CN112103210B - Chip bonding process equipment for semiconductor chip packaging - Google Patents
Chip bonding process equipment for semiconductor chip packaging Download PDFInfo
- Publication number
- CN112103210B CN112103210B CN202010810890.8A CN202010810890A CN112103210B CN 112103210 B CN112103210 B CN 112103210B CN 202010810890 A CN202010810890 A CN 202010810890A CN 112103210 B CN112103210 B CN 112103210B
- Authority
- CN
- China
- Prior art keywords
- substrate
- chip
- conveyor
- positioning
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor chip processing, in particular to a chip bonding process device for semiconductor chip packaging, which comprises a main body conveyor, a substrate conveyor, a chip conveyor, a substrate positioning table, a substrate glue injection mechanism, a chip positioning table, a substrate feeding mechanism and a chip feeding mechanism, wherein a plurality of positioning frames are arranged on the main body conveyor, substrate positioning grooves corresponding to the positioning frames are arranged on the substrate positioning table, an epoxy resin drip injection pipe corresponding to each substrate positioning groove is arranged on the substrate glue injection mechanism, the chip feeding mechanism comprises a first sucker capable of grabbing a workpiece in each substrate positioning groove and moving the workpiece into each positioning frame, the chip positioning table is provided with a chip positioning groove corresponding to each positioning frame, the chip feeding mechanism comprises a second sucker capable of grabbing the workpiece in each chip positioning groove and moving the workpiece into each positioning frame, and the device can bond chips packaged by semiconductor chips in batches and improve the bonding efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor chip processing, in particular to chip bonding process equipment for semiconductor chip packaging.
Background
In the semiconductor technology, a series of treatments need to be performed on a semiconductor chip, wherein a semiconductor packaging process is involved, and the packaging process directly determines the reliability of a product, wherein the bonding process is the most important, in the step of gluing and bonding, a tool such as a writing brush is generally adopted to manually dip bonding glue or glue discharging equipment is utilized to transfer the bonding glue to a chip bonding area, then a vacuum suction head is utilized to bond and cure a single chip, and the chip bonding can be completed after the thinning treatment.
Disclosure of Invention
In order to solve the technical problem, the chip bonding process equipment for semiconductor chip packaging is provided, the equipment can automatically process the semiconductor chip packaging, and can bond the semiconductor chip packaging chips in batches at the same time, so that the bonding efficiency is improved.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows:
a chip bonding process device for semiconductor chip packaging comprises a main body conveyor, a substrate conveyor, a chip conveyor, a substrate positioning table, a substrate glue injection mechanism, a chip positioning table, a substrate feeding mechanism and a chip feeding mechanism, wherein a plurality of positioning frames are arranged on the main body conveyor and are distributed at equal intervals along the length direction of the main body conveyor, the substrate conveyor and the chip conveyor are respectively arranged on two sides of the cylinder conveyor at intervals, the substrate conveyor, the chip conveyor and the main body conveyor are distributed in a parallel state, the substrate positioning table is arranged on one side of the substrate conveyor, the substrate glue injection mechanism is arranged on the top of the substrate positioning table, substrate positioning grooves corresponding to the positioning frames are arranged on the substrate positioning table, epoxy resin dripping pipes corresponding to the substrate positioning grooves are arranged on the substrate glue injection mechanism, the substrate feeding mechanism is arranged between the substrate positioning table and the main body conveyor, the substrate feeding mechanism comprises first suckers capable of grabbing and moving workpieces in the positioning frames, the chip positioning table is arranged on one side of the chip positioning table, the chip feeding mechanism is arranged between the chip positioning table and the main body conveyor, the chip positioning table is provided with second suckers capable of grabbing the workpieces in the positioning frames.
Preferably, one side of the substrate conveyor is respectively provided with a first support frame in one-to-one correspondence with the substrate positioning grooves on the substrate positioning table, each first support frame is respectively provided with a first air cylinder, each first air cylinder is horizontally arranged, the output end of each first air cylinder extends towards the direction of each substrate positioning groove, and the output end of each first air cylinder is respectively provided with a first push plate capable of pushing a workpiece on the substrate conveyor to each substrate positioning groove.
Preferably, the substrate glue injection mechanism comprises a cross beam, a first motor, two-way screws, a lifting plate, two hinge rods and two bearing seats, wherein the cross beam is located above the substrate positioning table, two ends of the cross beam are respectively connected with the top of the substrate positioning table through vertical supports, the two bearing seats are symmetrically arranged at two ends of the top of the cross beam, the two-way screws are horizontally arranged between the two bearing seats, two ends of each two-way screw are respectively rotatably inserted into an inner ring of each bearing seat, the first motor is horizontally arranged on one side of one of the bearing seats, an output end of the first motor is in transmission connection with one end of each two-way screw, the two-way screws are symmetrically provided with screw rod sliding sleeves capable of moving in opposite directions, the lifting plate is horizontally arranged right below the cross beam, the two hinge rods are vertically and symmetrically arranged above the lifting plate, the bottom of each hinge rod is respectively hinged with the center of the top of the lifting plate, the upper end of each hinge rod penetrates through two faces of the cross beam and extends upwards, the top of each screw rod is respectively hinged with the bottom of each sliding sleeve, avoidance orifices for moving of each hinge rod are arranged on the cross beam, and the lifting plate at equal intervals.
Preferably, the two ends of the lifting plate are respectively provided with a sliding block, and each vertical support is respectively provided with a sliding groove for each sliding block to slide.
Preferably, substrate feeding mechanism includes first supporting station and the second motor with every locating frame one-to-one, and first supporting station is located between substrate locating station and the main part conveyer, and every second motor is vertical top of installing at first supporting station respectively, and the output of every second motor sets up respectively up, and the output of every second motor is equipped with the first pivot that is vertical setting respectively, and the top of every first pivot is equipped with the first extension board that is the level setting respectively, and the one end of every first extension board is connected respectively in the top of every first pivot.
Preferably, each extension end of the first extension plate is respectively provided with a first electric push rod which is vertically arranged, the working end of each first electric push rod is respectively arranged downwards, and each first suction disc is respectively horizontally arranged at the working end of each first electric push rod.
Preferably, one side of chip conveyer is equipped with respectively with the chip positioning bench chip constant head tank one-to-one's second support frame, is provided with the second cylinder on every second support frame respectively, and every second cylinder all is the level setting, and the output of every second cylinder extends the setting towards the direction of every chip constant head tank respectively, and the output of every second cylinder is provided with respectively can push away the second push pedal to every chip constant head tank with the work piece on the chip conveyer.
Preferably, chip feeding mechanism includes the second brace table and the third motor with every locating frame one-to-one, the second brace table is located between chip location platform and the main part conveyer, every third motor is vertical installation respectively at the top of the second brace table, the output of every third motor sets up respectively up, the output of every third motor is equipped with the second pivot that is vertical setting respectively, the top of every second pivot is equipped with the second extension board that is the level setting respectively, the one end of every second extension board is connected respectively in the top of every second pivot.
Preferably, every the extension end of second extension board sets up respectively and is the second electric putter of vertical setting, and every second electric putter's working end sets up down respectively, and every second sucking disc is horizontal installation respectively and is every second electric putter's working end.
A chip bonding process device and method for semiconductor chip packaging comprises the following steps:
the method comprises the following steps that firstly, during operation, substrates are sequentially conveyed through a substrate conveyor, when each substrate moves to one side of each substrate positioning groove, each first air cylinder is started simultaneously, and each first push plate is driven by each first air cylinder to push each substrate on the substrate conveyor into the substrate positioning groove to be positioned;
secondly, after each substrate enters each substrate positioning groove respectively and is positioned, starting a first motor, driving a two-way screw to rotate through the first motor, driving two screw rod sliding sleeves to move oppositely through the two-way screw rod respectively, driving the upper ends of two hinged connecting rods to move oppositely through the two screw rod sliding sleeves respectively, driving a lifting plate to linearly move along the vertical direction of a vertical support through the lower ends of the two hinged connecting rods until each epoxy resin drip pipe arranged on the lifting plate moves to a preset height to stop, injecting glue to the surface of each substrate through each epoxy resin drip pipe, and when the lifting plate is lifted along each vertical support, each sliding block arranged at the two ends of the lifting plate respectively moves in a limiting manner along each sliding groove;
thirdly, after the substrates in each substrate positioning groove are injected with glue through the epoxy resin drip injection pipe respectively, starting each second motor, driving each first rotating shaft to rotate through each second motor respectively, driving each first extending plate to rotate to the position right above each substrate positioning groove through the first rotating shaft to stop, starting a first electric push rod, driving a working end to move downwards through the first electric push rod, meanwhile, abutting the surface of each substrate, which is not injected with glue, through the first sucking disc, sucking, and then compounding, and driving the first rotating shaft through the second motors to enable the substrates sucked by the first sucking disc to be placed into a positioning frame on the main conveyor;
fourthly, sequentially conveying the chips through the chip conveyor, simultaneously starting each second air cylinder when each chip moves to one side of each chip positioning groove, and respectively driving each first push plate through each second air cylinder to push each chip on the chip conveyor into the chip positioning groove for positioning;
and fifthly, starting each third motor, driving each second rotating shaft to rotate through each third motor respectively, driving each second extending plate to rotate to each chip positioning groove through the second rotating shaft to stop, starting a second electric push rod, driving the working end to move downwards through the second electric push rod, simultaneously butting the surface of the chip through a second sucking disc, sucking, compounding, driving the second rotating shaft through the third motor to enable the substrate sucked by the second sucking disc to be placed on the substrate injected with glue on the main body conveyor, and completing bonding.
