CN101981913B - 晶片级光学元件的安装 - Google Patents
晶片级光学元件的安装 Download PDFInfo
- Publication number
- CN101981913B CN101981913B CN200980111373.3A CN200980111373A CN101981913B CN 101981913 B CN101981913 B CN 101981913B CN 200980111373 A CN200980111373 A CN 200980111373A CN 101981913 B CN101981913 B CN 101981913B
- Authority
- CN
- China
- Prior art keywords
- imageing sensor
- optical laminate
- top surface
- housing
- camera model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000012546 transfer Methods 0.000 claims description 9
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- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 7
- 239000006059 cover glass Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
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- 241000218202 Coptis Species 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/005—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having spherical lenses only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3093708P | 2008-02-22 | 2008-02-22 | |
US61/030,937 | 2008-02-22 | ||
US12/368,454 US9118825B2 (en) | 2008-02-22 | 2009-02-10 | Attachment of wafer level optics |
US12/368,454 | 2009-02-10 | ||
PCT/US2009/034528 WO2009105547A1 (en) | 2008-02-22 | 2009-02-19 | Attachment of wafer level optics |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101981913A CN101981913A (zh) | 2011-02-23 |
CN101981913B true CN101981913B (zh) | 2014-08-13 |
Family
ID=40985899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980111373.3A Expired - Fee Related CN101981913B (zh) | 2008-02-22 | 2009-02-19 | 晶片级光学元件的安装 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9118825B2 (zh) |
JP (2) | JP5829025B2 (zh) |
CN (1) | CN101981913B (zh) |
WO (1) | WO2009105547A1 (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
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US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
JP2010525412A (ja) | 2007-04-24 | 2010-07-22 | フレックストロニクス エーピー エルエルシー | 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール |
US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
EP2621158B1 (en) * | 2009-09-16 | 2017-11-08 | Medigus Ltd. | Small diameter visualization probes |
US20140320621A1 (en) * | 2009-09-16 | 2014-10-30 | Medigus Ltd. | Small diameter video camera heads and visualization probes and medical devices containing them |
US8760571B2 (en) * | 2009-09-21 | 2014-06-24 | Microsoft Corporation | Alignment of lens and image sensor |
JP2011082215A (ja) * | 2009-10-02 | 2011-04-21 | Olympus Corp | 撮像素子、撮像ユニット |
CN102096168A (zh) * | 2009-12-14 | 2011-06-15 | 昆山西钛微电子科技有限公司 | 免调焦光学摄像头模组 |
US8538215B2 (en) | 2010-05-20 | 2013-09-17 | Analog Devices, Inc. | Optical package and related methods |
US8308379B2 (en) | 2010-12-01 | 2012-11-13 | Digitaloptics Corporation | Three-pole tilt control system for camera module |
CN102486560A (zh) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
US8593561B2 (en) * | 2011-03-01 | 2013-11-26 | Omnivision Technologies, Inc. | Camera module and method for fabricating the same |
TW201307938A (zh) * | 2011-08-10 | 2013-02-16 | Hon Hai Prec Ind Co Ltd | 間隔環及鏡頭模組 |
WO2013052676A1 (en) | 2011-10-07 | 2013-04-11 | Analog Devices, Inc. | Systems and methods for air release in cavity packages |
CN103091808A (zh) * | 2011-11-03 | 2013-05-08 | 昆山西钛微电子科技有限公司 | 免调焦光学摄像头模组 |
US8842951B2 (en) | 2012-03-02 | 2014-09-23 | Analog Devices, Inc. | Systems and methods for passive alignment of opto-electronic components |
US9029759B2 (en) | 2012-04-12 | 2015-05-12 | Nan Chang O-Film Optoelectronics Technology Ltd | Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same |
US9716193B2 (en) | 2012-05-02 | 2017-07-25 | Analog Devices, Inc. | Integrated optical sensor module |
US9001268B2 (en) | 2012-08-10 | 2015-04-07 | Nan Chang O-Film Optoelectronics Technology Ltd | Auto-focus camera module with flexible printed circuit extension |
US10884551B2 (en) | 2013-05-16 | 2021-01-05 | Analog Devices, Inc. | Integrated gesture sensor module |
US9386203B2 (en) * | 2013-10-28 | 2016-07-05 | Omnivision Technologies, Inc. | Compact spacer in multi-lens array module |
US9887221B2 (en) | 2014-02-18 | 2018-02-06 | Heptagon Micro Optics Pte. Ltd. | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
EP2942938B1 (en) * | 2014-05-07 | 2021-01-27 | Veoneer Sweden AB | Camera module for a motor vehicle and method of pre-focusing a lens objective in a lens holder |
US9590129B2 (en) | 2014-11-19 | 2017-03-07 | Analog Devices Global | Optical sensor module |
FR3029013A1 (fr) | 2014-11-21 | 2016-05-27 | Stmicroelectronics (Grenoble 2) Sas | Dispositif electronique comprenant des puces empilees |
US9773740B2 (en) | 2014-11-26 | 2017-09-26 | Stmicroelectronics (Grenoble 2) Sas | Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive |
US9728510B2 (en) | 2015-04-10 | 2017-08-08 | Analog Devices, Inc. | Cavity package with composite substrate |
EP3112924B1 (en) | 2015-06-30 | 2021-07-28 | ams AG | Optical hybrid lens and method for producing an optical hybrid lens |
EP3398182A1 (en) * | 2015-12-31 | 2018-11-07 | Robert Bosch GmbH | Intelligent distributed vision traffic marker and method thereof |
US10488632B2 (en) * | 2016-01-20 | 2019-11-26 | Mems Optical Zoom Corporation | MEMS lens actuator |
TWI648586B (zh) * | 2016-03-15 | 2019-01-21 | 寧波舜宇光電信息有限公司 | Camera module and array camera module based on integrated packaging process |
JPWO2017203594A1 (ja) * | 2016-05-24 | 2018-11-15 | オリンパス株式会社 | 内視鏡用撮像ユニット、および内視鏡 |
JP6390763B1 (ja) * | 2017-06-28 | 2018-09-19 | Smk株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US10712197B2 (en) | 2018-01-11 | 2020-07-14 | Analog Devices Global Unlimited Company | Optical sensor package |
CN111487729A (zh) * | 2020-04-10 | 2020-08-04 | 武汉昱升光器件有限公司 | 一种光器件耦合uv胶水点胶方法 |
CN111853699B (zh) * | 2020-08-28 | 2021-02-12 | 广东烨嘉光电科技股份有限公司 | 一种大孔径的三片式透镜光学镜头 |
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JP6054344B2 (ja) | 2016-12-27 |
US9118825B2 (en) | 2015-08-25 |
WO2009105547A1 (en) | 2009-08-27 |
US20090213262A1 (en) | 2009-08-27 |
JP2014238596A (ja) | 2014-12-18 |
CN101981913A (zh) | 2011-02-23 |
JP2011514054A (ja) | 2011-04-28 |
JP5829025B2 (ja) | 2015-12-09 |
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