CN115241084B - Efficient semiconductor packaging equipment and packaging method thereof - Google Patents
Efficient semiconductor packaging equipment and packaging method thereof Download PDFInfo
- Publication number
- CN115241084B CN115241084B CN202210519864.9A CN202210519864A CN115241084B CN 115241084 B CN115241084 B CN 115241084B CN 202210519864 A CN202210519864 A CN 202210519864A CN 115241084 B CN115241084 B CN 115241084B
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- moving plate
- wafer
- injection molding
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000003292 glue Substances 0.000 claims abstract description 53
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- 238000001746 injection moulding Methods 0.000 claims abstract description 41
- 230000001502 supplementing effect Effects 0.000 claims abstract description 18
- 238000007599 discharging Methods 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 86
- 238000002347 injection Methods 0.000 claims description 28
- 239000007924 injection Substances 0.000 claims description 28
- 238000005452 bending Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000013589 supplement Substances 0.000 claims description 3
- 241000252254 Catostomidae Species 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 description 16
- 239000004033 plastic Substances 0.000 description 16
- 238000000465 moulding Methods 0.000 description 12
- 238000009434 installation Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 244000309464 bull Species 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to the field of semiconductor packaging equipment, in particular to efficient semiconductor packaging equipment and a packaging method thereof. The efficient semiconductor packaging equipment comprises a processing table, supporting columns, a top plate, a feeding conveying belt, a discharging conveying belt, a movable plate, a driving mechanism, a glue supplementing mechanism, an injection molding mechanism, a conveying belt, a conveying seat, a processing seat and fixing strips, wherein the supporting columns are fixedly connected to four corners of the top of the processing table. According to the efficient semiconductor packaging equipment and the packaging method thereof, the driving mechanism can drive the two movable plates to move back and forth along the guide rail, the processes of feeding, glue supplementing, injection molding and discharging are sequentially carried out, the reciprocating operation is carried out, the semiconductor is packaged continuously, the production and processing efficiency is improved, the packaging speed is accelerated, the assembly line operation is facilitated, the injection molding head can be always attached to the edge of the wafer in the glue supplementing process through the glue supplementing mechanism, the glue is more uniform in sealing, and the firmness and the sealing performance after glue supplementing are enhanced.
Description
Technical Field
The invention relates to the field of semiconductor packaging equipment, in particular to efficient semiconductor packaging equipment and a packaging method thereof.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small wafers after the scribing process, the bonding pads of the wafers are connected to corresponding pins of the substrate by utilizing superfine metal wires or conductive resin, a required circuit is formed, glue is supplemented to the outer ring of the wafers, the firmness of the wafers is guaranteed, then the independent wafers are subjected to injection molding resin shell packaging protection, the wafers need to be converted among stations through a mechanical arm in the processing process of glue supplementing and injection molding resin shell of the outer ring of the wafers, the efficiency of material loading and replacement through manual work is low, the material loading is carried out through the mechanical arm, the price is high, the cost is high, the direction of the mechanical arm needs to be adjusted through continuous rotation, the material loading is carried out in sequence, and the efficiency of semiconductor packaging is reduced.
Therefore, it is necessary to provide a new efficient semiconductor packaging apparatus and a packaging method thereof to solve the above technical problems.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a semiconductor packaging apparatus with high efficiency and a packaging method thereof.
The semiconductor packaging equipment with high efficiency provided by the invention comprises: processing platform, support column, roof, feeding conveyer belt, unloading conveyer belt, movable plate, actuating mechanism, benefit gluey mechanism, the mechanism of moulding plastics, conveying conveyer belt, transport seat, processing seat and fixed strip, the equal fixedly connected with support column in processing bench top four corners, processing bench side is equipped with the roof, the support column top all with roof fixed connection, the feeding conveyer belt is installed in processing bench top one side, the unloading conveyer belt is installed at processing bench top, the unloading conveyer belt sets up in feeding conveyer belt one side, the movable plate equidistance sets up between processing platform and roof, the actuating mechanism equidistance is installed in the roof bottom, benefit gluey mechanism and install in corresponding movable plate bottom one side, the mechanism of moulding plastics is installed in movable plate bottom one side that corresponds, conveying conveyer belt installs at processing bench top, and conveying conveyer belt and feeding conveyer belt mutually perpendicular, conveying conveyer belt outside equidistance installs the processing seat, the constant head tank has all been seted up at processing seat and conveying seat top.
Preferably, actuating mechanism includes spliced pole, guide rail, socket piece, outer loop bar, interior pole, bull stick, the lantern ring, telescopic cylinder, foundation block, connecting rod and side lever, the movable plate both sides all are equipped with the guide rail, the equal equidistance fixedly connected with spliced pole in guide rail top, the spliced pole top all with roof fixed connection, the equal fixedly connected with side lever in movable plate both sides, the side lever is all pegged graft inside the guide rail that corresponds, and the side lever all with corresponding guide rail sliding connection, the equal equidistance in movable plate top one side is equipped with outer loop bar, the equal sliding grafting of outer loop bar inside has interior pole, the equal fixedly connected with lantern ring in interior pole bottom, the inside equal rotation of lantern ring is connected with the bull stick, the bull stick all with corresponding fixed connection, outer loop bar top one side all is connected with the movable plate socket piece through the pivot rotation, socket piece top all with roof fixed connection, roof bottom equidistance is equipped with telescopic cylinder, telescopic cylinder top both sides all are connected with foundation block through the pivot rotation, foundation block top all with roof fixed connection, telescopic cylinder's output all rotates through the pivot pin and is connected with the movable plate top, the connecting rod top all is equipped with the outer wall through the pivot pin connection.
Preferably, mend gluey mechanism and include installation shell, motor, connecting seat, the piece of buckling, injecting glue head, slide bar, second spring, fixed block and spacing gyro wheel, conveyer belt top one side is equipped with the installation shell, and installation shell top and the movable plate fixed connection who corresponds, the inside fixed mounting of installation shell has the motor, the output of motor runs through installation shell fixedly connected with connecting seat, the output of motor passes through the bearing and is connected with the installation shell rotation, connecting seat bottom one side is equipped with the piece of buckling, the inside fixed mounting of the piece of buckling has the injecting glue head, the inside equidistance of connecting seat slides and pegs graft and has the slide bar, slide bar one end all with the piece fixed connection of buckling, the slide bar outside all overlaps there is the second spring, the one end of second spring all with connecting seat fixed connection, the other end of second spring all with the one end fixed connection who corresponds the slide bar, buckle piece one side equidistance fixed connection has the fixed block, rotate through the bearing between the fixed block and be connected with spacing gyro wheel.
Preferably, the mechanism of moulding plastics includes the set casing, moulds plastics the pipe, moulds plastics head, cover shell, ration box and elastic sheet, carry conveyer belt top one side to be equipped with the set casing, set casing top and the movable plate fixed connection who corresponds, the inside fixed mounting of set casing has the pipe of moulding plastics, mould plastics the socle end and install the head of moulding plastics, set casing bottom fixedly connected with cover shell, and the cover shell is in the first outside of moulding plastics, the inside slip of cover shell is pegged graft and is had the ration box, the inside equidistance of cover shell equiangular symmetry is equipped with elastic sheet, and elastic sheet both ends are equallyd divide do not with cover shell and quantitative box correspond one side inner wall fixed connection.
Preferably, three sides of the top of the processing table are fixedly connected with baffle plates.
Preferably, the equal fixedly connected with U-shaped board in movable plate bottom one side, the equal slip grafting of U-shaped inboard has the air duct, the equal fixedly connected with sucking disc in air duct bottom, the air duct outside all cup joints and is fixed with solid fixed ring, the air duct outside all overlaps and has first spring, the both ends of first spring are equallyd divide do not with solid fixed ring and U-shaped board fixed connection to.
Preferably, a placing frame is fixedly connected to one side of the top of the processing table.
Preferably, the containing discs are placed at the top of the containing frame at equal intervals, and the containing grooves are formed in the top of the containing discs at equal intervals.
Preferably, the outer wall of the side rod is positioned at two sides of the guide rail and is fixedly sleeved with a retaining ring.
A packaging method of a high-efficiency semiconductor packaging device comprises the following specific steps:
s1: the semiconductor with the connected wafer and the substrate is placed in a positioning groove of a feeding conveyor belt, and the semiconductor is conveyed in sequence through intermittent transmission of the feeding conveyor belt;
s2: when the wafer is conveyed to the feeding conveyor belt to be close to the edge part, the extending output end of a telescopic cylinder in the driving mechanism is shortened, the outer sleeve rod is driven to rotate through the output end, the moving plate moves, side rods on two sides of the moving plate slide in the guide rails, and the moving plate is lifted to a certain height and then moves in an inclined mode in the moving process;
s3: when the side rod of the moving plate slides to one end of the guide rail gradually, the sucker can face the edge of the wafer to descend, so that the wafer is adsorbed by the sucker, the output end of the telescopic cylinder reaches the shortest distance, and when the telescopic cylinder extends, the wafer is adsorbed by the sucker and moves synchronously with the moving plate;
s4: under the drive of the moving plate, the wafer is placed in the positioning groove corresponding to the processing seat on the conveying conveyor belt by the sucker, the telescopic cylinder is shortened again, the sucker moves the belt again to feed the conveying belt for secondary adsorption, and at the moment, the glue injection head descends to bring the processing seat corresponding to the belt, and the processing seat rotates along with the connecting seat under the drive of the motor, and simultaneously injects glue into the periphery of the wafer for glue supplement;
s5: the sucking disc slowly carries out secondary feeding along with the telescopic cylinder, the wafers which are well glued are conveyed towards the other moving plate in the feeding process, when the wafers reach the injection molding mechanism, the fixed shell is moved through the moving plate on the other side which is driven by the telescopic cylinder in the same way, the quantitative box is made to descend and be sleeved on the outer side of the corresponding wafer, and resin injection molding is carried out through the injection molding head;
s6: after injection molding is finished, the telescopic cylinder on the other side drives the movable plate to move gradually, the quantitative box is separated from the wafer, the sucking disc gradually reaches the injection molded wafer and adsorbs the injection molded wafer, and then the sucking disc is driven by the telescopic cylinder to place the packaged injection molded wafer on a blanking conveying belt for sequential conveying;
s7: the steps are sequentially carried out with the processes of feeding, glue supplementing, injection molding and discharging, reciprocating operation is carried out, and the semiconductor is continuously packaged.
