KR20160046977A - 이방성 도전입자 - Google Patents

이방성 도전입자

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Publication number
KR20160046977A
KR20160046977A KR1020140141883A KR20140141883A KR20160046977A KR 20160046977 A KR20160046977 A KR 20160046977A KR 1020140141883 A KR1020140141883 A KR 1020140141883A KR 20140141883 A KR20140141883 A KR 20140141883A KR 20160046977 A KR20160046977 A KR 20160046977A
Authority
KR
South Korea
Prior art keywords
anisotropic conductive
layer
insulating layer
resin
insulating
Prior art date
Application number
KR1020140141883A
Other languages
English (en)
Inventor
장세인
Original Assignee
삼성디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020140141883A priority Critical patent/KR20160046977A/ko
Priority to US14/733,281 priority patent/US9607727B2/en
Publication of KR20160046977A publication Critical patent/KR20160046977A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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Abstract

본 발명은 우수한 도전성을 가지며 절연신뢰성이 향상된 이방성 도전입자 및 이를 포함하는 이방성 도전재료를 제공한다. 본 발명의 이방성 도전입자는 제1절연층; 상기 제1절연층상에 배치된 제1도전층; 및 상기 제1도전층상에 배치된 제2절연층을 포함한다.

Description

이방성 도전입자{ANISOTROPIC ELECTROCONDUCTIVE PARTICLES}
본 발명은 이방성 도전입자 및 이를 포함하는 이방성 도전재료에 관한 것으로서, 더욱 상세하게는 우수한 도전성을 가지며 절연신뢰성이 향상된 이방성 도전입자 및 이를 포함하는 이방성 도전재료에 관한 것이다.
일반적으로,　평판 디스플레이는 액정표시장치(Liquid Crystal Display, LCD), 플라즈마 디스플레이 패널(Plasma Display Panel, PDP), 유기 발광 다이오드(Organic Light Emitting Device, OLED) 등으로 개발되고 있으며 이러한 제품은 화상 표시 패널과 구동칩 및 회로기판을 포함하고 있다. 이러한 제품에서 구동칩을 실장하여 화상 표시 패널의 전극과 전기적으로 접속하기 위해 이방성 도전필름이 사용되고 있다.
보다 구체적으로 설명하면, 장치에 신호를 전달하기 위하여 구동칩을 실장하는 방식은 칩 온 글래스(Chip On Glass, COG) 방식과 테이프 케리어 패키지(Tape Carrier Package, TCP)를 통해 실장하는 테이프 오토메이티드 본딩(Tape Automated Bonding)과 같은 방식으로, 패키지에서 요구되는 고집적화, 경량화에 대응하여 발전하고 있다. 또한 패키지에서 요구되는 전극 피치(pitch)의 미세화로 인해 종래에 사용하던 솔더링(soldering)을 이용한 방식은 더 이상 대응이 어려운 상태이며, 솔더링(Soldering)을 대체하는 수단으로 이방성 도전필름이 주로 사용되고 있다.
이러한 이방성 도전필름은 도전성 입자가 포함된 절연성 수지의 형태로 제조되고 있으며, 가열 공정과 가압 공정으로 패키지에 실장한다. 그 특성으로는 종방향으로는 전극간에 전기적인 접속을 실행하고, 횡방향으로는 절연성을 유지하는 것이다. 또한 이러한 이방성 도전재료는 회로기판의 인접 회로 간에는 절연층을 형성하여 전기적으로 절연시키고 접속을 요구하는 전극 간에는 도전성 입자가 위치하여 접속을 실행한다. 이러한 과정에서 절연층 내부에 다량의 도전성 입자가 함유되어 있어 도전성 입자가 브리지(Bridge)를 이루어 인접 회로간의 단락(Short)을 발생시키는 문제가 있다.
이에 본 발명은 패키지와 이방성 도전재료의 열압착 공정간에 발생할 수 있는 인접 회로간의 단락 발생을 방지하고 연결을 원하는 전극간에는 전기적인 접속을 원활하게 할 수 있는 이방성 도전입자를 제공하는 것을 목적으로 한다.
본 발명의 목적은 또한, 상기 본 발명의 이방성 도전입자를 포함하는 이방성 도전재료를 제공하는 데 있다.
본 발명의 일례는, 제1절연층, 상기 제1절연층상에 배치된 제1도전층, 및 상기 제1도전층상에 배치된 제2절연층을 포함하는 이방성 도전입자를 제공한다.
본 발명의 일례에 따르면, 상기 도전입자는 육면체, 다면체 및 구체 중 하나이다.
본 발명의 일례에 따르면, 상기 제2절연층상에 배치된 제2도전층, 및 상기 제2도전층상에 배치된 제3절연층을 더 포함한다.
본 발명의 일례에 따르면, 상기 절연층과 도전층은 교번하여 배치되며, 상기 절연층은 최상위층 및 최하위층에 배치된다.
본 발명의 일례에 따르면, 상기 절연층 및 도전층은 10 ㎛이하의 폭을 갖는다.
본 발명의 일례에 따르면, 상기 도전층은 Sn-Ag계 합금, Sn-Cu계 합금, Sn-Bi계 합금 또는 Sn-Zn계 합금으로 이루어진 군에서 선택되는 적어도 하나의 합금 재료를 포함한다.
본 발명의 일례에 따르면, 상기 Sn-Ag계 합금, Sn-Cu계 합금, Sn-Bi계 합금 및 Sn-Zn계 합금은 각각 Sn과 Ag, Sn과 Cu, Sn과 Bi, Sn과 Zn 외에 Ni, Cr, Fe, Co, Ge, P 및 Ga로 이루어진 군에서 선택되는 금속 재료를 더 포함한다.
본 발명의 일례에 따르면, 상기 절연층은 폴리에틸렌 및 그 공중합체, 폴리스티렌 및 그 공중합체, 폴리메틸메타크릴레이트 및 그 공중합체, 폴리비닐클로라이드 및 그 공중합체, 폴리카보네이트 및 그 공중합체, 폴리프로필렌 및 그 공중합체, 아크릴산에스테르계 고무, 폴리비닐아세탈, 폴리비닐부티랄, 아크릴로니트릴-부타디엔 공중합체, 페녹시 수지, 열가소성 에폭시 수지 및 폴리우레탄으로 이루어진 군에서 선택되는 적어도 하나의 절연성 수지를 포함한다.
본 발명의 일례는, 절연성 접착성분; 및 상기 절연성 접착성분에 분산되는, 본 발명의 일례에 따른 이방성 도전입자;를 포함하는 이방성 도전재료를 제공한다.
본 발명의 일례에 따르면, 상기 절연성 접착성분은 상기 절연성 접착성분은 아세트산비닐계 수지, 염화비닐계 수지, 아크릴계 수지, 스티렌계 수지, 폴리올레핀계 수지, 에틸렌-아세트산 비닐 공중합체, 폴리아미드계 수지, 에폭시계 수지, 우레탄계 수지, 아크릴계 수지, 폴리이미드계 수지, 불포화 폴리에스테르계 수지, 스티렌-부타디엔-스티렌 블록 공중합체, 스티렌-이소프렌-스티렌 블록 공중합체, 스티렌-부타디엔 공중합 고무, 클로로프렌 고무 및 아크릴로니트릴-스티렌 블록 공중합 고무로 이루어진 군에서 선택된다.
본 발명의 일례에 따르면, 이방성 도전재료는 이방성 도전필름, 이방성 도전시트, 이방성 도전 점접착제, 이방성 도전 잉크 및 이방성 도전 페이스트로 이루어진 군에서 선택된다.
본 발명에 따르면, 패키지와 이방성 도전 필름의 열압착 공정간에 발생할 수 있는 인접 회로간의 단락 발생을 효과적으로 방지하고, 연결을 원하는 전극간에는 전기적인 접속을 원활하게 할 수 있다.
다만, 본 발명의 효과는 이에 한정되는 것이 아니며, 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위에서 다양하게 확장될 수 있을 것이다.
도 1은 본 발명의 제1실시예에 따른 이방성 도전입자를 도시한 사시도이다.
도 2는 도 1의 절연층과 도전층이 교번하여 배치된 판상구조를 도시한 사시도이다.
도 3은 도 1의 이방성 도전입자의 일면을 도시한 단면도이다.
도 4는 본 발명의 제2실시예에 따른 이방성 도전입자의 일면을 도시한 단면도이다.
도 5는 본 발명에 따른 이방성 도전입자의 일면을 도시한 단면도이다.
도 6은 본 발명에 따른 이방성 도전입자를 포함한 이방성 도전재료를 도시한 단면도이다.
도 7은 도 6의 이방성 도전재료에 의하여 전기적으로 접속된 회로 접속 구조체를 도시한 개략도이다.
본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 것이며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 따라서, 몇몇 실시예에서, 잘 알려진 공정 단계들, 잘 알려진 소자 구조 및 잘 알려진 기술들은 본 발명이 모호하게 해석되는 것을 피하기 위하여 구체적으로 설명되지 않는다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭한다.
공간적으로 상대적인 용어인 "아래(below)", "아래(beneath)", "하부(lower)", "위(above)", "상부(upper)" 등은 도면에 도시되어 있는 바와 같이 하나의 소자 또는 구성 요소들과 다른 소자 또는 구성 요소들과의 상관관계를 용이하게 기술하기 위해 사용될 수 있다. 공간적으로 상대적인 용어는 도면에 도시되어 있는 방향에 더하여 사용시 또는 동작시 소자의 서로 다른 방향을 포함하는 용어로 이해되어야 한다. 예를 들면, 도면에 도시되어 있는 소자를 뒤집을 경우, 다른 소자의 "아래(below)"또는 "아래(beneath)"로 기술된 소자는 다른 소자의 "위(above)"에 놓여질 수 있다. 따라서, 예시적인 용어인 "아래"는 아래와 위의 방향을 모두 포함할 수 있다. 소자는 다른 방향으로도 배향될 수 있고, 이에 따라 공간적으로 상대적인 용어들은 배향에 따라 해석될 수 있다.
본 명세서에서 사용된 용어는 실시예들을 설명하기 위한 것이며 본 발명을 제한하고자 하는 것은 아니다. 본 명세서에서, 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함한다. 명세서에서 사용되는 "포함한다(comprises)" 및/또는 "포함하는(comprising)"은 언급된 구성요소, 단계, 동작 및/또는 소자는 하나 이상의 다른 구성요소, 단계, 동작 및/또는 소자의 존재 또는 추가를 배제하지 않는다.
다른 정의가 없다면, 본 명세서에서 사용되는 모든 용어(기술 및 과학적 용어를 포함)는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 공통적으로 이해될 수 있는 의미로 사용될 수 있을 것이다. 또 일반적으로 사용되는 사전에 정의되어 있는 용어들은 명백하게 특별히 정의되어 있지 않은 한 이상적으로 또는 과도하게 해석되지 않는다.
본 발명은 제1절연층; 상기 제1절연층상에 배치된 제1도전층; 및 상기 제1도전층상에 배치된 제2절연층을 포함하는 이방성 도전입자를 제공한다.
본 발명은 또한, 절연성 접착성분; 및 상기 절연성 접착성분에 분산되는 상기 본 발명에 따른 이방성 도전입자;를 포함하는 이방성 도전재료를 제공한다.
이하, 도 1 내지 도 3을 참조하여 본 발명의 제1실시예에 따른 이방성 도전입자에 대하여 상세히 설명한다.
도 1은 본 발명의 제1실시예에 따른 이방성 도전입자(510)의 구조를 도시한 사시도이며, 도 2는 절연층과 도전층이 교번하여 배치된 판상구조를 도시한 사시도이다. 또한, 도 3은 설명의 편의를 위해 도 1의 이방성 도전입자(510)의 일면을 도시한 단면도이다.
도 1 및 도 3에 도시된 바와 같이, 본 발명의 제1실시예에 따른 이방성 도전입자(510)는 제1절연층(511), 제1절연층(511)상에 배치된 제1도전층(512), 및 상기 제1도전층(512)상에 배치된 제2절연층(513)을 포함한다.
이방성 도전입자(510)은, 예를 들면 육면체, 다면체 및 구체 등 다양한 형상일 수 있으나, 바람직하게는 육면체 형상일 수 있다.
또한, 이방성 도전입자(510)는 전기적인 접속이 필요한 패키지의 구조에 따라서 수 마이크로미터(㎛)부터 수십 마이크로미터(㎛)의 폭을 가질 수 있다.
본 발명의 제1실시예에 따른 이방성 도전입자(510)는, 1 내지 10 ㎛의 치수, 즉 이방성 도전입자(510)의 형상에 따라 한 변의 길이, 직경 또는 장경을 갖는 것이 바람직하다. 이방성 도전입자(510)가 10 ㎛보다 큰 치수를 갖는 경우, 전자 부품 사이에 개재된 이방성 도전재료 내에 세밀한 도통로가 형성될 수 없게 되고, 이방성 도전 입자(510)가 1 ㎛보다 작은 치수를 갖는 경우에, 도통 신뢰성을 확보하기 위하여 이방성 도전재료는 다수의 이방성 도전 입자를 포함해야 한다.
이방성 도전입자(510)는 절연층(511, 513), 절연층(511, 513)과 교번하여 배치되는 도전층(512)을 포함한다.
절연층과 도전층의 개수는 제한되지 않으나, 도전 입자의 편재에 의하여 전자 회로 부품 사이의 단락 현상을 방지하기 위하여 이방성 도전입자(510)의 최상위층 및 최하위층은 절연층이 배치되어야 한다.
도 2를 참조하면, 이방성 도전입자(510)는, 제1절연층(511), 제1도전층(512) 및 제2절연층(513)을 순서대로 적층한 후, 절단선(C)을 따라 잘라 제조할 수 있다.
구체적으로, 절연층(511, 513)과 도전층(512)을 교번하여 적층하고, 최하위층으로 제1절연층(511) 최상위층으로 제2절연층(513)을 배치하여 판상 구조를 형성한다. 그 다음 절연층 및 도전층이 10 ㎛ 이하의 폭을 갖도록 절단선(C)을 따라 잘라 이방성 도전입자(510)를 형성한다.
도 1 내지 도 2에 도시한 바와 같이, 상기 이방성 도전입자(510)의 각 변은 자연스러운 곡면을 가지는 것이 바람직하나, 이에 한정되는 것은 아니다.
상기 절연층들(511, 513)은 폴리에틸렌 및 그 공중합체, 폴리스트렌 및 그 공중합체, 폴리메틸메타크릴레이트 및 그 공중합체, 폴리비닐클로라이드 및 그 공중합체, 폴리카보네이트 및 그 공중합체, 폴리프로필렌 및 그 공중합체, 아크릴산에스테르계 고무, 폴리비닐아세탈, 폴리비닐부티랄, 아크릴로니트릴-부타디엔 공중합체, 페녹시 수지, 열가소성 에폭시 수지 및 폴리우레탄으로 이루어진 군에서 선택되는 적어도 하나의 절연성 수지를 포함한다.
상기 도전층(512) 형성에 사용되는 재료로는 Sn-Ag계 합금, Sn-Cu계 합금, Sn-Bi계 합금 또는 Sn-Zn계 합금으로 이루어진 군에서 선택되는 적어도 하나의 합금이 바람직하며, 이들 각각의 합금은 물성 향상을 위하여 Sn과 Ag, Sn과 Cu, Sn과 Bi, Sn과 Zn 외에 Ni, Cr, Fe, Co, Ge, P 및 Ga과 같은 금속 재료를 더 포함할 수 있다.
도 4는 본 발명의 제2실시예에 따른 이방성 도전입자(520)의 일면을 도시한 단면도이다.
도 4에 도시된 바와 같이, 본 발명의 제2실시예에 따른 이방성 도전입자(520)는 제1절연층(521), 제1절연층(521)상에 배치된 제1도전층(522), 상기 제1도전층(522)상에 배치된 제2절연층(523), 상기 제2절연층(523)상에 배치된 제2도전층(524), 및 상기 제2도전층(524)상에 배치된 제3절연층(525)을 포함한다.
본 실시예에 따른 이방성 도전입자(520)는, 제1실시예에 따른 이방성 도전입자(510)와 비교할 때, 제2도전층(524) 및 제3절연층(525)을 더 포함한다. 본 실시예에 따른 이방성 도전입자(520)의 상기 절연층(521, 523, 525) 및 도전층(522, 524)은 상술한 것과 동일한 재료로 이루어질 수 있으며, 도전입자(520)의 편재에 의한 단락 방지를 위해 최상위층 및 최하위층에 절연층이 배치된다.
도 5는 본 발명에 따른 이방성 도전입자(500)의 일면을 도시한 단면도이다.
도 5에 도시한 바와 같이, 본 발명의 이방성 도전입자(500)는 절연층(501, 503)과 도전층(502)이 여러 층 반복적으로 교번하여 배치될 수 있다. 즉, 교번하여 배치되는 절연층과 도전층의 개수는 그 용도에 따라 결정될 수 있으며 특별히 제한되지 않는다. 다만, 상술한 바와 같이, 도전 입자의 편재에 의한 전자 회로 부품 사이의 단락을 방지하기 위하여 최상위층 및 최하위층에 절연층이 배치된다.
본 발명에 따른 이방성 도전입자(500)에 있어서, 상기 절연층(501, 503) 및 도전층(502)은 상술한 것과 동일한 재료로 이루어질 수 있다.
본 발명은 또한, 앞서 설명한 바와 같은 본 발명의 이방성 도전입자들이 절연성 접착성분에 분산되어 형성된 이방성 도전재료를 제공한다.
도 6은 본 발명에 따른 이방성 도전입자(500)를 포함한 이방성 도전재료(300)를 도시한 단면도이다.
도 6에서 보는 바와 같이, 이방성 도전재료(300)는 절연성 접착성분(400); 및 상기 절연성 접착성분(400)에 분산되는 이방성 도전입자(500)를 포함한다.
상기 절연성 접착성분(400)은 아세트산비닐계 수지, 염화비닐계 수지, 아크릴계 수지, 스티렌계 수지, 폴리올레핀계 수지, 에틸렌-아세트산 비닐 공중합체, 폴리아미드계 수지, 에폭시계 수지, 우레탄계 수지, 아크릴계 수지, 폴리이미드계 수지, 불포화 폴리에스테르계 수지, 스티렌-부타디엔-스티렌 블록 공중합체, 스티렌-이소프렌-스티렌 블록 공중합체, 스티렌-부타디엔 공중합 고무, 클로로프렌 고무 및 아크릴로니트릴-스티렌 블록 공중합 고무로 이루어진 군에서 선택된다.
상기 이방성 도전재료(300)의 태양은 특별히 제한되지 않으며, 대표적 태양으로는 이방성 도전필름, 이방성 도전시트, 이방성 도전 점접착제, 이방성 도전 잉크, 이방성 도전 페이스트가 있다.
도 7은 도 6의 이방성 도전재료에 의하여 전기적으로 접속된 회로 접속 구조체를 도시한 개략도이다.
이방성 도전재료(300)를 이용하여 미세회로를 전기적으로 접속시키는 방법에 대해 살펴보면, 먼저 구동칩(200)의 하면 및 표시패널(100)의 상면에 각각 서로 대향되도록 구비된 범프(bump; 220)와 전극(120) 사이에, 절연성 접착성분(400)과 그 절연성 접착성분(400)에 분산된 다수의 이방성 도전입자(500)로 이루어진 이방성 도전재료(300)를 개재시킨다. 그런 다음, 소정의 온도와 압력으로 열압착하면 도 7에 도시된 바와 같이 범프(220)와 전극(120) 사이에 개재된 이방성 도전입자(500)가 범프(220)와 전극(120)을 전기적으로 접속시키게 된다.
구체적으로, 대향되는 범프(220)와 전극(120)은 이방성 도전입자(500)의 도전층을 통해 전기적으로 접속되는 한편, 이 접속 과정에서 인접 회로 간, 예컨대 범프(220)-배선(140), 범프(220)-전극(120)-배선(140), 및 범프(220)-범프(220) 사이에서 발생하던 단락은 이방성 도전입자(500)의 절연층에 의해 방지될 수 있다.
이상에서 설명한 바와 같은 본 발명에 따르면, 본 발명은 미세회로를 전기적으로 접속시키는 과정에서 발생할 수 있는 인접 회로 간의 단락 발생을 효과적으로 방지할 뿐 아니라 연결을 원하는 전극간에는 전기적인 접속을 원활하게 하는 이방성 도전입자 및 이를 포함하는 이방성 도전재료를 제공할 수 있게 된다.
본 명세서에서 설명한 이방성 도전입자 및 이를 포함하는 이방성 도전재료의 실시예는 예시적인 것에 불과하며, 본 발명의 기술적 사상은 이에 한정하거나 제한되지 않고 본 발명 기술분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등예를 포함할 수 있다.
100: 표시패널
120: 전극
140: 배선
200: 구동칩
300: 이방성 도전재료
400: 절연성 접착성분
500, 510, 520: 이방성 도전입자
501, 503, 511, 513, 521, 523, 525: 절연층
502, 512, 522, 524: 도전층

Claims (11)

  1. 제1절연층;
    상기 제1절연층상에 배치된 제1도전층; 및
    상기 제1도전층상에 배치된 제2절연층;을 포함하는 이방성 도전입자.
  2. 제1항에 있어서, 상기 도전입자는 육면체, 다면체 및 구체 중 하나인 이방성 도전입자.
  3. 제1항에 있어서,
    상기 제2절연층상에 배치된 제2도전층; 및
    상기 제2도전층상에 배치된 제3절연층;을 더 포함하는 이방성 도전입자.
  4. 제1항에 있어서, 상기 절연층과 도전층은 교번하여 배치되며, 상기 절연층은 최상위층 및 최하위층에 배치된 이방성 도전입자.
  5. 제1항에 있어서, 상기 절연층 및 도전층은 10 ㎛이하의 폭을 갖는 이방성 도전입자.
  6. 제1항에 있어서, 상기 도전층은 Sn-Ag계 합금, Sn-Cu계 합금, Sn-Bi계 합금 또는 Sn-Zn계 합금으로 이루어진 군에서 선택되는 합금 재료를 포함하는 이방성 도전입자.
  7. 제1항에 있어서, 상기 Sn-Ag계 합금, Sn-Cu계 합금, Sn-Bi계 합금 및 Sn-Zn계 합금은 각각 Sn과 Ag, Sn과 Cu, Sn과 Bi, Sn과 Zn 외에 Ni, Cr, Fe, Co, Ge, P 및 Ga로 이루어진 군에서 선택되는 금속 재료를 더 포함하는 이방성 도전입자.
  8. 제1항에 있어서, 상기 절연층은 폴리에틸렌 및 그 공중합체, 폴리스티렌 및 그 공중합체, 폴리메틸메타크릴레이트 및 그 공중합체, 폴리비닐클로라이드 및 그 공중합체, 폴리카보네이트 및 그 공중합체, 폴리프로필렌 및 그 공중합체, 아크릴산에스테르계 고무, 폴리비닐아세탈, 폴리비닐부티랄, 아크릴로니트릴-부타디엔 공중합체, 페녹시 수지, 열가소성 에폭시 수지 및 폴리우레탄으로 이루어진 군에서 선택되는 절연성 수지를 포함하는 이방성 도전입자.
  9. 절연성 접착성분; 및
    상기 절연성 접착성분에 분산되는 제1항 내지 제7항 중 어느 한 항에 따른 이방성 도전입자;를 포함하는 이방성 도전재료.
  10. 제9항에 있어서, 상기 절연성 접착성분은 아세트산비닐계 수지, 염화비닐계 수지, 아크릴계 수지, 스티렌계 수지, 폴리올레핀계 수지, 에틸렌-아세트산 비닐 공중합체, 폴리아미드계 수지, 에폭시계 수지, 우레탄계 수지, 아크릴계 수지, 폴리이미드계 수지, 불포화 폴리에스테르계 수지, 스티렌-부타디엔-스티렌 블록 공중합체, 스티렌-이소프렌-스티렌 블록 공중합체, 스티렌-부타디엔 공중합 고무, 클로로프렌 고무 및 아크릴로니트릴-스티렌 블록 공중합 고무로 이루어진 군에서 선택되는 이방성 도전재료.
  11. 제9항에 있어서, 이방성 도전필름, 이방성 도전시트, 이방성 도전 점접착제, 이방성 도전 잉크 및 이방성 도전 페이스트로 이루어진 군에서 선택되는 이방성 도전재료.
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