CN104742261B - 加工装置 - Google Patents

加工装置 Download PDF

Info

Publication number: CN104742261B
Authority: CN; China
Prior art keywords: carrying; frame unit; frame; unit; pair
Prior art date: 2013-12-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

CN201410766785.3A

Other languages

English (en)

Chinese (zh)

Other versions

CN104742261A (zh

Inventor

寺师健太郎

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-12-26

Filing date

2014-12-11

Publication date

2018-09-11

2014-12-11 Application filed by Disco Corp filed Critical Disco Corp

2015-07-01 Publication of CN104742261A publication Critical patent/CN104742261A/zh

2018-09-11 Application granted granted Critical

2018-09-11 Publication of CN104742261B publication Critical patent/CN104742261B/zh

Status Active legal-status Critical Current

2034-12-11 Anticipated expiration legal-status Critical

Links

238000004140 cleaning Methods 0.000 claims abstract description 27
238000003754 machining Methods 0.000 claims description 10
238000009432 framing Methods 0.000 claims description 8
239000002390 adhesive tape Substances 0.000 claims description 2
230000007246 mechanism Effects 0.000 description 45
241000196324 Embryophyta Species 0.000 description 24
230000003028 elevating effect Effects 0.000 description 6
238000010521 absorption reaction Methods 0.000 description 4
238000009434 installation Methods 0.000 description 3
239000004065 semiconductor Substances 0.000 description 3
241000208340 Araliaceae Species 0.000 description 2
235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
235000003140 Panax quinquefolius Nutrition 0.000 description 2
238000010276 construction Methods 0.000 description 2
230000005611 electricity Effects 0.000 description 2
239000012530 fluid Substances 0.000 description 2
235000008434 ginseng Nutrition 0.000 description 2
230000008450 motivation Effects 0.000 description 2
230000033228 biological regulation Effects 0.000 description 1
230000007423 decrease Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
235000013399 edible fruits Nutrition 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
210000004209 hair Anatomy 0.000 description 1
238000000034 method Methods 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
230000011218 segmentation Effects 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Dicing (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Machine Tool Units (AREA)

CN201410766785.3A 2013-12-26 2014-12-11 加工装置 Active CN104742261B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2013-269126		2013-12-26
JP2013269126A JP6218600B2 (ja)	2013-12-26	2013-12-26	加工装置

Publications (2)

Publication Number	Publication Date
CN104742261A CN104742261A (zh)	2015-07-01
CN104742261B true CN104742261B (zh)	2018-09-11

Family

ID=53536606

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201410766785.3A Active CN104742261B (zh)	2013-12-26	2014-12-11	加工装置

Country Status (2)

Country	Link
JP (1)	JP6218600B2 (ja)
CN (1)	CN104742261B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2017180602A (ja) *	2016-03-29	2017-10-05	株式会社ディスコ	移動体送り機構および加工装置
JP6665041B2 (ja) *	2016-06-20	2020-03-13	株式会社ディスコ	切削装置
CN106141908B (zh) *	2016-08-25	2018-01-30	威海市银河光电设备有限公司	汽车玻璃板切割磨边定位装置
JP6909621B2 (ja) *	2017-04-24	2021-07-28	株式会社ディスコ	ウォータージェット加工装置
JP6855130B2 (ja) *	2017-06-16	2021-04-07	株式会社ディスコ	加工装置
JP7023740B2 (ja) *	2018-02-22	2022-02-22	東レエンジニアリング株式会社	実装装置
JP7126906B2 (ja) *	2018-09-06	2022-08-29	キヤノンマシナリー株式会社	搬送装置、搬送方法、ダイボンダ、およびボンディング方法
JP7162551B2 (ja) *	2019-02-18	2022-10-28	株式会社ディスコ	加工装置
JP7440288B2 (ja)	2020-02-07	2024-02-28	株式会社ディスコ	加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6459930A (en) *	1987-08-31	1989-03-07	Nitto Denko Corp	Ultraviolet-ray irradiation device for wafer mounting frame
JP4462717B2 (ja) *	2000-05-22	2010-05-12	株式会社ディスコ	回転ブレードの位置検出装置
JP5373517B2 (ja) *	2009-09-14	2013-12-18	株式会社ディスコ	搬送機構および加工装置
JP5554661B2 (ja) *	2010-08-27	2014-07-23	株式会社ディスコ	ダイシング加工装置
JP2013103280A (ja) *	2011-11-10	2013-05-30	Disco Corp	切削装置
CN103400789B (zh) *	2013-08-01	2018-01-26	上海集成电路研发中心有限公司	设备平台***及其晶圆传输方法

2013
- 2013-12-26 JP JP2013269126A patent/JP6218600B2/ja active Active
2014
- 2014-12-11 CN CN201410766785.3A patent/CN104742261B/zh active Active

Also Published As

Publication number	Publication date
JP6218600B2 (ja)	2017-10-25
JP2015126076A (ja)	2015-07-06
CN104742261A (zh)	2015-07-01

Legal Events

Date	Code	Title
2015-07-01	C06	Publication
2015-07-01	PB01	Publication
2017-01-04	C10	Entry into substantive examination
2017-01-04	SE01	Entry into force of request for substantive examination
2018-09-11	GR01	Patent grant
2018-09-11	GR01	Patent grant

Publication	Publication Date	Title
CN104742261B (zh)	2018-09-11	加工装置
US10170379B2 (en)	2019-01-01	Wafer processing system
KR102405690B1 (ko)	2022-06-03	절삭 장치
CN111604810B (zh)	2020-11-03	一种晶圆传输设备、化学机械平坦化装置及晶圆传输方法
CN107234527B (zh)	2019-03-26	玻璃研磨机
KR102117527B1 (ko)	2020-06-01	유리판 가공 장치
CN102024733B (zh)	2014-08-13	搬送机构和加工装置
CN107030902B (zh)	2020-05-26	切削装置
JP2008183705A (ja)	2008-08-14	ワークピース処理装置
CN219094012U (zh)	2023-05-30	一种自动晶圆隐形切割设备
TW201839834A (zh)	2018-11-01	切割裝置
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WO2012132648A1 (ja)	2012-10-04	ワークの回収装置
CN116940442A (zh)	2023-10-24	加工装置及加工品的制造方法
KR20220129081A (ko)	2022-09-22	가공 장치
CN102931120B (zh)	2017-09-29	工件传输***
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JP2024040887A (ja)	2024-03-26	加工装置
CN108962783A (zh)	2018-12-07	加工装置
JP6448456B2 (ja)	2019-01-09	加工装置
JP2021171881A (ja)	2021-11-01	切削装置及び載置プレート
CN115648035A (zh)	2023-01-31	一种工件表面处理设备