Compared with the prior art, the invention has the beneficial effects that:
a chip bonding process equipment for semiconductor chip encapsulation, this equipment can be automatic processes to can be simultaneously in batches carry out the chip bonding of semiconductor chip encapsulation, promote bonding efficiency.
Drawings
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a partial perspective view of the present invention;
FIG. 5 is an enlarged view taken at A of FIG. 4 in accordance with the present invention;
FIG. 6 is an enlarged view of the invention at B in FIG. 4;
FIG. 7 is a schematic view of a partial perspective structure of the substrate glue injection mechanism of the present invention;
fig. 8 is an enlarged view of the invention at C in fig. 7.
Description of the drawings:
1-a main body conveyor; 2-a substrate conveyor; 3-a chip conveyor; 4-a substrate positioning table; 5-chip positioning table; 6, positioning a frame; 7-substrate positioning groove; 8-epoxy resin drip tube; 9-a first suction cup; 10-chip positioning grooves; 11-a second suction cup; 12-a first support frame; 13-a first cylinder; 14-a first push plate; 15-a cross beam; 16-a first electric machine; 17-a bidirectional screw; 18-a lifter plate; 19-a hinged lever; 20-bearing seats; 21-a vertical support; 22-avoidance port; 23-a slide block; 24-a chute; 25-a first support table; 26-a second motor; 27-a first shaft; 28-a first extension panel; 29-a first electric push rod; 30-a second support; 31-a second cylinder; 32-a second pusher plate; 33-a second support table; 34-a third motor; 35-a second rotating shaft; 36-a second extension plate; 37-second electric push rod.
Detailed Description
The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
Referring to fig. 1 to 8, a chip bonding process device for semiconductor chip packaging comprises a main body conveyor 1, a substrate conveyor 2, a chip conveyor 3, a substrate positioning table 4, a substrate glue injection mechanism, a chip positioning table 5, a substrate feeding mechanism and a chip feeding mechanism, wherein a plurality of positioning frames 6 are arranged on the main body conveyor 1 and are distributed at equal intervals along the length direction of the main body conveyor 1, the substrate conveyor 2 and the chip conveyor 3 are respectively arranged at two sides of a cylinder conveyor at intervals, the substrate conveyor 2, the chip conveyor 3 and the main body conveyor 1 are distributed in a parallel state, the substrate positioning table 4 is arranged at one side of the substrate conveyor 2, the substrate glue injection mechanism is arranged at the top of the substrate positioning table 4, a substrate positioning groove 7 corresponding to each positioning frame 6 is arranged on the substrate positioning table 4, the substrate glue injection mechanism is provided with an epoxy resin drip injection pipe 8 corresponding to each substrate positioning groove 7, the substrate feeding mechanism is arranged between the substrate positioning table 4 and the main body conveyor 1, the substrate feeding mechanism comprises a suction cup 10 capable of moving the workpiece in each positioning groove 7 and moving from the first positioning frame 6 to the second positioning table 5, and the chip feeding mechanism is arranged between the chip positioning table 5 and the chip positioning table 6.
One side of substrate conveyer 2 is equipped with respectively and fixes a position first support frame 12 of base sheet constant head tank 7 one-to-one on the base sheet locating platform 4, be provided with first cylinder 13 on every first support frame 12 respectively, every first cylinder 13 all is the level setting, the direction extension setting of every base sheet constant head tank 7 is respectively towards every first cylinder 13's output, every first cylinder 13's output is provided with respectively can push away the work piece on the substrate conveyer 2 to the first push pedal 14 of every base sheet constant head tank 7, during the operation, carry the base sheet in proper order through substrate conveyer 2, when every base sheet removes respectively to one side of every base sheet constant head tank 7, start every first cylinder 13 simultaneously, drive every first push pedal 14 respectively through every first cylinder 13 and push every base sheet on the substrate conveyer 2 into base sheet constant head tank 7 and fix a position.
The substrate glue injection mechanism comprises a cross beam 15, a first motor 16, two-way screw rods 17, a lifting plate 18, two hinge rods 19 and two bearing seats 20, wherein the cross beam 15 is positioned above the substrate positioning table 4, two ends of the cross beam 15 are respectively connected with the top of the substrate positioning table 4 through vertical supports 21, the two bearing seats 20 are symmetrically arranged at two ends of the top of the cross beam 15, the two-way screw rods 17 are horizontally positioned between the two bearing seats 20, two ends of the two-way screw rods 17 are respectively inserted into an inner ring of each bearing seat 20 in a rotating manner, the first motor 16 is horizontally positioned at one side of one of the bearing seats 20, an output end of the first motor 16 is in transmission connection with one end of each two-way screw rod 17, screw rod sliding sleeves capable of moving in opposite directions on the two-way screw rods 17 are symmetrically arranged on the two-way screw rods 17, the lifting plate 18 is horizontally positioned under the cross beam 15, the two hinge rods 19 are vertically and symmetrically arranged above the lifting plate 18, the bottom of each hinged rod 19 is hinged with the center of the top of the lifting plate 18, the upper end of each hinged rod 19 penetrates through two sides of the cross beam 15 and extends upwards, the top of each hinged rod 19 is hinged with the bottom of each screw rod sliding sleeve, an avoidance port 22 for allowing each hinged rod 19 to move is arranged on the cross beam 15, all epoxy resin drip pipes 8 are distributed at the bottom of the lifting plate 18 along the length direction of the lifting plate 18 at equal intervals, when each substrate enters each substrate positioning groove 7 and is positioned, the first motor 16 is started, the first motor 16 drives the two-way screw rod 17 to rotate, the two screw rod sliding sleeves are driven to move oppositely through the two-way screw rod 17, the upper ends of the two hinged connecting rods are driven to move oppositely through the two screw rod sliding sleeves, and the lifting plate 18 is driven to linearly move along the vertical direction of the vertical support 21 through the lower ends of the two hinged connecting rods Until each epoxy resin dropping pipe 8 provided on the lifting plate 18 is moved to a preset height, and then glue is injected to the surface of each substrate through each epoxy resin dropping pipe 8.
The both ends of lifter plate 18 are provided with slider 23 respectively, are provided with respectively on every vertical support 21 to be used for supplying the gliding spout 24 of every slider 23, and when lifter plate 18 goes up and down along every vertical support 21, every slider 23 that lifter plate 18 both ends set up carries out spacing removal along every spout 24 respectively.
Substrate feeding mechanism includes first supporting station 25 and the second motor 26 with 6 one-to-one of every locating frame, first supporting station 25 is located between substrate locating station 4 and the main part conveyer 1, every second motor 26 is vertical top of installing at first supporting station 25 respectively, every second motor 26's output sets up respectively up, every second motor 26's output is equipped with the first pivot 27 that is vertical setting respectively, the top of every first pivot 27 is equipped with the first extension board 28 that is the level setting respectively, the one end of every first extension board 28 is connected respectively in the top of every first pivot 27.
The extending end of each first extending plate 28 is respectively provided with a first electric push rod 29 which is vertically arranged, the working end of each first electric push rod 29 is arranged downwards, each first suction cup 9 is horizontally arranged at the working end of each first electric push rod 29, after the substrate in each substrate positioning groove 7 is injected with glue through an epoxy resin dripping pipe 8, each second motor 26 is started, each first rotating shaft 27 is driven to rotate through each second motor 26, each first extending plate 28 is driven to rotate through the first rotating shaft 27 to stop right above each substrate positioning groove 7, each first electric push rod 29 is started, the working ends are driven to move downwards through the first electric push rods 29, meanwhile, the surfaces of the substrates which are not injected with glue are abutted through the first suction cups 9, suction and compounding are carried out, and then the substrates sucked by the first suction cups 9 are placed into the positioning frames 6 on the main body conveyor 1 through the second motors 26 driving the first rotating shafts 27.
One side of chip conveyor 3 is equipped with respectively with chip positioning table 5 on the second support frame 30 of chip positioning groove 10 one-to-one, be provided with second cylinder 31 on every second support frame 30 respectively, every second cylinder 31 all is the level setting, every second cylinder 31's output extends the setting towards every chip positioning groove 10's direction respectively, every second cylinder 31's output is provided with respectively can push away the work piece on the chip conveyor 3 to every chip positioning groove 10's second push pedal 32, carry the chip in proper order through chip conveyor 3, when every chip removes respectively to one side of every chip positioning groove 10, start every second cylinder 31 simultaneously, drive every first push pedal 14 respectively through every second cylinder 31 and push into chip positioning groove 10 with every chip on the chip conveyor 3 and fix a position.
Chip feeding mechanism includes second brace table 33 and the third motor 34 with 6 one-to-one of every locating frame, second brace table 33 is located between chip locating platform 5 and main part conveyer 1, every third motor 34 is vertical top of installing at second brace table 33 respectively, the output of every third motor 34 sets up respectively up, the output of every third motor 34 is equipped with the second pivot 35 that is vertical setting respectively, the top of every second pivot 35 is equipped with the second extension board 36 that is the level setting respectively, the one end of every second extension board 36 is connected respectively in the top of every second pivot 35.
The extension end of each second extension plate 36 is respectively provided with a second electric push rod 37 which is vertically arranged, the working end of each second electric push rod 37 is respectively arranged downwards, each second suction cup 11 is respectively arranged at the working end of each second electric push rod 37 horizontally, each third motor 34 is started, each third motor 34 is used for respectively driving each second rotating shaft 35 to rotate, each second extension plate 36 is driven to rotate through the second rotating shaft 35 and stop right above each chip positioning groove 10, each second electric push rod 37 is started, the working ends are driven to move downwards through the second electric push rods 37, the surfaces of the chips are simultaneously abutted through the second suction cups 11, the chips are sucked and then compounded, and the substrates sucked by the second suction cups 11 are placed on the substrates injected with glue on the main body conveyor 1 through the second rotating shafts 35 driven by the third motors 34, so that the bonding is completed.
A chip bonding process device and method for semiconductor chip packaging comprises the following steps:
firstly, during operation, substrates are sequentially conveyed through the substrate conveyor 2, when each substrate moves to one side of each substrate positioning groove 7, each first air cylinder 13 is started at the same time, and each first push plate 14 is driven by each first air cylinder 13 to push each substrate on the substrate conveyor 2 into the substrate positioning groove 7 for positioning;
secondly, after each substrate enters each substrate positioning groove 7 and is positioned, starting a first motor 16, driving a two-way screw 17 to rotate through the first motor 16, driving two screw slide sleeves to move oppositely through the two-way screw 17, driving the upper ends of two hinged connecting rods to move oppositely through the two screw slide sleeves, driving a lifting plate 18 to move linearly along the vertical direction of a vertical support 21 through the lower ends of the two hinged connecting rods until each epoxy resin drip pipe 8 arranged on the lifting plate 18 moves to a preset height to stop, injecting glue to the surface of each substrate through each epoxy resin drip pipe 8, and when the lifting plate 18 is lifted along each vertical support 21, each sliding block 23 arranged at the two ends of the lifting plate 18 respectively performs limiting movement along each sliding groove 24;
thirdly, after the substrate in each substrate positioning groove 7 is injected with glue through the epoxy resin dripping pipe 8, starting each second motor 26, driving each first rotating shaft 27 to rotate through each second motor 26, driving each first extending plate 28 to rotate to the position right above each substrate positioning groove 7 through the first rotating shaft 27 to stop, starting the first electric push rod 29, driving the working end to move downwards through the first electric push rod 29, meanwhile, abutting the surface of each substrate, which is not injected with glue, through the first suction cup 9, sucking, compounding, and driving the first rotating shaft 27 through the second motor 26 to enable the substrate sucked by the first suction cup 9 to be placed into the positioning frame 6 on the main body conveyor 1;
fourthly, the chips are sequentially conveyed by the chip conveyor 3, when each chip moves to one side of each chip positioning groove 10, each second air cylinder 31 is started simultaneously, and each first push plate 14 is driven by each second air cylinder 31 to push each chip on the chip conveyor 3 into the chip positioning groove 10 for positioning;
and fifthly, starting each third motor 34, driving each second rotating shaft 35 to rotate through each third motor 34 respectively, driving each second extending plate 36 to rotate to each chip positioning groove 10 through the second rotating shaft 35 to stop, starting a second electric push rod 37, driving the working end to move downwards through the second electric push rod 37, meanwhile, butting the surface of the chip through the second sucking disc 11, sucking, compounding, driving the second rotating shaft 35 through the third motor 34 to enable the substrate sucked by the second sucking disc 11 to be placed on the substrate injected with glue on the main body conveyor 1, and completing the bonding.
