CN117096060B - Semiconductor element packaging equipment - Google Patents
Semiconductor element packaging equipment Download PDFInfo
- Publication number
- CN117096060B CN117096060B CN202311040279.1A CN202311040279A CN117096060B CN 117096060 B CN117096060 B CN 117096060B CN 202311040279 A CN202311040279 A CN 202311040279A CN 117096060 B CN117096060 B CN 117096060B
- Authority
- CN
- China
- Prior art keywords
- plate
- cover
- sliding
- glue
- shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 89
- 238000007493 shaping process Methods 0.000 claims abstract description 67
- 238000003825 pressing Methods 0.000 claims abstract description 32
- 238000007789 sealing Methods 0.000 claims description 64
- 238000002347 injection Methods 0.000 claims description 23
- 239000007924 injection Substances 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 11
- 238000005485 electric heating Methods 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000002146 bilateral effect Effects 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000005491 wire drawing Methods 0.000 claims description 3
- 244000309464 bull Species 0.000 claims description 2
- 239000004576 sand Substances 0.000 claims 3
- 238000010009 beating Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 9
- 238000013459 approach Methods 0.000 description 8
- 238000004804 winding Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
Abstract
The invention discloses a semiconductor element packaging device, which relates to the technical field of semiconductor packaging, and comprises a glue beating machine and a carrier plate which is arranged on a glue beating machine workbench and used for bonding semiconductors, wherein an auxiliary shaping mechanism used for assisting glue shaping is arranged on the carrier plate; the auxiliary shaping mechanism comprises a positioning plate placed on the carrier plate, the shape of the positioning plate is consistent with that of the carrier plate, a plurality of through grooves are formed in the positioning plate, the positions of the through grooves are in one-to-one correspondence with the positions of semiconductors on the carrier plate, and a plurality of shaping dies for shaping glue are embedded in the through grooves. In the invention, the flow of glue is limited by the shaping die and the pressing plate in the shaping die, so that the phenomenon of glue overflow is reduced when the semiconductor is bonded on the glue, and meanwhile, the thickness of the glue point between the semiconductor and the carrier plate is relatively uniform, thereby avoiding the phenomenon of virtual bonding and further improving the effect of semiconductor packaging.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to semiconductor element packaging equipment.
Background
Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements.
When packaging the semiconductor, the semiconductor needs to be adhered to the carrier plate through glue, but the existing glue spraying device directly drops a certain amount of glue points on the carrier plate at the positions corresponding to the semiconductor, in actual production, the glue on the carrier plate can collapse and flow due to flowing, when the semiconductor is adhered to the glue again, the phenomenon of glue overflow often occurs, and meanwhile, the thickness of the glue points between the semiconductor and the carrier plate is inconsistent, so that the phenomenon of virtual adhesion occurs, and the effect of semiconductor packaging is poor.
Disclosure of Invention
The invention aims to solve the problems of the prior art and provides a semiconductor element packaging device.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The semiconductor element packaging equipment comprises a gluing machine and a carrier plate which is placed on a workbench of the gluing machine and used for bonding semiconductors, wherein an auxiliary shaping mechanism used for assisting in glue shaping is placed on the carrier plate; the auxiliary shaping mechanism comprises a positioning plate placed on the carrier plate, the shape of the positioning plate is consistent with that of the carrier plate, a plurality of through grooves are formed in the positioning plate, the positions of the through grooves are in one-to-one correspondence with the positions of semiconductors on the carrier plate, and shaping dies for shaping glue are embedded in the through grooves;
The shaping mould is including inlaying the shaping cover of locating in the logical inslot, the middle part cavity of shaping cover, both ends are the opening, slide from top to bottom in the shaping cover and be provided with the clamp plate, the injecting glue mouth has been seted up at the middle part of clamp plate, the top of clamp plate is provided with the seal assembly of shutoff injecting glue mouth, the top of shaping cover is higher than the top of support plate.
As a further description of the above technical solution:
The sealing assembly comprises two sliding sealing plates which are arranged in a glue injection port in a bilateral symmetry mode, one end of each sliding sealing plate, which is far away from each other, is connected with the bottom end of the inner wall of the glue injection port in a bilateral sliding mode, the two sliding sealing plates are rotatably provided with rotary sealing plates through torsion spring shafts, the torsion spring shafts are positioned at the left side and the right side of the rotary sealing plates, which are far away from the sliding sealing plates, the torsion spring shafts are rotatably arranged in the bottom ends of the inner walls of the glue injection port, the upper sides of the two ends, close to each other, of the rotary sealing plates are fixedly provided with C-shaped lug plates, the surfaces of the C-shaped lug plates are sleeved with one end of a pull rope in a sliding mode, the two ends, far away from the C-shaped lug plates, of the pull rope are respectively wound on winding rollers, the two winding rollers are respectively arranged in the inner parts of convex covers, the convex covers are fixedly arranged at the top ends of pressing plates, the convex covers are arranged at the top ends of the convex covers, the two rolling rollers are respectively positioned at the left side and the right side of the upper sides of the glue injection port, the rolling rollers are respectively, the front ends of the rolling roller shafts are respectively provided with first gears, the two lower gear covers are fixedly meshed with the two top ends of the two top plates, the two top plates are fixedly arranged at the bottom ends of the two top plates, and are respectively meshed with the top end covers, and are fixedly arranged on the top surfaces of the two top plates, and are respectively meshed with the top plates, and the two top end covers are respectively meshed with the top plates; the sliding type sealing plate is abutted with one end close to the rotary type sealing plate, and a rubber cushion is arranged at the abutting end of the rotary type sealing plate; the first gear is a small gear, and the second gear is a large gear;
convex strips are fixedly arranged at the front end and the rear end of the two sliding sealing plates, third gears are arranged at the front ends of the two torsion spring shafts, and tooth grooves meshed with the two third gears are respectively formed in the bottoms of one ends, away from each other, of the convex strips at the front ends;
The utility model discloses a glue injection machine, including the top plate, the trigger plate, the through-hole has been seted up at the middle part of top plate, the cross-sectional area of trigger plate is greater than the cross-sectional area of through-hole, the in-hole is inserted to the beat in the play gluey syringe needle in the machine, the surface mounting on beat gluey syringe needle upper portion is provided with the trigger plate that contacts with the top plate top.
As a further description of the above technical solution:
the left end the right-hand member of two convex strip boards in both sides is provided with the glue melting subassembly that prevents the syringe needle wire drawing of beating around the slidingtype closing plate, the glue melting subassembly is including setting up respectively in two lugs of two convex strip board right-hand member in both sides around the slidingtype closing plate of left end, two install the heating wire between the close one end of lug, the left end offer the storage tank that is used for accomodating two lugs in two convex strip boards around the slidingtype closing plate.
As a further description of the above technical solution:
The rear side of the lug at the rear end is provided with an on-off component for powering on and off the heating wire; the on-off assembly comprises a fixed box fixedly arranged at the rear side of the rear end lug, a protective cover arranged at the rear end of the fixed box, a first conductive cover fixedly arranged in the fixed box and electrically connected with one end of an external power supply, a second conductive cover fixedly arranged in the fixed box and electrically connected with one end of an electric heating wire, and a connecting conductive plate arranged between the first conductive cover and one end of the second conductive cover in a left-right sliding manner, wherein the right end of the first conductive cover and the left end of the second conductive cover are overlapped, the right end of the connecting conductive plate is fixedly provided with a sliding rod, the right end of the sliding rod movably penetrates through the inner wall of the fixed box and is abutted to the inner wall of the mounting groove, a convex plate is fixedly arranged in the middle of the sliding rod, and a second reset spring is arranged between the convex plate and the inner wall of the fixed box; the other end of the heating wire is electrically connected with the other end of the external power supply; the sliding rod, the fixing box and the protective cover are all made of insulating materials.
As a further description of the above technical solution:
Install the adjusting part that is used for adjusting the clamp plate position in the design cover, adjusting part is including fixing the L form fixed plate that sets up in a plurality of clamp plates tops respectively, two L form fixed plate symmetry sets up, and is a plurality of the left and right sides at design cover top is fixed respectively and is provided with two guide bars, two L form fixed plate keep away from the one end of clamp plate and slide connection about two guide bars respectively, through linking board fixed connection between two adjacent L form fixed plates in the adjacent two design covers, the middle part rotation of locating plate top left and right sides is provided with the threaded rod, the surface threaded connection of threaded rod has the screw seat, screw seat and linking board fixed connection.
As a further description of the above technical solution:
the surface of the pressing plate is wrapped with a rubber ring which is abutted against the inner wall of the shaping cover.
As a further description of the above technical solution:
the bottom of locating plate and the bottom of design cover all fixed bonding have the protective layer of rubber, set up the opening with design cover intercommunication in the protective layer of design cover bottom.
As a further description of the above technical solution:
the support plate is made of a gel-philic material, and the inner wall of the shaping cover, the bottom end of the rubber ring, the inner ring of the through hole, the sliding sealing plate and the bottom end of the rotary sealing plate are made of a non-gel-philic material.
Compared with the prior art, the invention has the following beneficial effects:
In the invention, the flow of glue is limited by the shaping die and the pressing plate in the shaping die, when the semiconductor is bonded on the glue, the phenomenon of glue overflow is reduced, and meanwhile, the thickness of the glue point between the semiconductor and the carrier plate is relatively uniform, so that the phenomenon of virtual bonding is avoided, and the effect of semiconductor packaging is improved.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a semiconductor device package apparatus according to the present invention;
fig. 2 is a schematic diagram of an external structure of an auxiliary shaping mechanism in a semiconductor device packaging apparatus according to the present invention;
fig. 3 is a schematic diagram illustrating an internal structure of an auxiliary shaping mechanism in a semiconductor device packaging apparatus according to the present invention;
fig. 4 is a schematic structural view of a forming die in a semiconductor device packaging apparatus according to the present invention;
FIG. 5 is a motion state diagram of FIG. 4;
fig. 6 is a schematic structural diagram of a sealing assembly in a semiconductor device packaging apparatus according to the present invention;
FIG. 7 is a state diagram of the motion of FIG. 6;
fig. 8 is a top view of a sliding seal plate in a semiconductor device package apparatus according to the present invention;
fig. 9 is a schematic structural diagram of an on-off assembly in a semiconductor device package apparatus according to the present invention.
In the figure: 1. a glue spreading machine; 2. a carrier plate; 21. a glue injection needle; 22. a trigger plate; 3. an auxiliary shaping mechanism; 31. a positioning plate; 32. forming die; 321. a shaping cover; 322. a pressing plate; 33. an adjustment assembly; 331. an L-shaped fixing plate; 332. a threaded rod; 333. a guide rod; 34. a seal assembly; 341. a sliding seal plate; 342. a rotary seal plate; 343. a pull rope; 344. a wind-up roll; 345. a convex cover; 346. a second gear; 347. a toothed plate; 348. a sliding cover; 349. convex strip plates; 3410. a third gear; 35. a bump; 351. heating wires; 352. an on-off assembly; 3521. a fixed box; 3522. a protective cover; 3524. a first conductive cap; 3525. a second conductive cover; 3526. connecting the conductive plates; 3527. a slide bar; 36. and (3) a protective layer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1 to 9, a semiconductor element packaging apparatus includes a glue dispenser 1 and a carrier plate 2 placed on a table of the glue dispenser 1 for bonding a semiconductor, wherein an auxiliary shaping mechanism 3 for assisting in shaping glue is placed on the carrier plate 2; the auxiliary shaping mechanism 3 comprises a positioning plate 31 placed on the carrier plate 2, the shape of the positioning plate 31 is consistent with that of the carrier plate 2, a plurality of through grooves are formed in the positioning plate 31, the positions of the through grooves are arranged in one-to-one correspondence with the positions of semiconductors on the carrier plate 2, and shaping dies 32 for shaping glue are embedded in the through grooves; specifically, an auxiliary fixing device for fixing the positioning plate 31 may be provided on the workbench of the glue dispenser 1;
The forming die 32 comprises a forming cover 321 embedded in the through groove, the middle of the forming cover 321 is hollow, two ends are provided with openings, a pressing plate 322 is arranged in the forming cover 321 in a vertical sliding mode, a glue injection opening is formed in the middle of the pressing plate 322, the top end of the pressing plate 322 is provided with a sealing assembly 34 for sealing the glue injection opening, and the top end of the forming cover 321 is higher than the top end of the carrier plate 2.
Further, the sealing assembly 34 comprises two sliding sealing plates 341 which are symmetrically arranged in the glue injection port, one ends of the two sliding sealing plates 341 deviating from each other are connected with the bottom end of the inner wall of the glue injection port in a sliding manner, one ends of the two sliding sealing plates 341 deviating from each other are rotatably provided with rotary sealing plates 342 through torsion spring shafts, the torsion spring shafts are positioned at one ends of the rotary sealing plates 342 far away from the sliding sealing plates 341, the torsion spring shafts are rotatably arranged in the bottom end of the inner wall of the glue injection port, C-shaped lug plates are fixedly arranged at the upper sides of the adjacent ends of the two rotary sealing plates 342, one ends of pull ropes 343 are sleeved on the surfaces of the two C-shaped lug plates in a sliding manner, one ends of the two pull ropes 343 far away from the C-shaped lug plates are respectively wound on winding rollers 344, the two winding rollers 344 are respectively rotatably arranged in the inner parts of the convex covers 345, the convex covers 345 are fixedly arranged at the top ends of the pressing plates 322, the convex cover 345 is arranged at the top end of the glue injection port, the two winding rollers 344 are respectively positioned at the left side and the right side above the glue injection port, the front ends of the rotating shafts of the two winding rollers 344 are respectively provided with a first gear, the opposite ends of the two first gears are respectively connected with a second gear 346 in a meshed manner, the two second gears 346 are respectively rotatably arranged on the inner wall of the convex cover 345, the opposite ends of the two second gears 346 are respectively connected with a toothed plate 347 in a meshed manner, the two toothed plates 347 are vertically and slidably arranged in the convex cover 345, the top ends of the two toothed plates 347 are respectively fixedly connected with the bottom end of a top plate, the bottom end of the top plate is fixedly provided with a sliding cover 348, the two toothed plates 347 are positioned in the sliding cover 348, the inner wall of the sliding cover 348 is in up-down sliding connection with the outer surface of the convex cover 345, and a first reset spring is arranged between the bottom end of the sliding cover 348 and the top end of the pressing plate 322; the sliding sealing plate 341 and the rotating sealing plate 342 are abutted to each other at the end close to each other, and a rubber pad is arranged at the abutting end of the rotating sealing plate 342; specifically, the arrangement of the rubber pad can facilitate the abutting connection of the rotary sealing plate 342 and the sliding sealing plate 341 according to the elastic property of the rubber pad;
The first gear is a pinion gear and the second gear 346 is a bull gear; convex strips 349 are fixedly arranged at the front end and the rear end of the two sliding sealing plates 341, a third gear 3410 is arranged at the front end of each torsion spring shaft, and tooth grooves meshed with the two third gears 3410 are respectively formed in the bottoms of the ends, away from each other, of the two convex strips 349 at the front end; specifically, by the engagement of the pinion and the large gear, when the large gear drives the pinion to rotate in an engaged manner, acceleration is realized, so that the wind-up roller 344 is rapidly driven to rotate, rapid rotation of the rotary sealing plate 342 is realized, and rapid movement of the sliding sealing plate 341 is further realized;
the glue-beating needle head 21 in the glue-beating machine 1 is inserted into the glue-injecting port, the outer surface of the upper part of the glue-beating needle head 21 is fixedly provided with a trigger plate 22 contacted with the top end of the top plate, the middle part of the top plate is provided with a through hole, the cross section area of the trigger plate 22 is larger than that of the through hole, and the spacing between the trigger plate 22 and the bottom end of the glue-beating needle head 21 is smaller than that between the top plate and the upper end of the glue-injecting port, so that before the trigger plate 22 is not contacted with the top plate, the bottom end of the glue-beating needle head 21 is not contacted with the upper end of the sliding sealing plate 341 in the glue-injecting port, and the opening of the glue-injecting port is ensured;
Moreover, the bottom ends of the two sliding sealing plates 341 and the bottom end of the rotary sealing plate 342 are arranged to be flush with the bottom end of the inner wall of the glue injection port, so that defects on the surface of the glue point are avoided;
Further, the right ends of the two raised line plates 349 on the front side and the rear side of the left end sliding type sealing plate 341 are provided with a glue melting assembly for preventing the glue injection needle 21 from wire drawing, the glue melting assembly comprises two convex blocks 35 respectively arranged on the right ends of the two raised line plates 349 on the front side and the rear side of the left end sliding type sealing plate 341, an electric heating wire 351 is arranged between one ends of the two convex blocks 35, and a containing groove for containing the two convex blocks 35 is formed in the two raised line plates 349 on the front side and the rear side of the left end sliding type sealing plate 341; the rear side of the rear end lug 35 is provided with an on-off component 352 for powering on and off the heating wire 351; the on-off assembly 352 comprises a fixed box 3521 fixedly arranged at the rear side of the rear end lug 35, a protective cover 3522 arranged at the rear end of the fixed box 3521, a first conductive cover 3524 fixedly arranged in the fixed box 3521 and electrically connected with one end of an external power supply, a second conductive cover 3525 fixedly arranged in the fixed box 3521 and electrically connected with one end of the heating wire 351, and a connecting conductive plate 3526 arranged between the first conductive cover 3524 and one end close to the second conductive cover 3525 in a left-right sliding manner, wherein the right end of the first conductive cover 3524 and the left end of the second conductive cover 3525 are overlapped, a sliding rod 3527 is fixedly arranged at the right end of the connecting conductive plate 3526, the right end of the sliding rod 3527 movably penetrates through the inner wall of the fixed box 3521 and is abutted with the inner wall of the mounting groove, a convex plate is fixedly arranged in the middle of the sliding rod 3527, and a second reset spring is arranged between the convex plate and the inner wall of the fixed box 3521; the other end of the heating wire 351 is electrically connected with the other end of the external power supply; the sliding rod 3527, the fixed box 3521 and the protective cover 3522 are all made of insulating materials; specifically, when the two sliding seal plates 341 are close to each other, the heated heating wire 351 is scratched by the glue outlet end at the bottom end of the glue spraying needle 21, so that the glue in the shaping cover 321 and the glue at the glue outlet end of the glue spraying needle 21 are fused, and the phenomenon of glue drawing is avoided; meanwhile, when the two sliding seal plates 341 are close to each other, the bump 35 is driven to approach the storage groove, so that the fixed box 3521 approaches the storage groove, so that the sliding rod 3527 approaches the storage groove, so as to push the sliding rod 3527, stretch the second return spring, and further drive the connecting conductive plate 3526 to move left, so that the connecting conductive plate 3526 between the first conductive cover 3524 and the second conductive cover 3525 is separated from the second conductive cover 3525, and electrical communication between the first conductive cover 3524 and the second conductive cover 3525 is lost, so that the electric heating wire 351 is electrically disconnected from an external power supply, and the electric heating wire 351 is not heated.
Further, an adjusting component 33 for adjusting the positions of the pressing plates 322 is installed in the shaping covers 321, the adjusting component 33 comprises L-shaped fixing plates 331 which are respectively and fixedly arranged at the tops of the pressing plates 322, the two L-shaped fixing plates 331 are symmetrically arranged, two guide rods 333 are respectively and fixedly arranged at the left end and the right end of the tops of the shaping covers 321, one ends of the two L-shaped fixing plates 331 far away from the pressing plates 322 are respectively and vertically connected with the two guide rods 333 in a sliding manner, the two adjacent L-shaped fixing plates 331 in the two adjacent shaping covers 321 are fixedly connected through a connecting plate, threaded rods 332 are rotatably arranged in the middle parts of the left side and the right side of the top end of the positioning plate 31, thread bases are connected with the surfaces of the threaded rods 332 in a threaded manner, and the thread bases are fixedly connected with the connecting plate; specifically, according to the glue amount of the glue needed when the semiconductor is bonded, the two threaded rods 332 are rotated to drive the L-shaped fixing plate 331 to move up and down, so that the position of the pressing plate 322 in the shaping cover 321 is adjusted, and the volume among the inner wall of the shaping cover 321, the lower part of the pressing plate 322 and the upper end of the carrier plate 2 is matched with the glue amount.
Further, the surface of the pressing plate 322 is wrapped with a rubber ring which is abutted against the inner wall of the shaping cover 321; specifically, in the process of moving the pressing plate 322 up and down, the pressing plate 322 is convenient to slide up and down due to the elastic property of the rubber ring.
Further, the bottom of locating plate 31 and the bottom of design cover 321 are all fixed to bond and have the protective layer 36 of rubber, set up the opening with design cover 321 intercommunication in the protective layer 36 of design cover 321 bottom, specifically, through the setting of protective layer 36, avoid because locating plate 31 direct and carrier plate 2 contact and the condition of fish tail carrier plate 2 upper surface, simultaneously, can increase the frictional force between locating plate 31 and the carrier plate 2.
Further, the carrier plate 2 is made of a gel-philic material, and the inner wall of the shaping cover 321, the bottom end of the rubber ring, the inner ring of the through hole, the sliding sealing plate 341 and the bottom end of the rotary sealing plate 342 are all made of a non-gel-philic material; specifically, since the carrier plate 2 is made of a gel-philic material, the inner wall of the shaping cover 321, the bottom end of the rubber ring, the inner ring of the through hole, the sliding sealing plate 341 and the bottom end of the rotary sealing plate 342 are all made of a non-gel-philic material, so that the gel point on the carrier plate 2 is quickly separated from the auxiliary shaping mechanism 3, thereby facilitating the subsequent bonding of the semiconductor on the carrier plate 2.
Working principle: when in use, according to the glue amount of the glue needed when the semiconductor is bonded, the two threaded rods 332 are rotated to drive the L-shaped fixing plate 331 to move up and down, so that the position of the pressing plate 322 in the shaping cover 321 is adjusted, and the volume among the inner wall of the shaping cover 321, the lower part of the pressing plate 322 and the upper end of the carrier plate 2 is matched with the glue amount;
Wherein, in the process of the up and down movement of the pressing plate 322, the pressing plate 322 is convenient to slide up and down due to the elastic property of the rubber ring;
Further, placing the positioning plate 31 on the carrier plate 2, and placing a plurality of shaping dies 32 in the positioning plate 31 in one-to-one correspondence with the positions of the semiconductors on the carrier plate 2; further, the position of the semiconductor on the carrier plate 2 is guided into the gluing machine 1;
Further, the glue-beating needle 21 in the glue-beating machine 1 is close to the shaping mould 32, and then drives the sliding cover 348 to move downwards through the trigger plate 22 to extrude the first reset spring, wherein in the process of moving downwards the sliding cover 348, the two toothed plates 347 are driven to move downwards, and then the two second gears 346 are respectively driven to rotate in an engaged manner, and further the two first gears are respectively driven to rotate in an engaged manner, and further the two winding rollers 344 are driven to rotate to wind the two pull ropes 343, and further the two rotary sealing plates 342 are respectively driven to rotate around the torsion spring shaft, wherein the two torsion spring shafts rotate to drive the third gears 3410 to rotate, and then the two sliding sealing plates 341 are driven to deviate from each other through the convex strips 349, so that the glue-beating needle 21 is convenient to pass through the glue injection opening in the pressing plate 322, and glue is filled in the shaping cover 321; after the glue is filled, the glue-beating needle 21 moves upwards and is far away from the glue injection port, the trigger plate 22 is driven to move upwards and is far away from the sliding cover 348, the first reset spring drives the sliding cover 348 to move upwards, the toothed plate 347 moves upwards, the first gear is driven to rotate in a meshed manner through the second gear 346, the winding roller 344 is enabled to release the pull rope 343, the torsion spring shaft drives the rotary sealing plate 342 to reset, meanwhile, the third gear 3410 at the front end of the torsion spring shaft drives the convex plate 349 to move, the two sliding sealing plates 341 are enabled to approach each other, and the closing of the glue injection port is achieved;
In the process that the two sliding seal plates 341 deviate from each other, the bump 35 is driven to be away from the storage groove, so that the fixed box 3521 is further away from the storage groove, so that the sliding rod 3527 is further away from the storage groove, the second return spring drives the sliding rod 3527 to move right, so as to drive the connecting conductive plate 3526 to move right, and the first conductive cover 3524 and the second conductive cover 3525 are electrically communicated, so that the heating wire 351 is electrically communicated with an external power supply, and the heating wire 351 is heated;
When the two sliding sealing plates 341 are close to each other, the heated heating wire 351 passes through the glue outlet end at the bottom end of the glue spraying needle 21, so that the glue in the shaping cover 321 and the glue at the glue outlet end of the glue spraying needle 21 are fused, and the phenomenon of glue drawing is avoided; meanwhile, when the two sliding seal plates 341 approach each other, the bump 35 is driven to approach the storage groove, so that the fixed box 3521 approaches the storage groove, so that the sliding rod 3527 approaches the storage groove, so as to push the sliding rod 3527, stretch the second return spring, and further drive the connecting conductive plate 3526 to move left, so that the connecting conductive plate 3526 between the first conductive cover 3524 and the second conductive cover 3525 is separated from the second conductive cover 3525, and electrical communication between the first conductive cover 3524 and the second conductive cover 3525 is lost, so that the electric heating wire 351 is electrically disconnected from an external power supply, and the electric heating wire 351 is not heated any more;
After all the glue dispensing points on the carrier plate 2 are finished, waiting for a period of time, separating the auxiliary shaping mechanism 3 from the carrier plate 2, wherein at the moment, the inner wall of the shaping cover 321, the bottom end of the rubber ring, the inner ring of the through hole, the sliding sealing plate 341 and the bottom end of the rotary sealing plate 342 are all made of non-gel-philic materials, so that the glue dispensing points on the carrier plate 2 are quickly separated from the auxiliary shaping mechanism 3, thereby facilitating the subsequent bonding of the semiconductor on the carrier plate 2.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (5)
1. The semiconductor element packaging equipment is characterized by comprising a gluing machine (1) and a carrier plate (2) which is placed on a workbench of the gluing machine (1) and used for bonding a semiconductor, wherein an auxiliary shaping mechanism (3) used for assisting in glue shaping is placed on the carrier plate (2); the auxiliary shaping mechanism (3) comprises a positioning plate (31) placed on the carrier plate (2), the shape of the positioning plate (31) is consistent with that of the carrier plate (2), a plurality of through grooves are formed in the positioning plate (31), the positions of the through grooves are in one-to-one correspondence with the positions of the carrier plate (2) for placing semiconductors, and shaping dies (32) for shaping glue are embedded in the through grooves;
The shaping die (32) comprises a shaping cover (321) embedded in the through groove, the middle of the shaping cover (321) is hollow, two ends of the shaping cover are provided with openings, a pressing plate (322) is arranged in the shaping cover (321) in a vertical sliding mode, a glue injection port is formed in the middle of the pressing plate (322), a sealing assembly (34) for sealing the glue injection port is arranged at the top end of the pressing plate (322), and the top end of the shaping cover (321) is higher than the top end of the carrier plate (2);
The sealing assembly (34) comprises two sliding sealing plates (341) which are arranged in the glue injection port in a bilateral symmetry way, one ends of the sliding sealing plates (341) deviating from each other are connected with the bottom end of the inner wall of the glue injection port in a bilateral sliding way, one ends of the sliding sealing plates (341) deviating from each other are provided with rotary sealing plates (342) through rotation of torsion spring shafts, the torsion spring shafts are positioned at one ends of the rotary sealing plates (342) far away from the sliding sealing plates (341), the torsion spring shafts are rotatably arranged in the bottom ends of the inner wall of the glue injection port, C-shaped lug plates are fixedly arranged at the upper sides of the close ends of the two rotary sealing plates (342), one ends of pull ropes (343) are sleeved on the surfaces of the two C-shaped lug plates in a sliding way, one ends of the two pull ropes (343) far away from the C-shaped lug plates are respectively wound on rolling rollers (344), the two rolling rollers (344) are respectively rotatably arranged in the inner parts of convex covers (345), the convex covers (345) are fixedly arranged at the top ends of the pressing plates (322), the convex covers (345) are arranged at the top ends of the first ends of the two rolling rollers (346) and are rotatably arranged at the two first ends of the two rolling rollers (346) which are respectively meshed with each other, one end, away from each other, of the two second gears (346) is connected with a toothed plate (347) in a meshed mode, the two toothed plates (347) are arranged in the convex cover (345) in a sliding mode, the top ends of the two toothed plates (347) are fixedly connected with the bottom end of the top plate, a sliding cover (348) is fixedly arranged at the bottom end of the top plate, the two toothed plates (347) are located in the sliding cover (348), the inner wall of the sliding cover (348) is connected with the outer surface of the convex cover (345) in a sliding mode, and a first reset spring is arranged between the bottom end of the sliding cover (348) and the top end of the pressing plate (322); one end of the sliding type sealing plate (341) is abutted with one end of the rotary type sealing plate (342), and a rubber cushion is arranged at the abutting end of the rotary type sealing plate (342); the first gear is a pinion gear and the second gear (346) is a bull gear;
Convex strips (349) are fixedly arranged at the front end and the rear end of the two sliding sealing plates (341), third gears (3410) are arranged at the front ends of the two torsion spring shafts, and tooth grooves meshed with the two third gears (3410) are respectively formed in the bottoms of one ends of the two convex strips (349) which face away from each other at the front ends;
a glue injecting needle head (21) in the glue injecting machine (1) is inserted into the glue injecting port, a trigger plate (22) contacted with the top end of the top plate is fixedly arranged on the outer surface of the upper part of the glue injecting needle head (21), a through hole is formed in the middle of the top plate, and the cross section area of the trigger plate (22) is larger than that of the through hole;
the left end two sand grip board (349) right-hand member around sliding seal board (341) is provided with the glue melting subassembly that prevents the wire drawing of gluing syringe needle (21), glue melting subassembly is including setting up respectively in two lug (35) of two sand grip board (349) right-hand member around left end sliding seal board (341), two install heating wire (351) between the close one end of lug (35), the left end offer in two sand grip board (349) around sliding seal board (341) and be used for accomodating the storage tank of two lug (35).
2. A semiconductor element packaging apparatus according to claim 1, wherein a back side of the bump (35) at a back end is provided with an on-off assembly (352) for turning on and off a heating wire (351); the on-off assembly (352) comprises a fixed box (3521) fixedly arranged at the rear side of a rear end lug (35), a protective cover (3522) arranged at the rear end of the fixed box (3521), a first conductive cover (3524) fixedly arranged in the fixed box (3521) and electrically connected with one end of an external power supply, a second conductive cover (3525) fixedly arranged in the fixed box (3521) and electrically connected with one end of an electric heating wire (351) and a connection conductive plate (3526) which is arranged between the first conductive cover (3524) and one end close to the second conductive cover (3525) in a left-right sliding manner, wherein the right end of the first conductive cover (3524) and the left end of the second conductive cover (3525) are overlapped, the right end of the connection conductive plate (3526) is fixedly provided with a sliding rod (3527), the right end of the sliding rod (3527) movably penetrates through the inner wall of the fixed box (3521) and is abutted against the inner wall of the mounting groove, the middle part of the sliding rod (3527) is fixedly provided with a convex plate, and a second reset spring is arranged between the convex plate and the inner wall of the fixed box (3521). The other end of the heating wire (351) is electrically connected with the other end of the external power supply; the sliding rod (3527), the fixed box (3521) and the protective cover (3522) are all made of insulating materials.
3. The semiconductor element packaging device according to claim 1, wherein an adjusting component (33) for adjusting the position of the pressing plate (322) is installed in the shaping cover (321), the adjusting component (33) comprises L-shaped fixing plates (331) fixedly arranged at the tops of the pressing plates (322), two L-shaped fixing plates (331) are symmetrically arranged, two guide rods (333) are fixedly arranged at the left end and the right end of the tops of the shaping covers (321), one ends, far away from the pressing plates (322), of the two L-shaped fixing plates (331) are respectively connected with the two guide rods (333) in an up-down sliding manner, two L-shaped fixing plates (331) adjacent to each other in the two shaping covers (321) are fixedly connected through a connecting plate, threaded rods (332) are rotatably arranged in the middle parts of the left side and the right side of the top ends of the positioning plates (31), and thread bases are fixedly connected with the connecting plates through surface thread bases.
4. A semiconductor element packaging apparatus according to claim 1, wherein the surface of the pressing plate (322) is wrapped with a rubber ring which abuts against the inner wall of the shaping cover (321).
5. The semiconductor element packaging device according to claim 1, wherein a rubber protection layer (36) is fixedly adhered to the bottom end of the positioning plate (31) and the bottom end of the shaping cover (321), and a through hole communicated with the shaping cover (321) is formed in the protection layer (36) at the bottom end of the shaping cover (321).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311040279.1A CN117096060B (en) | 2023-08-18 | 2023-08-18 | Semiconductor element packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311040279.1A CN117096060B (en) | 2023-08-18 | 2023-08-18 | Semiconductor element packaging equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117096060A CN117096060A (en) | 2023-11-21 |
| CN117096060B true CN117096060B (en) | 2024-04-19 |
Family
ID=88774496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311040279.1A Active CN117096060B (en) | 2023-08-18 | 2023-08-18 | Semiconductor element packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117096060B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309914B1 (en) * | 1998-04-03 | 2001-10-30 | Siliconware Precision Industrices Co., Ltd. | Method for making a semiconductor package |
| CN209607698U (en) * | 2019-06-06 | 2019-11-08 | 青岛众城精密模具有限公司 | A kind of novel integrated semiconductor packaging mold |
| CN112103210A (en) * | 2020-08-13 | 2020-12-18 | 张国华 | Chip bonding process equipment for semiconductor chip packaging |
| CN217847892U (en) * | 2022-08-02 | 2022-11-18 | 南通精研精密模具有限公司 | Semiconductor packaging mould is with dredging exhaust structure certainly |
| CN115799117A (en) * | 2022-12-07 | 2023-03-14 | 合肥大网格技术合伙企业(有限合伙) | Semiconductor packaging equipment and semiconductor packaging method |
-
2023
- 2023-08-18 CN CN202311040279.1A patent/CN117096060B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309914B1 (en) * | 1998-04-03 | 2001-10-30 | Siliconware Precision Industrices Co., Ltd. | Method for making a semiconductor package |
| CN209607698U (en) * | 2019-06-06 | 2019-11-08 | 青岛众城精密模具有限公司 | A kind of novel integrated semiconductor packaging mold |
| CN112103210A (en) * | 2020-08-13 | 2020-12-18 | 张国华 | Chip bonding process equipment for semiconductor chip packaging |
| CN217847892U (en) * | 2022-08-02 | 2022-11-18 | 南通精研精密模具有限公司 | Semiconductor packaging mould is with dredging exhaust structure certainly |
| CN115799117A (en) * | 2022-12-07 | 2023-03-14 | 合肥大网格技术合伙企业(有限合伙) | Semiconductor packaging equipment and semiconductor packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117096060A (en) | 2023-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104112679B (en) | resin encapsulation equipment and resin encapsulation method | |
| CN207026889U (en) | A kind of magneto automatic difference magnet steel machine | |
| JPH1177734A (en) | Resin molding method and resin molding device | |
| CN106915084B (en) | 3D printer and its print platform | |
| TW200415733A (en) | Resin molding machine | |
| CN117096060B (en) | Semiconductor element packaging equipment | |
| CN108114861B (en) | Pre-pressing type card gluing device | |
| CN115090481A (en) | Dispensing machine with accurate positioning function and using method thereof | |
| CN101304100B (en) | Electric core membrane extrusion mechanism and apparatus containing the same for adhering adhesive tape at battery electric core rear end | |
| CN209333532U (en) | A kind of row's silk gluing device for film wire | |
| CN209995481U (en) | Rolling-type gluing tool for shoemaking | |
| JP3149409B2 (en) | Method for manufacturing semiconductor device | |
| TW200900177A (en) | Method and device for forming color metal zipper | |
| CN212147208U (en) | A encapsulation moulding press for COB encapsulation LED display element | |
| CN210969657U (en) | Multi-station injection molding machine | |
| CN111196017A (en) | Extrusion equipment capable of controlling extrusion capacity | |
| CN112382586A (en) | Chip processing is with subsides installation | |
| CN112354802A (en) | Adhesive deposite device is used in production of LED lamp holder | |
| CN110442009A (en) | A kind of coating process and its filming equipment for watch dial | |
| CN115283203B (en) | Surface-mounted integrated circuit packaging equipment for planar array | |
| CN114243417B (en) | Encapsulation equipment and encapsulation process for conductive connecting piece | |
| CN106346930B (en) | A kind of extra quality transfer combination placement equipment | |
| CN115332095B (en) | QFN large substrate packaging mold and method | |
| CN210511158U (en) | LED waterproof lamp belt and manufacturing equipment thereof | |
| CN217395608U (en) | Novel container mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |