WO2008020577A1 - Connecting method - Google Patents
Connecting method Download PDFInfo
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- WO2008020577A1 WO2008020577A1 PCT/JP2007/065761 JP2007065761W WO2008020577A1 WO 2008020577 A1 WO2008020577 A1 WO 2008020577A1 JP 2007065761 W JP2007065761 W JP 2007065761W WO 2008020577 A1 WO2008020577 A1 WO 2008020577A1
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- WIPO (PCT)
- Prior art keywords
- adhesive layer
- anisotropic conductive
- terminal
- conductive adhesive
- connection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83862—Heat curing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- the present invention relates to a method for connecting electrical components.
- anisotropic conductive adhesive films have been used for the connection between substrates and electrical components, and for the connection between electrical components.
- a plurality of types of electrical components such as a semiconductor chip and a wiring board are connected to a glass substrate used in a liquid crystal panel using an anisotropic conductive adhesive film.
- Patent Document 1 Japanese Patent Laid-Open No. 2001-240816
- the present invention is for solving the above-described problems, and an object of the present invention is to provide an anisotropic conductive adhesive layer for a plurality of electric components having different terminal volumes due to different terminal thicknesses or terminal intervals. When connecting with each other, it is to connect the terminals of each electrical component securely using fewer kinds of anisotropic conductive adhesive layers.
- the present inventor has a large inter-terminal volume when connecting a plurality of electrical components having different inter-terminal volumes due to different terminal thicknesses or inter-terminal spacings to a substrate using an anisotropic conductive adhesive layer.
- an insulating adhesive layer is formed on the anisotropic conductive adhesive layer, the amount of adhesive required to fill the gap between the electrical component and the substrate is insulative.
- the present inventors have found that it can be supplemented with an adhesive layer and have completed the present invention.
- the present invention provides a connection terminal of the first electrical component, a connection terminal of the second electrical component having a larger inter-terminal volume than the connection terminal, respectively, a first board side terminal on the substrate surface, A method of connecting to the second substrate side terminal by an anisotropic conductive adhesive layer,
- connection terminal of the second electrical component and the second substrate-side terminal Between the connection terminal of the second electrical component and the second substrate-side terminal, the anisotropic conductive adhesive layer and the second content of conductive particles less than the anisotropic conductive adhesive layer Provided is a connection method in which an adhesive layer is disposed to connect a second electrical component.
- the inter-terminal volume refers to the volume of the gap between the connection terminals per unit area in the connection terminal formation region.
- the inter-terminal volume is larger as the terminal thickness is larger.
- the smaller the total of the connection terminal formation areas that is, the connection terminals are formed sparsely! /). big!/,.
- the first and second board-side terminals are, for example, wiring terminals formed in separate areas on the same or different boards, and connected to the connection terminals of the electrical components. That is, the shape, size, and arrangement location of each terminal are not particularly limited. The invention's effect
- connection terminal of the first electrical component and the first board side terminal and the electrical connection between the connection terminal of the second electrical component and the second board side terminal.
- Each connection is made with conductive particles in an anisotropic conductive adhesive layer. Therefore, even if the content of the conductive particles of the second adhesive layer used for connecting the second electrical component is less than that of the anisotropic conductive adhesive layer, it may not contain conductive particles. Electrical connection failure does not occur. Even if the thickness of the anisotropic conductive adhesive layer is larger than the minimum thickness required for these electrical connections, the excess anisotropic conductive adhesive is connected to the electrical parts by pressing during connection. Since it is pushed out from between the terminal and the terminal on the board side, it is eliminated, and in this case, there is no electrical connection failure.
- the mechanical adhesion between the formation region of the connection terminal of the first electrical component and the formation region of the first substrate-side terminal is obtained by changing the film thickness of the anisotropic conductive adhesive layer to the first connection terminal. And first board side By setting the thickness to be suitable for connection with the terminal, it can be performed satisfactorily.
- the mechanical adhesion between the connection region of the connection terminal of the second electrical component and the formation region of the second board-side terminal is larger in the inter-terminal volume in the second electrical component than in the first electrical component.
- the second adhesive layer together with the anisotropic conductive adhesive layer, the gaps between the terminals can be filled with these adhesives without any gaps.
- the second electrical component can be prevented from peeling off from the substrate.
- the second adhesive layer can be formed by applying a liquid adhesive layer, it is possible to easily change the film thickness so that it can be adapted to the connection of the second electrical component simply by changing the coating amount. Can do.
- the first electrical component and the second electrical component having different inter-terminal volumes can be connected to the substrate using the same anisotropic conductive adhesive film.
- FIG. 1 is a plan view of an LCD panel manufactured by the connection method of the present invention.
- FIG. 2A is a cross-sectional view taken along the line AA of the connection part of the semiconductor chip in the LCD panel.
- FIG. 2B is a BB cross-sectional view of the connection part of the wiring board in the LCD panel.
- FIG. 3A is an explanatory diagram of a manufacturing process of a connection portion of a semiconductor chip on a substrate.
- FIG. 3B is an explanatory diagram of the manufacturing process of the connection portion of the wiring board on the substrate.
- FIG. 4A is an AA cross-sectional view of a connection portion of a semiconductor chip on which an anisotropic conductive adhesive layer is formed.
- FIG. 4B is a cross-sectional view taken along the line BB of the connection portion of the wiring board on which the anisotropic conductive adhesive layer is formed.
- FIG. 5 is a cross-sectional view of a connection portion of a wiring board on which an insulating adhesive layer is formed.
- FIG. 6A is a cross-sectional view taken along the line AA in the heating and pressing step at the connection portion of the semiconductor chip on the substrate.
- FIG. 6B is a cross-sectional view taken along the line BB in the heating and pressing step at the connection portion of the wiring board on the substrate.
- FIG. 1 is a plan view of an LCD panel 1 which is an example of an electric device manufactured by the connection method of the present invention.
- the LCD panel 1 has a laminated substrate in which a front panel and a rear panel 10 are bonded together and a liquid crystal material is sealed therein.
- These front panel or rear panel 10 has a glass substrate 11, and the A metal film is patterned on the surface of the substrate 11 to form a plurality of elongated wiring portions 16.
- One end of the wiring portion 16 is a part 17 a of the first board side terminal 17, and the other end is a second board side terminal 18.
- the panel 10 is provided with an internal wiring 19, one end of which is connected to a driving circuit (not shown) such as a TFT, and the other end as a part 17 b of the first substrate side terminal 17. Collected.
- a driving circuit not shown
- the first board-side terminal 17b serving as one end of the internal wiring 19 is arranged in two rows with the first board-side terminal 17a serving as one end of the wiring section 16 described above.
- wiring portion 16 and the first and second substrate-side terminals 17 and 18 are formed of the same metal film, their film thicknesses are equal.
- the semiconductor chip 20, which is the first electrical component is formed on the first substrate side terminal 17, and the conductive particles 45 are placed in the insulating adhesive 40.
- the wiring board 25 as the second electrical component is connected to the same anisotropic conductive adhesive layer 41 on the second board side terminal 18 by being connected using the dispersed anisotropic conductive adhesive layer 41.
- the insulating adhesive layer 43 which is the second adhesive layer is used for connection. Therefore, if the wiring film (not shown) of the wiring board 25 is connected to an external circuit, an electrical signal from the external circuit is transmitted to the semiconductor chip 20 via the wiring board 25, and the electrical signal processed by the semiconductor chip 20 is transmitted.
- the display image on the LCD panel 1 can be switched by being transmitted to the drive circuit of the panel 10.
- connection structure of the LCD panel Details of the connection structure of the LCD panel are shown in FIGS. 2A and 2B.
- FIG. 2A is a cross-sectional view taken along the line AA of the connection portion of the semiconductor chip 20 in the LCD panel 1 of FIG.
- the semiconductor chip 20 has a chip body 21 and a plurality of bumps 22 arranged as connection terminals on one surface of the chip body 21, and the bumps 22 are connected to the first board-side terminal 17 on the substrate 11. It is aimed.
- the plurality of bumps 22 of the semiconductor chip 20 and the corresponding terminals of the substrate-side terminal 17 are electrically connected through the conductive particles 45, and the gap between these terminals is made of a cured product 40 ′ of an insulating adhesive. Filled, the semiconductor chip 20 and the substrate 11 are mechanically bonded.
- FIG. 2B is a cross-sectional view taken along the line BB of the connection portion of the wiring board 25 in the LCD panel 1 of FIG.
- the wiring board 25 is arranged as a connection terminal on the surface of the wiring board body 26 and the wiring board body 26.
- a plurality of electrodes 27 are provided, and the plurality of electrodes 27 are directed to the second substrate-side terminal 18 on the substrate 11. These electrodes 27 are formed more sparsely than the bumps 22 of the semiconductor chip 20 described above, and the electrode 27 is thick, so the inter-terminal volume is large, but the gap between the terminals is anisotropically conductive. Since the cured product 40 ′ of the insulating adhesive of the adhesive layer and the cured product 43 ′ of the insulating adhesive layer laminated thereon are filled, the wiring board 25 and the substrate 11 are mechanically good. It is glued to. In addition, corresponding terminals of the electrode 27 and the second substrate side terminal 18 are electrically connected via the conductive particles 45 included in the anisotropic conductive adhesive layer 41.
- FIGS. 3A and 3B to FIGS. 6A and 6B The following cross-sectional views for explaining this manufacturing process are cross-sectional views of parts corresponding to the above-described AA cross-sectional view and BB cross-sectional view.
- an anisotropic conductive adhesive film is prepared as the anisotropic conductive adhesive layer 41. More specifically, a binder containing a thermosetting resin is prepared as the insulating adhesive 40 constituting the anisotropic conductive adhesive, and the conductive particles 45 are dispersed in this to form a film. To obtain an anisotropic conductive adhesive film having a uniform film thickness.
- the film thickness of the anisotropic conductive adhesive layer 41 is set to a thickness suitable for connecting the bump 22 which is the connection terminal of the semiconductor chip 20 to the first substrate side terminal 17 and basically. Is a force that makes it equal to or greater than the total thickness of the first board-side terminal 17 and the bump 22.
- the bump 22 The thickness should be equal to or greater than thereby, as will be described later, the film piece 41a of the anisotropic conductive adhesive layer is placed between the first substrate side terminal and the plurality of bumps 22, and these are heated and pressed to form the substrate 11 and The gap between the semiconductor chip 20 and the semiconductor chip 20 is filled with an anisotropic conductive adhesive without any gap, and the substrate 11 and the semiconductor chip 20 are in close contact with each other.
