, the angle of the cone angle of described pyramidal structure is 90 ° to 160 °.
9. the electroplanting device that optimized temperature field according to claim 1 distributes, is characterized in that, the top of described bottom liquid inlet device or side are evenly provided with multiple mouth sprays.
10. an electro-plating method for the electroplanting device that optimized temperature field distributes, is characterized in that, this electro-plating method comprises the following steps: electrolytic solution is adjusted after concentration and temperature in reservoir, enters in work nest by liquid feeding pump; The flow direction of electrolytic solution in work nest is for from bottom to up; When the liquid level of work nest is during higher than liquid spill-way, the higher electrolytic solution of temperature that completes electroplating process overflows, and enters in polyrrhea groove; Liquid stream is taken the bubble of plating workpiece and insoluble anode generation out of simultaneously, avoids gas to be detained on plating workpiece and forms needle pore defect; Electrolytic solution in polyrrhea groove enters into reservoir through Pump for giving-out, starts new circulation after adjusting temperature and concentration.
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Cited By (8)
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| CN106149032A (en) * | 2016-08-15 | 2016-11-23 | 深圳市五株科技股份有限公司 | A kind of plating cylinder |
| CN106149034A (en) * | 2016-08-15 | 2016-11-23 | 深圳市五株科技股份有限公司 | A kind of plating cylinder |
| CN106283166A (en) * | 2016-09-09 | 2017-01-04 | 西北工业大学 | A kind of device for preparing hollow work-piece inner surface Ni SiC composite deposite |
| CN106917132A (en) * | 2017-04-27 | 2017-07-04 | 北京纽堡科技有限公司 | A kind of electroplanting device |
| CN108950625A (en) * | 2018-06-21 | 2018-12-07 | 上海交通大学 | Chromium-treated electroplating system is electroplated for revolving body workpieces |
| CN109023458A (en) * | 2018-08-13 | 2018-12-18 | 珠海市万顺睿通科技有限公司 | A kind of electroplanting device and method of PCB circuit board |
| CN112323131A (en) * | 2020-11-03 | 2021-02-05 | 重庆圣盈达科技开发有限公司 | Method for removing bubbles on surface of electroplated workpiece |
| CN112342601A (en) * | 2020-11-03 | 2021-02-09 | 重庆圣盈达科技开发有限公司 | Novel electroplating stirring device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106283166A (en) * | 2016-09-09 | 2017-01-04 | 西北工业大学 | A kind of device for preparing hollow work-piece inner surface Ni SiC composite deposite |
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| CN108950625A (en) * | 2018-06-21 | 2018-12-07 | 上海交通大学 | Chromium-treated electroplating system is electroplated for revolving body workpieces |
| CN108950625B (en) * | 2018-06-21 | 2020-02-21 | 上海交通大学 | Electroplating system for electroplating chromium on revolving body workpiece |
| CN109023458A (en) * | 2018-08-13 | 2018-12-18 | 珠海市万顺睿通科技有限公司 | A kind of electroplanting device and method of PCB circuit board |
| CN112323131A (en) * | 2020-11-03 | 2021-02-05 | 重庆圣盈达科技开发有限公司 | Method for removing bubbles on surface of electroplated workpiece |
| CN112342601A (en) * | 2020-11-03 | 2021-02-09 | 重庆圣盈达科技开发有限公司 | Novel electroplating stirring device |
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