Compared with the related art, the semiconductor packaging equipment with high efficiency and the packaging method thereof provided by the invention have the following beneficial effects:
1. the invention provides efficient semiconductor packaging equipment and a packaging method thereof.
2. The invention provides efficient semiconductor packaging equipment and a packaging method thereof, wherein an injection molding head can be always attached to the edge of a wafer in the glue supplementing process through a glue supplementing mechanism, so that the glue is more uniform in the glue supplementing process, and the firmness and the sealing property after glue supplementing are enhanced.
3. The invention provides efficient semiconductor packaging equipment and a packaging method thereof.
4. When the sucker contacts with a wafer for adsorption, if the sucker descends too much, the sucker drives the air guide pipe to slide under the obstruction of the wafer, so that the first spring contracts to prevent the wafer from being damaged due to the excessive descent, the sucker can be attached to the wafer when the sucker descends, and the adsorption is stable and firm.
Drawings
Fig. 1 is a schematic structural diagram of a high-efficiency semiconductor packaging apparatus provided by the present invention;
FIG. 2 is a schematic view of the processing station of FIG. 1;
FIG. 3 is a schematic view of the construction of the conveyor belt of FIG. 1;
FIG. 4 is a schematic view of the top plate of FIG. 1;
FIG. 5 is an enlarged view of the structure of the area A shown in FIG. 4;
FIG. 6 is a schematic structural view of the drive mechanism shown in FIG. 1;
FIG. 7 is a schematic structural view of the glue filling mechanism shown in FIG. 1;
FIG. 8 is a schematic view of the structure of the bending sheet shown in FIG. 1;
FIG. 9 is a schematic structural view of the glue filling mechanism shown in FIG. 1;
FIG. 10 is a structural sectional view of the stationary housing shown in FIG. 1;
FIG. 11 is a cross-sectional view of the structure of the receiving tray shown in FIG. 1;
fig. 12 is a flow chart illustrating a packaging method of the efficient semiconductor packaging apparatus.
Reference numbers in the figures: 1. a processing table; 2. a support pillar; 3. a top plate; 4. a feed conveyor; 5. a blanking conveyor belt; 6. moving the plate; 7. a drive mechanism; 8. a glue supplementing mechanism; 9. an injection molding mechanism; 10. a conveyor belt; 11. a conveying seat; 12. processing a base; 13. a fixing strip; 14. a baffle plate; 15. positioning a groove; 16. placing a rack; 17. a storage tray; 18. a U-shaped plate; 19. an air duct; 20. a suction cup; 21. a fixing ring; 22. a first spring; 23. a placement groove; 71. connecting columns; 72. a guide rail; 73. a bearing block; 74. an outer loop bar; 75. an inner rod; 76. a rotating rod; 77. a collar; 78. a telescopic cylinder; 79. a foundation block; 710. a connecting rod; 711. a side lever; 712. a baffle ring; 81. mounting a shell; 82. a motor; 83. a connecting seat; 84. bending the sheet; 85. a glue injection head; 86. a slide bar; 87. a second spring; 88. a fixed block; 89. limiting the idler wheel; 91. a stationary case; 92. injection molding a tube; 93. an injection head; 94. a housing; 95. a dosing cartridge; 96. an elastic sheet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
Referring to fig. 1 to 11, an embodiment of the present invention provides an efficient semiconductor packaging apparatus, which includes: processing platform 1, support column 2, roof 3, feeding conveyer belt 4, unloading conveyer belt 5, movable plate 6, actuating mechanism 7, benefit gluey mechanism 8, the mechanism 9 of moulding plastics, conveyer belt 10, transport seat 11, processing seat 12 and fixed strip 13, the equal fixedly connected with support column 2 in 1 top four corners of processing platform, 1 top of processing platform is equipped with roof 3, 2 tops of support column all with roof 3 fixed connection, feeding conveyer belt 4 installs in 1 top one side of processing platform, unloading conveyer belt 5 installs at 1 top of processing platform, unloading conveyer belt 5 sets up in feeding conveyer belt 4 one side, 6 equidistance of movable plate sets up between processing platform 1 and roof 3, actuating mechanism 7 equidistance is installed in roof 3 bottom, benefit gluey mechanism 8 and install at corresponding movable plate 6 bottom one side of movable plate, the mechanism 9 of moulding plastics installs in 6 bottom one side of corresponding, conveyer belt 10 installs at 1 top of processing platform, and conveyer belt 10 and feeding conveyer belt 4 mutually perpendicular, transport conveyer belt 10 outside equidistance installs processing seat 12, constant head tank 15 has all been seted up at processing seat 12 and transport seat 11 tops.
It should be noted that:
in an embodiment of the present invention, referring to fig. 4 and 6, the driving mechanism 7 includes a connecting column 71, a guide rail 72, a receiving block 73, an outer sleeve 74, an inner rod 75, a rotating rod 76, a collar 77, a telescopic cylinder 78, a base block 79, a connecting rod 710 and side rods 711, the two sides of the moving plate 6 are respectively provided with the guide rail 72, the tops of the guide rails 72 are respectively and equidistantly fixedly connected with the connecting column 71, the top ends of the connecting column 71 are respectively and fixedly connected with the top plate 3, the two sides of the moving plate 6 are respectively and fixedly connected with the side rods 711, the side rods 711 are respectively inserted into the corresponding guide rails 72, the side rods 711 are respectively and slidably connected with the corresponding guide rails 72, one side of the top of the moving plate 6 is equally and equidistantly provided with the outer sleeve 74, the inner rod 75 is respectively and slidably inserted into the outer sleeve 74, the bottom end of the inner rod 75 is respectively and fixedly connected with the collar 77, the inner rod 77 is rotatably connected with the rotating rod 76, the rotating rod 76 is respectively and fixedly connected with the corresponding moving plate 6, one side of the top end of the outer sleeve 74 is rotatably connected with the receiving block 73 through a shaft pin, the top end of the connecting rod 73, the top of the connecting rod 73 is respectively connected with the outer wall of the base rod 710, the connecting rod is connected with the connecting rod 78 through a shaft pin 79, the connecting rod 79, the top end of the base rod 78, the connecting rod is respectively connected with the outer wall of the base rod 710, the outer wall of the base rod 78, the base rod 710, the outer wall of the base rod is connected with the outer wall of the base rod 78, the base rod 710, the base rod 78, the outer wall of the base rod 78, the outer end of the base rod 710 is connected with the base rod 78;
it should be noted that: the extending output end of the telescopic cylinder 78 in the driving mechanism 7 is shortened, the outer loop bar 74 is driven to rotate through the output end, the two outer loop bars 74 on one side of the moving plate 6 are always kept parallel under the limitation of the connecting rod 710, the moving plate 6 is prevented from inclining when moving, the loop 77 at the end part of the inner bar 75 can rotate outside the rotating bar 76 while the outer loop bars 74 rotate, the inner bar 75 slides from the inside of the bar outside according to the rotating angle, the moving plate 6 is driven to move through the rotating inner bar 75 and the outer loop bars 74, the side bars 711 on the two sides of the moving plate 6 slide in the guide rail 72, the moving plate 6 can move along the shape of the guide rail 72, the moving plate 6 is lifted to a certain height firstly and then moves in an inclined shape in the moving process, and the moving plate 6 can continuously move back and forth along the guide rail 72 through the reciprocating operation of the telescopic cylinder 78;
in the embodiment of the present invention, please refer to fig. 7 and 8, the glue supplementing mechanism 8 includes a mounting shell 81, a motor 82, a connecting seat 83, a bending piece 84, a glue injection head 85, a sliding rod 86, a second spring 87, a fixing block 88 and a limiting roller 89, the mounting shell 81 is arranged on one side above the conveying conveyor belt 10, the top of the mounting shell 81 is fixedly connected with the corresponding moving plate 6, the motor 82 is fixedly mounted inside the mounting shell 81, the output end of the motor 82 penetrates through the mounting shell 81 and is fixedly connected with the connecting seat 83, the output end of the motor 82 is rotatably connected with the mounting shell 81 through a bearing, the bending piece 84 is arranged on one side of the bottom of the connecting seat 83, the glue injection head 85 is fixedly mounted inside the bending piece 84, the sliding rod 86 is inserted into the connecting seat 83 at equal intervals, one end of the sliding rod 86 is fixedly connected with the bending piece 84, the second spring 87 is sleeved outside the sliding rod 86, one end of the second spring 87 is fixedly connected with the connecting seat 83, the other end of the sliding rod 87 is fixedly connected with one end of the corresponding sliding rod 86, the fixing block 88 is fixedly connected with one side of the bending piece 84 at equal intervals, and the fixing block 88 is rotatably connected with the limiting roller 89;
it should be noted that: at the processing seat 12 corresponding to the descending belt of the glue injection head 85, the glue injection head rotates along with the connecting seat 83 and the bending piece 84 under the driving of the motor 82, glue is injected into the periphery of the wafer, glue is supplemented, in the rotating process, the limiting idler wheel 89 can be attached to the outer wall of the processing seat 12 to advance, in the rotating process, the sliding rod 86 is driven to slide through the bending piece 84, the second spring 87 contracts, the injection molding head 93 is always attached to the edge of the wafer, the glue sealing is more uniform, and the firmness and the sealing performance after glue supplementing are enhanced;
in the embodiment of the present invention, please refer to fig. 9 and 10, the injection molding mechanism 9 includes a fixed shell 91, an injection molding tube 92, an injection molding head 93, a casing 94, a quantitative box 95 and elastic sheets 96, one side of the upper side of the conveying conveyor belt 10 is provided with the fixed shell 91, the top of the fixed shell 91 is fixedly connected with the corresponding moving plate 6, the injection molding tube 92 is fixedly installed inside the fixed shell 91, the injection molding head 93 is installed at the bottom end of the injection molding tube 92, the casing 94 is fixedly connected to the bottom of the fixed shell 91, the casing 94 is sleeved outside the injection molding head 93, the quantitative box 95 is slidably inserted inside the casing 94, the elastic sheets 96 are symmetrically installed inside the casing 94 at equal intervals and at equal angles, and two ends of the elastic sheets 96 are respectively and fixedly connected with the inner walls of the corresponding sides of the casing 94 and the quantitative box 95;
it should be noted that: the fixed shell 91 moves along with the moving plate 6, so that the quantitative box 95 descends to be sleeved on the outer side of the corresponding wafer, when the quantitative box 95 descends to be attached to the processing seat 12, the quantitative box 95 moves downwards for a certain distance to deform the elastic sheet 96, the quantitative box 95 slides on the outer side of the sleeve 94, and resin injection is performed through the injection head 93;
in the embodiment of the present invention, referring to fig. 1, three sides of the top of the processing table 1 are fixedly connected with a baffle plate 14;
it should be noted that: ash falling can be reduced, and internal equipment is protected;
in the embodiment of the present invention, please refer to fig. 4 and 5, a U-shaped plate 18 is fixedly connected to one side of the bottom of the moving plate 6, air ducts 19 are slidably inserted into the U-shaped plate 18, suction cups 20 are fixedly connected to the bottoms of the air ducts 19, fixing rings 21 are fixedly sleeved on the outer sides of the air ducts 19, first springs 22 are sleeved on the outer sides of the air ducts 19, and two ends of each first spring 22 are fixedly connected to the corresponding fixing ring 21 and the corresponding U-shaped plate 18;
it should be noted that: the wafer is adsorbed by the sucker 20 and synchronously moves along with the moving plate 6, and the wafer is adsorbed when being contacted with the sucker 20, if the wafer descends too much, the sucker 20 drives the air duct 19 to slide under the obstruction of the wafer, so that the first spring 22 contracts to prevent the wafer from being damaged due to excessive descending, and the sucker 20 can be attached to the wafer when descending;
in the embodiment of the present invention, please refer to fig. 1 and fig. 2, a placing frame 16 is fixedly connected to one side of the top of the processing table 1;
it should be noted that: tools and the like are convenient to place;
in the embodiment of the present invention, please refer to fig. 1 and 11, the top of the placing rack 16 is equidistantly placed with receiving trays 17, and the top of the receiving trays 17 is equidistantly provided with placing grooves 23;
it should be noted that: unprocessed or processed semiconductors can be conveniently placed;
in the embodiment of the present invention, referring to fig. 4 and fig. 6, the outer wall of the side rod 711 is fixed to the two sides of the guide rail 72 by a retaining ring 712;
it should be noted that: the side lever 711 is prevented from shifting when sliding;
referring to fig. 1 to 12, a method for packaging a semiconductor package device with high efficiency includes the following steps:
s1: the semiconductor with the connected wafer and the substrate is placed in a positioning groove 15 of a feeding conveyor belt 4 and is conveyed in sequence through intermittent transmission of the feeding conveyor belt 4;
s2: when the wafers are conveyed to the feeding conveyor belt 4 to be close to the edge part, the extending output end of a telescopic cylinder 78 in the driving mechanism 7 is shortened, the outer loop rod 74 is driven to rotate through the output end, the moving plate 6 moves, the side rods 711 on the two sides of the moving plate 6 slide in the guide rails 72, and the moving plate 6 is lifted to a certain height and then moves in an inclined manner in the moving process;
s3: when the side rod 711 of the moving plate 6 slides to one end of the guide rail 72 gradually, the suction cup 20 can descend facing the edge of the wafer, so that the wafer is sucked by the suction cup 20, at this time, the output end of the telescopic cylinder 78 reaches the shortest distance, and when the telescopic cylinder 78 extends, the wafer is sucked by the suction cup 20 and moves synchronously with the moving plate 6;
s4: under the drive of the moving plate 6, the wafer is placed in the positioning groove 15 corresponding to the processing seat 12 on the conveying conveyor belt 10 by the suction cup 20, the telescopic cylinder 78 is shortened again, the suction cup 20 moves the belt feeding conveyor belt 4 again to perform secondary adsorption, at the moment, the glue injection head 85 descends to the processing seat 12 corresponding to the belt, and the glue injection head rotates along with the connecting seat 83 under the drive of the motor 82, and simultaneously injects glue into the periphery of the wafer for glue supplement;
s5: the sucking disc 20 slowly carries out secondary feeding along with the telescopic cylinder 78, the wafer which is well glued is conveyed towards the other moving plate 6 in the feeding process, when the wafer reaches the injection molding mechanism 9, the fixed shell 91 is moved by the moving plate 6 on the other side which is driven by the telescopic cylinder 78 in the same way, the quantitative box 95 is made to descend and be sleeved on the outer side of the corresponding wafer, and resin injection molding is carried out through the injection molding head 93;
s6: after injection molding, the movable plate 6 is driven by the telescopic cylinder 78 on the other side to gradually move, the quantitative box 95 is separated from the wafer, the suction cup 20 gradually reaches the injection molded wafer to adsorb the injection molded wafer, and then the injection molded wafer is placed on the blanking conveyor belt 5 by the suction cup 20 under the driving of the telescopic cylinder 78 to be sequentially conveyed;
s7: the steps are sequentially carried out with the processes of feeding, glue supplementing, injection molding and discharging, reciprocating operation is carried out, and the semiconductor is continuously packaged.
The working principle of the semiconductor packaging equipment with high efficiency and the packaging method thereof provided by the invention is as follows: the semiconductor with connected wafers and substrates is placed in the positioning groove 15 of the feeding conveyor belt 4, the feeding conveyor belt 4 carries out sequential conveying through intermittent transmission of a driving device connected with the feeding conveyor belt 4, when the wafers are conveyed to the feeding conveyor belt 4 to be close to the edge part, the extending output end of a telescopic cylinder 78 in a driving mechanism 7 is shortened, the outer loop rods 74 are driven to rotate through the output end, two outer loop rods 74 on one side of the moving plate 6 are always kept parallel under the limitation of a connecting rod 710, the moving plate 6 is prevented from inclining when moving, the loop 77 at the end part of the inner rod 75 can rotate on the outer side of the rotating rod 76 while the outer loop rods 74 rotate, the inner rod 75 slides from the inner side of the rod according to the rotating angle, the moving plate 6 is moved through the rotating inner rod 75 and the outer loop rods 74, side rods 711 on two sides of the moving plate 6 slide in the guide rail 72, and the moving plate 6 can follow the shape of the guide rail 72, when the side rod 711 of the moving plate 6 slides to one end of the guide rail 72, the suction cup 20 can descend against the edge wafer and absorb the wafer when contacting the wafer, if the side rod 711 of the moving plate 6 descends too much, the suction cup 20 will drive the air duct 19 to slide under the obstruction of the wafer, so as to contract the first spring 22 to avoid the excessive descent and damage to the wafer, and also to make the suction cup 20 fit with the wafer when descending, at this time, the output end of the telescopic cylinder 78 reaches the shortest distance, when the telescopic cylinder 78 extends, the suction cup 20 absorbs the wafer, the moving plate 6 moves synchronously, the suction cup 20 places the wafer into the positioning slot 15 of the corresponding processing seat 12 on the conveying belt 10 under the driving of the moving plate 6, the telescopic cylinder 78 shortens again, the suction cup 20 moves again to take the feeding belt 4 to absorb the wafer for a second time, at this time, the glue injection head 85 descends to bring the corresponding processing seat 12, the glue injection head rotates along with the connecting seat 83 and the bending piece 84 under the driving of the motor 82, glue is injected around the wafer to be supplemented, the limiting roller 89 can move along with the outer wall of the processing seat 12 in the rotating process, the sliding rod 86 is driven to slide through the bending piece 84 in the rotating process, the second spring 87 contracts, the injection head 93 is always attached to the edge of the wafer, the sucking disc 20 slowly carries out secondary feeding along with the telescopic cylinder 78, the wafer with the supplemented glue is conveyed towards the other movable plate 6 in the feeding process, and when the wafer reaches the injection molding mechanism 9, the movable plate 6 on the other side is driven by the telescopic cylinder 78 to move the fixed shell 91, make quantitative box 95 descend the cover and outside the corresponding wafer, when quantitative box 95 descends laminating processing seat 12, can move one end distance downwards again, let elastic sheet 96 take place deformation, quantitative box 95 slides in the cover shell 94 outside, carry out resin through the head 93 of moulding plastics, after good moulding plastics, opposite side telescopic cylinder 78 drives movable plate 6 and moves gradually, let quantitative box 95 and wafer separation, sucking disc 20 gradually to on the good wafer of moulding plastics, adsorb on the good wafer of moulding plastics, the drive of rethread telescopic cylinder 78, let sucking disc 20 place the good wafer of encapsulation on unloading conveyer belt 5, carry out transport in proper order, material loading through above-mentioned step in proper order, mend the process of glue, mould plastics, the unloading, carry out reciprocating operation, carry out continuous encapsulation to the semiconductor.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An efficient semiconductor packaging apparatus, comprising:
the device comprises a processing table (1), wherein four corners of the top of the processing table (1) are fixedly connected with supporting columns (2), a top plate (3) is arranged above the processing table (1), and the top ends of the supporting columns (2) are fixedly connected with the top plate (3);
the feeding conveyor belt (4), the feeding conveyor belt (4) is installed on one side of the top of the processing table (1);
the blanking conveying belt (5) is installed at the top of the processing table (1), and the blanking conveying belt (5) is arranged on one side of the feeding conveying belt (4);
the moving plates (6) are arranged between the processing table (1) and the top plate (3) at equal intervals;
the driving mechanisms (7), the driving mechanisms (7) are equidistantly arranged at the bottom of the top plate (3);
the glue supplementing mechanism (8), the glue supplementing mechanism (8) is installed on one side of the bottom of the corresponding moving plate (6);
the injection molding mechanism (9), the injection molding mechanism (9) is installed on one side of the bottom of the corresponding moving plate (6);
the conveying seats (11), the conveying seats (11) are respectively installed on the outer sides of the feeding conveying belt (4) and the blanking conveying belt (5) at equal intervals;
conveying belt (10), conveying belt (10) are installed at processing platform (1) top, and conveying belt (10) and feeding conveyor belt (4) mutually perpendicular, processing seat (12) are installed to conveying belt (10) outside equidistance, constant head tank (15) have all been seted up at processing seat (12) and conveying seat (11) top.
2. The efficient semiconductor packaging device according to claim 1, wherein the driving mechanism (7) comprises a connecting post (71), a guide rail (72), a receiving block (73), an outer sleeve rod (74), an inner rod (75), a rotating rod (76), a sleeve (77), a telescopic cylinder (78), a base block (79), a connecting rod (710) and side rods (711), the guide rail (72) is arranged on each side of the moving plate (6), the connecting post (71) is fixedly connected to the top of the guide rail (72) at equal intervals, the top end of the connecting post (71) is fixedly connected with the top plate (3), the side rods (711) are fixedly connected to each side of the moving plate (6), the side rods (711) are inserted into the corresponding guide rails (72), the moving plate is slidably connected with the corresponding guide rails (72), the outer sleeve rods (74) are arranged on one side of the top of the moving plate (6) at equal intervals, the inner rod (75) is slidably inserted into the outer sleeve rod (74), the sleeve (77) is fixedly connected to the bottom of the inner sleeve (77), the rotating rod (76) is rotatably connected with the rotating rod (76), and the rotating rod (73) is connected with the moving plate (73), all with roof (3) fixed connection in bearing piece (73) top, roof (3) bottom equidistance is equipped with telescopic cylinder (78), telescopic cylinder (78) top both sides all are rotated through the pivot and are connected with basic piece (79), basic piece (79) top all with roof (3) fixed connection, the output of telescopic cylinder (78) all rotates through pivot and outer loop bar (74) that correspond to be connected, movable plate (6) top one side all is equipped with connecting rod (710), connecting rod (710) both ends are equallyd divide and are do not rotated through pivot and outer loop bar (74) bottom outer wall that corresponds and are connected.
3. The efficient semiconductor packaging device according to claim 1, wherein the glue filling mechanism (8) comprises a mounting shell (81), a motor (82), a connecting seat (83), a bending piece (84), a glue injection head (85), a sliding rod (86), a second spring (87), a fixing block (88) and a limiting roller (89), the mounting shell (81) is arranged on one side above the conveying conveyor belt (10), the top of the mounting shell (81) is fixedly connected with the corresponding moving plate (6), the motor (82) is fixedly mounted inside the mounting shell (81), the output end of the motor (82) penetrates through the mounting shell (81) and is fixedly connected with the connecting seat (83), the output end of the motor (82) is rotatably connected with the mounting shell (81) through a bearing, the bending piece (84) is arranged on one side of the bottom of the connecting seat (83), the glue injection head (85) is fixedly mounted inside the bending piece (84), the sliding rod (86) is inserted into the connecting seat (83) in an equidistant manner, one end of the sliding rod (86) is fixedly connected with the bending piece (84), the second spring (87) is sleeved outside the sliding rod (86), and the other end of the second spring (87) is connected with the connecting seat (87), bend piece (84) one side equidistance fixedly connected with fixed block (88), be connected with spacing gyro wheel (89) through the bearing rotation between fixed block (88).
4. The efficient semiconductor packaging device according to claim 1, wherein the injection molding mechanism (9) comprises a fixed shell (91), an injection molding pipe (92), an injection molding head (93), a sleeve (94), a quantitative box (95) and an elastic sheet (96), the fixed shell (91) is arranged on one side above the conveying conveyor belt (10), the top of the fixed shell (91) is fixedly connected with the corresponding moving plate (6), the injection molding pipe (92) is fixedly installed inside the fixed shell (91), the injection molding head (93) is installed at the bottom end of the injection molding pipe (92), the sleeve (94) is fixedly connected to the bottom of the fixed shell (91), the sleeve (94) is sleeved outside the injection molding head (93), the quantitative box (95) is slidably inserted inside the sleeve (94), the elastic sheets (96) are symmetrically arranged inside the sleeve (94) at equal intervals and at equal angles, and two ends of the elastic sheet (96) are fixedly connected with the inner walls of the corresponding sides of the sleeve (94) and the quantitative box (95).
5. The efficient semiconductor package device according to claim 1, wherein a baffle plate (14) is fixedly connected to three sides of the top of the processing table (1).
6. The efficient semiconductor packaging equipment according to claim 1, wherein one side of the bottom of the moving plate (6) is fixedly connected with a U-shaped plate (18), air guide tubes (19) are inserted in the U-shaped plate (18) in a sliding mode, suckers (20) are fixedly connected with the bottoms of the air guide tubes (19), fixing rings (21) are fixedly sleeved on the outer sides of the air guide tubes (19), first springs (22) are sleeved on the outer sides of the air guide tubes (19), and two ends of each first spring (22) are fixedly connected with the corresponding fixing ring (21) and the corresponding U-shaped plate (18).
7. The efficient semiconductor packaging apparatus according to claim 1, wherein a rack (16) is fixedly connected to one side of the top of the processing table (1).
8. The efficient semiconductor packaging equipment according to claim 7, wherein the top of the placing frame (16) is placed with the containing trays (17) at equal intervals, and the top of the containing trays (17) is provided with the placing grooves (23) at equal intervals.
9. The efficient semiconductor packaging device according to claim 2, wherein the side bars (711) are sleeved and fixed with retaining rings (712) on the outer wall at both sides of the guide rail (72).
10. The method for packaging a semiconductor package device with high efficiency according to any one of claims 1 to 9, comprising the following steps:
s1: the semiconductor with the connected wafer and the substrate is placed in a positioning groove (15) of a feeding conveyor belt (4) and is conveyed in sequence through intermittent transmission of the feeding conveyor belt (4);
s2: when the wafer is conveyed to the feeding conveyor belt (4) to be close to the edge part, the extending output end of a telescopic cylinder (78) in the driving mechanism (7) is shortened, an outer loop rod (74) is driven to rotate through the output end, the moving plate (6) is made to move, side rods (711) on two sides of the moving plate (6) slide in the guide rail (72), and the moving plate (6) is made to lift to a certain height and then move in an inclined mode in the moving process;
s3: when the side rod (711) of the moving plate (6) slides to one end of the guide rail (72) gradually, the sucker (20) can descend against the edge wafer to enable the wafer to be sucked by the sucker (20), the output end of the telescopic cylinder (78) reaches the shortest distance, when the telescopic cylinder (78) extends, the wafer is sucked by the sucker (20) and moves synchronously with the moving plate (6);
s4: under the drive of the moving plate (6), the wafer is placed in a positioning groove (15) corresponding to the processing seat (12) on the conveying conveyor belt (10) by the sucker (20), the telescopic cylinder (78) is shortened again, the sucker (20) moves again to carry out secondary adsorption on the feeding conveyor belt (4), the glue injection head (85) descends to bring the processing seat (12) corresponding to the glue injection head, and the glue injection head rotates along with the connecting seat (83) under the drive of the motor (82) while injecting glue around the wafer for glue supplement;
s5: the sucking disc (20) is slowly fed for the second time along with the telescopic cylinder (78), the wafers which are well glued are conveyed towards the other moving plate (6) in the feeding process, when the wafers reach the injection molding mechanism (9), the fixed shell (91) is moved through the moving plate (6) on the other side which is driven by the telescopic cylinder (78) in the same way, the quantitative box (95) is made to descend and be sleeved on the outer side of the corresponding wafer, and resin injection molding is carried out through the injection molding head (93);
s6: after injection molding is finished, the movable plate (6) is driven by the telescopic cylinder (78) on the other side to gradually move, the quantitative box (95) is separated from the wafer, the sucking disc (20) gradually moves onto the injection molded wafer to adsorb the injection molded wafer, and the sucking disc (20) is driven by the telescopic cylinder (78) to place the encapsulation injection molded wafer on the blanking conveying belt (5) for sequential conveying;
s7: the steps are sequentially carried out with the processes of feeding, glue supplementing, injection molding and discharging, reciprocating operation is carried out, and the semiconductor is continuously packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210519864.9A CN115241084B (en) | 2022-05-12 | 2022-05-12 | Efficient semiconductor packaging equipment and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210519864.9A CN115241084B (en) | 2022-05-12 | 2022-05-12 | Efficient semiconductor packaging equipment and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115241084A CN115241084A (en) | 2022-10-25 |
| CN115241084B true CN115241084B (en) | 2023-03-17 |
Family
ID=83668057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210519864.9A Active CN115241084B (en) | 2022-05-12 | 2022-05-12 | Efficient semiconductor packaging equipment and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115241084B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204045550U (en) * | 2014-09-19 | 2014-12-24 | 铜陵富仕三佳机器有限公司 | A kind of full-automatic package system |
| CN111376432A (en) * | 2018-12-29 | 2020-07-07 | 深圳市远望工业自动化设备有限公司 | Injection molding packaging system |
| CN113478731A (en) * | 2021-09-03 | 2021-10-08 | 南通迅腾精密设备有限公司 | Semiconductor packaging injection mold |
-
2022
- 2022-05-12 CN CN202210519864.9A patent/CN115241084B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204045550U (en) * | 2014-09-19 | 2014-12-24 | 铜陵富仕三佳机器有限公司 | A kind of full-automatic package system |
| CN111376432A (en) * | 2018-12-29 | 2020-07-07 | 深圳市远望工业自动化设备有限公司 | Injection molding packaging system |
| CN113478731A (en) * | 2021-09-03 | 2021-10-08 | 南通迅腾精密设备有限公司 | Semiconductor packaging injection mold |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115241084A (en) | 2022-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108453504B (en) | Full-automatic intelligent assembly line for gearbox | |
| CN113120304A (en) | Automatic balance equipment in workshop of moulding plastics | |
| CN109748104A (en) | A kind of double-station poly-lithium battery charging method | |
| CN115043042B (en) | Full-automatic multi-azimuth visual detection and packaging integrated equipment | |
| CN110775625A (en) | Rod piece die filling equipment | |
| CN115424967A (en) | Grain transfer equipment and grain transfer process thereof | |
| CN112936729A (en) | Automatic feeding and discharging module system | |
| CN113504006A (en) | Full-automatic air tightness detection method | |
| CN107298306B (en) | Feeding device | |
| CN114348596B (en) | Automatic welding, assembling and packaging machine | |
| CN111604689A (en) | Automatic assembling machine | |
| CN111302064A (en) | Accurate unloader of laser scribing machine | |
| CN115973761A (en) | Automatic circulating feeding and storing machining device and automatic circulating feeding and storing machining process for standardized material plates | |
| CN215363794U (en) | Wafer frame loading attachment for chip package | |
| CN114464562A (en) | Automatic chip blanking and conveying device | |
| CN115241084B (en) | Efficient semiconductor packaging equipment and packaging method thereof | |
| CN111891608A (en) | Feeding and discharging mechanism for layered materials | |
| CN213893168U (en) | Detection packaging device | |
| CN113375868A (en) | Full-automatic air tightness detection device | |
| CN216189185U (en) | Standardized charging tray automatic cycle material loading and storage processing device | |
| CN108637672B (en) | Full-automatic intelligent assembling process for gearbox | |
| CN107265056B (en) | Material tray storage and feeding device | |
| CN211858589U (en) | Batch surface mounting die for chip surface covers | |
| CN210881102U (en) | Automatic bottom box feeding machine | |
| CN211225412U (en) | Sheet positioning and carrying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |