CN112888714B - 固化膜的制造方法、树脂组合物、固化膜、层叠体的制造方法及半导体元件的制造方法 - Google Patents

固化膜的制造方法、树脂组合物、固化膜、层叠体的制造方法及半导体元件的制造方法 Download PDF

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CN112888714B
CN112888714B CN201980067579.4A CN201980067579A CN112888714B CN 112888714 B CN112888714 B CN 112888714B CN 201980067579 A CN201980067579 A CN 201980067579A CN 112888714 B CN112888714 B CN 112888714B
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cured film
resin composition
producing
film
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CN112888714A (zh
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福原庆
山崎健太
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/145—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
CN201980067579.4A 2018-10-19 2019-10-09 固化膜的制造方法、树脂组合物、固化膜、层叠体的制造方法及半导体元件的制造方法 Active CN112888714B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018197584 2018-10-19
JP2018-197584 2018-10-19
PCT/JP2019/039778 WO2020080216A1 (ja) 2018-10-19 2019-10-09 硬化膜の製造方法、樹脂組成物、硬化膜、積層体の製造方法および半導体デバイスの製造方法

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CN112888714A CN112888714A (zh) 2021-06-01
CN112888714B true CN112888714B (zh) 2023-02-28

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JP (2) JP7137631B2 (ja)
KR (1) KR102637283B1 (ja)
CN (1) CN112888714B (ja)
TW (1) TWI819121B (ja)
WO (1) WO2020080216A1 (ja)

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TW202206500A (zh) * 2020-07-22 2022-02-16 日商富士軟片股份有限公司 樹脂組成物、膜、濾光器、固體攝像元件、圖像顯示裝置及樹脂
KR102642893B1 (ko) * 2021-02-12 2024-03-05 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06242613A (ja) * 1993-02-18 1994-09-02 Toray Ind Inc ポリイミドパターンの形成方法
JPH11282155A (ja) * 1998-03-27 1999-10-15 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いたソルダーレジストの製造法
JP4798851B2 (ja) * 2001-01-23 2011-10-19 旭化成イーマテリアルズ株式会社 アルコキシシラン化合物及びその組成物
JP2003345012A (ja) * 2002-05-28 2003-12-03 Hitachi Chemical Dupont Microsystems Ltd 感光性組成物、及びこれを用いた電子部品
JP2004031564A (ja) 2002-06-25 2004-01-29 Toray Ind Inc 樹脂膜の熱処理方法
JP2007233319A (ja) * 2006-01-31 2007-09-13 Kaneka Corp 感光性樹脂組成物およびその利用
JP4876851B2 (ja) * 2006-10-23 2012-02-15 東レ株式会社 耐熱樹脂前駆体組成物およびそれを用いた半導体装置
JP5062109B2 (ja) * 2007-10-09 2012-10-31 Ｊｎｃ株式会社 液晶配向剤、液晶配向膜および液晶表示素子
JP2010054451A (ja) 2008-08-29 2010-03-11 Yamanaka Semiconductor Kk 微小分析装置及びその製造方法、並びにその製造装置
JP5444833B2 (ja) * 2009-05-18 2014-03-19 日立化成株式会社 感光性樹脂組成物、リブパターンの形成方法及び電子部品
JP5153762B2 (ja) * 2009-12-25 2013-02-27 日東電工株式会社 広帯域コレステリック液晶フィルムの製造方法
WO2011078055A1 (ja) * 2009-12-24 2011-06-30 日東電工株式会社 広帯域コレステリック液晶フィルムの製造方法
EP2565037B1 (en) * 2011-08-31 2014-10-01 Fujifilm Corporation Process for producing flexographic printing plate precursor for laser engraving, and process for making flexographic printing plate
KR20140087645A (ko) * 2012-12-31 2014-07-09 제일모직주식회사 포지티브형 감광성 수지 조성물
KR20160124082A (ko) * 2014-02-10 2016-10-26 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 폴리이미드 전구체를 포함하는 수지 조성물, 경화막의 제조 방법 및 전자 부품
JP6390165B2 (ja) * 2014-05-21 2018-09-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
KR101989422B1 (ko) * 2015-06-30 2019-06-14 후지필름 가부시키가이샤 전구체 조성물, 감광성 수지 조성물, 전구체 조성물의 제조 방법, 경화막, 경화막의 제조 방법 및 반도체 디바이스
TW201710390A (zh) * 2015-08-31 2017-03-16 Fujifilm Corp 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件
SG11201807941YA (en) * 2016-03-18 2018-10-30 Toray Industries Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor
JP6845848B2 (ja) * 2016-06-02 2021-03-24 富士フイルム株式会社 積層体の製造方法、半導体素子の製造方法および積層体
KR102189432B1 (ko) * 2016-08-31 2020-12-11 후지필름 가부시키가이샤 수지 조성물 및 그 응용
US11561470B2 (en) * 2017-03-29 2023-01-24 Toray Industries, Inc. Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same

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TW202043295A (zh) 2020-12-01
TWI819121B (zh) 2023-10-21
WO2020080216A1 (ja) 2020-04-23
JP7137631B2 (ja) 2022-09-14
KR20210057104A (ko) 2021-05-20
JP2023003421A (ja) 2023-01-11
JPWO2020080216A1 (ja) 2021-09-02
KR102637283B1 (ko) 2024-02-16
CN112888714A (zh) 2021-06-01

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