CN113873774A - Horizontal copper deposition device for manufacturing printed circuit board - Google Patents
Horizontal copper deposition device for manufacturing printed circuit board Download PDFInfo
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- CN113873774A CN113873774A CN202111082928.5A CN202111082928A CN113873774A CN 113873774 A CN113873774 A CN 113873774A CN 202111082928 A CN202111082928 A CN 202111082928A CN 113873774 A CN113873774 A CN 113873774A
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- copper deposition
- horizontal copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the technical field of printed circuit board manufacturing, in particular to a horizontal copper deposition device for printed circuit board manufacturing, which comprises a horizontal copper deposition liquid tank, wherein a liquid pumping pipe is arranged at the bottom of the horizontal copper deposition liquid tank, one end of the liquid pumping pipe, which is far away from the horizontal copper deposition liquid tank, is connected with a liquid inlet end of a circulating pump, a liquid outlet end of the circulating pump is provided with a liquid conveying pipe, one end of the liquid conveying pipe, which is far away from the circulating pump, extends to the lower part in a cylinder body, the upper end of the cylinder body is in an open shape and is fixedly connected with a horn mouth with a wide upper part and a narrow lower part, a conical cover with a wide upper part and a narrow lower part is sleeved on the horn mouth, a floating plate capable of sliding up and down along the cylinder body is sleeved on the cylinder body, and a thick vinylon cloth block is paved on the floating plate, and compared with the prior art, the horizontal copper deposition device has the following beneficial effects: the method can prevent bubbles generated due to too high reflow speed of the horizontal copper deposition solution, reduce the influence on the horizontal copper deposition processing effect of the printed circuit board to the maximum extent, and reduce the reject ratio of the printed circuit board.
Description
Technical Field
The invention relates to a horizontal copper deposition device for manufacturing a printed circuit board, belonging to the technical field of manufacturing of printed circuit boards.
Background
The horizontal copper deposition process is widely applied to the production and processing of printed circuit boards, and mainly aims to deposit a layer of copper on a non-conductive base material through a series of chemical treatment methods, and then thicken the copper through a subsequent electroplating method to achieve the designed specific thickness. At present, in order to make the horizontal copper deposition liquid fully contact with the printed circuit board, the horizontal copper deposition liquid in the horizontal copper deposition liquid tank is usually circulated by a circulating pump, but the horizontal copper deposition liquid which flows into the horizontal copper deposition liquid tank again easily generates bubbles due to large flow velocity, so that the horizontal copper deposition processing effect of the printed circuit board is influenced, and the rejection rate of the printed circuit board is increased.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a horizontal copper deposition device for manufacturing a printed circuit board, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention is realized by the following technical scheme: a horizontal copper deposition device for printed circuit board manufacture comprises a horizontal copper deposition liquid tank, wherein a liquid suction pipe is installed at the bottom of the horizontal copper deposition liquid tank, one end of the liquid suction pipe, which is far away from the horizontal copper deposition liquid tank, is connected with a liquid inlet end of a circulating pump, the liquid outlet end of the circulating pump is provided with a liquid conveying pipe, one end of the liquid conveying pipe, which is far away from the circulating pump, extends to the lower position in a barrel body, the diameter of the barrel body is larger than that of the liquid conveying pipe and is vertically arranged in the horizontal copper deposition liquid tank, the upper end of the barrel body is in an opening shape and is fixedly connected with a horn mouth with an upper width and a lower width, a conical cover with an upper width and a lower width is sleeved on the horn mouth and is fixedly connected with the barrel body, the upper end of the conical cover is in a gap for horizontal copper deposition liquid flow, a floating plate capable of sliding up and down along the barrel body is sleeved on the barrel body, a thick vinylon the floating plate a thick vinylon cloth block is paved, the thick vinylon cloth block is sleeved on the cylinder body.
Specifically, the outer fixed surface of the cylinder is connected with a limiting strip arranged along the length direction of the cylinder, the floating plate is of a disc-shaped hollow structure, a first limiting groove matched with the limiting strip is formed in the inner surface of the floating plate, the thick vinylon cloth block is of a disc-shaped hollow structure, a second limiting groove coincided with the first limiting groove is formed in the inner surface of the thick vinylon cloth block in a processing mode, and the limiting strip penetrates through the first limiting groove and the second limiting groove.
Specifically, three first round hole has been seted up to the kickboard upper surface for annular equidistance, thick vinylon cloth piece upper surface is annular equidistance and sets up three second round hole with first round hole coincidence mutually, first round hole internal fixation has last barrel casing, it is the opening form to go up the barrel casing lower extreme, it runs through the second round hole and extends to thick vinylon cloth piece upside to go up the barrel casing upper end, it has the external screw thread to go up the barrel casing lower extreme and extend to the kickboard downside and process, it has lower barrel casing to go up barrel casing lower extreme threaded connection, the barrel casing lower extreme is the closed form down, the interior surface machining of lower barrel casing has the internal thread with external screw thread matched with.
Specifically, the upper sleeve upper surface is fixed with last sleeve fixedly connected with breather pipe, breather pipe upper end threaded connection has the screw thread lid.
Specifically, the lower sleeve opening end fixedly connected with seal cover, the seal cover is established on the upper sleeve, the seal cover evenly is fixed with a plurality of pin poles towards the one side of lower sleeve, a plurality of and pin pole matched with pinhole have evenly been seted up to the one side of lower sleeve towards the seal cover, the pin pole is fixed in the pinhole.
Specifically, top intermediate position fixedly connected with vertical arrangement's double-screw bolt in the conical cover, threaded connection has the thread bush on the double-screw bolt, the thread bush sets up in the barrel, two branches of thread bush surface symmetry fixedly connected with, the one end and the barrel inner wall fixed connection of thread bush are kept away from to branch.
Specifically, lower part position is equipped with the cyclic annular expansion pipe of volume expansion in the conical cover, the expansion pipe pastes with the conical cover mutually, the expansion pipe surface links to each other with the connecting pipe and communicates with each other, the one end that the expansion pipe was kept away from to the connecting pipe links to each other with the inflator and communicates with each other, the inflator is vertical form and arranges and the inflator surface keeps away from the one end fixedly connected with connecting rod of connecting pipe, the one end and the conical cover fixed connection of inflator are kept away from to the connecting rod, slidable mounting has the piston in the inflator, surface middle part position installs the screw rod on the piston, the screw rod upper end extends to the inflator upside and with inflator threaded connection.
Specifically, one end of the infusion tube, which is positioned at the bottom in the barrel body, is connected and communicated with a cylinder for dispersing the horizontally-deposited copper liquid, the two ends of the cylinder are both closed, and the outer surface of the cylinder is uniformly provided with a plurality of liquid outlet holes.
Specifically, the bottom of the horizontal copper deposition liquid tank is in an opening shape and is fixedly connected with a trapezoidal groove with a wide upper part and a narrow lower part, two support plates which are vertically arranged are arranged on two sides of the trapezoidal groove, a bottom plate with holes is fixedly connected to the edge of the lower part of one side, which is far away from the trapezoidal groove, of each support plate, a plurality of weight reducing ports are uniformly formed in one side, facing the trapezoidal groove, of each support plate, a liquid discharge pipe is installed on the lower part of one side of the trapezoidal groove, and a liquid discharge valve is installed at one end, far away from the trapezoidal groove, of each liquid discharge pipe.
The invention has the beneficial effects that:
1. the invention relates to a horizontal copper deposition device made of a printed circuit board, which realizes the purpose of reducing the flow rate of horizontal copper deposition liquid in the first step when the horizontal copper deposition liquid in a liquid conveying pipe flows into a cylinder under the working action of a circulating pump because the diameter of the cylinder is larger than that of the liquid conveying pipe, the horizontal copper deposition liquid overflows from a bell mouth along with the increase of the horizontal copper deposition liquid in the cylinder, the horizontal copper deposition liquid falls into the inner surface of a conical cover under the action of the bell mouth, then the horizontal copper deposition liquid flows downwards along the outer wall of the cylinder to play the purpose of reducing the flow rate of the horizontal copper deposition liquid in the second step, the horizontal copper deposition liquid flowing along the cylinder is contacted with a thick vinylon cloth block and then permeates into the thick vinylon cloth block to realize the purpose of reducing the flow in the third step, and then the horizontal copper deposition liquid flows back into a horizontal copper deposition liquid tank from the thick vinylon cloth block at a smaller flow rate to prevent the bubbles from being generated due to the overhigh return speed of the horizontal copper deposition liquid, the influence on the horizontal copper deposition processing effect of the printed circuit board is reduced to the maximum extent, and the reject ratio of the printed circuit board is reduced.
2. According to the horizontal copper deposition device for manufacturing the printed circuit board, the relative position of the lower cylinder sleeve and the upper cylinder sleeve is adjusted according to needs, and then the volume formed by the upper cylinder sleeve and the lower cylinder sleeve is increased or reduced until half of the thick vinylon cloth block is in the horizontal copper deposition liquid, so that the size of the buoyancy force borne by the floating plate is adjusted, the thick vinylon cloth block can conveniently rise or fall along the liquid level of the horizontal copper deposition liquid, and even if half of the thick vinylon cloth block is immersed in the horizontal copper deposition liquid.
3. According to the horizontal copper deposition device manufactured by the printed circuit board, the screw rod is screwed, and then the screw rod drives the piston to descend or ascend in the air cylinder, so that air in the air cylinder flows into the expansion pipe or air in the expansion pipe flows into the air cylinder, the size of the expansion pipe is adjusted, the purpose of conveniently adjusting the size of a gap between the conical cover and the cylinder body is achieved, and the horizontal copper deposition liquid can flow along the surface of the cylinder body.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a horizontal copper deposition apparatus for manufacturing a printed circuit board according to the present invention;
FIG. 2 is an enlarged view of the position A of the horizontal copper deposition device for manufacturing the printed circuit board according to the present invention;
FIG. 3 is a schematic view of an assembly of a circulating pump and a horizontal copper deposition bath in the horizontal copper deposition apparatus for manufacturing a printed circuit board according to the present invention;
FIG. 4 is a schematic view of the assembly of the cone-shaped cover and the cylinder in the horizontal copper deposition device for manufacturing the printed circuit board according to the present invention;
FIG. 5 is an assembly diagram of a limiting strip, a bell mouth and a cylinder in the horizontal copper deposition device manufactured by the printed circuit board of the present invention;
FIG. 6 is a perspective view of a floating plate in a horizontal copper deposition apparatus for manufacturing a printed circuit board according to the present invention;
FIG. 7 is a perspective view of a vinylon cloth block in a horizontal copper deposition apparatus for manufacturing a printed circuit board according to the present invention;
FIG. 8 is a perspective view of an upper sleeve of a horizontal copper deposition device for manufacturing a printed circuit board according to the present invention;
FIG. 9 is a perspective view of a lower sleeve of the horizontal copper deposition device for manufacturing a printed circuit board according to the present invention;
FIG. 10 is a schematic view showing the assembly of the gas cylinder, the expansion tube and the conical cover in the horizontal copper deposition device made of the printed circuit board of the present invention;
in the figure: 1. the device comprises a horizontal copper precipitation liquid tank, 2, a trapezoid groove, 3, a liquid discharge valve, 4, a liquid discharge pipe, 5, a support plate, 6, a bottom plate, 7, a weight reduction port, 8, a liquid delivery pipe, 9, a conical cover, 10, a threaded cover, 11, a vent pipe, 12, an upper sleeve, 13, a lower sleeve, 14, a barrel body, 15, a floating plate, 16, a thick vinylon cloth block, 17, a circulating pump, 18, a liquid suction pipe, 19, a stud, 20, a horn mouth, 21, a support rod, 22, a threaded sleeve, 23, a limiting strip, 24, a first limiting groove, 25, a first round hole, 26, a second limiting groove, 27, a second round hole, 28, a sealing sleeve, 29, a cylinder, 30, a liquid outlet hole, 31, an expansion pipe, 32, a connecting pipe, 33, an air cylinder, 34, a piston, 35 and a screw rod.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides a heavy copper installation of level of printed circuit board preparation, including the heavy copper cistern of level 1, the liquid suction pipe 18 is installed to the heavy copper cistern of level 1 bottom, liquid suction pipe 18 keeps away from the one end that the heavy copper cistern of level 1 and connects circulating pump 17 feed liquor end, circulating pump 17 goes out the liquid end and installs transfer line 8, during operation circulating pump 17, under circulating pump 17 work effect, the heavy copper liquor of level flows into transfer line 8 through liquid suction pipe 18 in, the heavy copper liquor of level flows back to the heavy copper cistern of level 1 from transfer line 8 afterwards.
One end of the infusion tube 8, which is far away from the circulating pump 17, extends to the lower part of the interior of the tube body 14, the diameter of the tube body 14 is larger than that of the infusion tube 8 and is vertically arranged in the horizontal copper deposition liquid tank 1, the upper end of the tube body 14 is in an opening shape and is fixedly connected with a horn mouth 20 with a wide upper part and a narrow lower part, a conical cover 9 with a wide upper part and a narrow lower part is sleeved on the horn mouth 20, the conical cover 9 is fixedly connected with the tube body 14, the upper end of the conical cover 9 is in a closed shape, a gap for flowing horizontal copper deposition liquid exists between the small end of the conical cover 9 and the outer surface of the tube body 14, a floating plate 15 capable of sliding up and down along the tube body 14 is sleeved on the tube body 14, a thick vinylon cloth 16 is paved on the floating plate 15, the thick vinylon cloth 16 is sleeved on the tube body 14, when the horizontal copper deposition liquid in the infusion tube 8 flows into the tube body 14 under the working action of the circulating pump 17, the diameter of the tube body 14 is larger than that the diameter of the tube 14, so as to realize the purpose of slowing down the horizontal copper deposition liquid at the first step, along with the increase of the horizontal copper deposition liquid in the cylinder 14, the horizontal copper deposition liquid overflows from the bell mouth 20, and under the action of the bell mouth 20, the horizontal copper deposition liquid falls into the inner surface of the conical cover 9, then the horizontal copper deposition liquid flows downwards along the outer wall of the cylinder 14, the purpose of slowing down the flow rate of the horizontal copper deposition liquid in the second step is achieved, the horizontal copper deposition liquid flowing along the cylinder 14 is contacted with the thick vinylon cloth 16 and then permeates into the thick vinylon cloth 16, the purpose of slowing down the flow in the third step is achieved, then the horizontal copper deposition liquid flows back into the horizontal copper deposition liquid tank 1 from the thick vinylon cloth 16 at a small flow rate, bubbles caused by the fact that the backflow speed of the horizontal copper deposition liquid is too fast are prevented, the influence on the horizontal copper deposition processing effect of the printed circuit board is reduced to the maximum extent, and the reject ratio of the printed circuit board is reduced.
As an embodiment of the present invention: referring to fig. 2, 5, 6 and 7, the outer surface of the cylinder 14 is fixedly connected with a limiting strip 23 arranged along the length direction of the cylinder 14, the floating plate 15 is of a disc-shaped hollow structure, the inner surface of the floating plate 15 is provided with a first limiting groove 24 matched with the limiting strip 23, the thick vinylon cloth 16 is of a disc-shaped hollow structure, the inner surface of the thick vinylon cloth 16 is provided with a second limiting groove 26 overlapped with the first limiting groove 24, so that the limiting strip 23 penetrates through the first limiting groove 24 and the second limiting groove 26, and the floating plate 15 is prevented from rotating around the cylinder 14.
As an embodiment of the present invention: referring to fig. 1, 2, 6, 7 and 8, the upper surface of the floating plate 15 is provided with three first circular holes 25 at equal intervals in a ring shape, the upper surface of the thick vinylon cloth 16 is provided with three second circular holes 27 at equal intervals in a ring shape, which coincide with the first circular holes 25, an upper sleeve 12 is fixed in the first circular holes 25, the lower end of the upper sleeve 12 is in an open shape, the upper end of the upper sleeve 12 extends to the upper side of the thick vinylon cloth 16 through the second circular holes 27, the lower end of the upper sleeve 12 extends to the lower side of the floating plate 15 and is provided with external threads, the lower end of the upper sleeve 12 is in threaded connection with a lower sleeve 13, the lower end of the lower sleeve 13 is in a closed shape, the internal threads matched with the external threads are processed on the inner surface of the lower sleeve 13, the relative position of the lower sleeve 13 and the upper sleeve 12 is adjusted as required, and the volume formed by the upper sleeve 12 and the lower sleeve 13 is increased or decreased until half of the thick vinylon cloth 16 is in the horizontal copper-sinking solution, the floating plate 15 can be adjusted in buoyancy, so that the thick vinylon cloth 16 can conveniently rise or fall along with the liquid level of the horizontal copper immersion liquid, even if half of the thick vinylon cloth 16 is immersed in the horizontal copper immersion liquid.
As an embodiment of the present invention: referring to fig. 1, 2 and 8, a vent pipe 11 is fixedly connected to the upper sleeve 12 and fixed to the upper surface of the upper sleeve 12, a screw cap 10 is threadedly connected to the upper end of the vent pipe 11, and after the screw cap 10 is removed, air can conveniently enter and exit a space formed by the upper sleeve 12 and the lower sleeve 13 through the vent pipe 11.
As an embodiment of the present invention: referring to fig. 9, a sealing sleeve 28 is fixedly connected to an opening end of the lower sleeve 13, the sealing sleeve 28 is sleeved on the upper sleeve 12, a plurality of pin rods are uniformly fixed on one surface of the sealing sleeve 28 facing the lower sleeve 13, a plurality of pin holes matched with the pin rods are uniformly formed on one surface of the lower sleeve 13 facing the sealing sleeve 28, the pin rods are fixed in the pin holes, the connection reliability of the sealing sleeve 28 and the lower sleeve 13 is improved, and the sealing sleeve 28 prevents water and flat copper liquid from entering a space formed by the lower sleeve 13 and the upper sleeve 12.
As an embodiment of the present invention: referring to fig. 4, a vertically arranged stud 19 is fixedly connected to the middle position of the inner top of the conical cover 9, a threaded sleeve 22 is connected to the stud 19 in a threaded manner, the threaded sleeve 22 is arranged in the cylinder 14, two support rods 21 are symmetrically and fixedly connected to the outer surface of the threaded sleeve 22, one ends of the support rods 21, which are far away from the threaded sleeve 22, are fixedly connected to the inner wall of the cylinder 14, and the stud 19 is screwed into the threaded sleeve 22 to complete connection between the conical cover 9 and the cylinder 14, so that the conical cover 9 can be conveniently disassembled and assembled.
As an embodiment of the present invention: referring to fig. 10, a volume-expandable annular expansion tube 31 is disposed at a lower position inside the conical cover 9, the expansion tube 31 is adhered to the conical cover 9, an outer surface of the expansion tube 31 is connected to a connection tube 32, an end of the connection tube 32 away from the expansion tube 31 is connected to an air cylinder 33, the air cylinder 33 is vertically disposed, an end of the outer surface of the air cylinder 33 away from the connection tube 32 is fixedly connected to a connection rod, an end of the connection rod away from the air cylinder 33 is fixedly connected to the conical cover 9, a piston 34 is slidably mounted in the air cylinder 33, a screw 35 is mounted at a middle position of an upper surface of the piston 34, an upper end of the screw 35 extends to an upper side of the air cylinder 33 and is in threaded connection with the air cylinder 33, the screw 35 is screwed, and the piston 34 is driven by the screw 35 to descend or ascend inside the air cylinder 33, so that air in the air cylinder 33 flows into the expansion tube 31 or air in the expansion tube 31 flows into the air cylinder 33, thereby adjusting the volume of the expansion tube 31, the purpose of conveniently adjusting the size of the gap between the conical cover 9 and the cylinder 14 is achieved, and the horizontal copper deposition liquid can flow along the surface of the cylinder 14.
As an embodiment of the present invention: referring to fig. 4, one end of the infusion tube 8, which is located at the bottom inside the tube body 14, is connected and communicated with a cylinder 29 for dispersing the horizontal copper deposition solution, two ends of the cylinder 29 are both closed, a plurality of liquid outlet holes 30 are uniformly formed in the outer surface of the cylinder 29, and the cylinder 29 with the liquid outlet holes 30 is mounted on the infusion tube 8, so that the horizontal copper deposition solution is uniformly dispersed in the tube body 14.
As an embodiment of the present invention: referring to fig. 1, the bottom of a horizontal copper deposition liquid tank 1 is open and fixedly connected with a trapezoidal groove 2 which is wide at the top and narrow at the bottom, two support plates 5 which are vertically arranged are arranged on two sides of the trapezoidal groove 2, a bottom plate 6 with holes is fixedly connected to the edge of the lower portion of one side of each support plate 5, which deviates from the trapezoidal groove 2, a plurality of weight reducing ports 7 are uniformly formed in one side of each support plate 5, a liquid discharge pipe 4 is installed at the lower portion of one side of each trapezoidal groove 2, a liquid discharge valve 3 is installed at one end, which is far away from the trapezoidal groove 2, of each liquid discharge pipe 4, the bottom plate 6 is fixed at a required position, and the positions of the support plates 5 are fixed, namely, the position of the horizontal copper deposition liquid tank 1 is limited, and when the liquid discharge valve 3 is opened, horizontal copper deposition liquid is collected in the trapezoidal groove 2 and is discharged through the liquid discharge pipe 4.
The specific implementation mode is as follows: under the working action of the circulating pump 17, when the horizontal copper deposition liquid in the liquid conveying pipe 8 flows into the cylinder 14, the diameter of the cylinder 14 is larger than that of the liquid conveying pipe 8, so that the aim of reducing the flow rate of the horizontal copper deposition liquid in the first step is fulfilled, the horizontal copper deposition liquid overflows from the bell mouth 20 along with the increase of the horizontal copper deposition liquid in the cylinder 14, and under the action of the bell mouth 20, the horizontal copper deposition liquid falls into the inner surface of the conical cover 9, then the horizontal copper deposition liquid flows downwards along the outer wall of the cylinder 14, so that the aim of reducing the flow rate of the horizontal copper deposition liquid in the second step is fulfilled, the horizontal copper deposition liquid flowing along the cylinder 14 is contacted with the thick vinylon cloth 16 and then permeates into the thick vinylon cloth 16, so that the aim of reducing the flow in the third step is fulfilled, then the horizontal copper deposition liquid flows back into the horizontal copper deposition liquid tank 1 from the thick vinylon the basis of a small flow rate, bubbles caused by the excessively high return speed of the horizontal copper deposition liquid are prevented, and the influence on the horizontal copper deposition processing effect of the printed circuit board is reduced to the maximum extent, the reject ratio of the printed circuit board is reduced.
The relative position of the lower cylinder sleeve 13 and the upper cylinder sleeve 12 is adjusted according to the requirement, and then the volume formed by the upper cylinder sleeve 12 and the lower cylinder sleeve 13 is increased or reduced until half of the thick vinylon cloth 16 is in the horizontal copper-sinking liquid, so that the buoyancy force applied to the floating plate 15 is adjusted, the thick vinylon cloth 16 can conveniently rise or fall along with the liquid level of the horizontal copper-sinking liquid, and even if half of the thick vinylon cloth 16 is immersed in the horizontal copper-sinking liquid.
The screw rod 35 is screwed, and the screw rod 35 drives the piston 34 to descend or ascend in the air cylinder 33, so that air in the air cylinder 33 flows into the expansion pipe 31 or air in the expansion pipe 31 flows into the air cylinder 33, the size of the expansion pipe 31 is adjusted, the purpose of conveniently adjusting the size of a gap between the conical cover 9 and the cylinder 14 is achieved, and the horizontal copper deposition liquid can flow along the surface of the cylinder 14.
Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.
Claims (9)
1. The utility model provides a heavy copper installation of level of printed circuit board preparation, includes heavy copper cistern of level (1), its characterized in that: liquid suction pipe (18) is installed to horizontal heavy copper cistern (1) bottom, liquid suction pipe (18) is kept away from the one end connection circulating pump (17) feed liquor end of horizontal heavy copper cistern (1), circulating pump (17) goes out the liquid end and installs transfer line (8), the one end that circulating pump (17) were kept away from to transfer line (8) extends to lower part position in barrel (14), barrel (14) diameter is greater than the diameter and the vertical arrangement of transfer line (8) and is in horizontal heavy copper cistern (1), barrel (14) upper end is opening form and fixedly connected with goes up narrow horn mouth (20) under the width, the cover is equipped with on horn mouth (20) and goes up narrow bell jar (9) under the width, bell jar (9) and barrel (14) fixed connection, there is the clearance that is used for horizontal heavy copper liquid to flow for closed form and bell jar (9) stub end and barrel (14) surface on bell jar (9), the novel multifunctional bathtub is characterized in that a floating plate (15) capable of sliding up and down along the bathtub body (14) is sleeved on the bathtub body (14), a thick vinylon cloth block (16) is paved on the floating plate (15), and the bathtub body (14) is sleeved with the thick vinylon cloth block (16).
2. The horizontal copper deposition device for manufacturing the printed circuit board according to claim 1, wherein: barrel (14) surface fixed connection has along spacing (23) that barrel (14) length direction arranged, kickboard (15) are disc hollow structure, kickboard (15) internal surface is seted up with spacing (23) matched with first spacing groove (24), thick vinylon cloth piece (16) are disc hollow structure, thick vinylon cloth piece (16) internal surface processing has second spacing groove (26) of coinciding mutually with first spacing groove (24), second spacing groove (26) are run through in spacing (23).
3. The horizontal copper deposition device for manufacturing the printed circuit board according to claim 2, wherein: three first round hole (25) have been seted up to kickboard (15) upper surface for annular equidistance, thick vinylon cloth piece (16) upper surface is annular equidistance and has seted up three second round hole (27) with first round hole (25) coincidence mutually, first round hole (25) internal fixation has last barrel casing (12), it describes for the opening to go up barrel casing (12) lower extreme, it runs through second round hole (27) and extends to thick vinylon cloth piece (16) upside to go up barrel casing (12) upper end, it extends to kickboard (15) downside and processes to go up barrel casing (12) lower extreme threaded connection and has lower barrel casing (13), barrel casing (13) lower extreme is the closed form down, barrel casing (13) internal surface processing has the internal thread with external thread matched with down.
4. The horizontal copper deposition device for manufacturing printed circuit boards according to claim 3, wherein: an air pipe (11) fixedly connected with the upper barrel sleeve (12) is fixed on the upper surface of the upper barrel sleeve (12), and a threaded cover (10) is in threaded connection with the upper end of the air pipe (11).
5. The horizontal copper deposition device for manufacturing printed circuit boards according to claim 3, wherein: the improved cylinder sleeve is characterized in that a sealing sleeve (28) is fixedly connected to an opening end of the lower cylinder sleeve (13), the sealing sleeve (28) is sleeved on the upper cylinder sleeve (12), a plurality of pin rods are uniformly fixed to one surface, facing the lower cylinder sleeve (13), of the sealing sleeve (28), a plurality of pin holes matched with the pin rods are uniformly formed in the lower cylinder sleeve (13) facing one surface of the sealing sleeve (28), and the pin rods are fixed in the pin holes.
6. The horizontal copper deposition device for manufacturing the printed circuit board according to claim 1, wherein: top intermediate position fixedly connected with vertical arrangement's double-screw bolt (19) in conical cover (9), threaded connection has thread bush (22) on double-screw bolt (19), thread bush (22) set up in barrel (14), two branch (21) of thread bush (22) surface symmetry fixedly connected with, the one end and barrel (14) inner wall fixed connection of thread bush (22) are kept away from in branch (21).
7. The apparatus of claim 6, wherein: lower part position is equipped with the expandable annular expansion pipe of volume (31) in conical cover (9), expansion pipe (31) is pasted mutually with conical cover (9), expansion pipe (31) surface links to each other with connecting pipe (32) and communicates with each other, the one end that expansion pipe (31) were kept away from in connecting pipe (32) links to each other with inflator (33) and communicates with each other, inflator (33) are vertical form and arrange and inflator (33) surface keep away from the one end fixedly connected with connecting rod of connecting pipe (32), the one end and conical cover (9) fixed connection of inflator (33) are kept away from to the connecting rod, slidable mounting has piston (34) in inflator (33), screw rod (35) are installed to piston (34) upper surface middle part position, screw rod (35) upper end extends to inflator (33) upside and with inflator (33) threaded connection.
8. The horizontal copper deposition device for manufacturing the printed circuit board according to claim 1, wherein: one end of the infusion tube (8) positioned at the bottom in the barrel body (14) is connected and communicated with a cylinder (29) used for dispersing the horizontal copper deposition liquid, two ends of the cylinder (29) are both closed, and the outer surface of the cylinder (29) is uniformly provided with a plurality of liquid outlet holes (30).
9. The horizontal copper deposition device for manufacturing the printed circuit board according to claim 1, wherein: the bottom of horizontal heavy copper liquid groove (1) is narrow dovetail groove (2) about opening form and fixedly connected with width, the both sides of dovetail groove (2) all are equipped with two vertical arrangement's extension board (5), one side lower part edge fixedly connected with foraminiferous bottom plate (6) that extension board (5) deviate from dovetail groove (2), a plurality of heavy mouths (7) that subtract have evenly been seted up towards the one side of dovetail groove (2) in extension board (5), fluid-discharge tube (4) are installed to one side lower part position in dovetail groove (2), fluid-discharge tube (4) are kept away from the one end of dovetail groove (2) and are installed flowing back valve (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111082928.5A CN113873774B (en) | 2021-09-15 | 2021-09-15 | Horizontal copper deposition device for manufacturing printed circuit board |
Applications Claiming Priority (1)
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| CN113873774B (en) | 2023-08-29 |
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