CN110911317A - Chip production error control method based on Internet of things - Google Patents
Chip production error control method based on Internet of things Download PDFInfo
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- CN110911317A CN110911317A CN201911235282.2A CN201911235282A CN110911317A CN 110911317 A CN110911317 A CN 110911317A CN 201911235282 A CN201911235282 A CN 201911235282A CN 110911317 A CN110911317 A CN 110911317A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 44
- 238000001179 sorption measurement Methods 0.000 claims abstract description 28
- 238000002347 injection Methods 0.000 claims abstract description 17
- 239000007924 injection Substances 0.000 claims abstract description 17
- 238000012858 packaging process Methods 0.000 claims abstract description 5
- 239000000725 suspension Substances 0.000 claims description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 244000309464 bull Species 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses a chip production error control method based on the Internet of things, which belongs to the field of chip production and comprises a chip base and a chip, wherein the control method comprises the following steps: s1, first, mounting the chip base in a positioning device for positioning, so as to avoid package failure caused by chip base deviation in the packaging process; s2, moving the adsorption device through the sliding mechanism, moving the adsorption device to the upper side of the conveying device, adjusting the telescopic device to move the lower end of the adsorption device downwards, starting the adsorption device to suck the chip on the conveying device, realizing accurate positioning of the base and the chip, and bonding the chip through a glue injection mode around the chip, effectively preventing the chip from deviating and causing packaging errors.
Description
Technical Field
The invention relates to the field of chip production, in particular to a chip production error control method based on the Internet of things.
Background
The chip package, which is a package for mounting a semiconductor integrated circuit chip, plays a role in placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and is a bridge for communicating the internal world of the chip with an external circuit (the connection points on the chip are connected to the pins of the package through wires, and the pins are connected with other devices through wires on a printed board).
The in-process of chip package needs to glue the chip on the base with glue, because glue solidification needs a period of time, if do not fix the chip this moment, the chip causes the skew easily and leads to installation error's production, causes the welding point on the chip to be unable to be connected with the pin that corresponds.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a chip production error control method based on the Internet of things, which can realize the accurate positioning of a base and a chip, and can effectively prevent a packaging error caused by the deviation of the chip by adhering the chip in a glue injection mode around the chip.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A chip production error control method based on the Internet of things comprises a chip base and a chip, and the control method comprises the following steps:
s1, first, mounting the chip base in a positioning device for positioning, so as to avoid package failure caused by chip base deviation in the packaging process;
s2, moving the adsorption device through the sliding mechanism to enable the adsorption device to move above the conveying device, adjusting the telescopic device to enable the lower end of the adsorption device to move downwards, and starting the adsorption device to adsorb the chip on the conveying device;
s3, moving the sliding mechanism again to move the adsorption device to the position right above the positioning device, moving the sliding mechanism until the sliding mechanism is fixed by the fixing device, and adjusting the telescopic device again to enable the adsorption device to place the chip into the positioning device;
and S4, after the chip is placed in place, injecting glue, closing the adsorption device after the glue is solidified, and adjusting the telescopic device to return to the original position so as to carry out the next operation.
Furthermore, the positioning device in the S1 method includes a base, a positioning seat is fixedly connected to the upper surface of the base, a positioning groove is formed in the upper surface of the positioning seat, a chip base is arranged in the positioning groove, a transversely arranged gas spring is fixedly connected to the inner wall of one side of the positioning groove, a top plate is fixedly connected to the end portion of the gas spring, two transversely arranged pull rods are fixedly connected to the side wall of the top plate away from the chip base, the two pull rods penetrate through the side wall of the positioning seat, the pull rods are pulled outwards, the gas spring is compressed to have elastic force, when the chip base is placed in the positioning groove, the pull rods are loosened, and the elastic force of the gas spring enables the top plate to fix the chip base in the positioning groove, so that the chip base can.
Furthermore, the sliding mechanism in the S2 method includes two pillars, two of the pillars are all fixedly connected with the upper surface of the base, and the two pillars are respectively located at two sides of the positioning seat, a beam is fixedly connected between the upper ends of the two pillars, a guide rail is arranged inside the beam, and a guide block is slidably connected in the guide rail, and the guide block slides in the guide rail, so that the chip is conveniently sucked and put down.
Further, the telescopic device in the S2 method includes a first suspension rod, the first suspension rod is fixedly connected to the guide block, a cavity is formed at the lower end of the first suspension rod, a second suspension rod is inserted into the cavity, a rotation rod is rotatably connected to one side wall of the cavity and transversely arranged, the rotation rod penetrates through the side wall of the first suspension rod, a worm wheel is fixedly sleeved on the side wall of the rotation rod, a vertical worm is rotatably connected to the upper end wall of the cavity, a screw rod is fixedly connected to the lower end of the worm, a threaded hole matched with the screw rod is formed in the upper end side wall of the second suspension rod, a mounting seat is fixedly connected to the lower end of the second suspension rod, a glue injection positioning box is sleeved on the outer side of the mounting seat, connecting rods are fixedly connected to both side walls of the mounting positions, and are fixedly connected to the connecting rods and the glue injection positioning box, when the rotation rod is rotated, the worm drives the screw rod and meshes with the screw hole, because first jib and second jib all are square post, consequently, the axial of second jib rotates and is restricted, the second jib just can reciprocate when screw rod and screw hole meshing like this, injecting glue locating box and chip contact with the chip base simultaneously when the second jib moves down in addition, the injecting glue locating box encloses the chip all around, inject glue into the injecting glue locating box this moment, glue encloses the chip in the centre, treat that glue solidification back can effectively prevent the chip off tracking.
Further, the adsorption device in the S2 method comprises a vacuum generator, the vacuum generator is fixedly connected with the first suspender, the vacuum generator is connected with a sucker through a hose, the sucker is fixedly connected with the lower end of the mounting seat, the vacuum generator enables the sucker to generate negative pressure, and the sucker sucks up the chip to complete grabbing and putting down of the chip.
Further, the conveying device in the S2 method includes a conveying belt, the conveying belt is fixedly connected to the upper surface of the base, the conveying belt is disposed on one side of the positioning seat, and the conveying belt is used for continuously conveying the chips during the production process.
Furthermore, the fixing device in the method of S3 includes a magnet block, the magnet block is fixedly connected to the side wall of the cross beam, the side wall of the first suspension rod is fixedly connected to an iron block matched with the magnet block, and after the iron block is attracted by the magnet block, the first suspension rod and the lower device do not shake, so that the chip can be effectively prevented from shifting.
Further, the spout has all been seted up to the both sides inner wall of cavity, and the both sides lateral wall of second jib all rotates and is connected with the pulley with spout sliding connection, when the second jib reciprocated in first jib, the pulley slides in the spout, takes place the skew when can prevent like this that the second jib from removing, avoids the production of error.
Furthermore, a handle is fixedly connected to the side wall of one side of the first hanging rod, and the handle facilitates left-right movement of the hand.
Furthermore, one end of the rotating rod, which is positioned outside the cavity, is fixedly connected with a crank, and the crank facilitates the rotation of the rotating rod by a hand.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the elasticity of utilizing the air spring realizes fixing the chip base, prevents the in-process skew of chip base encapsulation, utilizes the adsorption of magnet piece and iron plate to fix the telescoping device to rock when putting the chip, and adopt the mode of injecting glue all around at the chip to bond the chip, but the production of error is avoided to the furthest to the mutually supporting like this, ensures that the welding point of chip can be accurate and the pin corresponds.
(2) The guide block slides in the guide rail, so that the chip is conveniently sucked and put down.
(3) When rotating the bull stick, the bull stick drives worm wheel and worm meshing, the worm drives screw rod and screw hole meshing, because first jib and second jib all are square post, consequently the axial of second jib rotates and is restricted, the second jib just can reciprocate when screw rod and screw hole meshing like this, in addition when the second jib moves down the injecting glue locating box and the contact of chip base simultaneously, the injecting glue locating box encloses the chip all around, inject glue into the injecting glue locating box this moment, glue encloses the chip in the centre, treat that glue solidification back can effectively prevent the chip off tracking.
(4) The vacuum generator enables the sucking disc to generate negative pressure, and the sucking disc sucks up the chip to complete the grabbing and putting down of the chip.
(5) The conveyer belt is used for continuously conveying the chips to the production process.
(6) When the magnet blocks attract the iron blocks, the first suspension rod and the lower device do not move any more, so that the chip can be effectively prevented from deviating.
(7) When the second suspender moves up and down in the first suspender, the pulley slides in the sliding groove, so that the second suspender can be prevented from shifting when moving, and the generation of errors is avoided.
(8) The handle is convenient for the left-right movement of the hand.
(9) The crank is convenient for the hand to rotate the rotating rod.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a cross-sectional structural view of the guide rail of the present invention;
FIG. 3 is a schematic cross-sectional view of the positioning base of the present invention;
FIG. 4 is a schematic view of the structure at A in FIG. 3;
FIG. 5 is a schematic view of the structure at B in FIG. 3;
FIG. 6 is a cross-sectional view of a first boom of the present invention;
fig. 7 is a schematic view of the structure at C in fig. 6.
The reference numbers in the figures illustrate:
the device comprises a base 1, a positioning seat 2, a positioning groove 3, a chip base 4, an air spring 5, a top plate 6, a pull rod 7, a support 8, a cross beam 9, a guide rail 10, a guide block 11, a first suspender 12, a magnet 13, an iron block 14, a second suspender 15, a rotating rod 16, a worm wheel 17, a worm 18, a screw rod 19, a threaded hole 20, a mounting seat 21, a glue injection positioning box 22, a conveying belt 23, a connecting rod 24, a sucking disc 25, a chip 26, a vacuum generator 27, a hose 28, a chute 29, a pulley 30, a crank 31 and a handle 32.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1 to 7, a chip production error control method based on the internet of things includes a chip base 4 and a chip 26, and the control method includes:
referring to fig. 1-4, S1, first, a chip base 4 is mounted in a positioning device for positioning to prevent the chip base 4 from being shifted to cause package failure in the packaging process, the positioning device includes a base 1, a positioning seat 2 is fixedly connected to the upper surface of the base 1, a positioning groove 3 is formed on the upper surface of the positioning seat 2, the chip base 4 is disposed in the positioning groove 3, a transversely disposed gas spring 5 is fixedly connected to the inner wall of one side of the positioning groove 3, a top plate 6 is fixedly connected to the end of the gas spring 5, two transversely disposed pull rods 7 are fixedly connected to the side wall of the top plate 6 away from the chip base 4, the two pull rods 7 are both disposed through the side wall of the positioning seat 2, the pull rods 7 are pulled outward, the gas spring 5 is compressed to have elastic force, when the chip base 4 is placed in the positioning groove 3, the pull rods 7 are released, the elastic force of the gas spring 5 makes the top, to achieve positioning of the chip pad 4;
s2, moving the adsorption device through a sliding mechanism, moving the adsorption device to the position above the conveying device, adjusting the telescopic device to enable the lower end of the adsorption device to move downwards, starting the adsorption device to adsorb the chip 26 on the conveying device, wherein the sliding mechanism comprises two support columns 8, the two support columns 8 are both fixedly connected with the upper surface of the base 1, the two support columns 8 are respectively arranged at two sides of the positioning seat 2, a cross beam 9 is fixedly connected between the upper ends of the two support columns 8, a guide rail 10 is arranged in the cross beam 9, a guide block 11 is connected in the guide rail 10 in a sliding manner, and the guide block 11 slides in the guide rail 10, so that the chip 26 is conveniently adsorbed and put down;
referring to fig. 5-7, the telescopic device in the method of S2 includes a first suspension rod 12, a handle 32 is fixedly connected to a side wall of the first suspension rod 12, the handle 32 facilitates a left-right movement of a hand, the first suspension rod 12 is fixedly connected to a guide block 11, a cavity is formed at a lower end of the first suspension rod 12, sliding grooves 29 are formed in inner walls of two sides of the cavity, a pulley 30 slidably connected to the sliding groove 29 is rotatably connected to the side walls of two sides of a second suspension rod 15, when the second suspension rod 15 moves up and down in the first suspension rod 12, the pulley 30 slides in the sliding groove 29, so that the second suspension rod 15 is prevented from shifting when moving, and errors are avoided, the second suspension rod 15 is inserted in the cavity, a horizontally disposed rotating rod 16 is rotatably connected to an inner wall of one side of the cavity, a crank 31 is fixedly connected to one end of the rotating rod 16 located outside the cavity, and the crank 31 facilitates the hand, the rotating rod 16 penetrates through the side wall of the first suspender 12, a worm wheel 17 is fixedly sleeved on the side wall of the rotating rod 16, a vertical worm 18 is rotatably connected to the inner wall of the upper end of the cavity, a screw rod 19 is fixedly connected to the lower end of the worm 18, a threaded hole 20 matched with the screw rod 19 is formed in the side wall of the upper end of the second suspender 15, a mounting seat 21 is fixedly connected to the lower end of the second suspender 15, a glue injection positioning box 22 is sleeved on the outer side of the mounting seat 21, connecting rods 24 are fixedly connected to the side walls on the two sides of the mounting seat 21, the connecting rods 24 are fixedly connected with the glue injection positioning box 22, when the rotating rod 16 is rotated, the rotating rod 16 drives the worm wheel 17 to be meshed with the worm 18, the worm 18 drives the screw rod 19 to be meshed with the threaded hole 20, because the first suspender 12 and the second suspender 15 are square columns, the axial rotation of the second suspender 15 is limited, and, in addition, when the second suspender 15 moves downwards, the glue injection positioning box 22 and the chip 26 are simultaneously contacted with the chip base 4, the glue injection positioning box 22 surrounds the chip 26, glue is injected into the glue injection positioning box 22 at the moment, the chip 26 is surrounded in the middle by the glue, and the chip 26 can be effectively prevented from deviating after the glue is cured;
referring to fig. 5, the suction device in the S2 method includes a vacuum generator 27, the vacuum generator 27 is fixedly connected to the first suspension rod 12, the vacuum generator 27 is connected to the suction cup 25 through a hose 28, the suction cup 25 is fixedly connected to the lower end of the mounting base 21, the vacuum generator 27 generates a negative pressure on the suction cup 25, and the suction cup 25 sucks up the chip 26 to complete the grabbing and dropping of the chip 26;
the conveying device in the method of S2 includes a conveying belt 23, the conveying belt 23 is fixedly connected to the upper surface of the base 1, the conveying belt 33 is disposed at one side of the positioning seat 2, and the conveying belt 23 is used for continuously conveying the chips 26 to the production process;
s3, moving the sliding mechanism again to move the adsorption device to the position right above the positioning device, moving the sliding mechanism until the sliding mechanism is fixed by the fixing device, and adjusting the telescopic device again to enable the adsorption device to place the chip 26 in the positioning device;
the fixing device in the method of S3 includes a magnet 13, the magnet 13 is fixedly connected to the side wall of the beam 9, the side wall of the first suspension rod 12 is fixedly connected to an iron block 14 matching with the magnet 13, when the magnet 13 attracts the iron block 14, the first suspension rod 12 and the lower device will not shake, thus effectively preventing the chip from shifting;
s4, after the chip 26 is placed in place, glue injection is started, the adsorption device is closed after the glue is solidified, and the telescopic device is adjusted to return to the original position so as to carry out the next operation.
In the operation of the invention, firstly, the chip base 4 is positioned, so as to prevent the chip base 4 from deviating to cause packaging failure in the packaging process, the pull rod 7 is pulled outwards during the fixing process, the gas spring 5 is compressed to have elasticity, the pull rod 7 is released after the chip base 4 is placed in the positioning groove 3, the elasticity of the gas spring 5 enables the top plate 6 to fix the chip base 4 in the positioning groove 3, so as to realize the positioning of the chip base 4, then the first suspender 12 is moved, the guide block 11 slides in the guide rail 10, the vacuum generator 27 is started when the sucking disc 25 is positioned above the conveyer belt 23, the vacuum generator 27 enables the sucking disc 25 to generate negative pressure, the sucking disc 25 sucks up the chip 26, then the chip 26 is moved above the chip base 4, the rotating bar 16 is rotated, the rotating bar 16 drives the worm wheel 17 to be meshed with the worm 18, the worm 18 drives the screw rod 19 to be meshed with the threaded hole 20, because the first suspender 12 and the second suspender 15 are square columns, therefore, the axial rotation of the second suspender 15 is limited, so that the second suspender 15 can move up and down when the screw rod 19 is meshed with the threaded hole 20, when the second suspender 15 moves down, the glue injection positioning box 22 and the chip 26 simultaneously contact with the chip base 4 and press the chip base 4, the glue injection positioning box 22 surrounds the chip 26, glue is injected into the glue injection positioning box 22 at the moment, the chip 26 is surrounded in the middle by the glue, the chip 26 can be effectively prevented from deviating after the glue is cured, the accurate positioning of the chip base 4 and the chip 26 can be realized, and the chip 26 is bonded in a glue injection mode around the chip 26, so that the packaging error caused by the deviation of the chip 26 can be effectively prevented.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (10)
1. A chip production error control method based on the Internet of things comprises a chip base (4) and a chip (26), and is characterized in that: the control method comprises the following steps:
s1, first, the chip base (4) is installed in the positioning device for positioning, so as to avoid the chip base (4) from shifting to cause package failure in the packaging process;
s2, moving the adsorption device through the sliding mechanism to enable the adsorption device to move above the conveying device, adjusting the telescopic device to enable the lower end of the adsorption device to move downwards, and starting the adsorption device to adsorb the chip (26) on the conveying device;
s3, moving the sliding mechanism again to move the adsorption device to the position right above the positioning device, moving the sliding mechanism until the sliding mechanism is fixed by the fixing device, and adjusting the telescopic device again to enable the adsorption device to place the chip (26) in the positioning device;
s4, after the chip (26) is placed in place, glue injection is started, the adsorption device is closed after the glue is solidified, and the telescopic device is adjusted to return to the original position so as to carry out the next operation.
2. The chip production error control method based on the internet of things as claimed in claim 1, wherein: the positioning device in the S1 method comprises a base (1), wherein a positioning seat (2) is fixedly connected to the upper surface of the base (1), a positioning groove (3) is formed in the upper surface of the positioning seat (2), a chip base (4) is arranged in the positioning groove (3), an air spring (5) transversely arranged is fixedly connected to the inner wall of one side of the positioning groove (3), a top plate (6) is fixedly connected to the end portion of the air spring (5), two transversely arranged pull rods (7) are fixedly connected to the side wall, far away from the chip base (4), of the top plate (6), and the two pull rods (7) penetrate through the side wall of the positioning seat (2).
3. The chip production error control method based on the internet of things as claimed in claim 2, wherein: the sliding mechanism in the S2 method comprises two supporting columns (8), wherein the two supporting columns (8) are fixedly connected with the upper surface of the base (1), the two supporting columns (8) are respectively arranged on two sides of the positioning seat (2), a cross beam (9) is fixedly connected between the upper ends of the two supporting columns (8), a guide rail (10) is arranged inside the cross beam (9), and a guide block (11) is connected in the guide rail (10) in a sliding mode.
4. The chip production error control method based on the Internet of things as claimed in claim 3, wherein: the telescopic device in the S2 method comprises a first suspender (12), the first suspender (12) is fixedly connected with a guide block (11), a cavity is formed in the lower end of the first suspender (12), a second suspender (15) is inserted in the cavity, a transversely-arranged rotating rod (16) is rotatably connected to the inner wall of one side of the cavity, the rotating rod (16) penetrates through the side wall of the first suspender (12), a worm wheel (17) is fixedly sleeved on the side wall of the rotating rod (16), a vertical worm (18) is rotatably connected to the inner wall of the upper end of the cavity, a screw rod (19) is fixedly connected to the lower end of the worm (18), a threaded hole (20) matched with the screw rod (19) is formed in the side wall of the upper end of the second suspender (15), a mounting seat (21) is fixedly connected to the lower end of the second suspender (15), and a glue injection positioning box (22) is sleeved on the outer side of the mounting seat, install equal fixedly connected with connecting rod (24) in the both sides lateral wall of (21), and connecting rod (24) and injecting glue location box (22) fixed connection.
5. The chip production error control method based on the Internet of things as claimed in claim 4, wherein: the adsorption device in the S2 method comprises a vacuum generator (27), wherein the vacuum generator (27) is fixedly connected with the first suspender (12), the vacuum generator (27) is connected with a suction cup (25) through a hose (28), and the suction cup (25) is fixedly connected with the lower end of the mounting seat (21).
6. The chip production error control method based on the internet of things as claimed in claim 2, wherein: the conveying device in the S2 method comprises a conveying belt (23), wherein the conveying belt (23) is fixedly connected with the upper surface of the base (1), and the conveying belt (23) is arranged on one side of the positioning seat (2).
7. The chip production error control method based on the Internet of things as claimed in claim 4, wherein: the fixing device in the S3 method comprises a magnet block (13), the magnet block (13) is fixedly connected with the side wall of the cross beam (9), and an iron block (14) matched with the magnet block (13) is fixedly connected with the side wall of the first suspension rod (12).
8. The chip production error control method based on the Internet of things as claimed in claim 4, wherein: the inner walls of the two sides of the cavity are both provided with sliding grooves (29), and the side walls of the two sides of the second suspender (15) are both rotatably connected with pulleys (30) which are slidably connected with the sliding grooves (29).
9. The chip production error control method based on the Internet of things as claimed in claim 4, wherein: a handle (32) is fixedly connected to one side wall of the first suspension rod (12).
10. The chip production error control method based on the Internet of things as claimed in claim 4, wherein: and one end of the rotating rod (16) positioned outside the cavity is fixedly connected with a crank (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN112103210A (en) * | 2020-08-13 | 2020-12-18 | 张国华 | Chip bonding process equipment for semiconductor chip packaging |
| CN112420585A (en) * | 2020-11-06 | 2021-02-26 | 莱西市亨元产业互联网中心 | 5G chip packaging method |
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