- the binder contains an adhesive component such as a thermoplastic resin or rubber, the substrate 11 and the semiconductor chip 20 can be firmly bonded.
- the first film piece 41a used for connecting the semiconductor chip 20 to the first substrate side terminal 17 from the anisotropic conductive adhesive film 41 and the second substrate side terminal 18 are connected.
- the second film piece 41b used for connecting the wiring board 25 is cut out.
- the first film piece 4 la is placed on the first substrate side terminal 17 of the substrate 11 shown in FIG. 3A, and the first film piece 4 la is placed on the second substrate side terminal 18 shown in FIG. 3B. Place the second film piece 41b.
- the first substrate side terminal 17 is covered with the first film piece 41a, and as shown in FIG. 4B, the second substrate side terminal 18 is the second film side. Covered with piece 41b.
- an insulating binder containing a thermosetting resin is used, and no conductive particles are contained! /
- a paste-like insulating adhesive is prepared, and this is shown in FIG. 5 using a dispenser or the like.
- an insulating adhesive layer 43 is formed on the surface of the second film piece 41b.
- the film thickness of this insulating adhesive layer 43 is the total film thickness force S of the second film piece 41b and the insulating adhesive layer 43, basically the electrode 27 and the second substrate side terminal 18. Force S to be equal to or greater than the total thickness S, if the thickness of the second board-side terminal 18 is sufficiently thin relative to the thickness of the electrode 27, sufficient thickness to fill the gap between the electrodes 27 Therefore, it should be equal to or more than the thickness of the electrode 27.
- the thickness of the electrode 27 of the wiring board 25 is 35 m or more
- the thickness of the second board-side terminal 18 is so thin that it can be ignored with respect to the thickness of the electrode 27 of the wiring board 25.
- the thickness of the film piece 41b is 20 m or more and 25 ⁇ m or less
- the thickness of the insulating adhesive layer 43 is 5 ⁇ m or more and 35,1 m or less! /.
- the semiconductor chip 20 is aligned on the first substrate side terminal 17 with the arrangement surface of the bump 22 facing downward, and on the first film piece 41a. Place and press the semiconductor chip 20 while heating. As a result, the first film piece 4 la is heated and softened due to heat conduction, and the anisotropic conductive adhesive between each bump 22 and the first substrate side terminal 17 is pushed away by pressing the semiconductor chip 20. .
- the surface of the semiconductor chip body 21 or a protective film formed on the surface is exposed, and a recess 37 having the exposed surface as a bottom surface is formed.
- the pressed anisotropic conductive adhesive flows into the concave portion 37 by the pressing.
- thermosetting resin Since the film piece 41a contains a thermosetting resin, if the heating and pressing are further continued, while the part 37 is filled with the anisotropic conductive adhesive layer, the thermosetting resin contained therein overlaps and cures, and as shown in FIG. 2A, the semiconductor chip 20 is electrically and mechanically Also connected to.
- the insulating adhesive layer 43 is formed so that the total thickness of the insulating adhesive layer 43 and the second film piece 41b is sufficient to fill the gap between the electrodes 27. Is formed. Therefore, if the heating and pressing of the wiring board 25 is continued, the wiring board 25 is connected well both electrically and mechanically as shown in FIG. 2B.
- the binder forming the insulating adhesive layer 43 contains an adhesive component such as a thermoplastic resin or rubber, the substrate 11 and the wiring board 25 can be firmly bonded.
- the wiring board 25 is connected without forming the insulating adhesive layer 43! /,
- the electrode 27 of the wiring board 25 is compared with the bump 22 of the semiconductor chip 20. Since the inter-terminal volume is large, the terminals of the electrodes 27 cannot be filled with the anisotropic conductive adhesive, and mechanical adhesion failure between the wiring board 25 and the substrate 11 is likely to occur.
- the electrode 27 that is the connection terminal of the second electrical component is formed thicker and sparser than the bump 22 that is the connection terminal of the first electrical component (semiconductor chip 20).
- the present invention is not limited to this.
- the second connection terminal is wider than the distance between the first connection terminals.
- the amount by which the anisotropic conductive adhesive layer is pushed away during the connection is the amount that fills the recess 38 between the second connection terminals. If not enough, an insulating adhesive layer 43 is formed on the anisotropic conductive adhesive layer 41 before pressing the second electrical component.
- the second adhesive layer provided on the anisotropic conductive adhesive layer 41 is necessary for the electrical connection to reduce the conduction resistance by using more conductive particles.
- the conductive particles may not be included! /
- an insulating adhesive containing conductive particles may be provided! /.
- the inclusion of the conductive particles in the insulating adhesive layer not only increases the connection force but also increases the cost, and in particular the second adhesive containing the conductive particles.
- the agent layer is formed by applying a paste-like adhesive, it is necessary to devise a method for maintaining the dispersed state of the conductive particles in the paste-like adhesive, which complicates the manufacturing process.
- the content of the conductive particles in the second adhesive layer 43 is at least smaller than the content of the anisotropic conductive adhesive layer 41, more preferably conductive particles. Do not include.
- the formation of the second adhesive layer 43 is not limited to the application of a paste-like adhesive, and a film-shaped one may be attached to the anisotropic conductive adhesive layer 41.
- a dispensing device such as a dispenser is less expensive, and the application of a paste-like adhesive has a smaller film thickness. It can be easily changed according to the inter-terminal volume of the second connection terminal, and even if the surface of the anisotropic conductive adhesive layer on the second connection terminal is uneven, the unevenness Since it is flattened by the adhesive layer, there is an advantage that air is not easily caught in the interface between the second adhesive layer 43 and the second electrical component 25 when the second electrical component is pressed. Therefore, the second adhesive layer 43 can be formed by applying a paste-like material rather than applying a film-shaped material!
- a general coating apparatus such as a dispenser roll coater can be used to apply the paste-like second adhesive layer 43.
- the order in which the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are arranged on the second substrate side terminal 18 of the substrate 11 is the same as that on the second substrate side terminal 18.
- Anisotropic conductive adhesion In addition to sequentially arranging the agent layer 41 and the second adhesive layer 43, the anisotropic conductive adhesive layer 41 is arranged on the second substrate side terminal 18 in addition to connecting the second electrical component 25, On the other hand, the second adhesive layer 43 is disposed on the second connection terminal 27 of the second electrical component 25, and the anisotropic conductive property is formed on the second board-side terminal 18 where these may be connected. Without arranging the adhesive layer 41, the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are arranged on the second connection terminal 27 of the second electric component 25, thereby providing the second electric component. 25 can also be connected on the substrate 11.
- the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are arranged on the second board-side terminal 18 of the board 11 rather than being arranged on the second electrical component 25.
- the second electrical component 25 is easier to handle. Therefore, it is preferable that the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are sequentially disposed on the second substrate side terminal 18 before the second electrical component 25 is connected.
- the adhesive constituting the second adhesive layer 43 is a film
- the second adhesive layer 43 is first disposed on the second substrate side terminal 18 of the substrate 11.
- an anisotropic conductive adhesive layer 41 may be disposed thereon.
- the anisotropic conductive adhesive layer 41 is provided on the first and second substrate side terminals 17 and 18, the first and second substrate side terminals 17 and 18 are separately provided. Instead of attaching film pieces 41a and 41b, create a long film piece that is equal to or longer than the distance between the first and second substrate side terminals 17 and 18.
- the single long film piece may be stuck on the substrate 11 to cover the first and second substrate side terminals 17 and 18 at the same time. In this case, the time required for manufacturing can be shortened as compared to the case where a separate film piece is attached because the process of attaching the film piece only needs to be performed once.
- the order in which the first and second electrical components are connected is not particularly limited. After the second electrical component is heated and pressed, the first electrical component is heated and pressed. Then, they may be connected, or the first and second electrical components may be heated and pressed simultaneously for connection.
- the method of heating and pressing the first and second electrical components is not particularly limited, and a generally used method, for example, a method of pressing a heated head having a raised temperature against the first or second electrical component, the substrate 11 Place the connection part of the first and second electrical components in the heating table with the temperature raised, and press the first and second electrical components with the pressing head, or use both the heating table and the heating head.
- a generally used method for example, a method of pressing a heated head having a raised temperature against the first or second electrical component, the substrate 11 Place the connection part of the first and second electrical components in the heating table with the temperature raised, and press the first and second electrical components with the pressing head, or use both the heating table and the heating head.
- the conditions for heat pressing are not particularly limited! /, But in general, the optimum thermocompression bonding conditions differ depending on the thickness of the anisotropic conductive adhesive layer or the insulating adhesive layer or the type of electrical component. Therefore, it is preferable to change the heating and pressing conditions for each type of electrical component.
- the heating temperature of the semiconductor chip 20 and the wiring board 25 is 130 to 180 ° C
- the heating pressing time of the semiconductor chip 20 is 5 to 10 seconds
- the heating pressing time of the wiring board is 8 Seconds to 20 seconds
- the substrate 11 to which the first and second electrical components are connected is not limited to the above-described substrate of the LCD panel 1, but various substrates such as a substrate for a PDP panel, a base for a mobile phone or a computer may be used. It can be a substrate.
- the types of electrical components are not limited to the semiconductor chip 20 and the wiring board 25, and other components such as resistance elements can also be used.
- TAB Transmission Automated Bonding
- FPC Flexible Printed Circuit
- a rigid substrate or the like
- the number of electrical components to be connected to the substrate 11 is not limited to two types, and three or more types of electrical components having different connection terminal thicknesses can be connected to the same substrate 11.
- the thickness of the anisotropic conductive adhesive layer formed on the substrate 11 is matched to that having the smallest inter-terminal volume of the electrical component.
- the thickness of the second adhesive layer formed on the anisotropic conductive adhesive layer is set to the inter-terminal volume of each electrical component. It is preferable to change according to the size.
- the particle size and content of the conductive particles 45 used therein are not particularly limited, but the connection terminals (bumps 22, electrodes 27) Of these, it is preferable to design so that the connection terminal having the smaller tip area (connection area) is securely connected.
- connection area of the bump 22 of the semiconductor chip 20 is 2000 ⁇ m 2
- the content of conductive particles necessary to securely connect the bump 22 is 1.5 million particles / mm.
- the type of the conductive particles 45 is not particularly limited, and the surface of the metal particles or the conductive particles having conductive layers such as a metal coating layer formed on the surface of the resin particles, the surface of the metal particles or the conductive particles. Resin-coated particles covered with a resin film can be used.
- composition of the binder used for the anisotropic conductive adhesive layer 41 and the composition of the binder used for the insulating adhesive layer 43 are not particularly limited. Those that cure by are preferred. These may have the same composition or different compositions.
- thermosetting resin for example, an epoxy resin, an acrylate resin, a urea resin, a melamine resin, a phenol resin, or the like can be used as long as it is polymerized by heating.
- an epoxy resin is preferable in consideration of a good adhesive strength after curing.
- the anisotropic conductive adhesive film 41 and the insulating adhesive layer 43 contain an epoxy resin as a thermosetting resin
- the insulating adhesive layer 43 is formed on the anisotropic conductive adhesive film 41.
- the wiring with the insulating adhesive layer 43 is compared with the case where the force is not formed.
- the adhesive strength of the plate 25 increased by about 2 N / cm to 5 N / cm.
- epoxy resin bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol nopolac type epoxy resin, cresol nopolac type epoxy resin, ester type epoxy resin, alicyclic epoxy resin, etc. Or, use a mixture of two or more.
- acrylate urethane acrylate, polyester acrylate, epoxy acrylate or the like having a reactive double bond can be used alone or in combination of two or more.
- a curing agent for example, an amine compound
- a thermosetting resin for example, a thermoplastic resin and / or rubber that is an adhesive component
- a filler for example, Silica, My strength, etc.
- pigments, antistatic agents, additives such as coupling agents, coloring agents, anti-aging agents, etc. to improve adhesion to inorganic materials (eg glass substrates) 1 More than one kind can be contained.
- the binder used for the anisotropic conductive adhesive layer 41 is thermally cured.
- the epoxy resin is contained as the curable resin, the glass transition temperature is 130 to 170 ° C, the binder used for the insulating adhesive layer 43 contains the epoxy resin as the thermosetting resin, and the glass transition temperature is 110 to 120; ° C.
- connection method of the present invention requires a force S to be widely used in the manufacture of electrical parts using anisotropic conductive adhesive.
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Abstract
A method is provided for connecting a connecting terminal (22) of a first electric component (20) with a first substrate side terminal (17) on a substrate (11), and for connecting a connecting terminal (27) of a second electric component (25), which has a larger volume between the terminals compared with the connecting terminal (22), with a second substrate side terminal (18) on the substrate, by using an anisotropic conductive adhesive layer (41). Between the connecting terminal (27) of the second electric component (25) and the second substrate side terminal (18), a second adhesive layer (43) containing conductive particles (45) less than those contained in the anisotropic conductive adhesive layer (41) is arranged with the anisotropic conductive adhesive layer (41), and the second electric component (25) is connected. Thus, the first electric component (20) and the second electric component (25) having different volumes between the terminals are surely connected to the substrate (11).
Description
明 細 書 Specification
接続方法 Connection method
技術分野 Technical field
[0001] 本発明は電気部品の接続方法に関する。 The present invention relates to a method for connecting electrical components.
背景技術 Background art
[0002] 従来より基板と電気部品との接続や、電気部品同士の接続に異方導電性接着フィ ルムが用いられている。 [0002] Conventionally, anisotropic conductive adhesive films have been used for the connection between substrates and electrical components, and for the connection between electrical components.
[0003] 例えば、液晶パネルに用いられるガラス基板には、半導体チップ、配線板等の複数 種類の電気部品が異方導電性接着フィルムを用いて接続されている。 [0003] For example, a plurality of types of electrical components such as a semiconductor chip and a wiring board are connected to a glass substrate used in a liquid crystal panel using an anisotropic conductive adhesive film.
[0004] しかしながら、各電気部品の端子厚や端子間隔は必ずしも同じではなぐ端子厚や 端子間隔に応じて異方導電性接着フィルムの厚さを変えることが必要とされ、そのた めに、厚さの異なる複数種の異方導電性接着フィルムを用意して使用せねばならな いという煩雑さがあった。即ち、薄い端子の電気部品を基板に接続する際に、厚い端 子用の異方導電性接着フィルムを用いると接続不良が起こり、逆に厚い端子の電気 部品を基板に接続する際に、薄い端子用の異方導電性接着フィルムを用いると、電 気部品と基板との隙間に異方導電性接着フィルムが充填されずに空隙が生じ、その 空隙が電気部品の剥離の原因となる。 [0004] However, it is necessary to change the thickness of the anisotropic conductive adhesive film according to the terminal thickness and the terminal interval that are not necessarily the same for each electrical component. There was a problem that a plurality of types of anisotropic conductive adhesive films having different thicknesses had to be prepared and used. In other words, when connecting an electrical component with a thin terminal to the board, if an anisotropic conductive adhesive film for a thick terminal is used, a connection failure occurs. Conversely, when connecting an electrical part with a thick terminal to the board, the connection is thin. When the anisotropic conductive adhesive film for terminals is used, a gap is formed in the gap between the electrical component and the substrate without being filled with the anisotropic conductive adhesive film, and the gap causes peeling of the electrical component.
特許文献 1 :特開 2001— 240816号公報 Patent Document 1: Japanese Patent Laid-Open No. 2001-240816
発明の開示 Disclosure of the invention
発明が解決しょうとする課題 Problems to be solved by the invention
[0005] 本発明は上述した課題を解決するためのものであり、その目的は、端子厚又は端 子間隔が異なることにより端子間容積が異なる複数の電気部品を異方導電性接着剤 層を用いて接続する際に、より少ない種類の異方導電性接着剤層を用いてそれぞれ の電気部品の端子を確実に接続することにある。 [0005] The present invention is for solving the above-described problems, and an object of the present invention is to provide an anisotropic conductive adhesive layer for a plurality of electric components having different terminal volumes due to different terminal thicknesses or terminal intervals. When connecting with each other, it is to connect the terminals of each electrical component securely using fewer kinds of anisotropic conductive adhesive layers.
課題を解決するための手段 Means for solving the problem
[0006] 本発明者は、端子厚又は端子間隔が異なることにより端子間容積が異なる複数の 電気部品を、異方導電性接着剤層を用いて基板に接続する際に、端子間容積の大
きい電気部品に対しては、異方導電性接着剤層上に絶縁性接着剤層を形成してお くと、電気部品と基板との間の間隙の充填に必要な接着剤量を絶縁性接着剤層で補 えることを見出し、本発明を完成するに至った。 [0006] The present inventor has a large inter-terminal volume when connecting a plurality of electrical components having different inter-terminal volumes due to different terminal thicknesses or inter-terminal spacings to a substrate using an anisotropic conductive adhesive layer. For threshold electrical components, if an insulating adhesive layer is formed on the anisotropic conductive adhesive layer, the amount of adhesive required to fill the gap between the electrical component and the substrate is insulative. The present inventors have found that it can be supplemented with an adhesive layer and have completed the present invention.
[0007] 即ち、本発明は、第一の電気部品の接続端子、該接続端子よりも端子間容積の大 きい第二の電気部品の接続端子を、それぞれ基板表面の第一の基板側端子、第二 の基板側端子に、異方導電性接着剤層によって接続する方法であって、 That is, the present invention provides a connection terminal of the first electrical component, a connection terminal of the second electrical component having a larger inter-terminal volume than the connection terminal, respectively, a first board side terminal on the substrate surface, A method of connecting to the second substrate side terminal by an anisotropic conductive adhesive layer,
第二の電気部品の接続端子と第二の基板側端子との間に、異方導電性接着剤層 と共に、該異方導電性接着剤層よりも導電性粒子の含有量の少ない第二の接着剤 層を配置して第二の電気部品を接続する接続方法を提供する。 Between the connection terminal of the second electrical component and the second substrate-side terminal, the anisotropic conductive adhesive layer and the second content of conductive particles less than the anisotropic conductive adhesive layer Provided is a connection method in which an adhesive layer is disposed to connect a second electrical component.
[0008] ここで、端子間容積とは、接続端子の形成領域における単位面積あたりの、接続端 子同士の間隙の容積をいう。この端子間容積は、端子厚が厚い程大きぐ接続端子 の形成領域の平面図において接続端子の形成面積の合計が小さいほど(即ち、接 続端子が疎に形成されて!/、るほど)大き!/、。 Here, the inter-terminal volume refers to the volume of the gap between the connection terminals per unit area in the connection terminal formation region. The inter-terminal volume is larger as the terminal thickness is larger. In the plan view of the connection terminal formation region, the smaller the total of the connection terminal formation areas (that is, the connection terminals are formed sparsely! /). big!/,.
[0009] また、第一、第二の基板側端子とは、例えば、同一又は異なる基板上の離間した領 域にそれぞれ形成された配線端子であって、電気部品の接続端子と接続される部分 のことであり、各端子の形状、大きさ、配置場所は特に限定されるものではない。 発明の効果 [0009] The first and second board-side terminals are, for example, wiring terminals formed in separate areas on the same or different boards, and connected to the connection terminals of the electrical components. That is, the shape, size, and arrangement location of each terminal are not particularly limited. The invention's effect
[0010] 本発明によれば、第一の電気部品の接続端子と第一の基板側端子との電気的接 続と、第二の電気部品の接続端子と第二の基板側端子との電気的接続は、それぞ れ異方導電性接着剤層中の導電性粒子で行われる。従って、第二の電気部品の接 続に使用する第二の接着剤層の導電性粒子の含有量が異方導電性接着剤層より 少なくても、さらには導電性粒子を含有しなくても、電気的接続不良は生じない。な お、異方導電性接着剤層の膜厚が、これらの電気的接続に必要な最低膜厚より厚く ても、余分な異方導電性接着剤は、接続時の押圧により電気部品の接続端子と基板 側端子との間から押し出されて排除されるので、この場合にも電気的接続不良は生 じない。 [0010] According to the present invention, the electrical connection between the connection terminal of the first electrical component and the first board side terminal, and the electrical connection between the connection terminal of the second electrical component and the second board side terminal. Each connection is made with conductive particles in an anisotropic conductive adhesive layer. Therefore, even if the content of the conductive particles of the second adhesive layer used for connecting the second electrical component is less than that of the anisotropic conductive adhesive layer, it may not contain conductive particles. Electrical connection failure does not occur. Even if the thickness of the anisotropic conductive adhesive layer is larger than the minimum thickness required for these electrical connections, the excess anisotropic conductive adhesive is connected to the electrical parts by pressing during connection. Since it is pushed out from between the terminal and the terminal on the board side, it is eliminated, and in this case, there is no electrical connection failure.
[0011] 一方、第一の電気部品の接続端子の形成領域と第一の基板側端子の形成領域と の機械的接着は、異方導電性接着剤層の膜厚を、第一の接続端子と第一の基板側
端子との接続に適した厚さに設定することにより、良好に行うことができる。 [0011] On the other hand, the mechanical adhesion between the formation region of the connection terminal of the first electrical component and the formation region of the first substrate-side terminal is obtained by changing the film thickness of the anisotropic conductive adhesive layer to the first connection terminal. And first board side By setting the thickness to be suitable for connection with the terminal, it can be performed satisfactorily.
[0012] また、第二の電気部品の接続端子の形成領域と第二の基板側端子の形成領域と の機械的接着は、端子間容積が第一の電気部品より第二の電気部品で大きくても、 異方導電性接着剤層と共に第二の接着剤層を使用することにより端子間の間隙をこ れらの接着剤で隙間無く充填することができるので、良好に行うことができ、第二の電 気部品の基板からの剥離を防止できる。この場合、第二の接着剤層は、液状の接着 剤層の塗布により形成できるので、塗布量を変えるだけで、第二の電気部品の接続 に適合するように、容易に膜厚を変えることができる。 [0012] In addition, the mechanical adhesion between the connection region of the connection terminal of the second electrical component and the formation region of the second board-side terminal is larger in the inter-terminal volume in the second electrical component than in the first electrical component. However, by using the second adhesive layer together with the anisotropic conductive adhesive layer, the gaps between the terminals can be filled with these adhesives without any gaps. The second electrical component can be prevented from peeling off from the substrate. In this case, since the second adhesive layer can be formed by applying a liquid adhesive layer, it is possible to easily change the film thickness so that it can be adapted to the connection of the second electrical component simply by changing the coating amount. Can do.
[0013] したがって本発明によれば、端子間容積の異なる第一の電気部品と第二の電気部 品を、同じ異方導電性接着フィルムを用いて基板に接続することができる。 Therefore, according to the present invention, the first electrical component and the second electrical component having different inter-terminal volumes can be connected to the substrate using the same anisotropic conductive adhesive film.
図面の簡単な説明 Brief Description of Drawings
[0014] [図 1]図 1は本発明の接続方法により製造される LCDパネルの平面図である。 FIG. 1 is a plan view of an LCD panel manufactured by the connection method of the present invention.
[図 2A]図 2Aは LCDパネルにおける半導体チップの接続部位の A— A断面図である [FIG. 2A] FIG. 2A is a cross-sectional view taken along the line AA of the connection part of the semiconductor chip in the LCD panel.
[図 2B]図 2Bは LCDパネルにおける配線板の接続部位の B— B断面図である。 [FIG. 2B] FIG. 2B is a BB cross-sectional view of the connection part of the wiring board in the LCD panel.
[図 3A]図 3Aは基板上の半導体チップの接続部位の製造工程の説明図である。 [FIG. 3A] FIG. 3A is an explanatory diagram of a manufacturing process of a connection portion of a semiconductor chip on a substrate.
[図 3B]図 3Bは基板上の配線板の接続部位の製造工程の説明図である。 [FIG. 3B] FIG. 3B is an explanatory diagram of the manufacturing process of the connection portion of the wiring board on the substrate.
[図 4A]図 4Aは異方導電性接着剤層を形成した半導体チップの接続部位の A— A断 面図である。 [FIG. 4A] FIG. 4A is an AA cross-sectional view of a connection portion of a semiconductor chip on which an anisotropic conductive adhesive layer is formed.
[図 4B]図 4Bは異方導電性接着剤層を形成した配線板の接続部位の B— B断面図で ある。 [FIG. 4B] FIG. 4B is a cross-sectional view taken along the line BB of the connection portion of the wiring board on which the anisotropic conductive adhesive layer is formed.
[図 5]図 5は絶縁性接着剤層を形成した配線板の接続部位の断面図である。 FIG. 5 is a cross-sectional view of a connection portion of a wiring board on which an insulating adhesive layer is formed.
[図 6A]図 6Aは基板上の半導体チップの接続部位における加熱押圧工程の A— A 断面図である。 [FIG. 6A] FIG. 6A is a cross-sectional view taken along the line AA in the heating and pressing step at the connection portion of the semiconductor chip on the substrate.
[図 6B]図 6Bは基板上の配線板の接続部位における加熱押圧工程の B— B断面図で ある。 [FIG. 6B] FIG. 6B is a cross-sectional view taken along the line BB in the heating and pressing step at the connection portion of the wiring board on the substrate.
符号の説明 Explanation of symbols
[0015] 1 · · · LCDパネノレ
10···フロントパネル又はリアパネル [0015] 1 · · · LCD panel 10 .. Front panel or rear panel
11…基板 11 ... Board
16···配線部 16 ... Wiring section
17···第一の基板側端子 17 ··· First board side terminal
18···第二の基板側端子 18 ... Second board side terminal
19ー内部配茅泉 19-Inside hot spring
20···半導体チップ (第一の電気部品) 20 ... Semiconductor chip (first electrical component)
21···半導体チップ本体 21 ... Semiconductor chip body
22···バンプ (第一の接続端子) 22 ... Bump (first connection terminal)
25···配線板(第二の電気部品) 25 ... Wiring board (second electrical component)
26···配線板本体 26 ... Wiring board body
27···電極(第二の接続端子) 27 .. Electrode (second connection terminal)
37···凹部 37 ... Recess
38···凹部 38 ... Recess
40…絶縁性接着剤 40… Insulating adhesive
40'···異方導電性接着剤を構成する絶縁性接着剤の硬化物 40 '···· Hardened material of insulating adhesive constituting anisotropic conductive adhesive
41· · '異方導電性接着剤層(異方導電性接着フィルム) 41 ·· 'Anisotropic conductive adhesive layer (anisotropic conductive adhesive film)
41a, 41b…異方導電性接着フィルムのフィルム片 41a, 41b ... Film pieces of anisotropic conductive adhesive film
43···絶縁性接着剤層(第二の接着剤層) 43 .. Insulating adhesive layer (second adhesive layer)
43'…絶縁性接着剤の硬化物 43 '... Hardened product of insulating adhesive
45···導電性粒子 45 ... Conductive particles
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
[0016] 以下、図面を参照しつつ、本発明を詳細に説明する。なお、各図中、同一符号は、 同一又は同等の構成要素を表している。 Hereinafter, the present invention will be described in detail with reference to the drawings. In the drawings, the same reference numerals represent the same or equivalent components.
[0017] 図 1は、本発明の接続方法により製造された電気装置の一例である、 LCDパネル 1 の平面図を示している。この LCDパネル 1は、フロントパネルとリアパネル 10が貼り合 わされ、その内部に液晶材料が封入された積層基板を有している。 FIG. 1 is a plan view of an LCD panel 1 which is an example of an electric device manufactured by the connection method of the present invention. The LCD panel 1 has a laminated substrate in which a front panel and a rear panel 10 are bonded together and a liquid crystal material is sealed therein.
[0018] これらのフロントパネル又はリアパネル 10はガラス製の基板 11を有しており、その
基板 11の表面には金属膜がパターユングされて複数本の細長の配線部 16が形成さ れている。この配線部 16の一端は第一の基板側端子 17の一部 17aとなり、他端は第 二の基板側端子 18となっている。 [0018] These front panel or rear panel 10 has a glass substrate 11, and the A metal film is patterned on the surface of the substrate 11 to form a plurality of elongated wiring portions 16. One end of the wiring portion 16 is a part 17 a of the first board side terminal 17, and the other end is a second board side terminal 18.
[0019] また、パネル 10には内部配線 19が設けられており、その一端は TFT等の駆動回 路(不図示)に接続され、他端は第一の基板側端子 17の一部 17bとして集められて いる。図 1に示したように、この内部配線 19の一端となる第一の基板側端子 17bは、 前述の配線部 16の一端となる第一の基板側端子 17aと二列に並べられている。 In addition, the panel 10 is provided with an internal wiring 19, one end of which is connected to a driving circuit (not shown) such as a TFT, and the other end as a part 17 b of the first substrate side terminal 17. Collected. As shown in FIG. 1, the first board-side terminal 17b serving as one end of the internal wiring 19 is arranged in two rows with the first board-side terminal 17a serving as one end of the wiring section 16 described above.
[0020] ここで、配線部 16と、第一、第二の基板側端子 17、 18は同じ金属膜から形成され ているので、これらの膜厚は等しくなつている。 Here, since the wiring portion 16 and the first and second substrate-side terminals 17 and 18 are formed of the same metal film, their film thicknesses are equal.
[0021] この LCDパネル 1においては、後に詳述するように、第一の基板側端子 17上に第 一の電気部品である半導体チップ 20が、絶縁性接着剤 40中に導電性粒子 45を分 散させた異方導電性接着剤層 41を用いて接続され、第二の基板側端子 18上に第 二の電気部品である配線板 25が、同様の異方導電性接着剤層 41に加えて、第二 の接着剤層である絶縁性接着剤層 43を用いて接続されている。したがって、配線板 25の配線膜 (不図示)を外部回路に接続すれば、外部回路からの電気信号が配線 板 25を介して半導体チップ 20に伝達され、半導体チップ 20で処理された電気信号 がパネル 10の駆動回路に伝達され、 LCDパネル 1の表示画像を切り替えることがで きる。 In the LCD panel 1, as will be described in detail later, the semiconductor chip 20, which is the first electrical component, is formed on the first substrate side terminal 17, and the conductive particles 45 are placed in the insulating adhesive 40. The wiring board 25 as the second electrical component is connected to the same anisotropic conductive adhesive layer 41 on the second board side terminal 18 by being connected using the dispersed anisotropic conductive adhesive layer 41. In addition, the insulating adhesive layer 43 which is the second adhesive layer is used for connection. Therefore, if the wiring film (not shown) of the wiring board 25 is connected to an external circuit, an electrical signal from the external circuit is transmitted to the semiconductor chip 20 via the wiring board 25, and the electrical signal processed by the semiconductor chip 20 is transmitted. The display image on the LCD panel 1 can be switched by being transmitted to the drive circuit of the panel 10.
[0022] LCDパネルの接続構造の詳細を、図 2A及び図 2Bに示す。 Details of the connection structure of the LCD panel are shown in FIGS. 2A and 2B.
[0023] 図 2Aは、図 1の LCDパネル 1における半導体チップ 20の接続部分の A— A断面 図である。半導体チップ 20はチップ本体 21と、チップ本体 21の一面に接続端子とし て配置された複数のバンプ 22とを有しており、このバンプ 22を基板 11上の第一の基 板側端子 17に向けている。そして半導体チップ 20の複数のバンプ 22と基板側端子 17の対応する端子同士力 導電性粒子 45を介して電気的に接続され、これらの端 子の間隙が絶縁性接着剤の硬化物 40'で充填され、半導体チップ 20と基板 11が機 械的に接着している。 FIG. 2A is a cross-sectional view taken along the line AA of the connection portion of the semiconductor chip 20 in the LCD panel 1 of FIG. The semiconductor chip 20 has a chip body 21 and a plurality of bumps 22 arranged as connection terminals on one surface of the chip body 21, and the bumps 22 are connected to the first board-side terminal 17 on the substrate 11. It is aimed. The plurality of bumps 22 of the semiconductor chip 20 and the corresponding terminals of the substrate-side terminal 17 are electrically connected through the conductive particles 45, and the gap between these terminals is made of a cured product 40 ′ of an insulating adhesive. Filled, the semiconductor chip 20 and the substrate 11 are mechanically bonded.
[0024] 図 2Bは図 1の LCDパネル 1における配線板 25の接続部分の B— B断面図である。 FIG. 2B is a cross-sectional view taken along the line BB of the connection portion of the wiring board 25 in the LCD panel 1 of FIG.
配線板 25は配線板本体 26と、配線板本体 26の表面に接続端子として配置された
複数の電極 27とを有し、この複数の電極 27を基板 11上の第二の基板側端子 18に 向けている。これらの電極 27は、前述の半導体チップ 20のバンプ 22よりも疎に形成 されており、また、電極 27の厚みも厚いため、端子間容積が大きいが、端子の間隙 には、異方導電性接着剤層の絶縁性接着剤の硬化物 40'と、その上に積層された 絶縁性接着剤層の硬化物 43'が満たされているので、配線板 25と基板 11とは機械 的に良好に接着されている。また、電極 27と第二の基板側端子 18の対応する端子 同士は、異方導電性接着剤層 41に含まれる導電性粒子 45を介して電気的に接続さ れている。 The wiring board 25 is arranged as a connection terminal on the surface of the wiring board body 26 and the wiring board body 26. A plurality of electrodes 27 are provided, and the plurality of electrodes 27 are directed to the second substrate-side terminal 18 on the substrate 11. These electrodes 27 are formed more sparsely than the bumps 22 of the semiconductor chip 20 described above, and the electrode 27 is thick, so the inter-terminal volume is large, but the gap between the terminals is anisotropically conductive. Since the cured product 40 ′ of the insulating adhesive of the adhesive layer and the cured product 43 ′ of the insulating adhesive layer laminated thereon are filled, the wiring board 25 and the substrate 11 are mechanically good. It is glued to. In addition, corresponding terminals of the electrode 27 and the second substrate side terminal 18 are electrically connected via the conductive particles 45 included in the anisotropic conductive adhesive layer 41.
[0025] 次に、図 3A、 3B〜図 6A、 6Bを参照しつつ LCDパネル 1の製造工程について説 明する。なお、この製造工程を説明する以下の断面図は、上述の A— A断面図、 B— B断面図に対応する部位の断面図である。 Next, a manufacturing process of the LCD panel 1 will be described with reference to FIGS. 3A and 3B to FIGS. 6A and 6B. The following cross-sectional views for explaining this manufacturing process are cross-sectional views of parts corresponding to the above-described AA cross-sectional view and BB cross-sectional view.
[0026] 先ず、異方導電性接着剤層 41として異方導電性接着フィルムを作成する。より具 体的には、異方導電性接着剤を構成する絶縁性接着剤 40として、熱硬化性樹脂を 含有するバインダーを用意し、この中に導電性粒子 45を分散させ、これをフィルム状 に成形し、膜厚が均一な異方導電性接着フィルムを得る。 First, an anisotropic conductive adhesive film is prepared as the anisotropic conductive adhesive layer 41. More specifically, a binder containing a thermosetting resin is prepared as the insulating adhesive 40 constituting the anisotropic conductive adhesive, and the conductive particles 45 are dispersed in this to form a film. To obtain an anisotropic conductive adhesive film having a uniform film thickness.
[0027] ここで、異方導電性接着剤層 41の膜厚は、第一の基板側端子 17に半導体チップ 20の接続端子であるバンプ 22を接続するのに適した厚さとし、基本的には、第一の 基板側端子 17とバンプ 22の合計厚と同等以上になるようにする力 第一の基板側 端子 17の厚みがバンプ 22の厚みに対して充分に薄い場合には、バンプ 22の厚みと 同等又はそれ以上とする。これにより、後述するように、第一の基板側端子と複数の バンプ 22との間に異方導電性接着剤層のフィルム片 41aを載置し、これらを加熱加 圧することにより、基板 11と半導体チップ 20との間隙が異方導電性接着剤で隙間無 く充填され、基板 11と半導体チップ 20とが密着する。特に、バインダーに熱可塑性 樹脂やゴム等の接着性成分を含有させた場合には、基板 11と半導体チップ 20とを 強固に接着することができる。 Here, the film thickness of the anisotropic conductive adhesive layer 41 is set to a thickness suitable for connecting the bump 22 which is the connection terminal of the semiconductor chip 20 to the first substrate side terminal 17 and basically. Is a force that makes it equal to or greater than the total thickness of the first board-side terminal 17 and the bump 22. If the thickness of the first board-side terminal 17 is sufficiently thin relative to the thickness of the bump 22, the bump 22 The thickness should be equal to or greater than Thereby, as will be described later, the film piece 41a of the anisotropic conductive adhesive layer is placed between the first substrate side terminal and the plurality of bumps 22, and these are heated and pressed to form the substrate 11 and The gap between the semiconductor chip 20 and the semiconductor chip 20 is filled with an anisotropic conductive adhesive without any gap, and the substrate 11 and the semiconductor chip 20 are in close contact with each other. In particular, when the binder contains an adhesive component such as a thermoplastic resin or rubber, the substrate 11 and the semiconductor chip 20 can be firmly bonded.
[0028] 次に、異方導電性接着フィルム 41から、第一の基板側端子 17への半導体チップ 2 0の接続に用いる第一のフィルム片 41aと、第二の基板側端子 18上への配線板 25 の接続に用いる第二のフィルム片 41bを切り出す。
[0029] そして、図 3Aに示す基板 11の第一の基板側端子 17上に、この第一のフィルム片 4 laを載置すると共に、図 3Bに示す第二の基板側端子 18上に第二のフィルム片 41b を載置する。 Next, the first film piece 41a used for connecting the semiconductor chip 20 to the first substrate side terminal 17 from the anisotropic conductive adhesive film 41 and the second substrate side terminal 18 are connected. The second film piece 41b used for connecting the wiring board 25 is cut out. Then, the first film piece 4 la is placed on the first substrate side terminal 17 of the substrate 11 shown in FIG. 3A, and the first film piece 4 la is placed on the second substrate side terminal 18 shown in FIG. 3B. Place the second film piece 41b.
[0030] これにより、図 4Aに示すように、第一の基板側端子 17は第一のフィルム片 41aで 覆われ、図 4Bに示すように、第二の基板側端子 18は第二のフィルム片 41bで覆わ れる。 Accordingly, as shown in FIG. 4A, the first substrate side terminal 17 is covered with the first film piece 41a, and as shown in FIG. 4B, the second substrate side terminal 18 is the second film side. Covered with piece 41b.
[0031] 次に、熱硬化性樹脂を含有した絶縁性バインダーからなり、導電粒子を含有しな!/、 ペースト状の絶縁性接着剤を調製し、これをデイスペンサ等を用いて、図 5に示すよう に、第二のフィルム片 41bの表面に塗布し、絶縁性接着剤層 43を形成する。この絶 縁性接着剤層 43の膜厚は、第二のフィルム片 41bと絶縁性接着剤層 43との合計膜 厚力 S、基本的には電極 27と第二の基板側端子 18との合計厚と同等以上になるよう にする力 S、第二の基板側端子 18の厚みが電極 27の厚みに対して充分に薄い場合 には、電極 27同士の間隙を充填するのに十分な厚さとなるように、電極 27の厚さと 同等又はそれ以上とする。 [0031] Next, an insulating binder containing a thermosetting resin is used, and no conductive particles are contained! / A paste-like insulating adhesive is prepared, and this is shown in FIG. 5 using a dispenser or the like. As shown, an insulating adhesive layer 43 is formed on the surface of the second film piece 41b. The film thickness of this insulating adhesive layer 43 is the total film thickness force S of the second film piece 41b and the insulating adhesive layer 43, basically the electrode 27 and the second substrate side terminal 18. Force S to be equal to or greater than the total thickness S, if the thickness of the second board-side terminal 18 is sufficiently thin relative to the thickness of the electrode 27, sufficient thickness to fill the gap between the electrodes 27 Therefore, it should be equal to or more than the thickness of the electrode 27.
[0032] 例えば、第二の基板側端子 18の厚みが配線板 25の電極 27の厚みに対して無視 出来る程度に薄ぐ配線板 25の電極 27の厚みが 35 m以上の場合、第二のフィル ム片 41bの厚みは 20 m以上 25 μ m以下とし、絶縁性接着剤層 43の膜厚は 5 μ m 以上 35 ,1 m以下とすることが好まし!/、。 [0032] For example, when the thickness of the electrode 27 of the wiring board 25 is 35 m or more, the thickness of the second board-side terminal 18 is so thin that it can be ignored with respect to the thickness of the electrode 27 of the wiring board 25. It is preferable that the thickness of the film piece 41b is 20 m or more and 25 μm or less, and the thickness of the insulating adhesive layer 43 is 5 μm or more and 35,1 m or less! /.
[0033] 次に、図 6Aに示すように、半導体チップ 20を、バンプ 22の配置面を下側に向け、 第一の基板側端子 17上で位置合わせし、第一のフィルム片 41a上に配置し、半導 体チップ 20を加熱しながら押圧する。これにより、熱伝導によって第一のフィルム片 4 laが昇温して軟化し、半導体チップ 20の押圧によって各バンプ 22と第一の基板側 端子 17との間の異方導電性接着剤を押し退ける。 Next, as shown in FIG. 6A, the semiconductor chip 20 is aligned on the first substrate side terminal 17 with the arrangement surface of the bump 22 facing downward, and on the first film piece 41a. Place and press the semiconductor chip 20 while heating. As a result, the first film piece 4 la is heated and softened due to heat conduction, and the anisotropic conductive adhesive between each bump 22 and the first substrate side terminal 17 is pushed away by pressing the semiconductor chip 20. .
[0034] この押圧前のバンプ 22同士の間には半導体チップ本体 21の表面又はその表面上 に形成された保護膜等が露出し、これらの露出表面を底面とする凹部 37が形成され ているが、押圧によりこの凹部 37に上述の押し退けられた異方導電性接着剤が流れ 込む。 [0034] Between the bumps 22 before pressing, the surface of the semiconductor chip body 21 or a protective film formed on the surface is exposed, and a recess 37 having the exposed surface as a bottom surface is formed. However, the pressed anisotropic conductive adhesive flows into the concave portion 37 by the pressing.
[0035] フィルム片 41aは熱硬化性樹脂を含有しているため、更に加熱押圧を続けると、凹
部 37が異方導電性接着剤層で充填されたまま、そこに含まれる熱硬化性樹脂が重 合して硬化し、図 2Aに示したように、半導体チップ 20が電気的にも機械的にも接続 される。 [0035] Since the film piece 41a contains a thermosetting resin, if the heating and pressing are further continued, While the part 37 is filled with the anisotropic conductive adhesive layer, the thermosetting resin contained therein overlaps and cures, and as shown in FIG. 2A, the semiconductor chip 20 is electrically and mechanically Also connected to.
[0036] 一方、図 6Bに示すように、配線板 25を、その電極 27の形成面を下側に向け、電極 27と第二の基板側端子とを位置合わせし、配線板 25を加熱しながら押圧する。これ により、熱伝導によって絶縁性接着剤層 43と異方導電性接着フィルムの第二のフィ ルム片 41bの両方が加熱されて軟化し、各電極 27と基板側端子との間の絶縁性接 着剤と異方導電性接着剤を押し退ける。 On the other hand, as shown in FIG. 6B, with the wiring board 25 facing the formation surface of the electrode 27 downward, the electrode 27 and the second board side terminal are aligned, and the wiring board 25 is heated. Press while pressing. As a result, both the insulating adhesive layer 43 and the second film piece 41b of the anisotropic conductive adhesive film are heated and softened by heat conduction, and the insulating contact between each electrode 27 and the board side terminal is heated. Push away the adhesive and anisotropic conductive adhesive.
[0037] この押圧前の配線板 25の電極 27同士の間には、配線板本体 26の表面又はその 表面上の保護膜等が露出し、これらの露出表面を底面とする凹部 38が形成されてい る力 押圧によりこの凹部 38に上述の押し退けられた絶縁性接着剤と異方導電性接 着剤の双方が流れ込む。 [0037] Between the electrodes 27 of the wiring board 25 before pressing, the surface of the wiring board body 26 or a protective film on the surface is exposed, and a recess 38 having the exposed surface as a bottom surface is formed. Due to the pressing force, both the insulating adhesive and the anisotropic conductive adhesive that have been pushed away flow into the recess 38.
[0038] また、絶縁性接着剤層 43と第二のフィルム片 41bとの合計膜厚が電極 27同士の間 隙を充填するのに十分な厚さとなるように、絶縁性接着剤層 43が形成されている。し たがって、配線板 25の加熱押圧を続けると、図 2Bに示したように、配線板 25が電気 的にも機械的にも良好に接続される。 [0038] Further, the insulating adhesive layer 43 is formed so that the total thickness of the insulating adhesive layer 43 and the second film piece 41b is sufficient to fill the gap between the electrodes 27. Is formed. Therefore, if the heating and pressing of the wiring board 25 is continued, the wiring board 25 is connected well both electrically and mechanically as shown in FIG. 2B.
[0039] 特に、絶縁性接着剤層 43を形成するバインダーに熱可塑性樹脂やゴム等の接着 性成分を含有させると、基板 11と配線板 25とを強固に接着することができる。 [0039] In particular, if the binder forming the insulating adhesive layer 43 contains an adhesive component such as a thermoplastic resin or rubber, the substrate 11 and the wiring board 25 can be firmly bonded.
[0040] これに対し、絶縁性接着剤層 43を形成しな!/、で配線板 25を接続した場合には、半 導体チップ 20のバンプ 22に比して、配線板 25の電極 27の端子間容積が大きいから 、電極 27の端子間を異方導電性接着剤で満たすことができず、配線板 25と基板 11 との機械的な接着不良が生じ易くなる。 On the other hand, when the wiring board 25 is connected without forming the insulating adhesive layer 43! /, The electrode 27 of the wiring board 25 is compared with the bump 22 of the semiconductor chip 20. Since the inter-terminal volume is large, the terminals of the electrodes 27 cannot be filled with the anisotropic conductive adhesive, and mechanical adhesion failure between the wiring board 25 and the substrate 11 is likely to occur.
[0041] 以上は、第二の電気部品(配線板 25)の接続端子である電極 27が第一の電気部 品(半導体チップ 20)の接続端子であるバンプ 22よりも厚ぐかつ疎に形成されてい る場合について説明した力 S、本発明はこれに限定されるものではない。 [0041] As described above, the electrode 27 that is the connection terminal of the second electrical component (wiring board 25) is formed thicker and sparser than the bump 22 that is the connection terminal of the first electrical component (semiconductor chip 20). However, the present invention is not limited to this.
[0042] 例えば、第一の接続端子と第二の接続端子の厚さが同じであっても、第一の接続 端子の間隔よりも第二の接続端子の間隔が広ぐ第二の接続端子がその接続時に 異方導電性接着剤層を押し退ける量が、第二の接続端子間の凹部 38を充填する量
に足りない場合には、第二の電気部品を押圧する前に、異方導電性接着剤層 41上 に絶縁性接着剤層 43を形成する。 [0042] For example, even if the first connection terminal and the second connection terminal have the same thickness, the second connection terminal is wider than the distance between the first connection terminals. The amount by which the anisotropic conductive adhesive layer is pushed away during the connection is the amount that fills the recess 38 between the second connection terminals. If not enough, an insulating adhesive layer 43 is formed on the anisotropic conductive adhesive layer 41 before pressing the second electrical component.
[0043] 本発明においては、電気的接続に、より多くの導電粒子を用いて導通抵抗を低くす る等の必要により、異方導電性接着剤層 41の上に設ける第二の接着剤層として、導 電性粒子を含まな!/、絶縁性接着剤層 43を用いることに代えて、絶縁性接着剤に導 電性粒子を含有させたものを設けてもよ!/、。 [0043] In the present invention, the second adhesive layer provided on the anisotropic conductive adhesive layer 41 is necessary for the electrical connection to reduce the conduction resistance by using more conductive particles. As an alternative, the conductive particles may not be included! / Instead of using the insulating adhesive layer 43, an insulating adhesive containing conductive particles may be provided! /.
[0044] しかし、導電性粒子は高価なため、絶縁性接着剤層に導電性粒子を含有させると 接続に力、かるコストが高くなるだけでなぐ特に導電性粒子を含有させた第二の接着 剤層をペースト状の接着剤の塗布によって形成する場合には、そのペースト状の接 着剤において導電性粒子の分散状態を維持させるための工夫が必要になり、製造 工程が煩雑になる。 [0044] However, since the conductive particles are expensive, the inclusion of the conductive particles in the insulating adhesive layer not only increases the connection force but also increases the cost, and in particular the second adhesive containing the conductive particles. When the agent layer is formed by applying a paste-like adhesive, it is necessary to devise a method for maintaining the dispersed state of the conductive particles in the paste-like adhesive, which complicates the manufacturing process.
[0045] 従って、通常は、第二の接着剤層 43の導電性粒子の含有量は少なくとも異方導電 性接着剤層 41の含有量よりも少ない方が好ましぐより好ましくは導電性粒子を含有 させないことである。 Therefore, it is usually preferable that the content of the conductive particles in the second adhesive layer 43 is at least smaller than the content of the anisotropic conductive adhesive layer 41, more preferably conductive particles. Do not include.
[0046] 第二の接着剤層 43の形成は、ペースト状の接着剤の塗布に限定されず、フィルム 状に成形したものを異方導電性接着剤層 41に貼付してもよい。 The formation of the second adhesive layer 43 is not limited to the application of a paste-like adhesive, and a film-shaped one may be attached to the anisotropic conductive adhesive layer 41.
[0047] しかしながら、フィルム状に成形したものを貼付するための仮貼り装置に比べ、ディ スペンサ等の塗布装置の方が安価である上、ペースト状の接着剤の塗布は、その膜 厚を第二の接続端子の端子間容積に合わせて容易に変更可能であるという点と、第 二の接続端子上の異方導電性接着剤層の表面に凹凸があっても、その凹凸が第二 の接着剤層で平坦化されるので、第二の電気部品を押圧する際に、第二の接着剤 層 43と第二の電気部品 25の界面に空気が巻き込まれ難いという利点がある。従って 、第二の接着剤層 43の形成は、フィルム状に成形したものを貼付するよりも、ペース ト状のものを塗布する方が優れて!/、る。 [0047] However, compared with a temporary sticking device for sticking a film-shaped one, a dispensing device such as a dispenser is less expensive, and the application of a paste-like adhesive has a smaller film thickness. It can be easily changed according to the inter-terminal volume of the second connection terminal, and even if the surface of the anisotropic conductive adhesive layer on the second connection terminal is uneven, the unevenness Since it is flattened by the adhesive layer, there is an advantage that air is not easily caught in the interface between the second adhesive layer 43 and the second electrical component 25 when the second electrical component is pressed. Therefore, the second adhesive layer 43 can be formed by applying a paste-like material rather than applying a film-shaped material!
[0048] なお、ペースト状の第二の接着剤層 43の塗布には、デイスペンサゃロールコーター 等一般的な塗布装置を用いることができる。 [0048] A general coating apparatus such as a dispenser roll coater can be used to apply the paste-like second adhesive layer 43.
[0049] 本発明において、基板 11の第二の基板側端子 18上に異方導電性接着剤層 41と 第二の接着剤層 43を配置する順序は、第二の基板側端子 18上に異方導電性接着
剤層 41と第二の接着剤層 43を順次配置してから、第二の電気部品 25を接続する他 、第二の基板側端子 18上に異方導電性接着剤層 41を配置し、一方、第二の電気部 品 25の第二の接続端子 27上に第二の接着剤層 43を配置し、これらを接続してもよ ぐ第二の基板側端子 18上に異方導電性接着剤層 41を配置せずに、第二の電気 部品 25の第二の接続端子 27上に異方導電性接着剤層 41と第二の接着剤層 43を 配置して第二の電気部品 25を基板 11上に接続することもできる。 In the present invention, the order in which the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are arranged on the second substrate side terminal 18 of the substrate 11 is the same as that on the second substrate side terminal 18. Anisotropic conductive adhesion In addition to sequentially arranging the agent layer 41 and the second adhesive layer 43, the anisotropic conductive adhesive layer 41 is arranged on the second substrate side terminal 18 in addition to connecting the second electrical component 25, On the other hand, the second adhesive layer 43 is disposed on the second connection terminal 27 of the second electrical component 25, and the anisotropic conductive property is formed on the second board-side terminal 18 where these may be connected. Without arranging the adhesive layer 41, the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are arranged on the second connection terminal 27 of the second electric component 25, thereby providing the second electric component. 25 can also be connected on the substrate 11.
[0050] しかし、異方導電性接着剤層 41と第二の接着剤層 43は、第二の電気部品 25に配 置するよりも、基板 11の第二の基板側端子 18上に配置した方が第二の電気部品 25 の取り扱いが容易である。したがって、第二の基板側端子 18上に異方導電性接着 剤層 41と第二の接着剤層 43を順次配置してから、第二の電気部品 25を接続するこ とが好ましい。 However, the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are arranged on the second board-side terminal 18 of the board 11 rather than being arranged on the second electrical component 25. The second electrical component 25 is easier to handle. Therefore, it is preferable that the anisotropic conductive adhesive layer 41 and the second adhesive layer 43 are sequentially disposed on the second substrate side terminal 18 before the second electrical component 25 is connected.
[0051] また、第二の接着剤層 43を構成する接着剤がフィルム状の場合には、基板 11の第 二の基板側端子 18上に先ず第二の接着剤層 43を配置してから、その上に異方導 電性接着剤層 41を配置してもよい。 [0051] If the adhesive constituting the second adhesive layer 43 is a film, the second adhesive layer 43 is first disposed on the second substrate side terminal 18 of the substrate 11. In addition, an anisotropic conductive adhesive layer 41 may be disposed thereon.
[0052] 本発明において、第一、第二の基板側端子 17、 18上に異方導電性接着剤層 41を 設ける態様としては、第一、第二の基板側端子 17、 18上に別々の異方導電性接着 フィルムのフィルム片 41a、 41bを貼付することに代えて、第一、第二の基板側端子 1 7、 18間の距離と同じかそれよりも長い長尺フィルム片を作成し、この 1枚の長尺フィ ルム片を基板 11上に貼付し、第一、第二の基板側端子 17、 18を同時に被覆するよ うに構成してもよい。この場合、フィルム片を貼付する工程が 1回で済むので、別々の フィルム片を貼付する場合に比べて製造に要する時間を短くすることができる。 In the present invention, as an aspect in which the anisotropic conductive adhesive layer 41 is provided on the first and second substrate side terminals 17 and 18, the first and second substrate side terminals 17 and 18 are separately provided. Instead of attaching film pieces 41a and 41b, create a long film piece that is equal to or longer than the distance between the first and second substrate side terminals 17 and 18. The single long film piece may be stuck on the substrate 11 to cover the first and second substrate side terminals 17 and 18 at the same time. In this case, the time required for manufacturing can be shortened as compared to the case where a separate film piece is attached because the process of attaching the film piece only needs to be performed once.
[0053] 本発明の接続方法において、第一、第二の電気部品を接続する順番は特に限定 されず、第二の電気部品を加熱押圧して接続した後、第一の電気部品を加熱押圧し て接続してもよいし、第一、第二の電気部品を同時に加熱押圧して接続してもよい。 In the connection method of the present invention, the order in which the first and second electrical components are connected is not particularly limited. After the second electrical component is heated and pressed, the first electrical component is heated and pressed. Then, they may be connected, or the first and second electrical components may be heated and pressed simultaneously for connection.
[0054] 第一、第二の電気部品を加熱押圧する方法は特に限定されず、一般に用いられる 方法、例えば、昇温した加熱ヘッドを第一、第二の電気部品に押し当てる方法、基板 11における第一、第二の電気部品の接続部分を昇温した加熱台に載置し、第一、 第二の電気部品を押圧ヘッドで押圧する方法、又は加熱台と加熱ヘッドの両方を用
いる方法がある。 [0054] The method of heating and pressing the first and second electrical components is not particularly limited, and a generally used method, for example, a method of pressing a heated head having a raised temperature against the first or second electrical component, the substrate 11 Place the connection part of the first and second electrical components in the heating table with the temperature raised, and press the first and second electrical components with the pressing head, or use both the heating table and the heating head. There is a way.
[0055] 加熱押圧の条件は特に限定されな!/、が、一般に異方導電性接着剤層や絶縁性接 着剤層の厚みや、電気部品の種類が異なると最適な熱圧着条件も異なるので、電気 部品の種類毎に加熱押圧の条件を変えることが好ましい。一例を述べると、半導体 チップ 20と配線板 25の加熱温度はそれぞれ 130〜; 180°Cであり、半導体チップ 20 の加熱押圧時間は 5秒〜 10秒であり、配線板の加熱押圧時間は 8秒〜 20秒である [0055] The conditions for heat pressing are not particularly limited! /, But in general, the optimum thermocompression bonding conditions differ depending on the thickness of the anisotropic conductive adhesive layer or the insulating adhesive layer or the type of electrical component. Therefore, it is preferable to change the heating and pressing conditions for each type of electrical component. For example, the heating temperature of the semiconductor chip 20 and the wiring board 25 is 130 to 180 ° C, the heating pressing time of the semiconductor chip 20 is 5 to 10 seconds, and the heating pressing time of the wiring board is 8 Seconds to 20 seconds
[0056] 本発明により接続する基板 11、半導体チップ 20、配線板 25それ自体の種類にも 特に限定はない。 [0056] There are no particular limitations on the types of the substrate 11, the semiconductor chip 20, and the wiring board 25 themselves connected according to the present invention.
[0057] 例えば、第一、第二の電気部品を接続する基板 11は、上述した LCDパネル 1の基 板に限定されず、 PDP用パネルの基板、携帯電話やコンピュータ用の基盤等、種々 の基板とすることができる。 [0057] For example, the substrate 11 to which the first and second electrical components are connected is not limited to the above-described substrate of the LCD panel 1, but various substrates such as a substrate for a PDP panel, a base for a mobile phone or a computer may be used. It can be a substrate.
[0058] 電気部品の種類は半導体チップ 20と配線板 25に限定されず、抵抗素子等他の部 品を用いることもできる。 [0058] The types of electrical components are not limited to the semiconductor chip 20 and the wiring board 25, and other components such as resistance elements can also be used.
[0059] 配線板 25についても、 TAB (Tape Automated Bonding) , FPC (Flexible P rinted Circuit)、リジッド基板等を用いることができる。 As the wiring board 25, TAB (Tape Automated Bonding), FPC (Flexible Printed Circuit), a rigid substrate, or the like can be used.
[0060] また、基板 11に接続する電気部品は 2種類に限定されず、接続端子の厚さの異な る 3種類以上の電気部品を同じ基板 11に接続することもできる。この場合、基板 11 上に形成する異方導電性接着剤層の膜厚は、電気部品の端子間容積が最も小さい ものに合わせることが好ましい。また、他の 2種類以上の電気部品を基板 11に接続 する際には、異方導電性接着剤層上に形成する第二の接着剤層の膜厚を、各電気 部品の端子間容積の大きさに合わせて変えることが好ましい。 [0060] In addition, the number of electrical components to be connected to the substrate 11 is not limited to two types, and three or more types of electrical components having different connection terminal thicknesses can be connected to the same substrate 11. In this case, it is preferable that the thickness of the anisotropic conductive adhesive layer formed on the substrate 11 is matched to that having the smallest inter-terminal volume of the electrical component. In addition, when connecting two or more other types of electrical components to the substrate 11, the thickness of the second adhesive layer formed on the anisotropic conductive adhesive layer is set to the inter-terminal volume of each electrical component. It is preferable to change according to the size.
[0061] 本発明に用いる異方導電性接着剤層 41自体の構成に関しては、そこに用いる導 電性粒子 45の粒径と含有量は特に限定されないが、接続端子 (バンプ 22、電極 27) のうち、先端の面積 (接続面積)が小さい方の接続端子が確実に接続されるように設 計することが好ましい。 [0061] Regarding the configuration of the anisotropic conductive adhesive layer 41 itself used in the present invention, the particle size and content of the conductive particles 45 used therein are not particularly limited, but the connection terminals (bumps 22, electrodes 27) Of these, it is preferable to design so that the connection terminal having the smaller tip area (connection area) is securely connected.
[0062] 一例を述べると、半導体チップ 20のバンプ 22の接続面積が 2000 μ m2である場合 に、バンプ 22を確実に接続するのに必要な導電性粒子の含有量は 150万個/ mm3
以上 600万個/ mm3以下であるのに対し、配線板 25の電極 27の接続面積が 4万 m2である場合に、電極 27を確実に接続するのに必要な導電性粒子の含有量は 3万 個/ mm3以上 100万個/ mm3以下である。 [0062] For example, when the connection area of the bump 22 of the semiconductor chip 20 is 2000 μm 2 , the content of conductive particles necessary to securely connect the bump 22 is 1.5 million particles / mm. Three The content of conductive particles necessary to securely connect the electrode 27 when the connection area of the electrode 27 of the wiring board 25 is 40,000 m 2 while the above is 6 million pieces / mm 3 or less Is 30,000 / mm 3 or more and 1 million / mm 3 or less.
[0063] 導電性粒子 45の種類は特に限定されず、金属粒子、樹脂粒子の表面に金属メッ キ層等の導電層が形成された導電性被覆粒子、金属粒子や導電性被覆粒子の表 面が樹脂膜で覆われた樹脂被覆粒子等を用いることができる。 [0063] The type of the conductive particles 45 is not particularly limited, and the surface of the metal particles or the conductive particles having conductive layers such as a metal coating layer formed on the surface of the resin particles, the surface of the metal particles or the conductive particles. Resin-coated particles covered with a resin film can be used.
[0064] 異方導電性接着剤層 41に用いるバインダーの組成と、絶縁性接着剤層 43に用い るバインダーの組成は特に限定されるものではないが、熱硬化性樹脂を含有し、カロ 熱により硬化するものが好ましい。これらは同一組成としてもよく、異なる組成としても よい。 [0064] The composition of the binder used for the anisotropic conductive adhesive layer 41 and the composition of the binder used for the insulating adhesive layer 43 are not particularly limited. Those that cure by are preferred. These may have the same composition or different compositions.
[0065] 熱硬化性樹脂としては、加熱により重合するものであれば、例えば、エポキシ樹脂、 アタリレート樹脂、尿素樹脂、メラミン樹脂、フエノール樹脂等を使用することができる 。中でも、硬化後の接着強度が良好な点を考慮すると、エポキシ樹脂が好ましい。 [0065] As the thermosetting resin, for example, an epoxy resin, an acrylate resin, a urea resin, a melamine resin, a phenol resin, or the like can be used as long as it is polymerized by heating. Among these, an epoxy resin is preferable in consideration of a good adhesive strength after curing.
[0066] 実際、異方導電性接着フィルム 41と絶縁性接着剤層 43に、熱硬化性樹脂としてェ ポキシ樹脂を含有させると、異方導電性接着フィルム 41の上に絶縁性接着剤層 43 を形成して配線板 25を接続した場合と、形成せずに配線板 25を接続した場合とを 比べると、絶縁性接着剤層 43を形成した場合が形成しな力 た場合に比べて配線 板 25の接着強度が 2N/cm〜5N/cm程度上昇した。 [0066] Actually, when the anisotropic conductive adhesive film 41 and the insulating adhesive layer 43 contain an epoxy resin as a thermosetting resin, the insulating adhesive layer 43 is formed on the anisotropic conductive adhesive film 41. When the wiring board 25 is connected without forming the wiring board, and when the wiring board 25 is connected without forming the wiring board, the wiring with the insulating adhesive layer 43 is compared with the case where the force is not formed. The adhesive strength of the plate 25 increased by about 2 N / cm to 5 N / cm.
[0067] エポキシ樹脂としては、ビスフエノーノレ A型エポキシ樹脂、ビスフエノール F型ェポキ シ樹脂、フエノールノポラック型エポキシ樹脂、クレゾールノポラック型エポキシ樹脂、 エステル型エポキシ樹脂、脂環型エポキシ樹脂等を単独、又は 2種類以上混合して 用いること力 Sでさる。 [0067] As the epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol nopolac type epoxy resin, cresol nopolac type epoxy resin, ester type epoxy resin, alicyclic epoxy resin, etc. Or, use a mixture of two or more.
[0068] アタリレートとしては、反応性二重結合を有するウレタンアタリレート、ポリエステルァ タリレート、エポキシアタリレート等を単独又は 2種類以上用いることができる。 [0068] As the acrylate, urethane acrylate, polyester acrylate, epoxy acrylate or the like having a reactive double bond can be used alone or in combination of two or more.
[0069] また、上述したバインダーには必要に応じて、熱硬化性樹脂の重合を促進させる硬 化剤 (例えばアミン系化合物)、接着性成分である熱可塑性樹脂及び/又はゴム、充 填剤 (シリカ、マイ力等)、顔料、帯電防止剤、無機材料 (例えばガラス基板)への接 着性を高めるためのカップリング剤、着色剤、老化防止剤等の添加剤のいずれか 1
種類以上を含有させることができる。 [0069] In addition, the binder described above, if necessary, a curing agent (for example, an amine compound) that accelerates the polymerization of a thermosetting resin, a thermoplastic resin and / or rubber that is an adhesive component, and a filler. (Silica, My strength, etc.), pigments, antistatic agents, additives such as coupling agents, coloring agents, anti-aging agents, etc. to improve adhesion to inorganic materials (eg glass substrates) 1 More than one kind can be contained.
[0070] 異方導電性接着剤層 41のバインダーの組成と絶縁性接着剤層 43に用いるバイン ダ一の組成の一例を述べると、異方導電性接着剤層 41に用いるバインダーは熱硬 化性樹脂としてエポキシ樹脂を含有し、ガラス転移温度を 130〜170°Cとし、絶縁性 接着剤層 43に用いるバインダーは熱硬化性樹脂としてエポキシ樹脂を含有し、ガラ ス転移温度を 110〜; 120°Cとする。 [0070] An example of the binder composition of the anisotropic conductive adhesive layer 41 and the binder composition used for the insulating adhesive layer 43 will be described. The binder used for the anisotropic conductive adhesive layer 41 is thermally cured. The epoxy resin is contained as the curable resin, the glass transition temperature is 130 to 170 ° C, the binder used for the insulating adhesive layer 43 contains the epoxy resin as the thermosetting resin, and the glass transition temperature is 110 to 120; ° C.
産業上の利用可能性 Industrial applicability
[0071] 本発明の接続方法は、異方導電性接着剤を用いる電気部品の製造に広く使用す ること力 Sでさる。
[0071] The connection method of the present invention requires a force S to be widely used in the manufacture of electrical parts using anisotropic conductive adhesive.
Claims
[1] 第一の電気部品の接続端子、該接続端子よりも端子間容積の大きい第二の電気 部品の接続端子を、それぞれ基板表面の第一の基板側端子、第二の基板側端子に 、異方導電性接着剤層を用いて接続する方法であって、 [1] The connection terminal of the first electrical component and the connection terminal of the second electrical component having a larger inter-terminal volume than the connection terminal are respectively used as the first board side terminal and the second board side terminal on the substrate surface. A method of connecting using an anisotropic conductive adhesive layer,
第二の電気部品の接続端子と第二の基板側端子との間に、異方導電性接着剤層 と共に該異方導電性接着剤層よりも導電性粒子の含有量の少ない第二の接着剤層 を配置して第二の電気部品を接続する接続方法。 Between the connection terminal of the second electrical component and the second substrate-side terminal, the second adhesive having an anisotropic conductive adhesive layer and a lower content of conductive particles than the anisotropic conductive adhesive layer A connection method in which the second electrical component is connected by arranging the agent layer.
[2] 第二の接着剤層が、導電性粒子を含有しな!、絶縁性接着剤層である請求項 1記載 の接続方法。 [2] The connection method according to claim 1, wherein the second adhesive layer does not contain conductive particles and is an insulating adhesive layer.
[3] 第二の電気部品の接続端子が第一の電気部品の接続端子に比して端子厚が大き い請求項 1又は 2記載の接続方法。 [3] The connection method according to claim 1 or 2, wherein the connection terminal of the second electrical component is thicker than the connection terminal of the first electrical component.
[4] 第二の電気部品の接続端子が第一の電気部品の接続端子に比して端子間隔が 広レ、請求項;!〜 3の!/、ずれかに記載の接続方法。 [4] The connection method according to any one of claims 1 to 3, wherein the connection terminal of the second electrical component is wider than the connection terminal of the first electrical component.
[5] 異方導電性接着剤層を第二の基板側端子上に配置した後、その異方導電性接着 剤層上に第二の接着剤層を配置する請求項 1〜4のいずれかに記載の接続方法。 [5] The method according to any one of claims 1 to 4, wherein after the anisotropic conductive adhesive layer is disposed on the second substrate-side terminal, the second adhesive layer is disposed on the anisotropic conductive adhesive layer. The connection method described in 1.
[6] 異方導電性接着剤層として異方導電性接着フィルムを使用し、流動性を有する接 着剤を異方導電性接着フィルム上に塗布して第二の接着剤層を形成する請求項 5 記載の接続方法。 [6] A method in which an anisotropic conductive adhesive film is used as the anisotropic conductive adhesive layer, and a second adhesive layer is formed by applying a fluid adhesive on the anisotropic conductive adhesive film. Item 5. Connection method.
[7] 第一の基板側端子上の異方導電性接着剤層と第二の基板側端子上の異方導電 性接着剤層の厚みを等しくする請求項 1〜6のいずれかに記載の接続方法。 [7] The anisotropic conductive adhesive layer on the first board side terminal and the anisotropic conductive adhesive layer on the second board side terminal are equal in thickness. Connection method.
[8] 第一の電気部品として半導体チップを用い、第二の電気部品として配線板を用い る請求項 1〜7のいずれかに記載の接続方法。
8. The connection method according to any one of claims 1 to 7, wherein a semiconductor chip is used as the first electrical component and a wiring board is used as the second electrical component.
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JPH11195866A (en) * | 1997-12-27 | 1999-07-21 | Canon Inc | Multichip module and manufacture thereof |
JP2004136673A (en) * | 1997-02-27 | 2004-05-13 | Seiko Epson Corp | Bonded structure, liquid crystal device, and electronic equipment |
JP2005191386A (en) * | 2003-12-26 | 2005-07-14 | Optrex Corp | Electrode connecting method and method for manufacturing liquid crystal display element |
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JPS63310581A (en) * | 1987-06-12 | 1988-12-19 | Canon Inc | Film body for electric connection |
JPH0513119A (en) * | 1991-07-04 | 1993-01-22 | Sharp Corp | Tape connector for connecting electronic parts |
JPH0645024A (en) * | 1992-07-22 | 1994-02-18 | Hitachi Chem Co Ltd | Anisotropic conductive adhesive film |
JP4032439B2 (en) * | 1996-05-23 | 2008-01-16 | 日立化成工業株式会社 | Connection member, electrode connection structure and connection method using the connection member |
JP2000113919A (en) * | 1998-08-03 | 2000-04-21 | Sony Corp | Electrical connection device and electrically connecting method |
JP2002093484A (en) * | 2000-09-11 | 2002-03-29 | Shin Etsu Polymer Co Ltd | Heat seal connector and connecting structure using the same |
JP4706142B2 (en) * | 2001-07-31 | 2011-06-22 | 日立化成工業株式会社 | Adhesive for circuit connection, circuit connection method using the same, and connection structure |
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JP2004136673A (en) * | 1997-02-27 | 2004-05-13 | Seiko Epson Corp | Bonded structure, liquid crystal device, and electronic equipment |
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