CN102107178A - 荧光材料涂布方法及其所制备的基板 - Google Patents
荧光材料涂布方法及其所制备的基板 Download PDFInfo
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- CN102107178A CN102107178A CN2009102656071A CN200910265607A CN102107178A CN 102107178 A CN102107178 A CN 102107178A CN 2009102656071 A CN2009102656071 A CN 2009102656071A CN 200910265607 A CN200910265607 A CN 200910265607A CN 102107178 A CN102107178 A CN 102107178A
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- 239000000758 substrate Substances 0.000 title claims abstract description 72
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- 239000002904 solvent Substances 0.000 claims abstract description 39
- 239000000843 powder Substances 0.000 claims description 42
- 239000000243 solution Substances 0.000 claims description 30
- 239000000203 mixture Substances 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- 150000004703 alkoxides Chemical class 0.000 claims description 14
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- 239000002253 acid Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
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- 229910052693 Europium Inorganic materials 0.000 claims description 6
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- 229910052772 Samarium Inorganic materials 0.000 claims description 6
- 229910052771 Terbium Inorganic materials 0.000 claims description 6
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 4
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052775 Thulium Inorganic materials 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910052712 strontium Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
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- 229910052745 lead Inorganic materials 0.000 claims description 3
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- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
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- 229910004283 SiO 4 Inorganic materials 0.000 claims description 2
- 229910021645 metal ion Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
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- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 9
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- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
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- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
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- 229910017604 nitric acid Inorganic materials 0.000 description 2
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- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- NJSVDVPGINTNGX-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethanamine Chemical group CCC[Si](OC)(OC)OCN NJSVDVPGINTNGX-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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- 230000003595 spectral effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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CN 200910265607 CN102107178B (zh) | 2009-12-28 | 2009-12-28 | 荧光材料涂布方法及其所制备的基板 |
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CN102107178A true CN102107178A (zh) | 2011-06-29 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104279514A (zh) * | 2013-07-03 | 2015-01-14 | 深圳市绎立锐光科技开发有限公司 | 波长转换装置及其制备方法、相关发光装置与投影*** |
CN105845809A (zh) * | 2015-02-04 | 2016-08-10 | 亿光电子工业股份有限公司 | Led封装结构及其制造方法 |
CN106486586A (zh) * | 2015-08-24 | 2017-03-08 | 广科精密股份有限公司 | 发光装置及其制备方法 |
CN107876320A (zh) * | 2016-09-30 | 2018-04-06 | 上海汉邦普净节能科技有限公司 | 荧光粉涂布装置及涂布方法 |
CN108281535A (zh) * | 2018-02-02 | 2018-07-13 | 温州大学 | 复合荧光夹层玻璃及其制备方法和在白光led上的应用 |
CN113257976A (zh) * | 2020-02-10 | 2021-08-13 | 台湾爱司帝科技股份有限公司 | 发光二极管芯片封装结构及其制作方法 |
CN113257981A (zh) * | 2020-02-10 | 2021-08-13 | 台湾爱司帝科技股份有限公司 | 发光二极管芯片封装结构及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1078734A (zh) * | 1992-05-11 | 1993-11-24 | 王胜利 | 反光复合涂料 |
US20040152389A1 (en) * | 2001-09-14 | 2004-08-05 | Fujitsu Limited Of Kawasaki, Japan | Method for forming phosphor layer of gas discharge tube and method for fabricating phosphor layer supporting member |
CN1597840A (zh) * | 2004-08-06 | 2005-03-23 | 孙祥民 | 一种用玻璃微珠制成的蓄光发光节能材料及其用途 |
CN101206330A (zh) * | 2007-12-19 | 2008-06-25 | 京东方科技集团股份有限公司 | 彩膜基板及制造方法和液晶显示装置 |
-
2009
- 2009-12-28 CN CN 200910265607 patent/CN102107178B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1078734A (zh) * | 1992-05-11 | 1993-11-24 | 王胜利 | 反光复合涂料 |
US20040152389A1 (en) * | 2001-09-14 | 2004-08-05 | Fujitsu Limited Of Kawasaki, Japan | Method for forming phosphor layer of gas discharge tube and method for fabricating phosphor layer supporting member |
CN1597840A (zh) * | 2004-08-06 | 2005-03-23 | 孙祥民 | 一种用玻璃微珠制成的蓄光发光节能材料及其用途 |
CN101206330A (zh) * | 2007-12-19 | 2008-06-25 | 京东方科技集团股份有限公司 | 彩膜基板及制造方法和液晶显示装置 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104279514A (zh) * | 2013-07-03 | 2015-01-14 | 深圳市绎立锐光科技开发有限公司 | 波长转换装置及其制备方法、相关发光装置与投影*** |
CN104279514B (zh) * | 2013-07-03 | 2015-12-02 | 深圳市绎立锐光科技开发有限公司 | 波长转换装置及其制备方法、相关发光装置与投影*** |
CN105845809A (zh) * | 2015-02-04 | 2016-08-10 | 亿光电子工业股份有限公司 | Led封装结构及其制造方法 |
CN106486586A (zh) * | 2015-08-24 | 2017-03-08 | 广科精密股份有限公司 | 发光装置及其制备方法 |
CN106486586B (zh) * | 2015-08-24 | 2019-10-01 | 广科精密股份有限公司 | 发光装置及其制备方法 |
CN107876320A (zh) * | 2016-09-30 | 2018-04-06 | 上海汉邦普净节能科技有限公司 | 荧光粉涂布装置及涂布方法 |
CN107876320B (zh) * | 2016-09-30 | 2020-11-06 | 江苏中曦半导体有限公司 | 荧光粉涂布装置及涂布方法 |
CN108281535A (zh) * | 2018-02-02 | 2018-07-13 | 温州大学 | 复合荧光夹层玻璃及其制备方法和在白光led上的应用 |
CN113257976A (zh) * | 2020-02-10 | 2021-08-13 | 台湾爱司帝科技股份有限公司 | 发光二极管芯片封装结构及其制作方法 |
CN113257981A (zh) * | 2020-02-10 | 2021-08-13 | 台湾爱司帝科技股份有限公司 | 发光二极管芯片封装结构及其制作方法 |
CN113257976B (zh) * | 2020-02-10 | 2022-06-24 | 台湾爱司帝科技股份有限公司 | 发光二极管芯片封装结构及其制作方法 |
US11456398B2 (en) | 2020-02-10 | 2022-09-27 | Asti Global Inc., Taiwan | Method of manufacturing LED chip package structure |
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CN102107178B (zh) | 2013-06-05 |
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Effective date of registration: 20210219 Address after: 239400 north of balinghu Road West of Fushan Road, Chancheng New District, Mingguang Economic Development Zone, Chuzhou City, Anhui Province Patentee after: Anhui Yuanye photoelectric Co.,Ltd. Address before: 201315 room 58, 4th floor, building 1, no.2568, Hunan Road, Kangqiao Town, Pudong New Area, Shanghai Patentee before: SHANGHAI HANBANG PUJING ENERGY CONSERVATION TECH Co.,Ltd. |
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Effective date of registration: 20211220 Address after: 201306 2nd floor, no.979 Yunhan Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Shanghai Liga management consulting partnership (L.P.) Address before: 239400 north of balinghu Road West of Fushan Road, Chancheng New District, Mingguang Economic Development Zone, Chuzhou City, Anhui Province Patentee before: Anhui Yuanye photoelectric Co.,Ltd. |
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Effective date of registration: 20230522 Address after: Room 3, No. 336 Kanghui Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province, 215313 Patentee after: Suzhou Duolis Technology Co.,Ltd. Address before: 201306 2nd floor, no.979 Yunhan Road, Lingang New Area, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee before: Shanghai Liga management consulting partnership (L.P.) |