CN107876320B - 荧光粉涂布装置及涂布方法 - Google Patents
荧光粉涂布装置及涂布方法 Download PDFInfo
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- CN107876320B CN107876320B CN201610886781.8A CN201610886781A CN107876320B CN 107876320 B CN107876320 B CN 107876320B CN 201610886781 A CN201610886781 A CN 201610886781A CN 107876320 B CN107876320 B CN 107876320B
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- 239000000758 substrate Substances 0.000 claims abstract description 37
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000002347 injection Methods 0.000 claims abstract description 23
- 239000007924 injection Substances 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 238000005192 partition Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 239000011796 hollow space material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
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- 239000000463 material Substances 0.000 abstract description 23
- 238000004519 manufacturing process Methods 0.000 abstract description 7
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- 238000011049 filling Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- NJSVDVPGINTNGX-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethanamine Chemical compound CCC[Si](OC)(OC)OCN NJSVDVPGINTNGX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 239000002077 nanosphere Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
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- 150000003839 salts Chemical class 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- -1 silicon alkoxide Chemical class 0.000 description 1
- 239000012703 sol-gel precursor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
- B05C9/027—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means using applicator shoes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/065—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects having colour interferences or colour shifts or opalescent looking, flip-flop, two tones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
- B05D2401/10—Organic solvent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2451/00—Type of carrier, type of coating (Multilayers)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105131800 | 2016-09-30 | ||
TW105131800A TWI613011B (zh) | 2016-09-30 | 2016-09-30 | 螢光粉塗佈裝置及塗佈方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107876320A CN107876320A (zh) | 2018-04-06 |
CN107876320B true CN107876320B (zh) | 2020-11-06 |
Family
ID=59094576
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621112305.2U Active CN206293459U (zh) | 2016-09-30 | 2016-10-11 | 荧光粉涂布装置 |
CN201610886781.8A Active CN107876320B (zh) | 2016-09-30 | 2016-10-11 | 荧光粉涂布装置及涂布方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621112305.2U Active CN206293459U (zh) | 2016-09-30 | 2016-10-11 | 荧光粉涂布装置 |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN206293459U (zh) |
TW (1) | TWI613011B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI710129B (zh) * | 2020-02-10 | 2020-11-11 | 台灣愛司帝科技股份有限公司 | 發光二極體晶片封裝結構及其製作方法 |
TWI766234B (zh) * | 2020-02-10 | 2022-06-01 | 台灣愛司帝科技股份有限公司 | 發光二極體晶片封裝結構及其製作方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61178070A (ja) * | 1985-01-31 | 1986-08-09 | Japan Radio Co Ltd | 螢光体塗膜形成法 |
JPS61216767A (ja) * | 1985-03-22 | 1986-09-26 | Shimadzu Corp | 微粉末の塗布方法 |
CN101093869A (zh) * | 2007-07-26 | 2007-12-26 | 电子科技大学 | 基于水溶性感光胶的功率型白光led平面涂层工艺 |
CN201389516Y (zh) * | 2009-04-28 | 2010-01-27 | 上海宝绿包装材料科技有限公司 | 涂布循环料槽 |
CN102107178A (zh) * | 2009-12-28 | 2011-06-29 | 李威汉 | 荧光材料涂布方法及其所制备的基板 |
CN102694091A (zh) * | 2012-06-13 | 2012-09-26 | 佛山市国星光电股份有限公司 | 用于在晶圆级封装中暴露电极的方法及掩膜版 |
CN102945915A (zh) * | 2012-10-22 | 2013-02-27 | 厦门多彩光电子科技有限公司 | 一种led荧光粉涂覆工艺 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11251463A (ja) * | 1998-03-06 | 1999-09-17 | Matsushita Electron Corp | 半導体記憶装置およびその製造方法 |
CN101623682B (zh) * | 2008-07-09 | 2011-05-25 | 北京石油化工学院 | 液位沉降法制备薄膜的装置 |
TWI398306B (zh) * | 2009-12-24 | 2013-06-11 | Wei Han Lee | 螢光材料塗佈方法 |
CN102148304B (zh) * | 2010-02-09 | 2013-07-03 | 和椿科技股份有限公司 | 制膜***及制膜方法 |
CN101884969B (zh) * | 2010-06-25 | 2012-07-04 | 北京航空航天大学 | 一种液面下降法制备薄膜的装置 |
TWI484664B (zh) * | 2012-09-11 | 2015-05-11 | Brightek Optoelectronic Co Ltd | 螢光粉粒子之塗佈方法 |
-
2016
- 2016-09-30 TW TW105131800A patent/TWI613011B/zh active
- 2016-10-11 CN CN201621112305.2U patent/CN206293459U/zh active Active
- 2016-10-11 CN CN201610886781.8A patent/CN107876320B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61178070A (ja) * | 1985-01-31 | 1986-08-09 | Japan Radio Co Ltd | 螢光体塗膜形成法 |
JPS61216767A (ja) * | 1985-03-22 | 1986-09-26 | Shimadzu Corp | 微粉末の塗布方法 |
CN101093869A (zh) * | 2007-07-26 | 2007-12-26 | 电子科技大学 | 基于水溶性感光胶的功率型白光led平面涂层工艺 |
CN201389516Y (zh) * | 2009-04-28 | 2010-01-27 | 上海宝绿包装材料科技有限公司 | 涂布循环料槽 |
CN102107178A (zh) * | 2009-12-28 | 2011-06-29 | 李威汉 | 荧光材料涂布方法及其所制备的基板 |
CN102694091A (zh) * | 2012-06-13 | 2012-09-26 | 佛山市国星光电股份有限公司 | 用于在晶圆级封装中暴露电极的方法及掩膜版 |
CN102945915A (zh) * | 2012-10-22 | 2013-02-27 | 厦门多彩光电子科技有限公司 | 一种led荧光粉涂覆工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN206293459U (zh) | 2017-06-30 |
TW201811443A (zh) | 2018-04-01 |
CN107876320A (zh) | 2018-04-06 |
TWI613011B (zh) | 2018-02-01 |
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PB01 | Publication | ||
PB01 | Publication | ||
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Effective date of registration: 20191024 Address after: 214063 811, 8th floor, 599-1 (Building 1), Jianshe West Road, Wuxi City, Jiangsu Province Applicant after: Jiangsu Zhongxi Semiconductor Co.,Ltd. Address before: 201315, Shanghai, Cambridge Town, Pudong New Area, Shanghai South Road, No. 1, building 58, room 4, 2568 Applicant before: SHANGHAI HANBANG PUJING ENERGY CONSERVATION TECH CO.,LTD. |
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Effective date of registration: 20230323 Address after: Room 3, No. 336 Kanghui Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province, 215314 Patentee after: Suzhou Duolis Technology Co.,Ltd. Address before: 214063 811, 8th Floor, 599-1 (Building 1), Jianzhu West Road, Wuxi City, Jiangsu Province Patentee before: Jiangsu Zhongxi Semiconductor Co.,Ltd. |