The foregoing shows and describes the general principles, principal features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A chip bonding process device for semiconductor chip packaging is characterized by comprising a main body conveyor (1), a substrate conveyor (2), a chip conveyor (3), a substrate positioning table (4), a substrate glue injection mechanism, a chip positioning table (5), a substrate feeding mechanism and a chip feeding mechanism, wherein a plurality of positioning frames (6) are arranged on the main body conveyor (1) and are distributed at equal intervals along the length direction of the main body conveyor (1), the substrate conveyor (2) and the chip conveyor (3) are respectively arranged at two sides of a cylinder conveyor at intervals, the substrate conveyor (2), the chip conveyor (3) and the main body conveyor (1) are distributed in a parallel state, the substrate positioning table (4) is positioned at one side of the substrate conveyor (2), the substrate glue injection mechanism is arranged at the top of the substrate positioning table (4), the substrate positioning table (4) is provided with substrate positioning grooves (7) corresponding to each positioning frame (6), the substrate mechanism is provided with epoxy resin drip injection pipes (8) corresponding to each substrate positioning groove (7), the substrate feeding mechanism is positioned between the substrate positioning table (4) and the main body conveyor (1), each substrate feeding mechanism comprises a first chip positioning frame (6) and a sucker (5) capable of grabbing each substrate to grab each chip positioning table (5), the chip feeding mechanism is positioned between the chip positioning table (5) and the main body conveyor (1), the chip positioning table (5) is provided with chip positioning grooves (10) corresponding to each positioning frame (6), and the chip feeding mechanism comprises second suckers (11) which can grab workpieces in each chip positioning groove (10) and move to each positioning frame (6);
one side of the substrate conveyor (2) is respectively provided with first support frames (12) which are in one-to-one correspondence with the substrate positioning grooves (7) on the substrate positioning table (4), each first support frame (12) is respectively provided with a first air cylinder (13), each first air cylinder (13) is horizontally arranged, the output end of each first air cylinder (13) extends towards the direction of each substrate positioning groove (7), and the output end of each first air cylinder (13) is respectively provided with a first push plate (14) which can push a workpiece on the substrate conveyor (2) to each substrate positioning groove (7);
the substrate glue injection mechanism comprises a cross beam (15), a first motor (16), two-way screws (17), a lifting plate (18), two hinge rods (19) and two bearing seats (20), the cross beam (15) is positioned above the substrate positioning table (4), two ends of the cross beam (15) are respectively connected with the top of the substrate positioning table (4) through vertical supports (21), the two bearing seats (20) are symmetrically arranged at two ends of the top of the cross beam (15), the two-way screws (17) are horizontally positioned between the two bearing seats (20), two ends of the two-way screws (17) are respectively inserted into an inner ring of each bearing seat (20) in a rotatable manner, the first motor (16) is horizontally positioned at one side of one bearing seat (20), the output end of the first motor (16) is in transmission connection with one end of the two-way screws (17), sliding sleeves capable of moving in the opposite directions on the two-way screws (17) are symmetrically arranged on the two-way screws (17), the lifting plate (18) is horizontally positioned right below the cross beam (15), the two hinge rods (19) are symmetrically arranged above the hinge plates and penetrate through the centers of the two hinge rods (19), the lifting plate (18) and the lifting plate (18) extends upwards, an avoidance opening (22) for each hinged rod (19) to move is formed in the cross beam (15), and all the epoxy resin drip pipes (8) are distributed at the bottom of the lifting plate (18) at equal intervals along the length direction of the lifting plate (18);
the two ends of the lifting plate (18) are respectively provided with a sliding block (23), and each vertical bracket (21) is respectively provided with a sliding groove (24) for each sliding block (23) to slide;
substrate feeding mechanism includes first supporting station (25) and second motor (26) with every locating frame (6) one-to-one, first supporting station (25) are located between substrate location platform (4) and main part conveyer (1), every second motor (26) are vertical top of installing in first supporting station (25) respectively, the output of every second motor (26) sets up respectively, the output of every second motor (26) is equipped with first pivot (27) that are vertical setting respectively, the top of every first pivot (27) is equipped with respectively and is first extension board (28) that the level set up, the one end of every first extension board (28) is connected in the top of every first pivot (27) respectively.
2. The die bonding process equipment for semiconductor chip packaging according to claim 1, wherein the extending end of each first extending plate (28) is respectively provided with a first electric push rod (29) which is vertically arranged, the working end of each first electric push rod (29) is respectively arranged downwards, and each first suction cup (9) is respectively horizontally arranged at the working end of each first electric push rod (29).
3. The die bonding process equipment for semiconductor die packaging according to claim 2, wherein one side of the die conveyor (3) is respectively provided with a second supporting frame (30) corresponding to the die positioning slots (10) on the die positioning table (5) one by one, each second supporting frame (30) is respectively provided with a second cylinder (31), each second cylinder (31) is horizontally arranged, the output end of each second cylinder (31) extends towards the direction of each die positioning slot (10), and the output end of each second cylinder (31) is respectively provided with a second pushing plate (32) capable of pushing the workpiece on the die conveyor (3) to each die positioning slot (10).
4. The chip bonding process equipment for semiconductor chip packaging according to claim 3, wherein the chip feeding mechanism comprises a second supporting platform (33) and third motors (34) corresponding to each positioning frame (6) one by one, the second supporting platform (33) is located between the chip positioning platform (5) and the main body conveyor (1), each third motor (34) is vertically installed at the top of the second supporting platform (33), the output end of each third motor (34) is arranged upwards respectively, the output end of each third motor (34) is provided with a second rotating shaft (35) which is vertically arranged respectively, the top end of each second rotating shaft (35) is provided with a second extending plate (36) which is horizontally arranged respectively, and one end of each second extending plate (36) is connected with the top end of each second rotating shaft (35) respectively.
5. The die bonding process equipment for semiconductor die packaging according to claim 4, wherein the extending end of each second extending plate (36) is respectively provided with a second electric push rod (37) which is vertically arranged, the working end of each second electric push rod (37) is respectively arranged downwards, and each second suction cup (11) is respectively horizontally arranged at the working end of each second electric push rod (37).
