200815560 九、發明說明 【發明所屬之技術領域】200815560 IX. Description of the invention [Technical field to which the invention pertains]
本發明係有關連接電路用薄膜狀黏著劑者；詳細而言 係有關，主要爲將液晶面板之電極與FPC (撓性印刷配線 板）電極、F P C電極與P C B (印刷配線板）電極、及IC * 晶片等電子零件之電極與液晶面板電極或PCB電極電性連 接所使用的連接電路用薄膜狀黏著劑者。 【先前技術】 液晶面板之電極與FPC電極、FPC電極與PCB電極 、1C晶片等電子零件的電極與液晶面板電極或PCB電極 以電性連接之際，使用將導電粒子分散於絕緣性黏著劑樹 脂中之連接電路用薄膜狀黏著劑。具體而言，係在相對峙 之電路電極間配置連接電路用薄膜狀黏著劑，藉由將相對 峙之電路電極加熱、加壓，使加壓方向之電極間實施電性 • 連接。連接電路用薄膜狀黏著劑，有例如以特開平3 -16147號公報所揭示之環氧樹脂爲基質的連接電路用薄膜 Λ 狀黏著劑（例如，參照專利文獻1 )。 但是，以上述之連接電路用薄膜狀黏著劑所連接的連 ν 接體，在高濕環境下通電時，在電性電路或電極產生稱爲 移動之電析，有損於連接信賴性。此移動，在黏著劑中之 雜質或構成電極之金屬施加電壓時，產生離子化。 減低黏著劑中之離子濃度的方法，目前亦被檢討；例 如有在連接電路用薄膜狀黏著劑中含有銻•鉍系氧化物、 -5- 200815560 或鎂•銀系氧化物等離子捕集劑的技術（例如參照專利文 獻2) 〇 專利文獻1 :特開平3 -1 6 1 47號公報 專利文獻2 :特開平9- 1 99207號公報 β 【發明內容】 〔發明所欲解決之課題〕 鲁 不過，該專利文獻2記載之技術，有下述之問題，於 電路的連接信賴性之點，並不充分。即，上述之技術，在 離子捕集劑之粒子徑比導電粒子徑大時，不能充分獲得介 著導電粒子之電性連接；另一方面，離子捕集劑之粒子徑 比導電性粒子徑小時，捕集劑滲入導電粒子與電極之間， 有妨礙電性連接的問題。因此，上述以往技術中，確保相 對峙之電路電極間的連接信賴性，充分提升耐移動性，相 當困難。 ® 本發明鑑於上述以往技術所具有之課題，以提供耐移 動性優越、能提升在高濕環境下之電路的連接信賴性之連 ^ 接電路用薄膜狀黏著劑爲目的。 〔課題之解決手段〕 本發明的工作同仁，爲達成上述目的，經深入探討不 斷硏究之結果，發現藉由硬化後對水的接觸角顯示特定之 値以上的薄膜狀黏著劑所連接之電路連接體，在所定之耐 濕通電試驗中，移動之產生量極少，完成本發明。 -6 - 200815560 即，本發明提供一種連接電路用薄膜狀黏著劑，其係 介於互相對峙的電路電極之間，，藉由加熱、加壓於互相對 峙之電路電極，使加壓方向之電極間進行電性的連接之連 接電路用薄膜狀黏著劑；其特徵爲該黏著劑於硬化後，對 水之接觸角爲90°以上。 於此，所謂「黏著劑之硬化後」，係指以使用DSC ( 差示掃描熱量計）所測定之硬化前的黏著劑之發熱量爲 Q〇 ( J/g)、使用DSC所測定之硬化後的黏著劑之發熱量 爲Q1 ( J/g)時，以下述式（1)定義之硬化率C爲80%以 上的狀態之意。 C(%)=(Q0-Ql)/Q0xl00 …⑴ 又，所謂「對水之接觸角」，係指依Jis R3 257法， 在溫度25±5°C，濕度50±10%的條件下所測定之値的意思 〇 依本發明之連接電路用薄膜狀黏著劑，連接之電路連 接體即使在高濕環境下通電時，亦可充分抑制移動的產生 之故，能提升在高濕環境下之電路的連接信賴性。 不過，隨電路圖型之微細化，電路電極間之空間預測 今後將更小；依本發明之連接電路用薄膜狀黏著劑，耐移 動性優越之故，即使連接具有微細圖型之電路電極時，能 有效防止產生移動之起因的短路。 本發明之連接電路用薄膜狀黏著劑，以含有苯氧樹脂 、環氧樹脂、橡膠成份及潛在性硬化劑爲佳。此情況，黏 著劑之移動性更爲提升，能以更高水準達成電路之連接信 200815560 賴性。 以含上述成份之黏著劑’達成該效果之理由雖不明確 ，本發明的工作同仁有如下之推測。即，含苯氧樹脂、環 氧樹脂及橡膠成份以及潛在性硬化劑、同時在硬化後對水 之接觸角爲90。以上者’藉由含有苯氧樹脂提升黏著劑之 耐熱性、藉由含有橡膠成份提升對連接體之密著力•防濕 性、藉由含有環氧樹脂促進潛在性硬化劑之硬化等作用’ 以高水準發揮良好之平衡。其結果’可高度抑制分份對電 路電極之滲入。又，藉由含有環氧樹脂及潛在性硬化劑之 組合，能使黏著劑之儲存穩定性與硬化性兩立’同時有助 於處理性•操作性之提升。 該苯氧樹脂，從更提升耐移動性之觀點而言’以具有 芴環者爲佳。 該苯氧樹脂爲具有芴環者，能更提升耐移動性的理由 ，本發明的工作同仁有如下之推·。即1，在苯氧樹脂、環 氧樹脂及橡膠成份以及潛在性硬化劑之組合中’將芴環導 入苯氧樹脂，提升黏著劑之耐熱性，於高溫條件下在連接 電路部不產生鬆驰之故，更可充分防止水份的滲入’進而 提升耐移動性。 又，上述環氧樹脂，從更提升耐移動性之觀點而言， 以具有萘骨架者爲佳。還有，藉由該環氧樹脂具有萘骨架 ，更提升耐移動性的理由，本發明的工作同仁有如下之推 測。即，在苯氧樹脂、環氧樹脂及橡膠成份以及潛在性硬 化劑之組合中，將萘骨架導入環氧樹脂，藉由潛在性硬化 -8- 200815560 劑促進硬化，黏著劑的硬化更爲堅固之故’可充分防止水 份之滲入，更提升耐移動性。 又，該橡膠成份之分子量，以70萬以上爲佳。此情 況，黏著劑之密著力或防濕性更爲提高，可硬實獲得優越 之耐移動性。 又，本發明提供一種連接電路用薄膜狀黏著劑，其係 介於互相對峙的電路電極之間，藉由加熱、加壓於互相對 峙之電路電極，使加壓方向之電極間進行電性的連接之連 接電路用薄膜狀黏著劑；其特徵爲含有具含2個以上苯環 之芳香族環狀構造的苯氧樹脂、環氧樹脂、橡膠成份及潛 在性硬化劑。 依該連接電路用薄膜狀黏著劑，即使將連接之電路連 接體在高濕環境下通電時，亦可充分抑制移動的產生之故 ，能提升在高濕環境下之電路的連接信賴性。又，依該連 接電路用薄膜狀黏著劑，耐移動性優越之故，即使連接具 有微細圖型之電路電極時，能有效防止產生移動之起因的 短路。 該連接電路用薄膜狀黏著劑中，以含有2個以上苯環 之芳香族環狀構造係源自多環芳香族化合物者爲佳。 又，該多環芳香族化合物以二羥基化合物爲佳。 進行，該二羥基化合物，以具有萘、苊、芴、二苯并 呋喃、蒽及菲中之任一構造的化合物爲佳。 又，該連接電路用薄膜狀黏著劑中，該多環芳香族化 合物以具有芴環構造之二羥基化合物爲佳。 -9- 200815560 進而，該多環芳香族化合物以具有芴環構造之二苯酚 化合物爲佳。 〔發明之功效〕 依本發明可提供，耐移動性優越、在高濕環境下可提 升電路之連接信賴性的連接電路用薄膜狀黏著劑。 9 〔發明之實施形態〕 依情況而異，參照圖面，就本發明之適合的實施形態 詳細說明如下。還有，圖面中，相同或相當部份使用同一 符號，省略重複說明。 本發明之第1連接電路用薄膜狀黏著劑，其係介於互 相對峙的電路電極之間，藉由加熱·加壓於互相對峙之電 路電極，使加壓方向之電極間進行電性的連接之連接電路 用薄膜狀黏著劑；其特徵爲該黏著劑於硬化後，對水之接 ® 觸用爲90。以上。 本發明之連接電路用薄膜狀黏著劑，以含有苯氧樹脂 . 、環氧樹脂、橡膠成份及潛在性硬化劑者爲佳。 . 本實施形態中所使用之苯氧樹脂有，例如藉由2官能 苯酚類與環氧鹵丙烷反應至高分子量' 或藉由2官能環氧 樹脂與2官能苯酚類聚加成所得之樹脂。更具體而言’苯 氧樹脂可藉由例如2官能苯酚類與環氧鹵丙烷，在鹼金屬 氫氧化物等觸媒之存在下，於非反應性溶劑中40〜12〇°C的 溫度下反應而得。又’苯氧樹脂’可藉由2官能環氧樹脂 -10- 200815560 與2官能苯酚類，在鹼金屬化合物、有機磷系化合物、環 狀胺系化合物等觸媒之存在下，於沸點爲120 °C以上之醯 胺系、醚系、酮系、內酯系、醇系等有機溶劑中，在反應 固形份爲50重量份以下的條件，加熱至50〜200°C進行聚 加成反應而得。苯氧樹脂可單獨1種或2種以上組合使用 〇 2官能環氧樹脂有，雙酚A型環氧樹脂、雙酚F型環 氧樹脂、雙酚AD型環氧樹脂、雙酚S型環氧樹脂等。 2官能苯酚類，係具有2個酚性羥基者，如此之2官 能苯酚類有，例如雙酚A、雙酚F、雙酚AD、雙酚S等雙 酌類。 又，苯氧樹脂，以其分子內含有具2個以上苯環之芳 香族環狀構造爲佳，含2個以上苯環之芳香族環狀構造， 有源自多環芳香族化合物之分子構造等。多環芳香族化合 物有，例如具有萘、苊、芴、二苯并呋喃、蒽、菲等構造 之二羥基化合物等。此等多環芳香族化合物之中，以具有 芴環構造之二羥基化合物爲佳。進行多環芳香族化合物以 具有芴環構造之二苯酚化合物爲佳，以4,4，-(9-亞芴基 )-二苯酚更佳。 又，苯氧樹脂，可使用藉由2官能環氧樹脂、與具有 聯苯骨架之二羥基化合物進行聚加成所得者。 苯氧樹脂在黏著劑中之配合量，相對於黏著劑全量以 10〜4 0質量％爲佳，以1〇〜30質量％更佳。苯氧樹脂之配合 量未達10質量％時，難以獲得提升耐移動性之效果；超過 -11 - 200815560 4 0質量％時，黏著劑之流動性降低，難以獲得電極間之導 通。 本實施形態中所使用之環氧樹脂有，例如環氧氯丙烷 與雙酚A、或F、AD等所衍生之雙酚型環氧樹脂、聚矽氧 改性環氧樹脂，主骨架中具有萘環之萘型環氧樹脂等。此 等之中以萘型環氧樹脂爲佳。此等環氧樹脂可1種單獨或 2種以上組合使用。此等環氧樹脂，以使用雜質離子（+ 、Cl_等）、或水解性氯等減低至3 0 0ppm以下之高純度品 ，可抑制移動之故，較適合。 環氧樹脂在黏著劑中之配合量，相對於黏著劑全量以 10〜50質量％爲佳，以20〜40質量％更佳。環氧樹脂之配合 量未達1 〇質量％時，與潛在性硬化劑反應之環氧樹脂成份 少之故，黏著劑之硬化不完全、水份容易滲入。又，其他 之黏著劑構成材料（苯氧樹脂、橡膠成份）的配合比率增 多之故，黏著劑之流動性降低，難以獲得電極間的導通。 另一方面，配合量超過5 0質量％時，黏著劑之流動性過高 ，壓黏後之連接部中容易產生氣泡，於高溫條件下水容易 滲入。 本實施形態中所使用之橡膠成份有，例如以丙烯酸、 丙烯酸酯、甲基丙烯酸酯及丙烯腈中之至少一種作爲單體 的聚合物或共聚物等。此等之中以含有具環氧丙基之丙烯 酸環氧丙基酯或甲基丙烯酸環氧丙基酯之共聚物系丙烯酸 橡膠較適合使用。 橡膠成份之分子量，從黏著劑之密著力或防濕性高之 -12 - 200815560 點而言，重量平均分子量（Mw)以70萬以上爲佳。 橡膠成份在黏著劑中之配合量，相對於黏著劑全量以 1 0〜5 G質量％爲佳，以2 0〜4 0質量％更佳。橡膠成份之配合 量未達10%時，難以確保黏著劑之密著力，在高濕條件下 連接部容易渗入水。另一方面，配合量超過50質量％時， 黏著劑之流動性降低，難以獲得電極間之導通。 本實施形態中所使用之潛在性硬化劑有，例如咪唑系 、餅系、胺基醯亞胺、二苯胺二醯亞胺等。此等可1種單 獨或2種以上組合使用。又，從延長黏著劑的可使用時間 之觀點而言，該硬化劑以使用被聚胺基甲酸酯系、聚酯系 之高分子物質等被覆的微膠囊化者爲佳。 潛在性硬化劑在黏著劑中之配合量，從獲得充分之反 應率的觀點而言，相對於黏著劑全量以0.1〜50質量％爲佳 ，更佳爲1〜3 0質量％。潛在性硬化劑之配合量未達〇 . 1質 量％時，黏著劑之硬化有不充分的傾向；超過50質量％時 ’流動性降低、難以獲得電極間之導通，又黏著劑之可使 用時間有縮短的傾向。 本實施形態之連接電路用薄膜狀黏著劑，以含有導電 粒子爲佳。即使不含導電性粒子，可藉由電路電極相互間 之直接接觸，將電路構件予以連接；藉由含有導電粒子， 可積極賦予異向導電性，可吸收晶片之衝撃或基板電極之 高度的不勻之故，能更穩定連接。 導電粒子有，例如Ni、Au、Ag、Cu或焊劑等金屬粒 子，在聚苯乙烯等高分子之球狀的核材中設置Ni、Au等 -13- 200815560 導電層者。進而可使用在導電性粒子之表面被覆絕緣性樹 脂者。 本實施形態中，導電性粒子係以Ni等過渡金屬、或 以非導電性之玻璃、陶瓷、塑料等所形成的粒子爲核，在 其表面被覆由Au等貴金屬所成的被覆層者較適合。具有 如此之貴金屬的被覆層之導電性粒子，將連接電路材料加 熱及加壓時予以變形，增加與電路電極之接觸面積，更提 φ 升信賴性。 導電粒子之粒徑，必要比連接基板之電極的最小間隔 小，存在電極之高度的不勻時，以比高度不勻大爲佳。具 體而言，導電粒子之粒徑以1〜10// m爲佳。 分散於黏著劑之導電粒子的配合量，以黏著劑全體之 體積爲基準，以0.1〜30體積％爲佳，以0·1〜15體積％更佳 。導電粒子之配合量，超過3 0體積％時，在鄰接電極間， 有容易產生短路之傾向。 ® 本實施形態之連接電路用薄膜狀黏著劑，相對於耐移 動性，在不損及特性之程度可含有偶合劑。偶合劑有，例 如酮亞胺、乙烯基、丙烯酸基、胺基、環氧基、及異氰酸 酯基含有物，從密著力提升之點而言，甚爲適合。 本實施形_之連接電路用薄膜狀黏著劑，係含有上述 之苯氧樹脂、環氧樹脂、橡膠成份、潛在性硬化劑及導電 粒子、以及因應需求之其他成份調製所成的連接電路用黏 著劑組成物，可藉由將其形成爲薄膜狀製作而成。 薄膜之形成’係例如藉由將上述連接電路用黏著劑組 -14- 200815560 成物溶解或分散於有機溶劑，調製成液狀之塗佈液，將此 塗佈液塗佈於剝離性薄膜上，藉由在硬化劑之活性溫度以 下進行去除溶劑。使用之有機溶劑，從提升黏著劑組成物 之溶解性的觀點而言，以芳香族烴系與含氧系（甲苯、乙 酸乙酯等）之混合溶劑，能提升材料的溶解性之故，較爲 適合。 本實施形態之連接電路用薄膜狀黏著劑，以下述之方 法能確認硬化後之對水的接觸角是否在90°以上。 (1 )首先’將連接電路用薄膜狀黏著劑貼合於滑動 玻璃。此時，亦可加熱同時加壓，加熱溫度爲不使連接電 路用薄膜狀黏著劑中之黏著劑組成物硬化的溫度。其次， 以下述式（1)所定義之硬化率C爲80%以上的所定加熱 條件，使連接電路用薄膜狀黏著劑硬化。 C(%) = (Q0-Ql)/Q0xl00 …⑴ 式（1 )中，Q0爲使用DSC (差示掃描熱量計）所測 定之硬化前的黏著劑之發熱量（J/g ) ，Q 1爲以所定之加 熱條件經硬化後的黏著劑之發熱量（J/g )。 (2 )其次，依JIS R3275法，在溫度25±5°C，濕度 5 0± 1 0%之條件下，測定該所得硬化物表面之對水的接觸角 。還有，測定之際滴下於硬化物表面的水，使用純水。測 定可使用例如「CA-W 1 5 0」（協和界面科學股份有限公司 製）等之接觸角計。 本實施形態中，藉由適當決定上述之苯氧樹脂、環氧 樹脂、橡膠成份及潛在性硬化劑之種類及此等的配合量， -15- 200815560 使上述所測定之接觸角達9 0 °以上，能獲得本發明之連接 電路用薄膜狀黏著劑。 本實施形態之連接電路用薄膜狀黏著劑中，使硬化後 之接觸角增大的方法有，例如使用分子內具有含2個以上 苯環之芳香族環狀構造（尤其荀環）的苯氧樹脂，增加此 苯氧樹脂之配合量的方法；及增加橡膠成份之配合量的方 法等。另一方面，減小硬化後之接觸角的方法，有減少該 苯氧樹脂之配合量的方法；及減少橡膠成份之配合量的方 法等。藉由配合聚矽氧改性環氧樹脂，可增大硬化後之接 觸角。 又，本實施形態之連接電路用薄膜狀黏著劑，從作爲 連接電路用黏著劑之特性良好、提升耐移動的觀點而言， 上述所測定之接觸角以90°〜110°爲佳，更佳爲90。〜100。， 最佳爲95°〜98°。 又，從作爲連接電路用黏著劑之特性良好，提升耐移 動的觀點而言，上述所測定之接觸角以92°以上爲佳，較 佳爲95°以上，更佳爲97°以上。 進而，本實施形態之連接電路用薄膜狀黏著劑，以在 加熱至190 °C之烘箱中予以硬化1小時以上時，成爲上述 (1)所定義之硬化率C爲80%以上者，甚爲適合。 本發明之第2連接電路用薄膜狀黏著劑，其係介於互 相對峙的電路電極之間，藉由加熱、加壓於互相對峙之電 β極，使加壓方向之電極間進行電性的連接之連接電路 用薄膜狀黏著劑；其特徵爲含有：具有含2個以上苯環之 -16- 200815560 芳香族環狀構造的苯氧樹脂、環氧樹脂、橡膠成份及潛在 性硬化劑。 就具有含2個以上苯環之芳香族環狀構造的苯氧樹脂 、環氧樹脂、橡膠成份及潛在性硬化劑而言，可使用本發 明之第1連接電路用薄膜狀黏著劑所說明者。 本實施形態之連接電路用薄膜狀黏著劑中，含2個以 上苯環之芳香族環狀化合物，以源自多環芳香族化合物爲 佳。即，苯氧樹脂以使用具有含2個以上苯環之芳香族環 狀構造的多環芳香族化合物作爲構成材料，藉由上述之方 法所合成者爲佳。 又，該多環芳香族化合物，以二羥基化合物爲佳。進 而，此二羥基化合物，以具有萘、苊、芴、二苯并呋喃、 蒽及菲中任一構造之化合物爲佳。 又，本實施形態中，該多環芳香族化合物，以具有芴 環構造之二羥基化合物爲佳，以具有芴環構造之二苯酚化 合物更佳。最佳之多環芳香族化合物爲4,4’-( 9-亞芴基 )-二苯酉分。 本發明之第2連接電路用薄膜狀黏著劑苯氧樹脂、環 氧樹脂、橡膠成份及潛在性硬化劑之配合量，以設定在與 本發明之第1連接電路用薄膜狀黏著劑同樣的範圍爲佳。 又，本發明之第2連接電路用薄膜狀黏著劑，從作爲 連接電路用黏著劑之特性良好、提升耐移動的觀點而言， 該黏著劑於硬化後對水之接觸角以90°以上爲佳、90°〜110。 較佳，90°〜100°更佳，最佳爲95°〜98°。 -17- 200815560 又，從作爲連接電路用黏著劑之特性良好 動的觀點而言，上述所測定之接觸角以92°以 佳爲95°以上、更佳爲97°以上。 本發明之第2連接電路用薄膜狀黏著劑中 、之接觸角增大的方法有，例如增加具有含2個 族環狀構造（尤其芴環）的苯氧樹脂之配合量 增加橡膠成份之配合量的方法等。另一方面， 之接觸角的方法，有減少該苯氧樹脂之配合量 減少橡膠成份之配合量的方法等。又，藉由配 性環氧樹脂，可增大硬化後之接觸角。 本發明之第2連接電路用薄膜狀黏著劑， 粒子爲佳。導電粒子可使用上述者。 本實施形態之連接電路用薄膜狀黏著劑， 之苯氧樹脂、環氧樹脂、橡膠成份、潛在性硬 粒子、以及因應需求之其他成份調製所成的連 著劑組成物，可藉由將其.形成薄膜狀製作而成 其他之成份，可使用本發明之第1連接電 黏著劑所說明者。又，薄膜之形成，可採用與 1連接電路用薄膜狀黏著劑的情況同樣之方法I 圖1爲本發明的連接電路用薄膜狀黏著劑 態的示意剖面圖。圖1所示之連接電路用薄膜 ，係將上述之連接電路用黏著劑組成物形成爲 依此連接電路用薄膜狀黏著劑，可輕易處理、 被著體，連接操作容易進行。 、提升耐移 上爲佳，較 ，使硬化後 以上之芳香 的方法；及 減小硬化後 的方法；及 合聚矽氧改 以含有導電 係含有上述 化劑及導電 接電路用黏 〇 路用薄膜狀 本發明之第 I行。 之一實施形 狀黏著劑1 薄膜狀者。 容易設置於 -18- 200815560 還有，連接電路用薄膜狀黏著劑1，可由2種以上之 層所成的多層構成。此情況，硬化後之接觸角爲90°以上 的本發明之黏著劑層’係配置於移動容易產生之被著體側 、尤其電路側。又’本發明之連接電路用薄膜狀黏著劑使 用多層ACF之構成材料時，容易產生移動之被著體中的 接觸層，以由本發明之連接電路用薄膜狀黏著劑所成者爲 佳。此層，可作爲硬化後之耐移動層的功能。本實施形態 中，測定此耐移動層之接觸角，確認硬化後之接觸角爲 90°以上。 連接電路用薄膜狀黏著劑1，可藉由將含上述苯氧樹 脂、環氧樹脂、橡膠成份及潛在性硬化劑之黏著劑組成物 溶解於該有機溶液者，使用塗佈裝置塗佈於支撐體PET ( 聚對苯二甲酸乙二酸酯）薄膜等上，在黏著劑組成物不硬 化之溫度，予以熱風乾燥所定之時間而製作。還有，連接 電路用薄膜狀黏著劑1之厚度沒有特別的限制，以比連接 對象之電路構件間的空隙厚爲佳。一般而言，相對於空隙 以5// m以上厚之膜厚較適合，相對於空隙以7〜100/zm 厚之膜厚更佳，以10〜5 0//m厚之膜厚最適合。 又，經本發明之工作同仁的檢討，移動容易在形成電 極之玻璃基板上產生。因此，本發明之連接電路用薄膜狀 黏著劑，適合使用爲玻璃面板用之連接電路用的黏著劑。 進而，依本發明之連接電路用薄膜狀黏著劑，可在上述之 玻璃面板上形成耐移動層。又，本發明之連接電路用薄膜 狀黏著劑，使用爲多層ACF之構成材料時，在與多層 -19- 200815560 ACF之玻璃面板接觸側，配置本發明之連接電路用薄膜狀 黏著劑，能在該玻璃面板上形成耐移動層。 <電路構件之連接構造> 圖2爲藉由連接電路用薄膜狀黏著劑所連接之電路構 件的連接構造之一實施形態的槪略剖面圖。如圖2所示， 本實施形態之電路構件的連接構造，係具備互相對峙之第 1電路構件20及第2電路構件30，在第1電路構件20與 第2電路構件30之間，設置將此等連接之連接電路構件 10。 第1電路構件20，具備電路基板（第1電路基板）21 、與形成與電路基板21之主面21a上的電路電極（第1 電路電極）22。還有，在電路基板21之主面21a上，依 情況而異，亦可形成絕緣層（圖上未標示）。 另一方面，第2電路構件30，具備電路基板（第2電 路基板）31、與形成於電路基板31之主面31a上的電路 電極（第2電路電極）32。又，電路基板31之主面31a 上，依情況而異，亦可形成絕緣層（圖上未標示）。 第1及第2電路構件2 0、3 0，形成必要電性連接之電 極時沒有特別的限制。具體而言，有形成液晶顯示器所使 用之ITO等電極的玻璃或塑料基板、印刷配線板、陶瓷配 線板、撓性配線板、半導體矽晶片等。此等因應需求可組 合使用。如此，本實施形態中，以印刷配線板或聚醯亞胺 等有機物所成之材質爲首，可使用具有銅、鋁等金屬或 -20- 200815560 ITO (氧化銦錫）、氮化矽（SiNx )、二氧化矽（Si〇2 ) 等無機材質之各種各樣的表面狀態之電路構件。 電路連接構件1 〇，包含絕緣性物質1 1及導電粒子7 。導電粒子7，不僅互相對峙之電路電極22與電路電極 3 2之間，亦配置於主面2 1 a、3 1 a之相互間。在電路構件 之連接構造中，電路電極22、32，介著導電粒子7以電性 連接。即，導電粒子7直接接觸於電路電極22、32之雙 方。 於此，導電粒子7，具有可電性連接之導電性時，沒 有特別的限制，有Au、Ag、Ni、Cu、Co、焊劑等金屬粒 子或碳等。又，亦可使用將非導電性之玻璃、陶瓷、塑料 等以上述金屬等導電物質被覆者。此時，被覆之金屬層的 厚度，爲獲得充分之導電性，以1 〇nm以上爲佳。 於此電路構件之連接構造中，如上所述，介著導電粒 子7，使對峙之電路電極22與電路電極32以電性連接。 因而充分減低電路電極22、32間之連接電阻。因此，電 路電極22、3 2間之電流的流通滑順，能充分發揮電路持 有之功能。還有，電路連接構件1〇不含導電粒子7，電路 電極22與電路電極32直接接觸，以電性連接。 電路連接構件1 〇，如後所述’藉由本發明之連接電路 用薄膜狀黏著劑的硬化物所構成之故，在高濕條件下具有 充分的耐移動性。因此，在高濕環境下通電時可充分防止 電路電極22、32上產生電析，能提高電路電極22、32間 之電特性的長期信賴性。 -21 - 200815560 <電路構件之連接構造的製造方法> 其次’就上述之電路構件的連接構造之製造方法予以 說明。 首先’準備上述之第1電路構件20、連接電路用薄膜 狀黏著劑40〔參照圖3 ( a )〕。連接電路用薄膜狀黏著 劑40，係將電路連接材料成形爲薄膜狀者。電路連接材料 ，含有黏著劑組成物5、與導電粒子7。於此，黏著劑組 成物5’使用上述之含有苯氧樹脂、環氧樹脂、橡膠成份 及潛在性硬化劑者。還有，電路連接材料不含導電粒子7 時，其電路連接材料可使用各向異性導電性黏著劑作爲絕 緣性黏著劑，尤其亦有稱爲非導電性糊料之NCP。又，電 路連接材料含有導電粒子7時，其電路連接材料，有稱爲 ACP者。因而，使用具有NCF功能之本發明的連接電路 用薄膜狀黏著劑，可替代ACF功能之連接電路用薄膜狀 黏著劑40，獲得電路構件之連接構造。 又，電路連接材料中導電粒子7之含量，相對於電路 連接材料之全量以0.1〜30體積％爲佳，以0.1〜15體積％更 佳，含量未達〇·1體積％時，有難以獲得良好的導通之傾 向。另一方面，超過3〇體積％時，有引起鄰接電路之短路 的可能性。 其次，將連接電路用薄膜狀黏著劑4 0，承載於形成第 1電路構件20之電路電極22的面上。還有，連接電路用 薄膜狀黏著劑40黏附於支撐體上時，使連接電路用薄膜 -22- 200815560 狀黏著劑40側向著第〗電路構件20，承載於第1電路構 件2 0上。此時，連接電路用薄膜狀黏著劑40爲薄膜狀容 易處理。因此，第1電路構件20與第2電路構件30之間 ，可輕易介著連接電路用薄膜狀黏著劑40，第1電路構件 20與第2電路構件30之連接操作可輕易進行。 又，將連接電路用薄膜狀黏著劑40，於圖3 ( a )之 箭頭A及B的方向加壓，將薄膜狀電路連接材料40假連 • 接於第1電路構件20〔參照圖3 ( b )〕。此時，可加熱 同時加壓。但，加熱溫度爲不使連接電路用薄膜狀黏著劑 40中之黏著劑組成物硬化之溫度。 接著，如圖3 ( c )所示，將第2電路構件3 0，使第2 電路電極向著第1電路構件20，承載於連接電路用薄膜狀 黏著劑40上。還有，連接電路用薄膜狀黏著劑40黏附於 支撐體上時，將支撐體剝離後，將第2電路構件30承載 於連接電路用薄膜狀黏著劑40上。 • 又，將連接電路用薄膜狀黏著劑40加熱，同時在圖3 (c)之箭頭A及B方向介著第1及第2電路構件20、30 予以加壓。此時之加熱溫度，在硬化劑之活性溫度以上。 如此，連接電路用薄膜狀黏著劑4G ’經硬化處理，進行本 連接，即得如圖2所示之電路構件的連接構造。 加熱溫度，爲例如17〇〜200°C，連接時間，爲例如10 秒〜1分鐘。此等條件，可由使用之用途、黏著劑組成物、 電路構件適當選擇；因應需求亦可進行後硬化。 如上所述，製造電路構件之連接構造時，在所得電路 -23- 200815560 構件之連接構造中，可使導電粒子7接觸於互相 路電極22、32之雙方，能充分減低電路電極22 連接電阻。 又，藉由將連接電路用薄膜狀黏著劑40加 路電極22與電路電極32間之距離在充分小的狀 劑組成物5進行硬化成爲絕緣性物質1 1 ;第1 20與第2電路構件3 0，介著電路連接構件1 0而 。在所得電路構件之連接構造中，電路連接構件 由本發明之連接電路用薄膜狀黏著劑的硬化物所 ’在高濕條件下亦具有充分的耐移動性。因此， 構件之連接構造，即使在高濕環境下通電時，亦 止在電路電極22、32上產生電析，電路電極22 連接信賴性優越。 【實施方式】 〔實施例〕 以實施例及比較例爲基準，更具體說明本發 本發明並非限定於下述之實施例者。 (配合.材料） 首先’準備以下述之材料作爲連接電路用薄 劑的配合材料。 苯氧樹脂-1 對峙之電 、32間之 熱，使電 態，黏著 電路構件 堅固連接 1 〇，係藉 構成之故 所得電路 能充分防 、3 2間之 明如下； 膜狀黏著 -24 - 200815560 由雙酚A型環氧樹脂、與分子內具有芴環構造之苯酚 化合物〔4，4 ’ - ( 9 -亞芴基二苯酚〕合成苯氧樹脂。所 得樹脂之重量平均分子纛，藉由GPC法標準聚苯乙烯換 算之値爲4萬。將此樹脂溶解於質量比爲甲苯（沸點 110.6°C、SP 値 8·90) /乙酸乙酯（沸點 77.；rC、SP 値 9.10) =50/50之混合溶劑，即得固形份4〇質量％之樹脂溶 液。以此作爲 < 苯氧樹脂_〗。 <苯氧樹脂-2> 由雙酚A型環氧樹脂、與環氧氯丙烷，合成之雙酚A 型苯氧樹脂〔苯酚4，4,-(1-甲基亞乙基）雙聚合物〕。所 得樹脂之重量平均分子量，藉由GPC法標準聚苯乙烯換 算之値爲3萬。將此樹脂溶解於質量比爲甲苯/乙酸乙酯 = 50/50之混合溶劑，即得固形份40質量％之樹脂溶液。 以此作爲 <苯氧樹脂-2>。 <環氧樹脂-1> • 準備萘型環氧樹脂（萘二醇系環氧樹脂，大日本油墨 化學工業股份有限公司製，商品名HP-4032、環氧當量 149)。以此作爲<環氧樹脂-1：> ° <環氧樹脂-2> 準備雙酚A型環氧樹脂（油化榭魯環氧股份有限公司 製，商品名耶皮口多828、環氧當量1 84 )。以此作爲 <環 -25- 200815560 氧樹脂-2>。 <含有硬化劑之環氧樹脂-1 > 準備含有含微膠囊型潛在性硬化劑（微膠囊化之胺系 * 硬化劑）、與雙酚F型環氧樹脂、與萘型環氧樹脂，依質 _ 量比爲34 ·· 49 : 17之液狀硬化劑的環氧樹脂（環氧當量 :2 02 )。以此作爲 <含有硬化劑之環氧樹脂-1 >。 <含有硬化劑之環氧樹脂-2> 準備含有含微膠囊型潛在性硬化劑（微膠囊化之胺系 硬化劑）、與雙酚F型環氧樹脂、依質量比爲35: 65之 液狀硬化劑的環氧樹脂（環氧當量：2 1 3 )。以此作爲 <含 有硬化劑之環氧樹脂-2>。 <丙烯酸橡膠> Φ 準備作爲橡膠成份之丙烯酸橡膠（丙烯酸丁酯40重 量份-丙烯酸乙酯30重量份-丙烯腈30重量份-甲苯丙烯酸 環氧丙基酯3重量份之共聚物，重量平均分子量：80萬。 將此丙烯酸橡膠溶解於質量比爲甲苯/乙酸乙酯=5 0/5 0之 混合溶液，即得固形份1 5質量°/❶之溶液。 <導電粒子> 準備在以聚苯乙烯作爲核之粒子表面，設置厚度〇·2 // m之鎳層，在此鎳層之外側設置厚度0.0 4 A m之金層所 -26- 200815560 成，平均粒徑5//m之導電粒子。 〔實施例1〕 將苯氧樹脂-1、丙烯酸橡膠及含有硬化劑之環氧樹脂-1，以固形份質量比20 : 30 : 50之配合比例混合，接著， 在此混合物1 00質量份中混合分散導電粒子5質量份，即 得黏著劑組成物。將所得黏著劑組成物以滾筒塗佈機塗佈 於分隔板上（施行聚矽氧處理之聚對苯二甲酸乙二醇酯薄 膜，厚度：50 // m )。接著，藉由將其於70°C加熱乾燥3 分鐘，形成厚度25 // m之薄膜狀黏著劑，即得實施例1之 連接電路用薄膜狀黏著劑。 〔實施例2〕 除實施例1中之苯氧樹脂-1、丙烯酸橡膠及含有硬化 劑之環氧樹脂-1的配合比例變更爲固形份質量比20 : 40 :40以外，與實施例1同樣進行，即得實施例2之連接電 路用薄膜狀黏著劑。 〔實施例3〕 除實施例1中之苯氧樹脂-1、丙烯酸橡膠及含有硬化 劑之環氧樹脂-1的配合比例變更爲固形份質量比20 ·· 20 :60以外，與實施例1同樣進行，即得實施例3之連接電 路用薄膜狀黏著劑。 -27· 200815560 〔實施例4〕 將苯氧樹脂-1、丙烯酸橡膠、環氧樹脂-1及含有硬化 劑之環氧樹脂-2，以固形份質量比20 : 30 : 5 : 45之配合 比例混合；接著，在此混合物100質量份中混合分散導電 粒子5質量份，即得黏著劑組成物。除使用此黏著劑組成 物替代實施例1中之黏著劑組成物以外，與實施例1同樣 進行，即得實施例4之連接電路用薄膜狀黏著劑。 〔實施例5〕 將苯氧樹脂-2、丙烯酸橡膠及含有硬化劑之環氧樹脂-1，以固形份質量比2 0 : 3 0 : 5 0之配合比例混合；接著， 在此混合物1 0 0質量份中混合分散導電粒子5質量份，即 得黏著劑組成物。除使用此黏著劑組成物替代實施例1之 黏著劑組成物以外，與實施例1同樣進行，即得實施例5 之連接電路用薄膜狀黏著劑。 〔實施例6〕 將苯氧樹脂-1、丙烯酸橡膠及含有硬化劑之環氧樹脂-2，以固形份質量比20 : 30 : 50之配合比例混合；接著， 在此混合物1 0 0質量份中混合分散導電粒子5質量份，即 得黏著劑組成物。除使用此黏著劑組成物替代實施例1之 黏著劑組成物以外，與實施例1同樣進行，即得實施例6 之連接電路用薄膜狀黏著劑。 -28- 200815560 〔比較例1〕 將苯氧樹脂-2、丙烯酸橡膠及含硬化劑之環氧樹脂-2 ，以固形份質量比20 : 3 0 : 5 〇之配合比例混合；接著， 在此混合物1 00質量份中混合分散導電粒子5質量份，即 得黏著劑組成物。除使用此黏著劑組成物替代實施例1之 ~ 黏著劑組成物以外，與實施例1同樣進行，即得比較例1 之連接電路用薄膜狀黏著劑。 〔比較例2〕 將苯氧樹脂-1、環氧樹脂-1及含硬化劑環氧樹脂-1， 以固形份質量比3 0 : 20 : 50之配合比例混合；接著，在 此混合物1 〇 〇質量份中混合分散導電粒子5質量份，即得 黏著劑組成物。除使用此黏著劑組成物替代實施例1之黏 著劑組成物以外，與實施例1同樣進行，即得比較例2之 連接電路用薄膜狀黏著劑。 〔比較例3〕 ， 將苯氧樹脂-1、環氧樹脂-1及含硬化劑環氧樹脂-2， 以固形份質量比30 : 20 : 50之配合比例混合；接著，在 此混合物1 〇〇質量份中混合分散導電粒子5質量份，即得 黏著劑組成物。除使用此黏著劑組成物替代實施例1之黏 著劑組成物以外，與實施例1同樣進行，即得比較例3之 連接電路用薄膜狀黏著劑。 -29- 200815560 〔比較例4〕 將苯氧樹脂-1、環氧樹脂-2及含硬化劑環氧樹脂-1 ’ 以固形份質量比30 : 20 : 50之配合比例混合；接著’在 此混合物1 00質量份中混合分散導電粒子5質量份’即得 黏著劑組成物。除使用此黏著劑組成物替代實施例1之黏 _ 著劑組成物以外，與實施例1同樣進行，即得比較例4之 連接電路用薄.膜狀黏著劑。 〔比較例5〕 將苯氧樹脂-2、丙烯酸橡膠及含硬化劑環氧樹脂-2， 以固形份質量比20 ·· 20 : 60之配合比例混合；接著，在 此混合物1 0 0質量份中混合分散導電粒子5質量份，即得 黏著劑組成物。除使用此黏著劑組成物替代實施例1之黏 著劑組成物以外，與實施例1同樣進行，即得比較例5之 連接電路用薄膜狀黏著劑。 ® 就上述所得實施例1〜6及比較例1〜5之連接電路用薄 膜狀黏著劑，實施下述之接觸角測定及耐移動性試驗。所 . 得結果如表1及表2所示。 <相對於水之接觸角的測定> 將所得連接電路用薄膜狀黏著劑轉印於滑動玻_ ± $ 用烘箱以190 °C，1小時之條件進行加熱硬化。就硬化後 之薄膜狀黏著劑表面，使用接觸角計（協和界面科學股份 有限公司製，CA-Wl5〇)，依JIS R3275之方法測定溫度 -30- 200815560 25±5°C、濕度50±10%之條件下相對於水的接觸角。還有 ，測定係在硬化物表面的3個處所進行，所得之値的平均 作爲接觸角。又，就以上述加熱硬化條件硬化之黏著劑， 算出以下述式（2 )所定義之硬化率CI的結果，確認實施 例1〜6及比較例1〜5之連接電路用薄膜狀黏著劑的任一均 '爲80%以上。所算出之硬化率如表1及表2所示。 CI(%) = (Q2-Q3)/Q2xl00 …（2) • 式（2)中，Q2爲使用DSC (差示掃描熱量計）所測 定之硬化前的黏著劑之發熱量（J/g) ; Q3爲以上述加熱 條件（190°C，1小時），硬化後之黏著劑的發熱量（J/g <耐移動性試驗> 首先，使用所得之連接電路用薄膜狀黏著劑，將附置 ITO梳形圖型電極（間距l〇〇/zm、線85gm、空間15/zm )玻璃基板、與2層FPC (間距100/zm、線50/zm、空 間50/zm、電路高8//m、基材：聚醯亞胺、電路：Cu/Sn 電鍍）以下述之方法連接，製成電路連接體。 將裁斷爲所定尺寸之薄膜狀黏著劑（1.5x25mm)，以 8 0°C、lOKgf/cm2、4秒之條件貼合於附置ITO梳型圖型 之玻璃基板後，將分隔板剝離，接著使2層FPC之電路與 玻璃基板側之電路進行位置吻合。接著，自FPC上方進行 180°C、3MPa、15秒之加熱、加壓，進行本連接。 將上述所得之電路連接體，放置於60°C、90%RH之 -31 - 200815560 試驗槽中，在相對於梳形電極施加DC20V。以此狀態經過 96小時後，使用金屬顯微鏡觀測薄膜狀黏著劑連接部（玻 璃基板側ITO電極與FPC側電極之接觸部、及黏著劑露 出部）中之移動的產生狀態，以下述基準評估。 A:移動之產生量微小（或無）。 B:移動之產生量甚少。 C:移動之產生量中等。 D:移動之產生量甚大' 〔表1〕The present invention relates to a film-like adhesive for connecting a circuit; in detail, it relates to an electrode of a liquid crystal panel, an FPC (flexible printed wiring board) electrode, an FPC electrode and a PCB (printed wiring board) electrode, and an IC. * A film-like adhesive for connecting circuits used for electrically connecting an electrode of an electronic component such as a wafer to a liquid crystal panel electrode or a PCB electrode. [Prior Art] When the electrodes of the liquid crystal panel and the electrodes of the electronic components such as the FPC electrode, the FPC electrode and the PCB electrode, and the 1C wafer are electrically connected to the liquid crystal panel electrode or the PCB electrode, the conductive particles are dispersed in the insulating adhesive resin. A film-like adhesive for connecting circuits in the middle. Specifically, a film-like adhesive for a connection circuit is disposed between the circuit electrodes of the 峙, and the electrode electrodes in the pressurizing direction are electrically connected to each other by heating and pressurizing the circuit electrodes facing each other. For example, a film-like adhesive for a connection circuit based on an epoxy resin disclosed in Japanese Laid-Open Patent Publication No. Hei No. Hei. However, when the connection body is connected to the above-mentioned film-like adhesive for a connection circuit, when it is energized in a high-humidity environment, an electro-emission called movement is generated in the electric circuit or the electrode, which impairs the connection reliability. This movement causes ionization when a voltage is applied to the impurities in the adhesive or the metal constituting the electrode. The method of reducing the concentration of ions in the adhesive has been reviewed. For example, there is a film-like adhesive for connecting circuits containing a lanthanum-based oxide, a -5-200815560 or a magnesium-silver oxide plasma trap. (Patent Document 2) Patent Document 1: Japanese Laid-Open Patent Publication No. Hei No. Hei No. Hei 9- 1 No. Hei. The technique described in Patent Document 2 has the following problems, and is insufficient in the connection reliability of the circuit. That is, in the above technique, when the particle diameter of the ion trapping agent is larger than the diameter of the conductive particles, the electrical connection between the conductive particles is not sufficiently obtained; on the other hand, the particle diameter of the ion trapping agent is smaller than the diameter of the conductive particles. The collector penetrates between the conductive particles and the electrode, and has a problem of impeding electrical connection. Therefore, in the above-described prior art, it is relatively difficult to ensure the connection reliability between the opposing circuit electrodes and to sufficiently improve the mobility resistance. In view of the above-described problems of the prior art, the present invention has an object of providing a film-like adhesive for a circuit for connecting circuits which is excellent in resistance to migration and which can improve the connection reliability of a circuit in a high-humidity environment. [Means for Solving the Problem] In order to achieve the above object, the work of the present invention has been intensively investigated, and it has been found that a circuit in which a film-like adhesive of a specific thickness or more is displayed by a contact angle with respect to water after hardening is found. In the connected body, the amount of movement generated was extremely small in the predetermined moisture-resistant energization test, and the present invention was completed. -6 - 200815560 That is, the present invention provides a film-like adhesive for a connecting circuit which is interposed between mutually opposing circuit electrodes, and is heated and pressurized against mutually opposing circuit electrodes to make electrodes in a pressing direction A film-like adhesive for connecting circuits electrically connected; characterized in that after the adhesive is cured, the contact angle with water is 90° or more. Here, the term "after curing of the adhesive" means that the calorific value of the adhesive before curing by DSC (differential scanning calorimeter) is Q〇 (J/g), and the hardening measured by DSC is used. When the calorific value of the adhesive is Q1 (J/g), the curing rate C defined by the following formula (1) is 80% or more. C(%)=(Q0-Ql)/Q0xl00 (1) The so-called "contact angle to water" refers to the method of Jis R3 257, at a temperature of 25 ± 5 ° C and a humidity of 50 ± 10%. In the case of the measurement, the film-like adhesive for a connection circuit according to the present invention can sufficiently suppress the occurrence of movement even when the circuit connection body is connected to a high-humidity environment, and can be improved in a high-humidity environment. Circuit connection reliability. However, as the circuit pattern is miniaturized, the space between the circuit electrodes is predicted to be smaller in the future. According to the film-like adhesive for a connection circuit of the present invention, when the circuit resistance is excellent, even when a circuit electrode having a fine pattern is connected, A short circuit that can effectively prevent the cause of the movement. The film-like adhesive for a connecting circuit of the present invention preferably contains a phenoxy resin, an epoxy resin, a rubber component, and a latent curing agent. In this case, the mobility of the adhesive is further improved, and the circuit connection letter can be reached at a higher level. Although the reason for achieving this effect by the adhesive containing the above components is not clear, the work of the present invention has the following assumptions. Namely, the phenoxy resin, the epoxy resin and the rubber component, and the latent curing agent, and the contact angle to water after hardening are 90. The above-mentioned 'by phenoxy resin to improve the heat resistance of the adhesive, to enhance the adhesion to the joint by containing rubber components, moisture resistance, and to promote the hardening of the latent hardener by containing epoxy resin' A high standard to play a good balance. As a result, the penetration of the fractional electrode to the circuit electrode can be highly suppressed. Further, by combining a combination of an epoxy resin and a latent curing agent, the storage stability and the hardenability of the adhesive can be both achieved, and the handleability and workability are improved. The phenoxy resin is preferably one having an anthracene ring from the viewpoint of further improving the resistance to migration. This phenoxy resin is a reason why it has an anthracene ring and can improve the mobility resistance. The work of the present invention has the following push. That is, in the combination of phenoxy resin, epoxy resin and rubber components and latent hardeners, the ring is introduced into the phenoxy resin to improve the heat resistance of the adhesive, and no relaxation occurs in the connecting circuit portion under high temperature conditions. Therefore, the penetration of moisture can be sufficiently prevented to further improve the mobility resistance. Further, the epoxy resin is preferably a naphthalene skeleton from the viewpoint of further improving the mobility resistance. Further, the epoxy resin has a naphthalene skeleton and the mobility resistance is further improved. The work of the present invention has the following estimations. That is, in a combination of a phenoxy resin, an epoxy resin, a rubber component, and a latent hardener, a naphthalene skeleton is introduced into an epoxy resin, and the hardening is hardened by the latent hardening-8-200815560 agent, and the hardening of the adhesive is stronger. The reason is that it can fully prevent the penetration of moisture and improve the mobility resistance. Further, the molecular weight of the rubber component is preferably 700,000 or more. In this case, the adhesion or moisture resistance of the adhesive is further improved, and the superior mobility resistance can be obtained hard. Moreover, the present invention provides a film-like adhesive for a connection circuit which is electrically connected between mutually opposing circuit electrodes by heating and pressurizing the circuit electrodes facing each other to electrically conduct between the electrodes in the pressurizing direction. A film-like adhesive for connecting a connection circuit; characterized by comprising a phenoxy resin having an aromatic ring structure containing two or more benzene rings, an epoxy resin, a rubber component, and a latent curing agent. According to the film-like adhesive for the connection circuit, even when the connected circuit connector is energized in a high-humidity environment, the occurrence of movement can be sufficiently suppressed, and the connection reliability of the circuit in a high-humidity environment can be improved. Further, according to the film-like adhesive for a connection circuit, since the resistance to movement is excellent, even when a circuit electrode having a fine pattern is connected, it is possible to effectively prevent a short circuit caused by the movement. In the film-like adhesive for a connection circuit, it is preferred that the aromatic cyclic structure containing two or more benzene rings is derived from a polycyclic aromatic compound. Further, the polycyclic aromatic compound is preferably a dihydroxy compound. The dihydroxy compound is preferably a compound having any one of naphthalene, anthracene, anthracene, dibenzofuran, anthracene and phenanthrene. Further, in the film-like adhesive for a connection circuit, the polycyclic aromatic compound is preferably a dihydroxy compound having an anthracene ring structure. Further, the polycyclic aromatic compound is preferably a diphenol compound having an anthracene ring structure. [Effect of the Invention] According to the present invention, it is possible to provide a film-like adhesive for a connection circuit which is excellent in mobility resistance and can improve the connection reliability of a circuit in a high-humidity environment. [Embodiment of the Invention] A preferred embodiment of the present invention will be described in detail below with reference to the drawings. In the drawings, the same or equivalent parts are designated by the same reference numerals, and the repeated description is omitted. The film-like adhesive for a first connection circuit of the present invention is electrically connected between mutually opposing circuit electrodes by heating and pressurizing the circuit electrodes facing each other to electrically connect the electrodes in the pressurizing direction. A film-like adhesive for connecting circuits; characterized in that after the adhesive is cured, the contact with water is 90. the above. The film-like adhesive for a connecting circuit of the present invention preferably contains a phenoxy resin, an epoxy resin, a rubber component, and a latent curing agent. The phenoxy resin used in the present embodiment is, for example, a resin obtained by reacting a bifunctional phenol with an epihalohydrin to a high molecular weight or by addition of a bifunctional epoxy resin to a bifunctional phenol. More specifically, the phenoxy resin can be used, for example, by a bifunctional phenol and an epihalohydrin in the presence of a catalyst such as an alkali metal hydroxide in a non-reactive solvent at a temperature of 40 to 12 ° C. The reaction comes. Further, the 'phenoxy resin' can be obtained by using a bifunctional epoxy resin-10-200815560 and a bifunctional phenol in the presence of a catalyst such as an alkali metal compound, an organophosphorus compound or a cyclic amine compound at a boiling point of 120. In an organic solvent such as a guanamine system, an ether system, a ketone system, a lactone system or an alcohol system having a temperature of 50 C or more, the reaction mixture is heated to 50 to 200 ° C to carry out a polyaddition reaction. Got it. The phenoxy resin may be used alone or in combination of two or more. The bisphenol A epoxy resin, the bisphenol F epoxy resin, the bisphenol AD epoxy resin, and the bisphenol S ring may be used. Oxygen resin, etc. The bifunctional phenols have two phenolic hydroxyl groups, and such two functional phenols include, for example, bisphenol A, bisphenol F, bisphenol AD, and bisphenol S. Further, the phenoxy resin preferably has an aromatic cyclic structure having two or more benzene rings in its molecule, an aromatic cyclic structure containing two or more benzene rings, and a molecular structure derived from a polycyclic aromatic compound. Wait. The polycyclic aromatic compound may, for example, be a dihydroxy compound having a structure such as naphthalene, anthracene, anthracene, dibenzofuran, anthracene or phenanthrene. Among these polycyclic aromatic compounds, a dihydroxy compound having an anthracene ring structure is preferred. The polycyclic aromatic compound is preferably a diphenol compound having an anthracene ring structure, and more preferably 4,4,-(9-fluorenylene)-diphenol. Further, as the phenoxy resin, those obtained by polyaddition of a bifunctional epoxy resin and a dihydroxy compound having a biphenyl skeleton can be used. The blending amount of the phenoxy resin in the adhesive is preferably 10 to 40% by mass based on the total amount of the adhesive, and more preferably 1 to 30% by mass. When the amount of the phenoxy resin is less than 10% by mass, it is difficult to obtain an effect of improving the mobility resistance; when it exceeds -11 - 200815560 40% by mass, the fluidity of the adhesive is lowered, and it is difficult to obtain conduction between the electrodes. The epoxy resin used in the present embodiment includes, for example, epichlorohydrin and bisphenol A, or a bisphenol epoxy resin derived from F or AD, and a polyoxymethylene-modified epoxy resin, and has a main skeleton. Naphthalene type epoxy resin such as naphthalene ring. Among these, a naphthalene type epoxy resin is preferred. These epoxy resins may be used alone or in combination of two or more. These epoxy resins are preferably used in a high-purity product which is reduced to 300 ppm or less by using impurity ions (+, Cl_, etc.) or hydrolyzable chlorine, and can suppress movement. The blending amount of the epoxy resin in the adhesive is preferably 10 to 50% by mass based on the total amount of the adhesive, and more preferably 20 to 40% by mass. When the amount of the epoxy resin is less than 1% by mass, the epoxy resin component which reacts with the latent hardener is less, the hardening of the adhesive is incomplete, and the water is easily infiltrated. Further, since the mixing ratio of other adhesive constituent materials (phenoxy resin and rubber component) is increased, the fluidity of the adhesive is lowered, and it is difficult to obtain conduction between the electrodes. On the other hand, when the compounding amount exceeds 50% by mass, the fluidity of the adhesive is too high, and bubbles are likely to be generated in the joint portion after the pressure bonding, and water easily permeates under high temperature conditions. The rubber component used in the present embodiment is, for example, a polymer or a copolymer containing at least one of acrylic acid, acrylate, methacrylate and acrylonitrile as a monomer. Among these, a copolymer-based acrylic rubber containing a glycidyl propylene acrylate having a glycidyl group or a glycidyl methacrylate is preferably used. The molecular weight of the rubber component is preferably from 700,000 or more in terms of weight average molecular weight (Mw) from the viewpoint of the adhesion or moisture resistance of the adhesive -12 - 200815560. The blending amount of the rubber component in the adhesive is preferably from 10 to 5 G% by mass based on the total amount of the adhesive, and more preferably from 20 to 40% by mass. When the blending amount of the rubber component is less than 10%, it is difficult to ensure the adhesion of the adhesive, and the joint easily penetrates into the water under high-humidity conditions. On the other hand, when the blending amount exceeds 50% by mass, the fluidity of the adhesive is lowered, and it is difficult to obtain conduction between the electrodes. The latent curing agent used in the present embodiment may, for example, be an imidazole system, a cake system, an amino quinone imine or a diphenylamine quinone imide. These may be used alone or in combination of two or more. Further, from the viewpoint of prolonging the usable time of the adhesive, the curing agent is preferably a microencapsulated one coated with a polyurethane-based or polyester-based polymer material. The amount of the latent curing agent in the adhesive is preferably from 0.1 to 50% by mass, more preferably from 1 to 30% by mass, based on the total amount of the adhesive, from the viewpoint of obtaining a sufficient reaction rate. When the amount of the latent hardener is less than 〇. 1% by mass, the curing of the adhesive tends to be insufficient; when it exceeds 50% by mass, the fluidity is lowered, the conduction between the electrodes is difficult to be obtained, and the adhesive can be used. There is a tendency to shorten. The film-like adhesive for a connection circuit of the present embodiment preferably contains conductive particles. Even if the conductive particles are not contained, the circuit members can be connected by direct contact between the circuit electrodes; by containing the conductive particles, the anisotropic conductivity can be actively imparted, and the height of the wafer or the height of the substrate electrode can be absorbed. Evenly, it can be connected more stably. The conductive particles include, for example, metal particles such as Ni, Au, Ag, Cu, or a flux, and a conductive layer of Ni, Au, or the like is provided in a spherical core material such as polystyrene. Further, it is possible to use an insulating resin coated on the surface of the conductive particles. In the present embodiment, the conductive particles are preferably made of a transition metal such as Ni or a non-conductive glass, ceramic, plastic or the like as a core, and a coating layer made of a noble metal such as Au is coated on the surface. . The conductive particles of the coating layer having such a noble metal are deformed when the connecting circuit material is heated and pressurized, and the contact area with the circuit electrode is increased, thereby improving the reliability of φ liter. The particle diameter of the conductive particles is required to be smaller than the minimum interval of the electrodes connected to the substrate, and when the height of the electrodes is uneven, it is preferably larger than the height unevenness. Specifically, the particle diameter of the conductive particles is preferably 1 to 10/m. The amount of the conductive particles dispersed in the adhesive is preferably 0.1 to 30% by volume, more preferably 0.1 to 15% by volume based on the total volume of the adhesive. When the amount of the conductive particles is more than 30% by volume, a short circuit tends to occur between adjacent electrodes. The film-like adhesive for a connection circuit of the present embodiment may contain a coupling agent to the extent that the properties are not impaired with respect to the resistance to movement. The coupling agent is, for example, a ketimine, a vinyl group, an acrylic group, an amine group, an epoxy group, and an isocyanate group-containing substance, which is suitable from the viewpoint of increasing the adhesion. The film-like adhesive for a connection circuit according to the present embodiment is a bonding circuit comprising the above-mentioned phenoxy resin, epoxy resin, rubber component, latent curing agent, conductive particles, and other components required for modulation. The composition of the agent can be produced by forming it into a film. The formation of the film is prepared by dissolving or dispersing the above-mentioned connecting circuit adhesive group-14-200815560 in an organic solvent to prepare a liquid coating liquid, and applying the coating liquid to the release film. The solvent is removed by below the activation temperature of the hardener. From the viewpoint of improving the solubility of the adhesive composition, the organic solvent to be used is a mixed solvent of an aromatic hydrocarbon system and an oxygen-containing (toluene, ethyl acetate, etc.), thereby improving the solubility of the material. To be suitable. In the film-like adhesive for a connection circuit of the present embodiment, it is confirmed by the following method whether or not the contact angle with water after curing is 90 or more. (1) First, a film-like adhesive for a connection circuit is bonded to a sliding glass. At this time, it is also possible to pressurize while heating, and the heating temperature is a temperature at which the adhesive composition in the film-like adhesive for the connecting circuit is not hardened. Then, the film-like adhesive for a connection circuit is cured by a predetermined heating condition in which the curing rate C defined by the following formula (1) is 80% or more. C(%) = (Q0-Ql)/Q0xl00 (1) In the formula (1), Q0 is the calorific value (J/g) of the adhesive before hardening measured by DSC (differential scanning calorimeter), Q 1 The calorific value (J/g) of the adhesive which has been hardened under the specified heating conditions. (2) Next, the contact angle with respect to water on the surface of the obtained cured product was measured in accordance with JIS R3275 at a temperature of 25 ± 5 ° C and a humidity of 50 ± 10%. Further, water which was dropped on the surface of the cured product at the time of measurement was pure water. For the measurement, a contact angle meter such as "CA-W 1 50" (manufactured by Kyowa Interface Science Co., Ltd.) or the like can be used. In the present embodiment, by appropriately determining the types of the above-mentioned phenoxy resin, epoxy resin, rubber component, and latent curing agent, and the amount of such a compounding agent, -15-200815560 makes the above-mentioned measured contact angle reach 90 °. As described above, the film-like adhesive for a connection circuit of the present invention can be obtained. In the film-like adhesive for a connection circuit of the present embodiment, the contact angle after curing is increased. For example, a phenoxy group having an aromatic cyclic structure (especially an anthracene ring) having two or more benzene rings in the molecule is used. a resin, a method of increasing the blending amount of the phenoxy resin; and a method of increasing the blending amount of the rubber component. On the other hand, a method of reducing the contact angle after hardening has a method of reducing the blending amount of the phenoxy resin; and a method of reducing the blending amount of the rubber component. By bonding a polyoxymethylene-modified epoxy resin, the contact angle after hardening can be increased. Further, the film-like adhesive for a connection circuit of the present embodiment preferably has a contact angle of 90° to 110°, more preferably from the viewpoint of improving the characteristics of the adhesive for the connection circuit and improving the movement resistance. It is 90. ~100. , the best is 95 ° ~ 98 °. Moreover, the contact angle measured as described above is preferably 92 or more, more preferably 95 or more, and still more preferably 97 or more from the viewpoint of improving the characteristics of the adhesive for the connection circuit and improving the movement resistance. Further, when the film-like adhesive for a connection circuit of the present embodiment is cured in an oven heated to 190 ° C for 1 hour or more, the curing ratio C defined by the above (1) is 80% or more. Suitable for. The film-like adhesive for a second connection circuit of the present invention is electrically connected between mutually opposing electrode electrodes by heating and pressurizing the mutually opposing electric β poles to electrically conduct between the electrodes in the pressurizing direction. A film-like adhesive for connecting a connection circuit, comprising: a phenoxy resin having an aromatic ring structure of -16 to 200815560 having two or more benzene rings, an epoxy resin, a rubber component, and a latent curing agent. The phenoxy resin having an aromatic ring structure containing two or more benzene rings, an epoxy resin, a rubber component, and a latent curing agent can be used as described for the film adhesive for a first connecting circuit of the present invention. . In the film-like adhesive for a connection circuit of the present embodiment, an aromatic cyclic compound containing two or more benzene rings is preferred from the polycyclic aromatic compound. In other words, the phenoxy resin is preferably a polycyclic aromatic compound having an aromatic ring structure having two or more benzene rings, and is synthesized by the above method. Further, the polycyclic aromatic compound is preferably a dihydroxy compound. Further, the dihydroxy compound is preferably a compound having any of naphthalene, anthracene, anthracene, dibenzofuran, anthracene and phenanthrene. Further, in the present embodiment, the polycyclic aromatic compound is preferably a dihydroxy compound having an anthracene ring structure, and more preferably a diphenol compound having an anthracene ring structure. The most preferred polycyclic aromatic compound is the 4,4'-(9-fluorenylene)-diphenylquinone. The blending amount of the film-form adhesive phenoxy resin, epoxy resin, rubber component and latent curing agent for the second connecting circuit of the present invention is set in the same range as the film adhesive for the first connecting circuit of the present invention. It is better. Moreover, the film-like adhesive for a second connection circuit of the present invention has a contact angle with water of 90° or more from the viewpoint of improving the characteristics of the adhesive for the connection circuit and improving the movement resistance. Good, 90°~110. Preferably, it is more preferably 90° to 100°, most preferably 95° to 98°. -17-200815560 Further, the contact angle measured as described above is preferably 95 or more, more preferably 97 or more, from the viewpoint of the characteristics of the adhesive for the connection circuit. In the film-like adhesive for a second connection circuit of the present invention, the contact angle is increased by, for example, increasing the blending amount of the phenoxy resin having a two-membered ring structure (especially an anthracene ring) and increasing the rubber component. The method of quantity, etc. On the other hand, the method of the contact angle is a method of reducing the blending amount of the phenoxy resin and reducing the blending amount of the rubber component. Further, by the matching epoxy resin, the contact angle after hardening can be increased. The film-like adhesive for the second connection circuit of the present invention is preferably a particle. The conductive particles can be used as described above. The film-like adhesive for a connection circuit of the present embodiment, which is a composition of a phenoxy resin, an epoxy resin, a rubber component, a latent hard particle, and other components which are required to be required, can be obtained by The other components which are formed into a film form can be used as described in the first connection of the electroconductive adhesive of the present invention. Further, the film formation can be carried out in the same manner as in the case of connecting a film-like adhesive for a circuit. Fig. 1 is a schematic cross-sectional view showing a film-like adhesive state for a connection circuit of the present invention. In the film for a connection circuit shown in Fig. 1, the above-mentioned adhesive composition for a connection circuit is formed into a film-like adhesive for connecting circuits, which can be easily handled and placed, and the connection operation can be easily performed. , a method of improving the resistance to shifting, and a method of improving the aroma after hardening; and a method of reducing the hardening; and the method of forming a conductive system containing the above-mentioned chemical agent and the conductive circuit for bonding Film form The first line of the invention. One of the embodiments is a shape adhesive 10 film. It is easy to install in -18-200815560. The film-like adhesive 1 for connecting circuits can be composed of a plurality of layers of two or more layers. In this case, the adhesive layer of the present invention having a contact angle of 90 or more after curing is disposed on the object side, particularly the circuit side, where movement is likely to occur. Further, when a film-like adhesive for a connecting circuit of the present invention is used as a constituent material of a multilayer ACF, a contact layer in a moving object is likely to be formed, and it is preferable that the film-form adhesive for a connecting circuit of the present invention is used. This layer functions as a layer that is resistant to movement after hardening. In the present embodiment, the contact angle of the transition-resistant layer was measured, and it was confirmed that the contact angle after curing was 90 or more. The film-like adhesive 1 for a connection circuit can be applied to a support by using a coating device by dissolving an adhesive composition containing the above phenoxy resin, epoxy resin, rubber component, and latent curing agent in the organic solution. A PET (polyethylene terephthalate) film or the like is produced by a hot air drying at a temperature at which the adhesive composition is not cured. Further, the thickness of the film-like adhesive 1 for the connection circuit is not particularly limited, and is preferably thicker than the gap between the circuit members to be connected. In general, a film thickness of 5//m or more is suitable for the void, and a film thickness of 7 to 100/zm is preferable with respect to the void, and a film thickness of 10 to 50/m thick is most suitable. . Further, by the review of the working colleagues of the present invention, the movement is easily generated on the glass substrate on which the electrodes are formed. Therefore, the film-like adhesive for a connection circuit of the present invention is suitably used as an adhesive for a connection circuit for a glass panel. Further, according to the film-like adhesive for a connecting circuit of the present invention, a movable layer can be formed on the above-mentioned glass panel. Further, when the film-like adhesive for a connection circuit of the present invention is used as a constituent material of a multilayer ACF, the film-like adhesive for a connection circuit of the present invention is disposed on the side of the glass panel of the multilayer -19-200815560 ACF. A light resistant layer is formed on the glass panel. <Connection Structure of Circuit Member> Fig. 2 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member connected by a film-like adhesive for a connection circuit. As shown in FIG. 2, the connection structure of the circuit member according to the present embodiment includes the first circuit member 20 and the second circuit member 30 facing each other, and is provided between the first circuit member 20 and the second circuit member 30. These connected connection circuit members 10. The first circuit member 20 includes a circuit board (first circuit board) 21 and a circuit electrode (first circuit electrode) 22 formed on the main surface 21a of the circuit board 21. Further, on the main surface 21a of the circuit board 21, an insulating layer (not shown) may be formed depending on the case. On the other hand, the second circuit member 30 includes a circuit board (second circuit board) 31 and a circuit electrode (second circuit electrode) 32 formed on the main surface 31a of the circuit board 31. Further, the main surface 31a of the circuit board 31 may be formed of an insulating layer (not shown) depending on the case. The first and second circuit members 20 and 30 are not particularly limited as long as they form an electrode to be electrically connected. Specifically, there are a glass or plastic substrate on which an electrode such as ITO used for a liquid crystal display, a printed wiring board, a ceramic wiring board, a flexible wiring board, a semiconductor germanium wafer, or the like is formed. These requirements can be combined. As described above, in the present embodiment, a material such as a printed wiring board or an organic material such as polyimide may be used, and a metal such as copper or aluminum or -20-200815560 ITO (indium tin oxide) or tantalum nitride (SiNx) may be used. ), a circuit member of various surface states of inorganic materials such as cerium oxide (Si〇2). The circuit connecting member 1 包含 includes an insulating material 1 1 and conductive particles 7 . The conductive particles 7 are disposed between the circuit electrodes 22 and the circuit electrodes 3 2 which are opposed to each other, and also between the main faces 2 1 a and 3 1 a . In the connection structure of the circuit members, the circuit electrodes 22, 32 are electrically connected via the conductive particles 7. That is, the conductive particles 7 are in direct contact with both of the circuit electrodes 22, 32. Here, when the conductive particles 7 have electrical conductivity that can be electrically connected, there are no particular restrictions, and there are metal particles such as Au, Ag, Ni, Cu, Co, and flux, or carbon. Further, it is also possible to use a non-conductive glass, ceramic, plastic or the like to be coated with a conductive material such as the above metal. In this case, the thickness of the metal layer to be coated is preferably 1 〇 nm or more in order to obtain sufficient conductivity. In the connection structure of the circuit member, as described above, the conductive electrode 7 is electrically connected to the circuit electrode 22 and the circuit electrode 32 via the conductive particles 7. Therefore, the connection resistance between the circuit electrodes 22, 32 is sufficiently reduced. Therefore, the current flow between the circuit electrodes 22 and 32 is smooth, and the function of the circuit can be sufficiently exhibited. Further, the circuit connecting member 1A does not contain the conductive particles 7, and the circuit electrode 22 is in direct contact with the circuit electrode 32 to be electrically connected. The circuit connecting member 1 is formed of a cured product of a film-like adhesive for a connecting circuit of the present invention as described later, and has sufficient mobility resistance under high-humidity conditions. Therefore, it is possible to sufficiently prevent the occurrence of electrodeposition on the circuit electrodes 22, 32 when the power is supplied in a high-humidity environment, and it is possible to improve the long-term reliability of the electrical characteristics between the circuit electrodes 22, 32. -21 - 200815560 <Manufacturing Method of Connection Structure of Circuit Member> Next, a method of manufacturing the connection structure of the above-described circuit member will be described. First, the first circuit member 20 and the film-like adhesive 40 for connecting circuits described above are prepared (see Fig. 3(a)). The film-like adhesive 40 for connecting circuits is formed by forming a circuit connecting material into a film shape. The circuit connecting material contains the adhesive composition 5 and the conductive particles 7. Here, the adhesive composition 5' uses the above-mentioned phenoxy resin, epoxy resin, rubber component and latent curing agent. Further, when the circuit connecting material does not contain the conductive particles 7, an anisotropic conductive adhesive can be used as the insulating adhesive for the circuit connecting material, and in particular, an NCP called a non-conductive paste. Further, when the circuit connecting material contains the conductive particles 7, the circuit connecting material is called ACP. Therefore, the film-like adhesive for a connection circuit of the present invention having the NCF function can be used instead of the film-like adhesive 40 for a connection circuit of the ACF function, and the connection structure of the circuit member can be obtained. Further, the content of the conductive particles 7 in the circuit connecting material is preferably 0.1 to 30% by volume based on the total amount of the circuit connecting material, more preferably 0.1 to 15% by volume, and the content is less than 0.1% by volume, which is difficult to obtain. Good tendency to conduct. On the other hand, when it exceeds 3% by volume, there is a possibility of causing a short circuit of the adjacent circuit. Next, the film-like adhesive 40 for the connection circuit is placed on the surface of the circuit electrode 22 on which the first circuit member 20 is formed. Further, when the film-like adhesive 40 for the connection circuit is adhered to the support, the film for the connection circuit 22-200815560 is placed on the first circuit member 20 toward the first circuit member 20. At this time, the film-like adhesive 40 for the connection circuit is easily handled as a film. Therefore, the film-like adhesive 40 for the connection circuit can be easily interposed between the first circuit member 20 and the second circuit member 30, and the connection operation between the first circuit member 20 and the second circuit member 30 can be easily performed. Further, the film-like adhesive 40 for connecting circuits is pressed in the directions of arrows A and B in Fig. 3 (a), and the film-like circuit connecting material 40 is spliced and connected to the first circuit member 20 (refer to Fig. 3 (refer to Fig. 3 ( b)]. At this time, it can be heated while being pressurized. However, the heating temperature is a temperature at which the adhesive composition in the film-like adhesive 40 for the connection circuit is not hardened. Then, as shown in Fig. 3 (c), the second circuit member 30 is placed on the film-like adhesive 40 for connection circuit with the second circuit electrode facing the first circuit member 20. When the film-like adhesive 40 for the connection circuit is adhered to the support, the second circuit member 30 is placed on the film-like adhesive 40 for connection circuit after the support is peeled off. • The connection circuit is heated by the film-like adhesive 40, and is pressurized by the first and second circuit members 20 and 30 in the directions of arrows A and B in Fig. 3(c). The heating temperature at this time is above the activation temperature of the hardener. As described above, the connection circuit is cured by the film-like adhesive 4G', and the connection is made, that is, the connection structure of the circuit member shown in Fig. 2 is obtained. The heating temperature is, for example, 17 Torr to 200 ° C, and the connection time is, for example, 10 seconds to 1 minute. These conditions can be appropriately selected from the use, the adhesive composition, and the circuit member; post-hardening can also be performed according to the demand. As described above, when the connection structure of the circuit member is manufactured, in the connection structure of the obtained circuit -23-200815560, the conductive particles 7 can be brought into contact with both of the mutual electrodes 22 and 32, and the connection resistance of the circuit electrode 22 can be sufficiently reduced. Moreover, the distance between the circuit electrode 22 and the circuit electrode 32 of the film-like adhesive 40 for connecting circuit is hardened to a sufficiently small composition 5 to become the insulating material 1 1 ; the first 20 and the second circuit member 30, via the circuit connection member 10. In the connection structure of the obtained circuit member, the circuit connecting member has sufficient resistance to movement under high-humidity conditions by the cured product of the film-like adhesive for a connecting circuit of the present invention. Therefore, even if the connection structure of the members is energized in a high-humidity environment, electrolysis is generated on the circuit electrodes 22 and 32, and the connection reliability of the circuit electrodes 22 is excellent. [Embodiment] [Embodiment] The present invention is not limited to the following examples based on the examples and comparative examples. (Materials: Materials) First, the following materials were prepared as a compounding material for connecting thin films for circuits. Benzene oxide resin-1, the heat of the 峙, 32 heat, so that the electrical state, the adhesive circuit components are firmly connected to 1 〇, the circuit obtained by the structure can be fully prevented, the two are as follows; membranous adhesion-24 - 200815560 Synthesis of phenoxy resin from bisphenol A epoxy resin and phenol compound [4,4 ' - ( 9 -decenylene diphenol) having an indole ring structure in the molecule. The weight average molecular weight of the obtained resin is obtained by The GPC standard polystyrene conversion is 40,000. The resin is dissolved in a mass ratio of toluene (boiling point 110.6 ° C, SP 値 8.90) / ethyl acetate (boiling point 77.; rC, SP 値 9.10) = 50/50 mixed solvent, that is, a solid solution of 4% by mass of a resin solution. < phenoxy resin _〗. <Phenoxy resin-2> Bisphenol A type epoxy resin and epichlorohydrin synthesized, bisphenol A type phenoxy resin [phenol 4,4,-(1-methylethylene) double polymerization Object]. The weight average molecular weight of the obtained resin was calculated to be 30,000 by the GPC standard polystyrene. This resin was dissolved in a mixed solvent having a mass ratio of toluene/ethyl acetate = 50/50 to obtain a resin solution having a solid content of 40% by mass. Take this as <Phenoxy resin-2>. <Epoxy Resin-1> • A naphthalene type epoxy resin (naphthalene diol epoxy resin, manufactured by Dainippon Ink Chemical Industry Co., Ltd., trade name: HP-4032, epoxy equivalent 149) was prepared. Take this as <Epoxy resin-1:> ° <Epoxy Resin-2> A bisphenol A type epoxy resin (manufactured by Oiled Glue Epoxy Co., Ltd., trade name: yuppie 828, epoxy equivalent 1 84) was prepared. Take this as <Ring -25- 200815560 Oxygen Resin-2>. <Epoxy Resin-1 containing a curing agent> Preparation of a microcapsule-containing latent curing agent (microencapsulated amine-based* hardener), bisphenol F-type epoxy resin, and naphthalene-type epoxy resin An epoxy resin (epoxy equivalent: 2 02 ) of a liquid hardener having a mass ratio of 34 ·· 49 :17. Take this as <Epoxy Resin-1 > containing a hardener. <Epoxy Resin-2 Containing Curing Agent> Preparation of a microcapsule-containing latent curing agent (microencapsulated amine-based curing agent) and a bisphenol F-type epoxy resin in a mass ratio of 35:65 Epoxy resin of liquid hardener (epoxy equivalent: 2 1 3 ). Take this as <Epoxy Resin-2 containing a hardener>. <Acrylic Rubber> Φ Acrylic rubber (40 parts by weight of butyl acrylate - 30 parts by weight of ethyl acrylate - 30 parts by weight of acrylonitrile - 3 parts by weight of toluene acrylate propylene acrylate) as a rubber component, weight Average molecular weight: 800,000. This acrylic rubber was dissolved in a mixed solution of a mass ratio of toluene/ethyl acetate = 5 0/5 0 to obtain a solid solution of 15 mass / ❶. <Electrically conductive particles> A nickel layer having a thickness of 〇·2 // m was prepared on the surface of particles having polystyrene as a core, and a gold layer having a thickness of 0.0 4 A m was provided on the outer side of the nickel layer -26-200815560 Conductive particles having an average particle diameter of 5/m. [Example 1] A phenoxy resin-1, an acryl rubber, and an epoxy resin-1 containing a hardener were mixed at a mixing ratio of a solid content of 20:30:50, and then, in this mixture of 100 parts by mass. 5 parts by mass of the conductive particles were mixed and dispersed to obtain an adhesive composition. The resulting adhesive composition was applied to a partitioning plate by a roll coater (polyethylene oxide-treated polyethylene terephthalate film, thickness: 50 // m). Then, the film-like adhesive having a thickness of 25 // m was formed by heating and drying at 70 ° C for 3 minutes to obtain a film-like adhesive for a connection circuit of Example 1. [Example 2] The same procedure as in Example 1 except that the mixing ratio of the phenoxy resin-1, the acryl rubber, and the epoxy resin-1 containing the curing agent in Example 1 was changed to a solid content ratio of 20:40:40. The film-like adhesive for a connection circuit of Example 2 was obtained. [Example 3] The mixing ratio of the phenoxy resin-1, the acryl rubber, and the epoxy resin-1 containing the curing agent in Example 1 was changed to the solid content ratio of 20··20:60, and Example 1 In the same manner, a film-like adhesive for a connection circuit of Example 3 was obtained. -27· 200815560 [Example 4] Mixing ratio of phenoxy resin-1, acrylic rubber, epoxy resin-1 and epoxy resin-2 containing hardener in a solid mass ratio of 20:30:5:45 Then, 5 parts by mass of the conductive particles are mixed and dispersed in 100 parts by mass of the mixture to obtain an adhesive composition. A film-like adhesive for a connection circuit of Example 4 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. [Example 5] A phenoxy resin-2, an acryl rubber, and an epoxy resin-1 containing a hardener were mixed at a mixing ratio of a solid mass ratio of 2 0 : 3 0 : 50; then, the mixture was 10 0 The adhesive composition was obtained by mixing and dispersing 5 parts by mass of the conductive particles in 0 parts by mass. A film-like adhesive for a connection circuit of Example 5 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. [Example 6] phenoxy resin-1, acryl rubber and epoxy resin-2 containing a hardener were mixed at a mixing ratio of solid content of 20:30:50; then, 100 parts by mass of the mixture 5 parts by mass of the conductive particles were mixed and dispersed to obtain an adhesive composition. A film-like adhesive for a connection circuit of Example 6 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. -28- 200815560 [Comparative Example 1] Mixing phenoxy resin-2, acrylic rubber and epoxy resin-2 containing a hardener in a mixing ratio of solid mass ratio of 20:3 0:5 Torr; The adhesive composition was obtained by mixing and dispersing 5 parts by mass of the conductive particles in 100 parts by mass of the mixture. A film-like adhesive for a connection circuit of Comparative Example 1 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. [Comparative Example 2] phenoxy resin-1, epoxy resin-1 and hardener-containing epoxy resin-1 were mixed at a mixing ratio of solid content of 3 0 : 20 : 50; then, in this mixture 1 〇 The adhesive composition was obtained by mixing and dispersing 5 parts by mass of the conductive particles in the mass parts. A film-like adhesive for a connection circuit of Comparative Example 2 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. [Comparative Example 3], phenoxy resin-1, epoxy resin-1 and hardener-containing epoxy resin-2 were mixed at a mixing ratio of solid content of 30:20:50; then, in this mixture 1 〇 The adhesive composition was obtained by mixing and dispersing 5 parts by mass of the conductive particles in the mass parts. A film-like adhesive for a connection circuit of Comparative Example 3 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. -29- 200815560 [Comparative Example 4] Mix phenoxy resin-1, epoxy resin-2 and hardener-containing epoxy resin-1' in a solid ratio of solid content of 30:20:50; The adhesive composition was obtained by mixing and dispersing 5 parts by mass of the conductive particles in 100 parts by mass of the mixture. A thin film-like adhesive for a connection circuit of Comparative Example 4 was obtained in the same manner as in Example 1 except that the adhesive composition was used instead of the adhesive composition of Example 1. [Comparative Example 5] phenoxy resin-2, acrylic rubber and hardener-containing epoxy resin-2 were mixed at a mixing ratio of solid content of 20 ··20:60; then, 100 parts by mass of the mixture 5 parts by mass of the conductive particles were mixed and dispersed to obtain an adhesive composition. A film-like adhesive for a connection circuit of Comparative Example 5 was obtained in the same manner as in Example 1 except that the adhesive composition of Example 1 was used instead of the adhesive composition. The contact angle measurement and the mobility resistance test described below were carried out for the film-form adhesives for the connection circuits of Examples 1 to 6 and Comparative Examples 1 to 5 obtained above. The results are shown in Tables 1 and 2. <Measurement of contact angle with respect to water> The obtained connecting circuit was transferred to a sliding glass _±$ by an oven at 190 ° C for 1 hour, and heat-hardened. For the surface of the film-like adhesive after hardening, a contact angle meter (CA-Wl5〇, manufactured by Kyowa Interface Science Co., Ltd.) was used, and the temperature was measured in accordance with JIS R3275, and the temperature was -30-200815560 25±5°C, and the humidity was 50±10. Contact angle with respect to water under % conditions. Further, the measurement was carried out at three locations on the surface of the cured product, and the average of the obtained crucibles was taken as the contact angle. Moreover, the result of the hardening rate CI defined by the following formula (2) was calculated by the adhesive which hardened by the above-mentioned heat-hardening conditions, and the film adhesive for connection circuits of the Examples 1 to 6 and the comparative examples 1 to 5 were confirmed. Either '80% or more. The calculated hardening rate is shown in Tables 1 and 2. CI (%) = (Q2-Q3) / Q2xl00 (2) • In the formula (2), Q2 is the calorific value (J/g) of the adhesive before hardening measured by DSC (differential scanning calorimeter). ; Q3 is the calorific value of the adhesive after curing under the above heating conditions (190 ° C, 1 hour) (J/g <Resistance resistance test> First, the ITO comb-shaped electrode (pitch l〇〇/zm, line 85 gm, space 15/zm) of the glass substrate was attached using the obtained film-like adhesive for the connection circuit, and Layer FPC (pitch 100/zm, line 50/zm, space 50/zm, circuit height 8//m, substrate: polyimine, circuit: Cu/Sn plating) are connected in the following manner to make a circuit connection body. The film-shaped adhesive (1.5 x 25 mm) cut into a predetermined size is attached to the glass substrate with the ITO comb pattern attached at 80 ° C, lOKgf/cm 2 , and 4 seconds, and then the separator is peeled off, and then the separator is peeled off. The circuit of the 2-layer FPC is aligned with the circuit on the glass substrate side. Next, the connection was carried out by heating and pressurizing at 180 ° C, 3 MPa, and 15 seconds from the top of the FPC. The circuit connector obtained above was placed in a test cell of -31 - 200815560 at 60 ° C and 90% RH, and DC 20 V was applied to the comb electrode. After 96 hours in this state, the state of movement in the film-like adhesive connecting portion (the contact portion between the ITO electrode and the FPC-side electrode on the glass substrate side and the adhesive exposed portion) was observed with a metal microscope, and evaluated based on the following criteria. A: The amount of movement generated is small (or none). B: The amount of movement generated is very small. C: The amount of movement generated is medium. D: The amount of movement generated is very large' [Table 1]
項 泪 實施例1 實施例2 實施例3 實施例4 實施例5 實施例6 配合材料 (固形質量比) 苯氧樹脂-1 20 20 20 20 20 苯氧樹脂·2 - 一 幽 一 20 一 丙烯酸橡膠 30 40 20 30 30 30 環氧樹脂-1 - • 5 • 硬化劑含有環 氧樹脂-1 50 40 60 - 50 - 硬化劑含有環 氧樹脂-2 - - - 45 - 50 導電粒子 5 5 5 5 5 5 硬化率(％) 98.1 96.6 99.2 96.5 97.9 96.2 平均接觸角(。） 95.9 97.2 94.9 93.4 90.3 92.7 耐移動性試驗性 Α〜Β A B B B B -32- 200815560Tears Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Mating material (solid mass ratio) phenoxy resin-1 20 20 20 20 20 phenoxy resin · 2 - one quilt 20 one acrylic rubber 30 40 20 30 30 30 Epoxy resin-1 - • 5 • Hardener containing epoxy resin - 1 50 40 60 - 50 - Hardener containing epoxy resin - 2 - - - 45 - 50 Conductive particles 5 5 5 5 5 5 Hardening rate (%) 98.1 96.6 99.2 96.5 97.9 96.2 Average contact angle (.) 95.9 97.2 94.9 93.4 90.3 92.7 Resistance testability Α~Β ABBBB -32- 200815560
〔表2〕 項目 比較例1 比較例2 比較例3 比較例4 比較例5 苯氧樹脂-1 - 30 30 30 « 苯氧樹脂-2 20 • 师 20 丙烯酸橡膠 30 • 霧 20 環氧樹脂-1 • 20 20 麵 配合材料 環氧樹脂-2 - * 一 20 (固形質量比) 硬化劑含有環氧樹 脂-1 - 50 - 50 - 硬化劑含有環氧樹 脂-2 50 - 50 - 60 導電粒子 5 5 5 5 5 硬化率(％) 96.4 97.5 96.8 98.4 98.5 平均接觸角(。） 89.3 88.1 87.2 88.2 88.5 耐移動性試驗性 C D D D C〜D 如表1及表2所示，相對於硬化後對水之接觸角未達 90°的比較例1〜5之連接電路用薄膜狀黏著劑，在連接之 電路連接體的移動產生量爲中量〜大量；硬化後對水之接 觸角爲90°以上的實施例1〜6之連接電路用薄膜狀黏著劑 ，所連接之電路連接體的移動產生量微小（或無）〜少量 ;確認耐移動性充分優越。尤其，實施例2之連接電路用 薄膜狀黏著劑顯示優異之耐移動性，此係含有多量之丙烯 酸橡膠，可增大硬化後之對水的接觸角，能更提升密著力 •防濕性。 依本發明之連接電路用薄膜狀黏著劑，即使將連接之 電路連接體在高濕環境下通電時，亦可充分抑制移動的產 生之故，在高濕環境下能提升電路之連接信賴性。 -33- 200815560 〔產業上之利用〕 依本發明，可提供耐移動性優越，在高濕環境下可提 升電路之連接信賴性的連接電路用薄膜狀黏著劑。 【圖式簡單說明】 圖1爲本發明的連接電路用薄膜狀黏著劑之一實施形 態的槪略剖面圖。 圖2爲藉由連接電路用薄膜狀黏著劑所連接之電路構 件的連接構造之一實施形態的槪略剖面圖。 圖3 ( a )〜（c )爲分別將電路構件連接之一連串步驟 圖。 【主要元件符號說明】 1、40:連接電路用薄膜狀黏著劑 5 :黏著劑組成物 7 :導電粒子 1 〇 :連接電路構件 1 1 :絕緣性物質 20、30 :電路構件 2 1、3 1 :電路基板 2 1 a :電路基板2 1之主面 31a:電路基板31之主面 22、32 :電路電極 -34-[Table 2] Item Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Phenoxy resin-1 - 30 30 30 « Phenoxy resin-2 20 • Division 20 Acrylic rubber 30 • Mist 20 Epoxy resin-1 • 20 20-face mating material Epoxy-2 - * A 20 (solid mass ratio) Hardener containing epoxy resin - 1 - 50 - 50 - Hardener containing epoxy resin - 2 50 - 50 - 60 Conductive particles 5 5 5 5 5 Hardening rate (%) 96.4 97.5 96.8 98.4 98.5 Average contact angle (.) 89.3 88.1 87.2 88.2 88.5 Resistance to testability CDDDC~D As shown in Tables 1 and 2, the contact angle with respect to water after hardening In the case of the film-like adhesives for the connection circuits of Comparative Examples 1 to 5 which were less than 90°, the amount of movement of the connected circuit connectors was medium to large; and the contact angle with water after hardening was 90° or more. The film-like adhesive for the connection circuit of ～6 has a small amount (or no) to a small amount of movement of the connected circuit connector, and it is confirmed that the resistance to movement is sufficiently excellent. In particular, the film-like adhesive of the connection circuit of Example 2 exhibits excellent mobility resistance, and this contains a large amount of acrylic rubber, which can increase the contact angle with water after hardening, and can further improve the adhesion and moisture resistance. According to the film-like adhesive for a connection circuit of the present invention, even when the connected circuit connector is energized in a high-humidity environment, the movement can be sufficiently suppressed, and the connection reliability of the circuit can be improved in a high-humidity environment. -33-200815560 [Industrial use] According to the present invention, it is possible to provide a film-like adhesive for a connection circuit which is excellent in mobility resistance and can improve connection reliability of a circuit in a high-humidity environment. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing one embodiment of a film-like adhesive for a connection circuit of the present invention. Fig. 2 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member connected by a film-like adhesive for a connection circuit. Fig. 3 (a) to (c) are a series of steps for connecting circuit members, respectively. [Description of main component symbols] 1. 40: Film-like adhesive for connecting circuit 5: Adhesive composition 7: Conductive particles 1 〇: Connecting circuit member 1 1 : Insulating substance 20, 30: Circuit member 2 1 , 3 1 : circuit board 2 1 a : main surface 31a of circuit board 2 1 : main surface 22, 32 of circuit board 31: circuit electrode - 34-