CN103289630B - 粘合剂、粘合剂清漆、粘合膜及布线膜 - Google Patents
粘合剂、粘合剂清漆、粘合膜及布线膜 Download PDFInfo
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- CN103289630B CN103289630B CN201310054086.1A CN201310054086A CN103289630B CN 103289630 B CN103289630 B CN 103289630B CN 201310054086 A CN201310054086 A CN 201310054086A CN 103289630 B CN103289630 B CN 103289630B
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
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- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
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- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/264—Up to 3 mils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
比较例11 | 比较例12 | 实施例14 | 实施例15 | 实施例16 | 实施例17 | |
聚酰亚胺膜的断裂拉伸率(%) | 60 | 42 | 110 | 82 | 80 | 75 |
聚酰亚胺膜的膜厚(μm) | 50 | 25 | 25 | 25 | 50 | 25 |
初始粘合力(kN/m) | 0.7 | 0.3 | 1.5 | 1.4 | 2.0 | 1.4 |
Claims (38)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2012-037313 | 2012-02-23 | ||
JP2012037313A JP5895585B2 (ja) | 2012-02-23 | 2012-02-23 | 接着剤、接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム |
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CN103289630A CN103289630A (zh) | 2013-09-11 |
CN103289630B true CN103289630B (zh) | 2016-03-30 |
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CN201310054086.1A Expired - Fee Related CN103289630B (zh) | 2012-02-23 | 2013-02-20 | 粘合剂、粘合剂清漆、粘合膜及布线膜 |
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US (1) | US9028970B2 (zh) |
JP (1) | JP5895585B2 (zh) |
CN (1) | CN103289630B (zh) |
Families Citing this family (11)
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JP6065604B2 (ja) * | 2013-01-22 | 2017-01-25 | 日立金属株式会社 | 接着剤ワニス、接着フィルム、及び配線フィルム |
CN107636107B (zh) * | 2015-06-10 | 2021-01-05 | 昭和电工材料株式会社 | 粘接剂组合物以及连接体 |
EP3353257A1 (en) * | 2015-09-21 | 2018-08-01 | LORD Corporation | Adhesive composition and method for bonding |
JP6747022B2 (ja) * | 2016-04-04 | 2020-08-26 | 日立金属株式会社 | 接着フィルム及びフラットケーブル |
KR20180071649A (ko) * | 2016-12-20 | 2018-06-28 | 현대자동차주식회사 | 연성 평면 케이블, 이를 포함하는 차량 및 연성 평면 케이블의 제조방법 |
CN110392708B (zh) * | 2017-02-20 | 2021-11-09 | 洛德公司 | 基于接枝树脂的粘合剂组合物 |
EP3632941B1 (en) * | 2018-10-01 | 2023-08-23 | Cubicure GmbH | Resin composition |
US20220025227A1 (en) * | 2018-12-03 | 2022-01-27 | Lord Corporation | Adhesive for castable urethanes |
KR102428824B1 (ko) | 2019-12-11 | 2022-08-02 | 주식회사 포스코 | 금속-플라스틱 복합소재 및 이의 제조 방법 |
CN115516037A (zh) * | 2020-06-16 | 2022-12-23 | 住友电气工业株式会社 | 树脂组合物、自粘性绝缘电线以及绕组束 |
JP7409980B2 (ja) * | 2020-06-29 | 2024-01-09 | 株式会社日立産機システム | モールド電気機器 |
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US5290614A (en) | 1990-01-23 | 1994-03-01 | Tomoegawa Paper Co., Ltd. | Adhesive tapes for tape automated bonding |
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JPH07278258A (ja) * | 1994-04-11 | 1995-10-24 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、接着剤シート、接着剤付き金属はく、ポリイミドフィルム及び金属はく張りポリイミドフィルム |
JP3587859B2 (ja) * | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
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- 2012-02-23 JP JP2012037313A patent/JP5895585B2/ja not_active Expired - Fee Related
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2013
- 2013-02-20 CN CN201310054086.1A patent/CN103289630B/zh not_active Expired - Fee Related
- 2013-02-20 US US13/771,949 patent/US9028970B2/en not_active Expired - Fee Related
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CN1392892A (zh) * | 2000-10-02 | 2003-01-22 | Ge聚合物株式会社 | 用于集成电路托盘的聚苯氧类复合树脂组合物 |
CN102171305A (zh) * | 2008-10-04 | 2011-08-31 | 三键股份有限公司 | 光固化性粘合剂组合物 |
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US20130220674A1 (en) | 2013-08-29 |
CN103289630A (zh) | 2013-09-11 |
JP5895585B2 (ja) | 2016-03-30 |
JP2013170267A (ja) | 2013-09-02 |
US9028970B2 (en) | 2015-05-12 |
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