6. An implementation method of a chip bonding process device for semiconductor chip packaging is characterized by comprising the following steps:
the method comprises the following steps that firstly, during operation, substrates are sequentially conveyed through a substrate conveyor (2), when each substrate moves to one side of each substrate positioning groove (7) respectively, each first air cylinder (13) is started simultaneously, and each first push plate (14) is driven by each first air cylinder (13) to push each substrate on the substrate conveyor (2) into the substrate positioning groove (7) for positioning;
secondly, after each substrate enters each substrate positioning groove (7) and is positioned, starting a first motor (16), driving a two-way screw (17) to rotate through the first motor (16), driving two screw rod sliding sleeves to move in opposite directions through the two screw rod sliding sleeves (17), driving the upper ends of two hinged connecting rods to move in opposite directions through the two screw rod sliding sleeves, driving a lifting plate (18) to linearly move along the vertical direction of a vertical support (21) through the lower ends of the two hinged connecting rods until each epoxy resin dripping pipe (8) arranged on the lifting plate (18) moves to a preset height and stops, injecting glue to the surface of each substrate through each epoxy resin dripping pipe (8), and when the lifting plate (18) is lifted along each vertical support (21), limiting movement is carried out on each sliding block (23) arranged at the two ends of the lifting plate (18) along each sliding groove (24) respectively;
thirdly, after the substrate in each substrate positioning groove (7) is injected with glue through an epoxy resin dripping pipe (8), each second motor (26) is started, each first rotating shaft (27) is driven to rotate through each second motor (26), each first extending plate (28) is driven to rotate through the first rotating shaft (27) to stop when the substrate is positioned right above each substrate positioning groove (7), a first electric push rod (29) is started, the working end is driven to move downwards through the first electric push rod (29), the surface of each substrate which is not injected with glue is abutted through the first suction disc (9) and sucked, then compounding is carried out, and the second motor (26) drives the first rotating shaft (27) to enable the substrate sucked by the first suction disc (9) to be placed into a positioning frame (6) on the main body conveyor (1);
fourthly, conveying the chips in sequence through the chip conveyor (3), starting each second air cylinder (31) when each chip moves to one side of each chip positioning groove (10) respectively, and driving each first push plate (14) to push each chip on the chip conveyor (3) into the chip positioning groove (10) through each second air cylinder (31) to position;
and fifthly, starting each third motor (34), driving each second rotating shaft (35) to rotate through each third motor (34) respectively, driving each second extending plate (36) to rotate to each chip positioning groove (10) through each second rotating shaft (35) to stop right above, starting a second electric push rod (37), driving a working end to move downwards through the second electric push rod (37), meanwhile, butting the surface of the chip through a second sucking disc (11), sucking, compounding, driving the second rotating shaft (35) through the third motor (34) to enable the substrate sucked by the second sucking disc (11) to be placed on the substrate injected with glue on the main body conveyor (1), and finishing the bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010810890.8A CN112103210B (en) | 2020-08-13 | 2020-08-13 | Chip bonding process equipment for semiconductor chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010810890.8A CN112103210B (en) | 2020-08-13 | 2020-08-13 | Chip bonding process equipment for semiconductor chip packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112103210A CN112103210A (en) | 2020-12-18 |
| CN112103210B true CN112103210B (en) | 2023-03-31 |
Family
ID=73752946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010810890.8A Active CN112103210B (en) | 2020-08-13 | 2020-08-13 | Chip bonding process equipment for semiconductor chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112103210B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366162B (en) * | 2021-01-13 | 2021-04-09 | 四川晶辉半导体有限公司 | Integrated packaging device for surface mount diodes |
| CN117096060B (en) * | 2023-08-18 | 2024-04-19 | 南通华隆微电子股份有限公司 | Semiconductor element packaging equipment |
| CN116995009B (en) * | 2023-09-26 | 2023-11-28 | 广东长华科技有限公司 | Die assembly for chip packaging processing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252239A (en) * | 1993-02-22 | 1994-09-09 | Toshiba Corp | Apparatus for fabricating semiconductor device |
| CN105990298A (en) * | 2015-02-06 | 2016-10-05 | 展讯通信（上海）有限公司 | Chip packaging structure and preparation method thereof |
| CN108538759A (en) * | 2018-04-02 | 2018-09-14 | 岑森参 | A kind of novel slice type semiconductor ultra-thin packaging system |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2688791B2 (en) * | 1991-05-01 | 1997-12-10 | 大日本印刷株式会社 | A device to attach sample chips to the mount of sample books |
| US6255140B1 (en) * | 1998-10-19 | 2001-07-03 | Industrial Technology Research Institute | Flip chip chip-scale package |
| WO2001026146A1 (en) * | 1999-10-01 | 2001-04-12 | Hitachi, Ltd. | Semiconductor device and method of manufacture thereof |
| SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
| KR100924548B1 (en) * | 2007-11-09 | 2009-11-02 | 주식회사 하이닉스반도체 | Die bonding apparatus |
| SG165186A1 (en) * | 2009-03-13 | 2010-10-28 | Semiconductor Tech & Instr Inc | An apparatus for handling a semiconductor component |
| JP5772092B2 (en) * | 2011-03-11 | 2015-09-02 | 富士電機株式会社 | Semiconductor manufacturing method and semiconductor manufacturing apparatus |
| US8613474B2 (en) * | 2011-07-06 | 2013-12-24 | Tel Nexx, Inc. | Substrate loader and unloader having a Bernoulli support |
| JP5774968B2 (en) * | 2011-11-15 | 2015-09-09 | ヤマハ発動機株式会社 | Component transfer device and suction position adjustment method in component transfer device |
| KR102231293B1 (en) * | 2014-02-10 | 2021-03-23 | 삼성전자주식회사 | Die bonding apparatus |
| CN108511364B (en) * | 2017-02-28 | 2020-01-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN109390249A (en) * | 2017-08-10 | 2019-02-26 | 上海微电子装备（集团）股份有限公司 | Semiconductor manufacturing apparatus |
| CN109449104A (en) * | 2018-11-13 | 2019-03-08 | 江苏澳芯微电子有限公司 | Encapsulate the device of chip |
| CN109290666B (en) * | 2018-11-19 | 2019-09-17 | 北京市金索恒盾防护设备有限公司 | Digital controlling plasma abnormity cutting lathe |
| CN110299312A (en) * | 2019-07-04 | 2019-10-01 | 深圳市诺泰自动化设备有限公司 | A kind of rotary type tower bonder |
| CN110911317A (en) * | 2019-12-05 | 2020-03-24 | 袁晓华 | Chip production error control method based on Internet of things |
-
2020
- 2020-08-13 CN CN202010810890.8A patent/CN112103210B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06252239A (en) * | 1993-02-22 | 1994-09-09 | Toshiba Corp | Apparatus for fabricating semiconductor device |
| CN105990298A (en) * | 2015-02-06 | 2016-10-05 | 展讯通信（上海）有限公司 | Chip packaging structure and preparation method thereof |
| CN108538759A (en) * | 2018-04-02 | 2018-09-14 | 岑森参 | A kind of novel slice type semiconductor ultra-thin packaging system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112103210A (en) | 2020-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112103210B (en) | Chip bonding process equipment for semiconductor chip packaging | |
| KR20130116960A (en) | Method and apparatus for working glass plate | |
| CN210995034U (en) | Automatic dispensing pressure maintaining equipment | |
| CN210223987U (en) | Full-automatic wafer lower and upper wax-loading return line | |
| JP6195008B2 (en) | Glass plate processing equipment | |
| CN116214160A (en) | Full-automatic assembly system and assembly method | |
| JP3497078B2 (en) | Die bonder | |
| CN211680877U (en) | Automatic man-machine combination assembling line for mainboard controller | |
| CN209754790U (en) | Full-automatic edge grinding equipment for lenses | |
| CN114148571B (en) | Glue bottle packing device | |
| CN210588058U (en) | Automatic assembling equipment | |
| WO2022188228A1 (en) | Machining device for automatic loading and unloading | |
| CN214487671U (en) | Six-station gluing and assembling equipment | |
| CN110676199B (en) | High-speed mounting imprinter | |
| CN209793351U (en) | Full-automatic grinding machine | |
| CN213494649U (en) | Rotary spot coating device for plastic workpieces | |
| CN110303339B (en) | Automatic assembly equipment | |
| CN212653241U (en) | Washing machine commutator processingequipment | |
| CN111628387B (en) | Card holds in palm bullet spare assembly system | |
| CN214795569U (en) | Vertical developing device | |
| CN215451351U (en) | Automatic arrangement machine for wafer base | |
| CN212750854U (en) | Wafer coating machine | |
| CN114750057B (en) | Back thinning equipment and process for producing composite fast recovery diode | |
| CN115241084B (en) | Efficient semiconductor packaging equipment and packaging method thereof | |
| CN214877852U (en) | Automatic feeding mechanism for nozzle assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230215 Address after: 334000 Building ABC, standard plant, Phase III, Xiafeng Industrial Park, Shangrao High-tech Zone, Guangfeng District, Shangrao City, Jiangxi Province Applicant after: Shangrao Guangfeng Times Technology Co.,Ltd. Address before: Room 506, unit 1, No. 13, Jinxing residential community, Shanghai Road, Qingshanhu District, Nanchang City, Jiangxi Province Applicant before: Zhang Guohua |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |