CN112648544B - 一种led直管灯 - Google Patents
一种led直管灯 Download PDFInfo
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- CN112648544B CN112648544B CN202110041062.7A CN202110041062A CN112648544B CN 112648544 B CN112648544 B CN 112648544B CN 202110041062 A CN202110041062 A CN 202110041062A CN 112648544 B CN112648544 B CN 112648544B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/278—Arrangement or mounting of circuit elements integrated in the light source
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/235—Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/272—Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/275—Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/015—Devices for covering joints between adjacent lighting devices; End coverings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
- F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21V25/00—Safety devices structurally associated with lighting devices
- F21V25/02—Safety devices structurally associated with lighting devices coming into action when lighting device is disturbed, dismounted, or broken
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/048—Joining glass to metal by means of an interlayer consisting of an adhesive specially adapted for that purpose
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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Abstract
本发明提供一种LED直管灯,其特征在于:包括灯管、套设于所述灯管的灯头、设于灯管内的灯板,所述灯管为玻璃灯管,所述灯头包括导热部及空心导电针;所述导热部和所述灯管之间通过热熔胶粘接固定,所述灯管包括一主体部和分别位于所述主体部两端的端部,所述端部的外径小于所述主体部的外径,所述灯头套设于所述端部。
Description
本发明申请是2015年9月25日提交中国专利局、申请号为201510622794.X、发明名称为“一种LED日光灯”的分案申请。
技术领域
本发明涉及照明器具领域,具体涉及一种LED直管灯。
背景技术
LED直管灯一般包括灯管、设于灯管内且带有光源的灯板,以及设于灯管两端的灯头,灯头内设有电源,光源与电源之间通过灯板进行电气连接。
现有的LED直管灯容易出现以下几类质量问题:
第一,现有LED直管灯中,灯头与灯管之间粘接时通常使用硅胶或白胶,当其直接套接灯头后,不易控制粘胶溢出的状况,如果不去除多余的粘胶,则影响美观、造成遮光问题;如果要去除多余的粘胶,则需要动用大量的人工在制造过程的后期进行擦拭,影响产量。此外,灯头内的电源组件的散热不良容易导致灯头内形成高温环境,进而减少热熔胶的使用寿命同时降低灯管与灯头间的粘接性,导致LED直管灯的可靠度下降。
第二,现有技术的灯管一般为均匀的圆柱体,灯头套设在灯管外并与灯管之间通过粘胶粘接,因此,灯头的外径要大于灯管的外径。包装时,由于包装承托物一般也是呈均匀柱状的盒体,从而只能与灯头接触,使得灯头成为唯一受力点,造成在运输过程中,灯头与灯管的连接部位容易破裂。针对此部分,申请号为US20100103673A的美国专利申请公开了一种LED直管灯,其灯管为玻璃灯管,并将灯头塞入玻璃灯管内,使得玻璃灯管的两端承受一个由内而外的力。但是相对于由外而内的方向来说,玻璃灯管能够承受的由内而外的力较小,因此在相同的施力条件下,这种LED直管灯较容易破裂。
第三,现有的LED直管灯中,光源为多个排布于灯板上的LED晶粒,对于每颗晶粒来说,因为其点光源的特性,未经过适宜的光学处理,整个灯管中的光照不均匀,因此当用户从外部观察灯管时,具有颗粒感,影响视觉的舒适度;并且无法从其他角度看到光源所发出的光线,具有视角上的缺陷。
授权公告号为CN 201954169 U,授权公告日为2011年8月31日的中国实用新型专利中公开了一种塑料管电磁熔连接结构,其包括塑料管和塑料管件,所述的塑料管件具有至少两个连通的连接端,且至少一个连接端制有外环壁并在所述外环壁内侧形成承接口,所述的塑料管***所述的承接口内,所述的外环壁与塑料管之间置有与二者熔接的熔接环。这种塑料管电磁熔连接结构通过熔接环实现对塑料管件和管子的熔接。LED直管灯产品需防止灯头上的塑料件(如灯头端部的绝缘垫)被融化而损坏,及电源需防止因温度过高而损坏,因此,上述的塑料管电磁熔连接结构并不适用于LED直管灯产品上。
发明内容
本发明提供一种新的LED直管灯,以解决上述问题。
本发明实施例提供一种LED直管灯,其特征在于:包括灯管、套设于所述灯管的灯头、设于灯管内的灯板,所述灯管为玻璃灯管,所述灯头包括导热部及空心导电针;所述导热部和所述灯管之间通过热熔胶粘接固定,所述灯管包括一主体部和分别位于所述主体部两端的端部,所述端部的外径小于所述主体部的外径,所述灯头套设于所述端部。
本发明实施例所述端部与所述主体部之间形成过渡部。
本发明实施例所述过渡部的两端皆呈弧面。
本发明实施例所述过渡部的外表面与所述主体部的外表面之间具有一弧面。
本发明实施例所述过渡部呈由两个弧面所构成的倒S形曲面。
本发明实施例所述两个弧面的曲率半径比例为1:1.5至1:10。
本发明实施例所述两个弧面的曲率半径比例为1:1.25至1:5。
本发明实施例所述过渡部的长度为1mm至4mm。
本发明实施例所述端部的外表面为一连续面且与所述主体部的外表面平行。
本发明实施例所述热熔胶包括焊泥粉,所述热熔胶加热后膨胀且冷却后固化,以实现所述灯头固定于所述灯管。
本发明实施例所述导热部与所述灯管之间形成容置空间,所述热熔胶填充于所述容置空间内。
本发明实施例所述灯头为全金属的,所述空心导电针的下部设置绝缘体。
本发明实施例所述灯头的外径与所述主体部的外径相等。
本发明实施例所述端部与所述主体部外径的差值为1mm至10mm。
本发明实施例所述端部与所述主体部外径的差值为2mm至7mm。
本发明实施例所述灯管的内周面涂覆扩散涂层,所述扩散涂层涂布到所述灯管的端部的端面上,所述热熔胶覆盖于所述端面的扩散涂层的表面。
本发明实施例还提供一种LED直管灯,其特征在于:包括灯管、套设于所述灯管的灯头、设于灯管内的灯板,所述灯管为玻璃灯管,所述灯头包括导热部及空心导电针;所述导热部和所述灯管之间通过热熔胶粘接固定,所述灯管包括一主体部和分别位于所述主体部两端的端部,所述端部的外径小于所述主体部的外径,所述灯头套设于所述端部;所述端部与所述主体部之间形成过渡部;所述过渡部的长度为1mm至4mm;所述灯头的外径与所述主体部的外径相等;所述灯头为全金属的,所述空心导电针的下部设置绝缘体;所述端部与所述主体部外径的差值为1mm至10mm;所述灯管的内周面涂覆扩散涂层,所述扩散涂层涂布到所述灯管的端部的端面上,所述热熔胶覆盖于所述端面的扩散涂层的表面。
本发明实施例所述扩散涂层和所述热熔胶间的摩擦力大于未涂上所述扩散涂层时所述灯管端部和所述热熔胶间的摩擦力。
本发明实施例所述过渡部的两端皆呈弧面。
本发明实施例所述过渡部的外表面与所述主体部的外表面之间具有一弧面。
本发明实施例所述过渡部呈由两个弧面所构成的倒S形曲面。
本发明实施例所述两个弧面的曲率半径比例为1:1.5至1:10。
本发明实施例所述两个弧面的曲率半径比例为1:1.25至1:5。
本发明实施例所述端部的外表面为一连续面且与所述主体部的外表面平行。
本发明实施例所述热熔胶包括焊泥粉,所述热熔胶加热后膨胀且冷却后固化,以实现所述灯头固定于所述灯管。
本发明实施例所述导热部与所述灯管之间形成容置空间,所述热熔胶填充于所述容置空间内。
与现有技术相比,本发明的技术方案具有以下优点:
在灯头上设置一导热部,在灯头与灯管连接时,可以通过热传导实现热熔胶的固化,粘接方便,效率高;灯管的一端或两端通过缩口形成一外径小于主体部的端部,并使得灯头外周面与主体部外周面平齐,使得包装承托物能够同时接触灯管和灯头,整个LED直管灯受力均匀,防止运输过程中破裂。另外,将灯头在过渡部与灯管粘接,由于灯管端部与主体部之间具有高度差,从而避免粘胶溢出至主体部上,省去人工修饰处理的麻烦,提高产量;灯管内设有一扩散层,当光线透过扩散层时能够发生漫射,可修正光线成均匀面光源以达到光学扩散的效果最终使得从灯管的亮度均匀分布。通过在灯管内壁设置一扩散层的形式,可以减小用户观察时的颗粒感,提升视觉舒适度;且扩散层的厚度可以非常小,从而在最大限度上保证光的输出效率;透过优化热熔胶的设计与使用以及热熔胶的加热方式,可以更好地执行灯管与灯头之间的结合固定,避免灯管与灯头间的热熔胶黏接因灯头内部环境的高温所导致的可靠度下降。此外,利用热熔胶作为灯管与灯头间实现绝缘作用的物体,亦可避免灯管破损时可能发生的触电情况。
附图说明
图1是本发明一实施例的LED直管灯的立体图;
图2是本发明一实施例的LED直管灯的立体分解图;
图3示出了本发明一实施例的LED直管灯的灯头的外部结构;
图4示出了本发明一实施例的LED直管灯的灯头的内部结构;
图5是本发明一实施例的LED直管灯的部分剖面图;
图6是本发明另一实施例的LED直管灯的灯头的立体剖视图;
图7是一示意图,示出了本发明另一实施例的LED直管灯;
图8是本发明另一实施例的LED直管灯;
图9是图8中的全塑料灯头沿X-X方向的剖视图;
图10是沿径向方向看,导磁金属件具有至少一空孔结构的示意图;
图11是沿径向方向看,导磁金属件具有至少一压痕结构的示意图;
图12是图8的灯头的绝缘管和灯管结合后,沿灯管轴向方向的剖视图;
图13是沿灯管轴向方向的剖视图;
图14示出了本发明又一实施例LED直管灯中的灯头结构;
图15示出了本发明各实施例LED直管灯中灯管的端部结构;
图16是一剖视图,示出了图15中灯管的过渡部的结构;
图17是本发明实施例LED直管灯中的灯管沿轴向方向的剖视图;
图18示出了图17的LED直管灯的第一个变形例沿轴向方向的剖视图;
图19示出了图17的LED直管灯的第二个变形例沿轴向方向的剖视图;
图20示出了图17的LED直管灯的第三个变形例沿轴向方向的剖视图;
图21示出了图17的LED直管灯的第四个变形例沿轴向方向的剖视图;
图22示出了本发明各实施例LED直管灯中,灯板为可挠式电路板且爬过强化部处与电源输出端焊接连接的结构;
图23示出了本发明各实施例LED直管灯中,灯板为双层可挠式电路板的层结构;
图24示出了本发明一实施例LED直管灯中,灯板为可挠式电路板且与电源的印刷电路板焊接的立体结构;
图25示出了本发明一实施例LED直管灯的灯板为可挠式电路板的焊盘结构;
图26示出了本发明一实施例LED直管灯的灯板为可挠式电路板且具有3个呈一列并排焊垫的焊盘结构;
图27示出了本发明一实施例LED直管灯的灯板为可挠式电路板且具有3个呈两列并排焊垫的焊盘结构;
图28示出了本发明实施例LED直管灯的灯板为可挠式电路板且具有4个呈一列并排焊垫的焊盘结构;
图29示出了本发明实施例LED直管灯的灯板为可挠式电路板且具有4个呈两列并排焊垫的焊盘结构;
图30示出了本发明实施例LED直管灯的灯板为可挠式电路板且焊垫具有孔洞的焊盘结构;
图31是图30的可挠式电路板与电源的印刷电路板焊接的侧面剖视局部放大图;
图32是图30的可挠式电路板的焊垫孔洞位置靠近边缘时,与电源的印刷电路板焊接的侧面剖视局部放大图;
图33示出了本发明实施例LED直管灯的灯板为可挠式电路板且其焊垫具有缺口的焊盘结构;
图34是沿图33中A-A'线的侧面剖视局部放大图;
图35示出了本发明一实施例LED直管灯中的光源中支架的立体结构;
图36示出了本发明一实施例LED直管灯中的电源结构。
具体实施方式
本发明的发明人在玻璃灯管的基础上,提出了一种新的LED直管灯,以解决背景技术中提到的问题以及上述问题。为使本发明的上述目的、特征和优点能够更为明显易懂,下面结合附图对本发明的具体实施例做详细的说明。
请参照图1与图2,本发明各实施例中,提供一种LED直管灯,其包括:一灯管1、一设于灯管1内的灯板2,以及分别设于灯管1两端的两个灯头3。其中灯管1可以采用塑料灯管或者玻璃灯管,一实施例中,所述灯头的尺寸大小为相同,且LED直管灯采用具强化部的玻璃灯管,以避免传统玻璃灯管易破裂以及破裂因漏电而引发的触电事故,以及塑料灯管容易老化的问题。
请参照图2与图15,一实施例中本发明所提出的LED直管灯的玻璃灯管具有结构强化端部,说明如下。灯管1包括主体部102和分别位于主体部102两端的端部101,灯头3套设于端部101外。其中,至少一个端部101的外径小于主体部102的外径。本实施例中,设置两个端部101的外径均小于主体部102的外径,端部101的剖面为一平面且与主体部102平行。具体地,灯管1的两端通过强化部处理,端部101形成强化部结构,灯头3套在强化后的端部101上,这样可以使得灯头3外径与灯管主体部102外径的差值变小,甚至完全相平,即灯头3外径与主体部102外径相等并使得灯头3与主体部102之间不会有缝隙产生。这样设置的好处在于,在运输过程中,包装承托物不会只接触灯头3,其能够同时接触灯头3和灯管1,使得整支LED直管灯受力均匀,而不会使得灯头3成为唯一受力点,避免灯头3与灯管端部101连接的部位由于受力集中发生破裂,提高产品的质量,并兼具美观的作用。
本实施例中,灯头3外径与主体部102外径基本相等,公差为在正负0.2mm(毫米)内,最多不超过正负1mm。
为了达到灯头3外径与主体部102外径基本相等的目的,根据不同的灯头3的厚度,强化后的端部101与主体部102外径的差值范围可以为1mm至10mm;或者更优选的,强化后的端部101与主体部102外径的差值范围可以放宽至2mm至7mm。
本实施例中,参照图15,灯管1的端部101与主体部102之间平滑过渡,形成一个过渡部103,过渡部103的两端皆呈弧面,即过渡部103的两端沿轴向的剖面呈弧线状。进一步地,弧面介于过渡部103的外表面与主体部102的外表面之间,弧面的弧角大于九十度,且端部101的外表面为一连续面且与主体部102的外表面仍维持平行。
过渡部103的长度为1mm至4mm,如果小于1mm,则过渡部的强度不够;如果大于4mm,则会减小主体部102的长度,减小发光面,同时需要灯头3的长度相应增加以与主体部102配合,造成灯头3的材料增加。在其他实施例中,则过渡部103也可以不为弧形。请参照图5与图16,图5示出了本发明实施例灯头3和灯管1的连接时的结构示意图,图16示出了图5中灯管1的过渡部103的结构示意图。如图5与图16所示,在本实施例中,灯管1系采用玻璃灯管,介于主体部102与端部101之间的过渡部103,会略呈由连续二个具有曲率半径R1、R2的弧面所构成的倒S形曲面,一般而言,二个弧面的曲率半径R1与R2之间的关系为R1<R2,R1与R2的比例范围R1:R2为1:1.5至1:10,较佳的范围为1:2.5至1:5,最佳的范围为1:3至1:4,本实施例采用R1:R2约为1:3,如此一来,靠近端部101的过渡部103(即图16所示弧面凹向上的过渡部103),经过强化处理后,使得玻璃处于内层受拉,外层受压的状态,从而达到增加玻璃灯管1的过渡部103强度的目的。而靠近主体部102的过渡部103(即图16所示弧面凹向下的过渡部103),经过强化处理后,使得玻璃处于内层受压,外层受拉的状态,从而达到增加玻璃灯管1的过渡部103强度的目的。
以T8的标准灯管为例,强化后的端部101的外径范围为20.9mm至23mm,如果小于20.9mm,则端部101的内径过小,导致电源部件无法***灯管1中。主体部102的外径范围为25mm至28mm,如果小于25mm,则以现有的工艺条件,不方便对其两端作强化部处理,如果大于28mm,将不符合行业标准。
请参照图3与图4,本发明一实施例中,LED直管灯的灯头3包括一绝缘管302,一固设于绝缘管302外周面上的导热部303,以及设于绝缘管302上的两支空心导电针301。
请参照图5,本实施例中,导热部303的一端伸出绝缘管302面向灯管的一端,导热部303的伸出部分(伸出绝缘管的部分)和灯管1之间通过一热熔胶6粘接。进一步地,灯头3通过导热部303延伸至过渡部103,藉由导热部303与过渡部103紧密的接触,使得导热部303和灯管1通过热熔胶6粘接时,不会有热熔胶6溢出灯头3而残留至灯管1的主体部102。此外,绝缘管302面向灯管1的一端未延伸至过渡部103,即绝缘管302面向灯管的一端与过渡部103之间保持一定间隔。本实施例中,绝缘管302的材质并不限定使用塑料、陶瓷等材质,主要是在一般状态下不是电的良导体即可。再者,热熔胶6是一种组成物,包含一种为焊泥粉的材料,成份较佳的为:酚醛树脂2127#、虫胶、松香、方解石粉、氧化锌、乙醇等。本实施例中,松香为一种增黏剂,具有溶于乙醇,但不溶于水的特性。这种热熔胶6能够在高温加热的条件下,改变其物理状态发生大幅膨胀,达到固化的效果,加上本身材料的黏性,从而可以使灯头3与灯管1紧密接触,便于LED直管灯实现自动化生产。于本实施例中,热熔胶6在高温加热后会呈现膨胀并流动,随后冷却即会达到固化的效果,当热熔胶6从室温加热到摄氏200至250度的温度时,热熔胶的体积将膨胀至原来的1至1.3倍。当然,本发明热熔胶成份的选用并不限定于此,亦可选用高温加热至预定温度后而固化的成份。由于本发明热熔胶6不会由于电源组件等发热元器件发热形成高温环境而导致可靠性下降,可以防止LED直管灯使用过程中灯管1与灯头3的粘接性能降低,提高长期可靠性。
具体地,在导热部303伸出部分的内周面与灯管1的外周面之间形成有一容置空间,热熔胶6填充于该容置空间中(图5中虚线B所示位置)。换言之,热熔胶6填充的位置借由与灯管1轴向垂直的第一虚拟平面(如图5中虚线B所画过的平面)通过:沿径向向内的方向,在第一虚拟平面的位置,依序排列为导热部303、热熔胶6和灯管1的外周面。热熔胶6涂覆厚度可以为0.2mm至0.5mm,热熔胶6会膨胀后固化,从而与灯管1接触并将灯头3固定于灯管1。并由于端部101和主体部102两者的外周面之间具有高度差,因此可以避免热熔胶溢出到灯管的主体部102部分上,免去后续的人工擦拭过程,提高LED直管灯的产量。
加工时,通过外部加热设备将热量传导至导热部303,然后再传导至热熔胶6、使热熔胶6膨胀后冷却固化,从而将灯头3固定粘接在灯管1上。
本实施例中,如图5所示,绝缘管302包括沿轴向相接的第一管302a和第二管302b,第二管302b的外径小于第一管302a的外径,两个管的外径差值范围为0.15mm至0.3mm。导热部303设于第二管302b的外周面上,导热部303的外表面与第一管302a的外周面平齐,使得灯头3的外表面平整光滑,保证整个LED直管灯在包装、运输过程中受力均匀。其中,导热部303沿灯头轴向方向的长度与绝缘管302的轴向长度比为1:2.5至1:5,即导热部长度:绝缘管长度为1:2.5至1:5。
在本实施例中,为了确保粘接的牢固性,本实施例设置第二管302b至少部分套设于灯管1外,容置空间还包括第二管302b的内表面和灯管的端部101外表面之间的空间。热熔胶6有部分填充于相互重迭(图5中虚线A所示位置)的第二管302b和灯管1之间,即部分热熔胶6位于第二管302b的内表面和端部101的外表面之间。换言之,热熔胶6填充于所述容置空间的位置借由一与灯管轴向垂直的第二虚拟平面(如图5中虚线A所画过的平面)通过:沿径向向内的方向,在第二虚拟平面的位置,依序排列为导热部303、第二管302b、热熔胶6及端部101。特予说明的是,于本实施例中,热熔胶6并不需要完全填满上述的容置空间(如图中容置空间还可以包括导热部303与第二管302b之间的空间)。制造时,当在导热部303和端部101之间涂覆热熔胶6时,可以适当增加热熔胶的量,使得在后续加热的过程中,热熔胶能够由于膨胀而流动至第二管302b和端部101之间,冷却固化后进而将两者粘合连接。
其中,灯管1的端部101插设于灯头3后,灯管1的端部101***灯头3部分的轴向长度占导热部303轴向长度的三分之一到三分之二之间,这样的好处是:一方面,保证空心导电针301与导热部303具有足够的爬电距离,通电时两者不易短接使人触电而引发危险;另一方面,由于绝缘管302的绝缘作用,使得空心导电针301与导热部303之间的爬电距离加大,更容易通过高电压时使人触电而引发危险的测试。
进一步地,对于第二管302b内表面的热熔胶6来说,第二管302b隔在热熔胶6与导热部303之间,因此热量从导热部303传导至热熔胶6的效果会打折扣。因此,参照图4,本实施例在第二管302b面向灯管1的一端(即远离第一管302a的一端)设置多个沿周向排列的缺口302c,增加导热部303与热熔胶6的接触面积,以利于热量快速从导热部303传导至热熔胶6上,加速热熔胶6的固化过程。同时,当用户触及导热部303时,由于导热部303和灯管1之间热熔胶6的绝缘作用,不会因为灯管1有破损而触电。
其中,导热部303可以为各种容易传导热量的材料,本实施例中为金属片,并兼具美观的考虑,例如铝合金。导热部303呈管状(或称环状),套设在第二管302b外。绝缘管302可以为各种绝缘材料,但以不容易导热为佳,避免热量传导至灯头3内部的电源组件上、影响电源组件的性能,本实施例中的绝缘管302为塑料管。
本发明LED直管灯的灯头,在其他实施例中,还可以设置成其他形式或者包含其他元件,说明如下。
请参照图6,在本发明另一实施例中,灯头3除包括绝缘管302外,还包括一导磁金属件9,但不包含前述的导热部。导磁金属件9固设在绝缘管302的内周面上,且至少部分位于绝缘管302的内周面和灯管端部之间、与灯管1沿径向具有重迭部分。
本实施例中,整个导磁金属件9都位于绝缘管302内,热熔胶6涂覆于导磁金属件9的内表面上(导磁金属件9面向灯管1的表面),并与灯管1的外周面粘接。其中,为了增加粘接面积、提高粘接稳定性,热熔胶6较佳覆盖导磁金属件9的整个内表面。
请参照图7,本实施例的LED直管灯于制造时,系将灯头3的绝缘管302插设于一外部加热设备中,此一外部加热设备较佳为一感应线圈11,使得感应线圈11位于导磁金属件9的上方而与导磁金属件9沿绝缘管302的径向相对。加工时,将感应线圈11通电,感应线圈11通电后形成电磁场,电磁场经过导磁金属件9后转换为电流,使得导磁金属件9发热,即运用电磁感应技术使得导磁金属件9发热,并热量传导至热熔胶6,热熔胶6吸收热量后膨胀并流动,经冷却后使得热熔胶6固化,以实现将灯头3固定于灯管1的目的。本实施例中,感应线圈11系由主要材质为紫铜且宽度5mm至6mm的金属导线所卷曲成的一环状线圈,环状线圈的直径约30mm至35mm,环状线圈直径下限稍大于灯头3的外径。
此外,感应线圈11被供应交流电,电功率为15kW至25kW,频率为25kHz至35kHz的电流。优选地,电功率为20kW,频率为30kHz。进一步地,感应线圈11还可与一功率放大单元搭配使用,藉以将交流电店功率放大1至2倍。感应线圈11所获电流大小为25A至35A,最佳为32.5A,感应线圈11的持续通电时间为2秒至10秒,最佳为5秒。感应线圈11尽量与绝缘管302同轴,使得能量传递较为均匀。本实施例中,感应线圈11与绝缘管302中轴线之间的偏差不超过0.05mm。当粘接完成后,将灯管1连同灯头3抽离感应线圈11。本实施例中,热熔胶6在吸收热量后会呈现膨胀并流动,随后冷却即会达到固化的效果。本实施例中,导磁金属件9的发热温度可以达到摄氏250至300度,而热熔胶6的加热温度可以达到摄氏200至250度。
本实施例中,上述的灯管1制造流程完成后,系采取感应线圈11不动,再将灯管1连同灯头3抽离感应线圈11的方式。然而,在其他实施例中,也可以是灯管1不动,再将感应线圈11脱离灯管的来完成。于此实施例中,导磁金属件9的加热设备可以采用具有复数个感应线圈11的装置,也就是说,当欲将复数个灯管1的灯头3加热时,仅需将复数个灯管1摆放在默认位置,接着,加热设备即会移动对应的感应线圈11至欲加热灯管1的灯头位置加热,加热完成后,卽会将复数个感应线圈11抽离对应的灯管1而完成导磁金属件9的加热。然而,在这些实施方式中,感应线圈11及灯头3之间的相对移动,无论是感应线圈11摆放在固定位置不动,灯头3被移动并插设于感应线圈11中,或是灯头3摆放在固定位置不动,感应线圈11被移动并让灯头3插设于感应线圈11中,均属于前后方向的相对移动。由于灯管1的长度远大于灯头3的长度,甚或在一些特殊用途中灯管1的长度可达240cm以上,因此在灯管1及灯头3连动的情况下,感应线圈11和灯头3彼此在相对抽入或抽离时,很可能会因为位置的误差而损害灯头3与灯管1的连接固定。
请参照图6,为了较好地支撑导磁金属件9,绝缘管302的内周面用于支撑导磁金属件9的部位302d的内径要大于其余部分302e的内径,并于302d及302e交接处形成一个台阶,导磁金属件9的轴向一端顶靠在台阶上,并且使得设置导磁金属件9后,整个灯头的内表面平齐。另外,导磁金属件9可以是各种形状,例如呈周向排列的片状或管状等,此处设置导磁金属件9呈与绝缘管302同轴的管状。
请参照图8、图9,在其他实施例中,绝缘管302的内周面用于支撑导磁金属件9的部位还可以为如下形式:绝缘管302的内周面上具有朝向绝缘管302内部突伸的支撑部313,并且,绝缘管302的内周面上、在支撑部313面向灯管主体部一侧还设置有凸出部310,所述凸出部310的径向厚度小于所述支撑部313的径向厚度。如图9所示,凸出部310与支撑部313沿轴向相连,导磁金属件9在轴向上顶靠在支撑部313的上缘(即支撑部面向凸出部一侧的端面),在周向上顶靠在凸出部310的径向内侧。也就是说,至少一部分凸出部310位于导磁金属件9和绝缘管302的内周面之间。
在其他实施例中,灯头3还可以作成全金属的,此时需要在空心导电针的下部增设一绝缘体,以耐高电压。
请参照图10,在其他实施例中,导磁金属件9面向绝缘管302的表面具有至少一空孔结构91,空孔结构91的形状为圆形,但不限于圆形,可以例如为椭圆形、方形、星形等,只要能够减少导磁金属件9和绝缘管302的内周面的接触面积,但又能具有热固化即加热热熔胶6的功能。优选地,空孔结构91面积占导磁金属件9面积的10%至50%。空孔结构91的排列可以呈周向等距离间隔排列或是不等距离间隔排列等。
请参照图11,在其他实施例中,导磁金属件9面向绝缘管302的表面具有一压痕结构93,压痕结构93可以为从导磁金属件9的内表面向外表面浮凸的结构,但也可以为从导磁金属件9的外表面向内表面浮凸的结构,其目的是为了在导磁金属件9的外表面形成凸起或凹陷,以达到减小使导磁金属件9的外表面和绝缘管302的内周面的接触面积的目的。也就是说,导磁金属件9的表面形状可选自空孔结构、浮凸结构及凹陷结构所组成的群组中的一种结构形状,以达到减小使导磁金属件9的外表面和绝缘管302的内周面的接触面积的目的。但需要注意的是,同时应当保证导磁金属件9与灯管稳定粘接,实现热固化热熔胶6的功能。
请参照图12,本实施例中,导磁金属件9为一圆形环。请参照图13,在其他实施例中,导磁金属件9为一非圆形环,例如但不限于椭圆形环,当灯管1和灯头3为椭圆形时,椭圆形环的短轴略大于灯管端部外径,以减小导磁金属件9的外表面和绝缘管302的内周面的接触面积,但又能实现热固化热熔胶6的功能。换言之,绝缘管302的内周面上具有支撑部313,非圆形环的导磁金属件9设于支撑部313上,因此,可以使导磁金属件9和绝缘管302的内周面的接触面积减少,并又能实现固化热熔胶6的功能。需说明的是,在其他实施例中,也可将导磁金属件9设至于灯头3的外部,取代如图5中所示的导热部303,藉由电磁感应原理,亦可实现固化热溶胶6的功能。
为了方便灯头3与灯管1的连接固定,本实施例针对灯头3做了改进。
请参照图3-5并结合图6-9,灯头3套设于灯管1外时,灯头3套设于灯管1的端部101外,并延伸至过渡部103,与过渡部103部分重迭。于本实施例中,灯头3包含有两根空心导电针301。
请参照图14,于另一实施例中,灯头3’的端部设有一凸柱312,凸柱312的顶端开设有孔洞,其外缘设有一深度为0.1mm的凹槽313可供导电引脚定位。导电引脚在穿出灯头3’端部凸柱312的孔洞之后,可弯折置于凹槽313之上,然后再以一导电金属帽311覆盖住凸柱312,如此,则可将导电引脚固定在凸柱312与导电金属帽311之间,于本实施例中,导电金属帽311的内径例如为7.56mm,而凸柱312的外径例如为7.23mm,且导电引脚外径例如为0.5mm,因此导电金属帽311可直接紧密覆盖住凸柱312而不需要再额外涂覆黏胶,如此便可完成电源5与导电金属帽311的电气连接。
请参照图2、3、12、13,在其他实施例中,本发明所提供的灯头上设有用于散热的孔洞304。藉此,让位于灯头内部的电源组件产生的热能够散去而不会造成灯头内部处于高温状态,以避免灯头内部元件的可靠度下降。
参照图17,本实施例的灯管1内除了紧贴于灯管1的灯板2(或可挠式电路板)外,还包括扩散层13,光源202产生的光线通过扩散层13后穿出灯管1。
扩散层13对光源202发出的光起到扩散的作用,因此,只要能使得光线透过扩散层13后再穿出灯管1,扩散层13的布置可以有多种形式,例如:扩散层13可以涂覆或覆盖于灯管1的内周面上,或者涂覆或覆盖于光源202表面上的扩散涂层(图中未示出),或者作为一个外罩而罩(或遮盖)在光源202外的扩散膜片。
请再次参照图17,当扩散层13为扩散膜片时,其可罩在光源202外,且与光源202不接触。
当扩散层13为扩散涂层时,其主要成分可以是碳酸钙、卤磷酸钙以及氧化铝其中的任一种,或其中任二种的组合,或三种的组合。当利用碳酸钙为主要材料搭配适当的溶液所形成的扩散涂层,将具有绝佳的扩散和透光(有机会达到90%以上)的效果。另外也发现,结合强化部玻璃的灯头有时候会有质量问题,有些许比例会容易脱落,而只要将该扩散涂层也涂到灯管的端部101的外表面上,扩散涂层和热熔胶6间会增加灯头和灯管间的摩擦力,使得扩散涂层和热熔胶6间的摩擦力大于未涂上扩散涂层时灯管的端部101的端面和热熔胶间的摩擦力,因此灯头3透过扩散涂层和热熔胶6间的摩擦力,灯头3脱落的问题便能大幅度的解决。
本实施例中,在调配时,扩散涂层的组成成分包括碳酸钙、磷酸锶(例如CMS-5000,白色粉末)、增稠剂,以及陶瓷活性炭(例如陶瓷活性碳SW-C,无色液体)。
具体地,当扩散涂层以碳酸钙为主材料,搭配增稠剂,陶瓷活性碳以及去离子水,混合后涂覆于玻璃灯管的内周面上,涂覆的平均厚度落在20至30μm之间,最后去离子水将挥发掉,只剩下碳酸钙、增稠剂与陶瓷活性碳三种物质。采用这种材料形成的扩散层13,可以具有约90%的透光率,一般而言,透光率的范围约为85%至96%。另外,这种扩散层13在除了具有扩散光的效果之外,还能起到电隔离的作用,从而使得当玻璃灯管破裂时,降低用户触电的风险;同时,这种扩散层13可以使得光源202在发光时,让光产生漫射,往四面八方射出,从而能够照到光源202的后方,即靠近可挠式电路板的一侧,避免在灯管1中形成暗区,提升空间的照明舒适感。此外,当选择不同材料成分的扩散涂层时,有另一种可能的实施方式,可以采用扩散层厚度范围为200μm至300μm,且透光率控制在92%至94%之间,也会有另一番效果。
在其他实施例中,扩散涂层也可以碳酸钙为主材料,搭配少量的反射材(如磷酸锶或硫酸钡)、增稠剂,陶瓷活性碳以及去离子水,混合后涂覆于玻璃灯管的内周面上,涂覆的平均厚度落在20至30μm之间,最后去离子水将挥发掉,只剩下碳酸钙、反射材、增稠剂与陶瓷活性碳四种物质。由于扩散层的目的是让光产生漫射,漫射现象在微观而言,是光线经颗粒的反射作用,磷酸锶或硫酸钡等反射材的颗粒粒径大小会远大于碳酸钙的粒径,因此,选择在扩散涂层中加入少量的反射材,可有效地增加光线的漫射效果。当然,其他实施例中,也可以选用卤磷酸钙或氧化铝为扩散涂层的主要材料,碳酸钙的颗粒的粒径大约落在2至4μm之间,而卤磷酸钙和氧化铝的颗粒的粒径大约分别落在4至6μm之间与1至2μm之间,以碳酸钙为例,当透光率的要求范围落在85%至92%时,整体以碳酸钙为主要材料的扩散涂层需涂覆的平均厚度约在20至30μm,在相同的透光率要求范围(85%至92%)下,卤磷酸钙为主要材料的扩散涂层需涂覆的平均厚度会落在25至35μm,氧化铝为主要材料的扩散涂层需涂覆的平均厚度会落在10至15μm。若透光率需求更高时,例如92%以上,则以碳酸钙、卤磷酸钙或氧化铝为主要材料的扩散涂层厚度则需更薄,以碳酸钙为主要材料的扩散涂层为例,其涂覆的平均厚度落在10至15μm之间。
也就是说,依灯管1的使用场合,而选择不同的透光率需求,即可选择所欲涂覆扩散涂层的主要材料、对应的形成厚度等等。需补充说明的是,扩散层的透光率越高,使用者看到光源的颗粒感会越显着。于本实施例中,形成扩散涂层主要有二种方式,一、压涂法:先将整支灯管直立后,于扩散涂层设备中利用压力施压,使得扩散涂层溶液灌满整支灯管后,接着移除压力,因扩散涂层溶液中含有增稠剂可增加碳酸钙等扩散涂层材料贴附于灯管内周面时的黏稠度,当扩散涂层溶液回流至扩散涂层设备后,再利用风干方式,使得扩散涂层均匀地形成于灯管的内周面;二、喷涂法:先将整支灯管直立后,利用扩散液喷涂设备将整支灯管内周面喷涂扩散涂层溶液,灯管可藉由倾斜摆设或旋转灯管等方式,以增加扩散涂层溶液贴附于灯管内周面时的均匀度,最后,再利用风干方式,使得扩散涂层均匀地形成于灯管的内周面。
继续参照图17,进一步地,灯管1的内周面上还设有反射膜12,反射膜12设于具有光源202的灯板2周围,且沿周向占用灯管1的部分内周面。如图17所示,反射膜12在灯板2两侧沿灯管周向延伸,灯板2基本位于反射膜12沿周向的中间位置。反射膜12的设置具有两方面的效果,一方面,当从侧面(图中X方向)看灯管1时,由于有反射膜12阻挡,不会直接看到光源202,从而减少颗粒感造成的视觉上的不适;另一方面,光源202发出的光经过反射膜12的反射作用,可以控制灯管的发散角,使得光线更多地朝向未涂有反射膜的方向照射,使得LED直管灯以更低的功率获得相同的照射效果,提高节能性。
在上述实施例中所述的各种类型反射膜12与各种类型扩散层13可以任意搭配,而能实现单独反射,单独扩散或同时实现反射及扩散的光学效果。例如,可以只设置反射膜12,不设置扩散层13,如图19、图20以及图21所示。
在其他的实施例中,玻璃管的内周面上,可全部都涂上扩散涂层,或者是部分涂上扩散涂层(有反射膜12之处不涂),但无论是哪一种方式,扩散涂层最好都要涂到灯管1的端部的外表面上,以使得灯头3与灯管1之间的黏接更牢固。
需补充的是,于本发明上述实施例中,皆可选用由扩散涂层、扩散膜片、反射膜以及粘接膜所组成的群组中的一种,应用于本发明光源所发出光线的光学处理。
请继续参照图2,本发明一实施例中,LED直管灯还包括粘接剂片4、灯板绝缘胶片7和光源胶片8。灯板2通过粘接剂片4粘贴于灯管1的内周面上。图中所示,粘接剂片4可以为硅胶,其形式不限,可以是图中所示的几段,或者呈长条状的一段。各种形式的粘接剂片4、各种形式的灯板绝缘胶片7和各种形式的光源胶片8可互为组合而构成本发明的不同实施例。
灯板绝缘胶片7涂于灯板2面向光源202的表面上,使得灯板2不外露,从而起到将灯板2与外界隔离的绝缘作用。涂胶时预留出与光源202对应的通孔71,光源202设于通孔71中。灯板绝缘胶片7的组成成分包括乙烯基聚硅氧烷、氢基聚硅氧烷和氧化铝。灯板绝缘胶片7的厚度范围为100μm至140μm(微米)。如果小于100μm,则起不到足够的绝缘作用,如果大于140μm,则会造成材料的浪费。
光源胶片8涂于光源202的表面。光源胶片8的颜色为透明色,以保证透光率。涂覆至光源202表面后,光源胶片8的形状可以为颗粒状、条状或片状。其中,光源胶片8的参数有折射率、厚度等。光源胶片8的折射率允许的范围为1.22~1.6,如果光源胶片8的折射率为光源202壳体折射率的开根号,或者光源胶片8的折射率为光源202壳体折射率的开根号的正负15%,则透光率较好。这里的光源壳体是指容纳LED晶粒(或芯片)的壳体。本实施例中,光源胶片8的折射率范围为1.225至1.253。光源胶片8允许的厚度范围为1.1mm至1.3mm,如果小于1.1mm,将会盖不住光源202,效果不佳,如果大于1.3mm,则会降低透光率,同时还会增加材料成本。
装配时,先将光源胶片8涂于光源202的表面;然后将灯板绝缘胶片7涂于灯板2上的一侧表面上;再把光源202固定于灯板2上;接着将灯板2与光源202相背的一侧表面通过粘接剂片4粘贴固定于灯管1的内周面;最后再将灯头3固定于灯管1的端部,同时将光源202与电源5电连接。或者是如图22所示,利用可挠式电路板2爬过过渡部103和电源5焊接(即穿过过渡部103与电源5焊接),或者采取传统导线打线的方式让灯板2与电源5电性相连,最后灯头3通过图5(用图3-图4的结构)或图7(用图6的结构)的方式接在强化处理的过渡部103,形成一个完整的LED直管灯。
本实施例中,灯板2通过粘接剂片4固定在灯管1的内周面,使得灯板2贴设在灯管1的内周面上,这样可以增大整支LED直管灯的发光角度,扩大可视角,这样设置一般可以使得可视角可以超过330度。通过在灯板2涂灯板绝缘胶片7,在光源202上涂绝缘的光源胶片8,实现对整个灯板2的绝缘处理,这样,即使灯管1破裂,也不会发生触电事故,提高安全性。
进一步地,灯板2可以是条状铝基板、FR4板或者可挠式电路板中的任意一种。由于本实施例的灯管1为玻璃灯管,如果灯板2采用刚性的条状铝基板或者FR4板,那么当灯管破裂,例如断成两截后,整个灯管仍旧能够保持为直管的状态,这时使用者有可能会认为LED直管灯还可以使用、并去自行安装,容易导致触电事故。由于可挠式电路板具有较强的可挠性与易弯曲的特性,解决刚性条状铝基板、FR4板可挠性与弯曲性不足的情况,因此本实施例的灯板2采用可挠式电路板,这样当灯管1破裂后,即无法支撑破裂的灯管1继续保持为直管状态,以告知使用者LED直管灯已经不能使用,避免触电事故的发生。因此,当采用可挠式电路板后,可以在一定程度上缓解由于玻璃管破碎而造成的触电问题。以下实施例即以可挠式电路板作为灯板2来做说明。
请参照图23,作为灯板2的可挠式电路板包括一层具有导电效果的线路层2a,光源202设于线路层2a上,通过线路层2a与电源电气连通。参照图23,本实施例中,可挠式电路板还可以包括一层介电层2b,与线路层2a迭置,介电层2b与线路层2a的面积相等,线路层2a在与介电层2b相背的表面用于设置光源202,介电层2b在与线路层2a相背的表面则通过粘接剂片4粘接于灯管1的内周面上。其中,线路层2a可以是金属层,或者布有导线(例如铜线)的电源层。
当然,本发明的可挠式电路板并不仅限于一层或二层电路板,在其他实施例中,可挠式电路板包括多层线路层2a与多层介电层2b,介电层2b与线路层2a会依序交错迭置且设于线路层2a与光源202相背的一侧,光源202设于多层线路层2a的最上一层,通过线路层2a的最上一层与电源电气连通。在其他实施例中,作为灯板2的可挠式电路板的长度大于灯管的长度。
请继续参照图2,灯板2上设有若干光源202,灯头3内设有电源5,光源202与电源5之间通过灯板2电气连通。本发明各实施例中,电源5可以为单个体(即所有电源组件都集成在一个部件中),并设于灯管1一端的灯头3中;或者电源5也可以分为两部分,称为双个体(即所有电源组件分别设置在两个部件中),并将两部分分别设于灯管两端的灯头3中。如果灯管1仅有一端作强化部处理时,电源优先选择为单个体,并设于强化后的端部101所对应的灯头3中。
不管是单个体还是双个体,电源的形成方式都可以有多重选择,例如,电源可以为一种灌封成型后的模块,具体地,使用一种高导热的硅胶(导热系数≥0.7w/m·k),通过模具对电源组件进行灌封成型,得到电源,这种方式得到的电源具有高绝缘、高散热、外形更规则的优点,且能够方便地与其他结构件配合。或者,电源也可以为不作灌封胶成型,直接将裸露的电源组件置入灯头内部,或者将裸露的电源组件用传统热缩管包住后,再置入灯头3内部。
换言之,本发明各实施例中,电源5可为如图23所示以单片印刷电路板搭载电源组件的形式出现,亦可为如图36所示以单个体模块的形式出现。
请参照图2并结合图36,于一实施例中,电源5的一端具有公插51,另一端具有金属插针52,灯板2的端部设有母插201,灯头3上设有用于连接外部电源的空心导电针301。电源5的公插51插设于灯板2的母插201内,金属插针52插设于灯头3的空心导电针301内。此时公插51和母插201相当于转接头,用于将电源5和灯板2电连接。当金属插针52***空心导电针301内后,经过外部冲压工具冲击空心导电针301,使得空心导电针301发生轻微的变形,从而固定住电源5上的金属插针52,并实现电气连接。
本实施例中,电源5的输入端具有金属插针52连接灯头,另一边输出端可依与灯板2的连接模式设置公插、电性金属连接孔或是焊盘。分开来的灯板2与电源5的输出端之间可以透过公插51与母插201连接,或者通过导线打线连接,导线的外层可以包裹绝缘套管做为电性绝缘保护。此外,灯板2与电源5的输出端亦可通过铆钉钉接、锡膏黏接、焊接或是以导线捆绑的方式来直接连接在一起。与前述灯板2的固定方式一致,可挠式电路板的一侧表面通过粘接剂片4粘接固定于灯管1的内周面,而可挠式电路板的两端可以选择固定或者不固定在灯管1的内周面上。
如果灯板2沿灯管1轴向的两端不固定在灯管1的内周面上,如果采用导线连接,在后续搬动过程中,由于两端自由,在后续的搬动过程中容易发生晃动,因而有可能使得导线发生断裂。因此灯板2与电源5的连接方式优先选择为焊接,具体地,参照图22,可以直接将灯板2爬过强化部结构的过渡部103后焊接于电源5的输出端上,免去导线的使用,提高产品质量的稳定性。此时灯板2不需要设置母插201,电源5的输出端也不需要设置公插51,具体作法可以是如图24所示,将电源5的输出端留出电源焊盘a,并在电源焊盘a上留锡、以使得焊盘上的锡的厚度增加,方便焊接,相应的,在灯板2的端部上也留出光源焊盘b,并将电源5输出端的电源焊盘a与灯板2的光源焊盘b焊接在一起。将焊盘所在的平面定义为正面,则灯板2与电源5的连接方式以两者正面的焊盘对接最为稳固,但是在焊接时焊接压头必须压在灯板2的背面,隔着灯板2来对焊锡加热,比较容易出现可靠度的问题。如果如图25所示,将灯板2正面的光源焊盘b中间开出孔洞,再将其正面朝上迭加在电源5正面的电源焊盘a上来焊接,则焊接压头可以直接对焊锡加热熔解,对实务操作上较为容易实现。
如果可挠式电路板的两端固定在灯管1的内周面上,则优先考虑在可挠式电路板上设置母插201,然后将电源5的公插51***母插201实现电气连接。
如图24所示,上述实施例中,作为灯板2的可挠式电路板大部分固定在灯管1的内周面上,只有在两端是不固定在灯管1的内周面上,不固定在灯管1内周面上的灯板2形成一自由部21,在装配时,自由部21和电源5焊接的一端会带动自由部21向灯管1内部收缩,灯板2的自由部21会因收缩而变形,使用上述的具有穿孔焊垫的灯板2,灯板2具有光源的一侧和电源5焊接的电源焊盘a是朝向同一侧的,灯板2的自由部21因收缩而变形时,灯板2和电源5焊接的一端对电源5是有一个侧向的拉力,相较于灯板2具有光源202的一侧和电源5焊接的电源焊盘a是朝向不同一侧的焊接法,灯板2和电源5焊接的一端对电源5还有一个向下的拉力,使用上述的具有穿孔焊垫的灯板2,形成结构性的电连接固定增强具有更佳的效果。在本实施例中,灯板2的光源焊盘b位于灯板2具有光源的另一侧,灯板2的光源焊盘b和电源5焊接的电源焊盘a相对应焊接固定。在装配时,灯板2的自由部21朝向灯管1的内部收缩而变形,受力变形的自由部21位于灯板2具有光源的相同侧。值得注意的是,当前述提及作为灯板2的可挠式电路板具有二层线路层夹一介电层的结构时,前述灯板2未设有光源202且突出于灯管1的末端区域可作为自由部21,而让自由部21实现二层线路层的连通及电源组件的电路布局。
如图25所示,灯板2的光源焊盘b为两个不连接的焊垫,分别和光源202正负极电连接,焊垫的大小约为3.5×2mm2,电源5的印刷电路板上也有与其相对应的焊垫,焊垫的上方为便于焊接机台自动焊接而有预留锡,锡的厚度可为0.1至0.7mm,较佳值为0.3至0.5mm较为恰当,以0.4mm为最佳。在两个焊垫之间可设置一绝缘孔洞c,避免两个焊垫在焊接的过程中因焊锡熔接在一起而造成电性短路,此外在绝缘孔洞c的后方还可设置定位孔d,用来让自动焊接机台可正确判断出光源焊盘b的正确位置。
灯板的光源焊盘b具有至少一个焊垫,分别和光源202正负极电连接。在其他实施例中,为了能达到兼容性及后续使用上的扩充性,光源焊盘b的数量可以具有一个以上的焊垫,例如1个、2个、3个、4个或是4个以上。当焊垫为1个时,灯板对应二端都会分别与电源电连接,以形成一回路,此时可利用电子组件取代的方式,例如:以电感取代电容当作稳流组件。如图26至28所示,当焊垫为3个时,第3个焊垫可以用作接地使用,当焊垫为4个时,第4个焊垫可以用来作讯号输入端。相应的,电源焊盘a亦留有和光源焊盘b数量相同的焊垫。当焊垫为3个以上时,焊垫间的排列可以为一列并排或是排成两列,依实际使用时的容置面积大小配置在适当的位置,只要彼此不电连接造成短路即可。在其他实施例中,若是将部份电路制作在可挠式电路板上,光源焊盘b可以只具有单独一个焊垫,焊垫数量愈少,在工艺上愈节省流程;焊垫数量愈多,可挠式电路板和电源输出端的电连接固定愈增强。
如图30所示,在其他实施例中,光源焊盘b的焊垫内部可以具有焊接穿孔e的结构,焊接穿孔e的直径可为1至2mm,较佳为1.2至1.8mm,最佳为1.5mm,太小则焊接用的锡不易穿越。当电源5的电源焊盘a与灯板2的光源焊盘b焊接在一起时,焊接用的锡可以穿过所述的焊接穿孔e,然后堆积在焊接穿孔e上方冷却凝结,形成具有大于焊接穿孔e直径的焊球结构g,这个焊球结构g会起到像是钉子的功能,除了透过电源焊盘a和光源焊盘b之间的锡固定外,更可以因为焊球结构g的作用而增强电性连接的稳固定。
如图31至图32所示,在其他实施例中,当光源焊盘b的焊接穿孔e距离灯板2的边缘≦1mm时,焊接用的锡会穿过所述的孔洞e而堆积在孔洞上方边缘,过多的锡也会从灯板2的边缘往下方回流,然后与电源焊盘a上的锡凝结在一起,其结构就像是一个铆钉将灯板2牢牢的钉在电源5的电路板上,具有可靠的电性连接功能。此外,焊接穿孔e的直径太小会阻碍锡穿过所述的孔洞,因此也可以将光源焊盘b的焊接穿孔e直接改为如图33及图34所是的焊接缺口f,焊接用的锡透过所述的焊接缺口f把电源焊盘a和光源焊盘b电连接固定,锡更容易爬上光源焊盘b而堆积在焊接缺口f周围,当冷却凝结后会有更多的锡形成具有大于焊接缺口f直径的焊球,这个焊球结构会让电性连接结构的固定能力增强。
在其他实施例中,焊垫的焊接穿孔是在边缘,也就是焊垫具有一焊接缺口,焊接用的锡透过所述的焊接缺口把电源焊盘a和光源焊盘b电连接固定,锡会堆积在焊接穿孔周围,当冷却后,会形成具有大于焊接穿孔直径的焊球,这个焊球结构会形成结构性的电连接固定增强,本实施例中,因为焊接缺口的设计,焊接用的锡起到像是C形钉子的功能。
焊垫的焊接穿孔不论是先形成好,或是在焊接的过程中直接用焊接压头打穿,都可以达到本实施例所述的结构。所述的焊接压头其与焊锡接触的表面可以为平面或是具有凹部和凸出部的表面,凸出部可以为长条状或是网格状,所述的凸出部不完全将穿孔覆盖,确保焊锡能从穿孔穿出,当焊锡穿出焊接穿孔堆积在焊接穿孔周围时,凹部能提供焊球的容置位置。在其他实施例中,作为灯板2的可挠式电路板具有一定位孔,在焊接时可以透过定位孔将电源焊盘a和光源焊盘b的焊垫精准的定位。
请参照图35,在本发明各实施例中,光源202可以进一步改良为包括具有凹槽202a的支架202b,以及设于凹槽202a中的LED晶粒(或芯片)18。凹槽202a内填充有荧光粉,荧光粉覆盖LED晶粒(或芯片)18,以起到光色转换的作用。特予说明的是,相较于传统LED晶粒(或芯片)的长度与宽度的比例约略为1:1的正方形形状。本发明各实施例中所采用的LED晶粒(或芯片)18的长度与宽度的比例范围可为2:1至10:1,本发明各实施例中采用的LED晶粒(或芯片)18的长度与宽度的比例范围以2.5:1至5:1为较佳,最佳范围为3:1至4.5:1,如此一来,将LED晶粒(或芯片)18的长度方向沿着灯管1的长度方向排列,改善了LED晶粒(或芯片)18的平均电流密度以及灯管1整体的出光光形等问题。
本发明各实施例中,一根灯管1中的光源202具有多个,多个光源202可以排布成一列或多列,每列光源202均沿灯管1的轴向(Y方向)排布。
Claims (25)
1.一种LED直管灯,其特征在于:包括灯管、套设于所述灯管的灯头、设于灯管内的灯板,所述灯管为玻璃灯管,所述灯头内配置有电源组件,所述灯头包括绝缘管、导热部、及设于所述绝缘管上的空心导电针;所述导热部固设于所述绝缘管外周面上,其一端伸出绝缘管面向灯管的一端,所述导热部伸出绝缘管的部分和所述灯管之间通过热熔胶粘接固定,所述导热部用于通过热传导实现所述热熔胶的固化;所述灯管包括一主体部和分别位于所述主体部两端的端部,所述端部的外径小于所述主体部的外径,所述灯头套设于所述端部。
2.根据权利要求1所述的LED直管灯,其特征在于:所述端部与所述主体部之间形成过渡部。
3.根据权利要求2所述的LED直管灯,其特征在于:所述过渡部的两端皆呈弧面。
4.根据权利要求2所述的LED直管灯,其特征在于:所述过渡部的外表面与所述主体部的外表面之间具有一弧面。
5.根据权利要求2所述的LED直管灯,其特征在于:所述过渡部呈由两个弧面所构成的倒S形曲面。
6.根据权利要求5所述的LED直管灯,其特征在于:所述两个弧面的曲率半径比例为1:1.5至1:10。
7.根据权利要求6所述的LED直管灯,其特征在于:所述两个弧面的曲率半径比例为1:1.25至1:5。
8.根据权利要求2至7任一所述的LED直管灯,其特征在于:所述过渡部的长度为1mm至4mm。
9.根据权利要求2至7任一所述的LED直管灯,其特征在于:所述端部的外表面为一连续面且与所述主体部的外表面平行。
10.根据权利要求1所述的LED直管灯,其特征在于:所述热熔胶包括焊泥粉,所述热熔胶加热后膨胀且冷却后固化,以实现所述灯头固定于所述灯管。
11.根据权利要求1或10所述的LED直管灯,其特征在于:所述导热部与所述灯管之间形成容置空间,所述热熔胶填充于所述容置空间内。
12.根据权利要求1所述的LED直管灯,其特征在于:所述灯头的外径与所述主体部的外径相等。
13.根据权利要求1或12所述的LED直管灯,其特征在于:所述端部与所述主体部外径的差值为1mm至10mm。
14.根据权利要求13所述的LED直管灯,其特征在于:所述端部与所述主体部外径的差值为2mm至7mm。
15.根据权利要求1所述的LED直管灯,其特征在于:所述灯管的内周面涂覆扩散涂层,所述扩散涂层涂布到所述灯管的端部的端面上,所述热熔胶覆盖于所述端面的扩散涂层的表面。
16.一种LED直管灯,其特征在于:包括灯管、套设于所述灯管的灯头、设于灯管内的灯板,所述灯管为玻璃灯管,所述灯头内配置有电源组件,所述灯头包括绝缘管、导热部、及设于所述绝缘管上的空心导电针;所述导热部固设于所述绝缘管外周面上,其一端伸出绝缘管面向灯管的一端,所述导热部伸出绝缘管的部分和所述灯管之间通过热熔胶粘接固定,所述灯管包括一主体部和分别位于所述主体部两端的端部,所述端部的外径小于所述主体部的外径,所述灯头套设于所述端部;所述端部与所述主体部之间形成过渡部;所述过渡部的长度为1mm至4mm;所述灯头的外径与所述主体部的外径相等;所述端部与所述主体部外径的差值为1mm至10mm;所述灯管的内周面涂覆扩散涂层,所述扩散涂层涂布到所述灯管的端部的端面上,所述热熔胶覆盖于所述端面的扩散涂层的表面;所述灯头上用于散热的孔洞。
17.根据权利要求16所述的LED直管灯,其特征在于:所述扩散涂层和所述热熔胶间的摩擦力大于未涂上所述扩散涂层时所述灯管端部和所述热熔胶间的摩擦力。
18.根据权利要求16所述的LED直管灯,其特征在于:所述过渡部的两端皆呈弧面。
19.根据权利要求16所述的LED直管灯,其特征在于:所述过渡部的外表面与所述主体部的外表面之间具有一弧面。
20.根据权利要求16所述的LED直管灯,其特征在于:所述过渡部呈由两个弧面所构成的倒S形曲面。
21.根据权利要求20所述的LED直管灯,其特征在于:所述两个弧面的曲率半径比例为1:1.5至1:10。
22.根据权利要求21所述的LED直管灯,其特征在于:所述两个弧面的曲率半径比例为1:1.25至1:5。
23.根据权利要求16至22任一所述的LED直管灯,其特征在于:所述端部的外表面为一连续面且与所述主体部的外表面平行。
24.根据权利要求17所述的LED直管灯,其特征在于:所述热熔胶包括焊泥粉,所述热熔胶加热后膨胀且冷却后固化,以实现所述灯头固定于所述灯管。
25.根据权利要求16或24所述的LED直管灯,其特征在于:所述导热部与所述灯管之间形成容置空间,所述热熔胶填充于所述容置空间内。
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