CN102090154A - 各向异性导电薄膜 - Google Patents
各向异性导电薄膜 Download PDFInfo
- Publication number
- CN102090154A CN102090154A CN2009801270289A CN200980127028A CN102090154A CN 102090154 A CN102090154 A CN 102090154A CN 2009801270289 A CN2009801270289 A CN 2009801270289A CN 200980127028 A CN200980127028 A CN 200980127028A CN 102090154 A CN102090154 A CN 102090154A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- conducting film
- half life
- anisotropic
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-181294 | 2008-07-11 | ||
JP2008181294 | 2008-07-11 | ||
PCT/JP2009/057256 WO2010004793A1 (ja) | 2008-07-11 | 2009-04-09 | 異方性導電フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102090154A true CN102090154A (zh) | 2011-06-08 |
CN102090154B CN102090154B (zh) | 2014-11-05 |
Family
ID=41506915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980127028.9A Active CN102090154B (zh) | 2008-07-11 | 2009-04-09 | 各向异性导电薄膜 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8715833B2 (zh) |
JP (1) | JP5549103B2 (zh) |
KR (2) | KR20110036733A (zh) |
CN (1) | CN102090154B (zh) |
HK (1) | HK1154332A1 (zh) |
TW (1) | TWI456018B (zh) |
WO (1) | WO2010004793A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103122221A (zh) * | 2011-11-18 | 2013-05-29 | 第一毛织株式会社 | 具有改善的预粘合加工性的各向异性导电膜和半导体装置 |
CN103173143A (zh) * | 2011-12-23 | 2013-06-26 | 第一毛织株式会社 | 各向异性导电膜和半导体器件 |
CN103579164A (zh) * | 2012-08-09 | 2014-02-12 | 日立化成株式会社 | 连接结构体 |
CN103709955A (zh) * | 2012-10-05 | 2014-04-09 | 迪睿合电子材料有限公司 | 电路连接材料及其制造方法、以及使用其而成的组装体的制造方法 |
CN103871544A (zh) * | 2012-12-11 | 2014-06-18 | 第一毛织株式会社 | 各向异性导电膜、用于该膜的组合物和半导体装置 |
TWI496870B (zh) * | 2013-09-10 | 2015-08-21 | Benq Materials Corp | 一種用於電子元件間電性導通的異方性導電膠 |
CN105594063A (zh) * | 2013-10-15 | 2016-05-18 | 迪睿合株式会社 | 各向异性导电膜 |
CN109334132A (zh) * | 2012-08-24 | 2019-02-15 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制造方法 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5621320B2 (ja) * | 2010-05-19 | 2014-11-12 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
JP2012079934A (ja) * | 2010-10-01 | 2012-04-19 | Sumitomo Electric Ind Ltd | フレキシブルプリント基板 |
JP5565277B2 (ja) * | 2010-11-09 | 2014-08-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
JP5823117B2 (ja) * | 2010-11-16 | 2015-11-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体、及び接合体の製造方法 |
JP5890614B2 (ja) * | 2011-05-27 | 2016-03-22 | デクセリアルズ株式会社 | 接続方法及び接続構造体並びに接続構造体の製造方法 |
JP5960408B2 (ja) * | 2011-10-28 | 2016-08-02 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
US9040837B2 (en) * | 2011-12-14 | 2015-05-26 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP6231257B2 (ja) * | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
JP6231256B2 (ja) * | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 異方性導電接着剤、及び電子部品の接続方法 |
KR101355857B1 (ko) * | 2011-12-16 | 2014-01-27 | 제일모직주식회사 | 이방 전도성 필름용 조성물, 이로부터 제조된 이방 전도성 필름 및 반도체 장치 |
CN103294248B (zh) * | 2012-08-17 | 2016-04-20 | 上海天马微电子有限公司 | 触控液晶显示装置的电连接结构 |
KR102259384B1 (ko) | 2012-08-24 | 2021-06-02 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
KR101583691B1 (ko) * | 2012-10-10 | 2016-01-08 | 제일모직주식회사 | 이방 전도성 접착 조성물 및 이를 이용한 이방 전도성 필름 |
KR101535600B1 (ko) * | 2012-11-06 | 2015-07-09 | 제일모직주식회사 | 이방성 도전 필름 및 반도체 장치 |
JP2014102943A (ja) * | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
JP6231394B2 (ja) * | 2014-02-03 | 2017-11-15 | デクセリアルズ株式会社 | アクリル系接着剤の反応率測定方法、及びアクリル系接着剤 |
JP6437323B2 (ja) * | 2014-02-14 | 2018-12-12 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
KR20160046977A (ko) * | 2014-10-20 | 2016-05-02 | 삼성디스플레이 주식회사 | 이방성 도전입자 |
JP6476747B2 (ja) * | 2014-10-28 | 2019-03-06 | デクセリアルズ株式会社 | 異方性導電フィルム及び接続構造体 |
JP5966069B2 (ja) * | 2015-08-27 | 2016-08-10 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体及び接続方法 |
CN108473633B (zh) | 2016-11-08 | 2020-12-01 | H.B.富乐公司 | 可低温固化的粘合剂组合物和包含其的制品 |
JP6906223B2 (ja) * | 2017-03-23 | 2021-07-21 | ナミックス株式会社 | 導電性樹脂組成物、導電性接着剤、および半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4341673B2 (ja) * | 2000-04-25 | 2009-10-07 | 日立化成工業株式会社 | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
TWI334880B (en) | 2000-12-28 | 2010-12-21 | Hitachi Chemical Co Ltd | Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive |
CA2465664A1 (en) * | 2001-11-01 | 2003-05-08 | Jsp Corporation | Process of producing expanded polypropylene resin beads |
JP2004067908A (ja) * | 2002-08-07 | 2004-03-04 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
JP2005197032A (ja) * | 2004-01-05 | 2005-07-21 | Asahi Kasei Electronics Co Ltd | 異方導電性フィルム |
JP2005320455A (ja) | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置 |
JP2006199825A (ja) | 2005-01-20 | 2006-08-03 | Soken Chem & Eng Co Ltd | 異方導電性接着テープおよび配線基板異方導電接着体 |
CN102277096A (zh) | 2005-03-04 | 2011-12-14 | 索尼化学&信息部件株式会社 | 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 |
JP5085028B2 (ja) | 2005-10-20 | 2012-11-28 | 日東電工株式会社 | 粘着型光学フィルムおよびその製造方法 |
US8247701B2 (en) * | 2006-04-27 | 2012-08-21 | Asahi Kasei Emd Corporation | Electroconductive particle placement sheet and anisotropic electroconductive film |
TW200815560A (en) | 2006-06-16 | 2008-04-01 | Hitachi Chemical Co Ltd | Film-shaped adhesive for circuit connection |
JP4789738B2 (ja) * | 2006-07-28 | 2011-10-12 | 旭化成イーマテリアルズ株式会社 | 異方導電性フィルム |
EP2048209A4 (en) * | 2006-08-04 | 2012-01-18 | Hitachi Chemical Co Ltd | ADHESIVE COMPOSITION AND CONNECTION STRUCTURE FOR CIRCUIT ELEMENT |
WO2008020577A1 (en) * | 2006-08-16 | 2008-02-21 | Sony Chemical & Information Device Corporation | Connecting method |
JP5013067B2 (ja) * | 2007-01-22 | 2012-08-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電フィルム |
JP5565277B2 (ja) * | 2010-11-09 | 2014-08-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
-
2009
- 2009-04-09 WO PCT/JP2009/057256 patent/WO2010004793A1/ja active Application Filing
- 2009-04-09 JP JP2009094618A patent/JP5549103B2/ja active Active
- 2009-04-09 CN CN200980127028.9A patent/CN102090154B/zh active Active
- 2009-04-09 US US13/002,543 patent/US8715833B2/en active Active
- 2009-04-09 KR KR1020117000554A patent/KR20110036733A/ko not_active Application Discontinuation
- 2009-04-09 KR KR1020137024199A patent/KR101615797B1/ko active IP Right Grant
- 2009-04-17 TW TW98112733A patent/TWI456018B/zh active
-
2011
- 2011-08-03 HK HK11108076.7A patent/HK1154332A1/zh unknown
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103122221A (zh) * | 2011-11-18 | 2013-05-29 | 第一毛织株式会社 | 具有改善的预粘合加工性的各向异性导电膜和半导体装置 |
CN103122221B (zh) * | 2011-11-18 | 2015-11-11 | 第一毛织株式会社 | 具有改善的预粘合加工性的各向异性导电膜和半导体装置 |
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CN103173143B (zh) * | 2011-12-23 | 2015-05-20 | 第一毛织株式会社 | 各向异性导电膜和半导体器件 |
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CN109334132B (zh) * | 2012-08-24 | 2022-02-25 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制造方法 |
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CN103871544A (zh) * | 2012-12-11 | 2014-06-18 | 第一毛织株式会社 | 各向异性导电膜、用于该膜的组合物和半导体装置 |
TWI496870B (zh) * | 2013-09-10 | 2015-08-21 | Benq Materials Corp | 一種用於電子元件間電性導通的異方性導電膠 |
CN105594063A (zh) * | 2013-10-15 | 2016-05-18 | 迪睿合株式会社 | 各向异性导电膜 |
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KR101615797B1 (ko) | 2016-04-26 |
JP5549103B2 (ja) | 2014-07-16 |
KR20110036733A (ko) | 2011-04-08 |
CN102090154B (zh) | 2014-11-05 |
WO2010004793A1 (ja) | 2010-01-14 |
HK1154332A1 (zh) | 2012-04-13 |
KR20130106451A (ko) | 2013-09-27 |
US20110110066A1 (en) | 2011-05-12 |
TW201002799A (en) | 2010-01-16 |
TWI456018B (zh) | 2014-10-11 |
JP2010037539A (ja) | 2010-02-18 |
US8715833B2 (en) | 2014-05-06 |
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