CN101693353A - Tool with sintered body polishing surface and method of manufacturing the same - Google Patents
Tool with sintered body polishing surface and method of manufacturing the same Download PDFInfo
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- CN101693353A CN101693353A CN200910170789A CN200910170789A CN101693353A CN 101693353 A CN101693353 A CN 101693353A CN 200910170789 A CN200910170789 A CN 200910170789A CN 200910170789 A CN200910170789 A CN 200910170789A CN 101693353 A CN101693353 A CN 101693353A
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- Prior art keywords
- milling tool
- grind section
- tool according
- abrasive particle
- sintered body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
- Y10T428/24579—Parallel ribs and/or grooves with particulate matter
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides an efficiently processible polishing tool, particularly used for a CMP pad conditioner, capable of solving problems in a fixing strength for fixing abrasive grains to a base plate and problems in nonuniform polished surface and a method of effectively manufacturing the polishing tool. The polishing tool (1) comprises a polishing part formed of a super abrasive grain sintered body sintered integrally with the lining material of a cemented carbide. The polishing part comprises a plurality of polishing units (2) with top parts. The top parts are positioned on an approximately same plane. The polishing units (2) are formed by forming a linear groove (3) group in the polishing part.
Description
The application is at the applying date: on August 25th, 2006, application number: 200680030735.2, denomination of invention: have the instrument of sintered body polishing surface and manufacture method thereof and dividing an application of proposing.
Technical field
The present invention relates to a kind of instrument and manufacture method thereof with sintered body polishing surface.Especially, the present invention relates to a kind of can to cmp (chemical-mechanical polishing: the be called for short CMP) pad that mainly constitutes by the hard urethanes with or the various semi-conducting material milling tool that carries out high flatness and high efficiency processing with and effective manufacture method.
Background technology
In recent years, along with the development of the distribution multiple stratification in the super LSI device, in the planarization that makes metal film wafers such as dielectric film between the layer or silicon, adopt CMP.And, need often or off and on to regulate the surface of this grinding pad in order to keep the high planarization and the wafer grinding rate of employed grinding pad among the CMP (being generally hard foamed polyurethane system).
In the past, when regulating this grinding pad, used to have a kind ofly the Buddha's warrior attendant abrasive particle to be fixedly installed to instrument on the substrate by electro-deposition.Example as the instrument of the adjusting usefulness of this electro-deposition type, the known rotating polishing tool (patent documentation 1) that following formation is arranged, that is: its central authorities at the circular surface of circular plate type base station are provided with the hollow region that does not dispose abrasive particle, in its arranged outside first area, and then in the arranged outside second abrasive grain layer zone of first area, and devices spaced apart is provided with the little abrasive grain layer of multiple row portion on the first abrasive grain layer zone, each little abrasive grain layer portion utilizes metal to electroplate will to surpass abrasive particle mutually to be fixedly installed in the lip-deep structure that roughly is the spherical protrusion of part, and the second abrasive grain layer zone is to utilize metal to electroplate will to surpass mutually abrasive particle to be fixedly installed in formation in the ring-type circumferential bulges portion.
The instrument of this electro-deposition type, because abrasive particle just fixes by the nickel of electro-deposition the fixed installation of substrate with coming physical property, so differs and satisfy confining force surely, the Buddha's warrior attendant abrasive particle can come off in the use, also has room for improvement life tools.
In addition, known have a kind of following milling tool, that is: it has with resinoid bond and will be fixedly installed in grindstone material layer on the circular Plane of rotation by the abrasive particle that diamond etc. forms, and is provided with to radial and concentric circles slit (patent documentation 2) on this grindstone material laminar surface.
Yet, owing to keep intensity not necessarily to be able to the level that satisfies by the abrasive particle of resin-bonded agent material, thereby, can't obtain sufficient life tools according to the purposes difference, in the electro-deposition instrument, do not reach the level that can satisfy in addition yet.
In addition, known have following a kind of dressing tool, and promptly it is formed with many mat golds diamond thin film (patent documentation 3) by gas phase synthesis method on the acting surface of the base member with protuberance.
Yet, in utilizing the forming process of gas phase synthesis method, on base member less concavo-convex, form relatively difficulty of diamond thin faithfully, and differ and obtain enough precision surely, can not say that in addition the engaging force of film and base member is very abundant.
In above-mentioned milling tool in the past (pad trimmer), owing to be the structure that on substrate (base member), is installed with a plurality of abrasive particle particles that particle directly has nothing in common with each other, so be difficult to obtain same abrasive particle (summit) level, therefore in adjusting operation, only be used with respect to the most outstanding particle of substrate (base member) face, the result is the consumption aggravation that is applied in these particles of over load, therefore finally in most cases becomes before reaching original life-span and can't use.
If do not rely on the grinding pad and the free abrasive of foaming urethanes system, but utilize the lip-deep instrument of base member of rigid metal system that the super abrasive particle of diamond etc. is fixed in, come wafers such as silicon are processed, then can save the time and the funds that are used to adjust, but, the super abrasive grain layers such as diamond that are disposed on the base member and constitute cutting edge are had and keep high-precision plane in order to be achieved.Yet this instrument but is not achieved.
Patent documentation 1: the Japan Patent spy opens the 2002-337050 communique
Patent documentation 2: the Japan Patent spy opens the 2004-291184 communique
Patent documentation 3: Japanese patent laid-open 10-071559 communique
Summary of the invention
Problem of the present invention is to provide a kind of abrasive particle that solved to the fixed installation strength problem of substrate and uneven abradant surface problem etc. and the milling tool that can process expeditiously and effective manufacture method thereof.Particularly as CMP pad trimmer, provide a kind of milling tool of can high accuracy and expeditiously the surface of semiconductor wafer etc. being processed.
In the process that the inventor repeats to further investigate in order to solve above-mentioned problem, discovery is in the milling tool with the grind section that is made of super abrasive particle sintered body, can solve above-mentioned problem by on grind section, forming specific a plurality of units polish, after further studying, finished the present invention.
That is, the present invention relates to a kind of above-mentioned milling tool, it is the milling tool with the grind section that is made of super abrasive particle sintered body, and grind section comprises a plurality of units polish with top, and each top is on the roughly same mutually plane.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein grind section is made of the super abrasive particle sintered body that one is sintered on the superhard alloy lining material, and units polish forms by the straight-line groove group is set on this grind section.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein whetted a knife in the top.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is quadrangular pyramid shape or quadrangular pyramid platform shape.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is a quadrangular pyramid platform shape, is whetted a knife at least one limit at top.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is triangle taper or triangular cone table shape.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is the triangular cone table shape, is whetted a knife at least one limit at top.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is the shape of the linearly crest line in top.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is quadrangular pyramid shape or triangle taper, being spaced apart more than the following 200um of 1500um of units polish.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein units polish is quadrangular pyramid shape or triangle taper, and the height of units polish is more than the following 30um of 200um.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein super abrasive particle is a diamond.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein adamantine nominal particle size is below the 40-60um.
In addition, the present invention relates to a kind of above-mentioned milling tool, the thickness of wherein super abrasive particle sintered body is more than the 0.1mm.
In addition, the present invention relates to a kind of above-mentioned milling tool, it is discoideus or circular.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein grind section is discoideus or circular.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein the external diameter of grind section is more than the 90mm.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein the top of grind section is below the 1mm with respect to the height of bottom land.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein grind section is cut apart grind section by 2 or 4 and is constituted, this cut apart grind section be respectively central angle equate fan-shaped.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein cut apart grind section and have 2 groove groups, the first groove faciation is set up abreast for the edge of the radial direction of cutting apart grind section, the second groove group and the first groove group quadrature and form.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein grind section is cut apart grind section by 3 or 6 and is constituted, this cut apart grind section be respectively central angle equate fan-shaped.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein cut apart grind section and have 3 groove groups, the first groove faciation is set up abreast for the edge of the radial direction of cutting apart grind section, and the second groove group and three-flute faciation form with 60 ° and 120 ° of crossing modes respectively the first groove group.
In addition, the present invention relates to a kind of above-mentioned milling tool, wherein groove forms by line cutting spark machined.
In addition, the present invention relates to a kind of above-mentioned milling tool, it is a CMP pad trimmer.
In addition, the present invention relates to a kind of manufacture method of above-mentioned milling tool, this milling tool has the grind section that is made of super abrasive particle sintered body, and this manufacture method comprises:
(1) will surpass on the lining material that the abrasive particle one is sintered in superhard alloy, obtain the operation of super abrasive particle sintered body,
The operation of the grind section planarization of the super abrasive particle sintered body that (2) will obtain,
(3) on the super abrasive particle sintered body of planarization, the straight-line groove group is set, forms a plurality of units polish, and as the operation of grind section.
In addition, the present invention relates to a kind of manufacture method of above-mentioned milling tool, this milling tool has the grind section that is made of super abrasive particle sintered body, and this manufacture method comprises:
(1) will surpass on the lining material that the abrasive particle one is sintered in superhard alloy, obtain the operation of super abrasive particle sintered body,
(2) go out a fan-shaped operation of cutting apart grind section from the super abrasive particle sintered body cutting that obtains.
(3) obtain the operation of a plurality of fan-segmentation grind section of equating with the fan-segmentation grind section central angle that obtains in above-mentioned (2),
A plurality of fan-segmentation grind section that (4) will obtain are closely in abutting connection with also being fixedly installed on the smooth substrate surface, and as the operation of discoideus or circular grind section,
(5) cutting apart on the border between grind section of the discoideus or circular grind section that in above-mentioned (4), obtains groove is set, and forms the operation of a plurality of units polish.
In addition, the present invention relates to a kind of recasting method of above-mentioned milling tool, this milling tool is above-mentioned any described milling tool, and this recasting method comprises by the remake operation at groove and units polish top of line cutting spark machined.
Milling tool of the present invention uses the grind section that is made of super abrasive particle sintered body, and carries out sintering more than the melt temperature of bond material, and the fixed installation intensity that has super abrasive particle thus is big, and in fact can not produce the advantage that comes off.Especially, using diamond particles as under the situation of super abrasive particle, bond material metal melting and diamond are supplied with diamond under thermodynamically stable temperature, pressure condition in manufacturing process, diamond particle in being partially dissolved in the bond material metal and powerful ground by integrated, fixedly mount intensity thus and further increase, come off so in fact eliminate.
In addition, usually, then can produce inhomogeneous if under very big area, carry out sintering, and form relatively difficulty of overall uniform grind section with bigger diameter, but from a plurality of milling tools that grind section is made super abrasive particle sintered body of cutting apart of the present invention, be to excise the bigger fan-segmentation grind section of diameter, and, therefore can make whole even and high-precision milling tool with its a plurality of combinations and as large diameter grind section from the super abrasive particle sintered body that can not form the uneven minor diameter of sintering.
In addition, be formed with the grind section of units polish, the surface is made of the super abrasive particle sintered body with abundant thickness, even therefore units polish is worn and torn because of use, also can cut easily remake groove and units polish such as spark machined by line, and use as instrument of the present invention again.
In addition, in the present invention, each units polish is the part that goes out from the super abrasive particle sintered body cutting at random of diamond sinter etc. by line cutting spark machined etc., the control of bottom surface level such as triangle cone and quadrangular pyramid body and height is easier to, therefore compare with milling tool in the past, can obtain to have the instrument of more high-precision abradant surface (level).Particularly can high accuracy and expeditiously the surface of semiconductor wafer etc. is processed and as CMP pad trimmer.
Description of drawings
Fig. 1 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.(embodiment 1)
Fig. 2 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.(embodiment 2)
Fig. 3 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Fig. 4 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Fig. 5 is the partial enlarged drawing of Fig. 4.
Fig. 6 is the partial enlarged drawing of Fig. 1.
Fig. 7 is the key diagram (vertical view) of expression according to a configuration example of the units polish of milling tool of the present invention.
Fig. 8 is the key diagram of the A-A section in the presentation graphs 7.
Fig. 9 is the key diagram (vertical view) of expression according to other configuration examples of the units polish of milling tool of the present invention.
Figure 10 is the key diagram of the B-B section in the presentation graphs 9.
Figure 11 is the key diagram of a form of adoptable Wire-cut Electrical Discharge Machining in the manufacture method of expression milling tool constructed in accordance.
Figure 12 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Figure 13 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Figure 14 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Figure 15 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Figure 16 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Figure 17 is the key diagram (vertical view) of expression according to an embodiment of milling tool of the present invention.
Symbol description is as follows:
1... milling tool; 2... units polish; 3... groove; 4... milling tool; 5... units polish; 6... groove; 7... milling tool; 8... units polish; 9... groove; 10... grind section; 12... first direction parallel slot group; 13,14... awl (platform) body side surface; 16... second direction parallel slot group; 17,18... cone inclined side; 19... quadrangular pyramid (platform) shape units polish; 22... first direction parallel slot group; 23,24... pyrometric cone inclined plane; 25... grind section; 27... the second parallel slot group; 28,29... inclined side; 31... third direction parallel slot group; 32,33... inclined side; 34... triangle taper units polish; 41... spark machined metal wire; 42... grind section; 43,44... units polish; 51... grind section; 52... circular substrate; 53... linearity groove group; 55... the second groove group; 58... periphery rake; 61... grind section; 62... circular substrate; 63... linearity groove group; 65... the second groove group; 66... three-flute group; 68... periphery rake; 69... interior all rakes; 71... grind section; 72... circular substrate; 73... linearity groove group; 74... junction surface; 75... the second groove group; 81... grind section; 82... circular substrate; 83... linearity groove group; 84... junction surface; 85... the second groove group; 91... grind section; 92... circular substrate; 93... linearity groove group; 94... junction surface; 95... the second groove group; 96... three-flute group; 101... grind section; 102... circular substrate; 103... linearity groove group; 104... junction surface; 105... the second groove group; 106... three-flute group.
The specific embodiment
As the super abrasive particle sintered body of the material of milling tool of the present invention, be the powder of diamond or c-BN super abrasive particles such as (cubic boron nitride elements) to be handled through the high pressure high temperature operation by usual way to obtain.The sintered body of this state because super abrasive particle sintered body produces moderate finite deformation, therefore makes its general planarization by the mould spark machined in advance.Then, specific in the present invention property landform grooving of mode next stage and projection side are createed units polish thus, i.e. the jut that directly contacts with the grinding object.In addition, utilizing as super abrasive particle sintered body under the situation of product sold on the market, according to specification and difference, but owing to the surface has been flattened, so can omit above-mentioned planarization preliminary treatment.
When forming above-mentioned groove, can utilize line cutting spark machined, mould spark machined or other accurate spark machined or Laser Processing etc., be preferably line cutting spark machined, particularly the situation that becomes sharp-pointed at the top that makes units polish etc. especially is preferably line cutting spark machined down.Line cutting spark machined is along super abrasive particle sintered body surface drive spark machined metal wire, utilizes the discharge between metal wire and the super abrasive particle sintered material, removes the method for material, carries out program run usually.
In milling tool of the present invention, above-mentioned units polish can be created by following dual mode, promptly for example on the circular sintered body layer with circle or concentric central round orifice across cutting be used to divide a plurality of groove groups (below be also referred to as divide the groove group) of abradant surface, or utilize the mould spark machined of electrode with the electrode surface that forms corresponding shape.Divide the groove group no matter be formed at any of super abrasive grain layer surface or electrode surface, all forming linearity is eaily.
Above-mentioned division groove group can be configured to variety of way.As an example, be set forth on the circular surface of super abrasive grain layer, form the mode (Fig. 1) of straight parallel line-group of the certain intervals of two groups of peripheries that extend to opposition side from periphery mutually orthogonally, perhaps make this straight line group be divided into three groups and in 60 ° of modes that intersect (Fig. 2).In these cases, create quadrangle or leg-of-mutton units polish respectively.
In addition, units polish also can be the shape (Fig. 3 at the linearly crest line in top; Units polish is crest line from the end to end of grind section, Fig. 4～Fig. 5; The base portion of units polish is a rectangle) etc.Units polish is under the rectangular situation, and the inclined plane of the units polish of groove and adjacency is formed by line cutting spark machined, so crest line forms abreast with long limit basically.In addition, the units polish of quadrangular pyramid shape interval in length and breadth might not equate, but as the CMP trimmer, be preferably square.
In above-mentioned example, play a role as effective means of abrasion in order to make each units polish, need make the top of each units polish enough little, and adjacent units polish maintain enough intervals each other and is spaced from each other.Area about the units polish top, as an example, key diagram is amplified in the part that schematically shows the milling tool 1 of Fig. 1 among Fig. 6, for example, preferably, topside area (Y) below 50%, is preferably 2～25% with respect to the ratio of the area (X) (that is, cutting the area of units polish circumferential groove 3 areas from the area in super abrasive grain layer cross section) of units polish 2 base portions especially.In addition, the drift angle at the top of units polish is preferably 30～120 °, is preferably 60～90 ° especially, more preferably about 70～80 °.
Groove depth (apart from the height of the bottom land of units polish) below the above 1mm of 0.1mm, is particularly suitable for to below the above 0.3mm of 0.15mm.If groove is shallow excessively, is then cut the smear metal of material and can't be discharged effectively, and ground the tendency that resistance has excessive increase.Opposite if dark excessively, the insufficient strength of units polish not only then, and also need the thickness of superfluous super abrasive grain layer.
Units polish forms, the top is linearity or line segment shape, and be triangle, four limits or more polygon post, and it is made each side, and structure is easier uniformly on whole height vertical and horizontal cross-section with respect to substrate, yet make a side at least, particularly on the front side tilts towards the rear with respect to parallel with axle for the instrument direction of rotation, can improve the sharpness of cutter thus.
As the shape of units polish, preferably, make each of units polish laterally inclined and be made as frustum, for example quadrangular pyramid platform shape or triangular cone table shape.See on this external sharpness aspect that especially preferred is point to be made at the top, for example quadrangular pyramid shape or triangle taper.
In addition, for corner post shape of being arranged or pyramidal units polish,, and make the edge or sharpization of summit at top if by utilizing specific purpose tool that the side of rectangle or leg-of-mutton one or more directions is ground, promptly carry out so-called " sharpening ", then can reach good sharpness.Especially, units polish is polygonal post, polygonal frustum, and the top be polygonal (typically, triangle or quadrangle) situation under, to whetting a knife at least on one side of top surface, and units polish is under the situation of quadrangular pyramid shape or triangle taper, also can not reach enough sharpness even do not whet a knife.
Grind section of the present invention constitutes, more than the external diameter 90mm, below the above 1mm of thickness 0.1mm of super abrasive grain layer.Use following structure as the super abrasive grain layer of sintering, that is: be the titanium carbide composite material with superhard alloy or be that the piece of the composite of main component is squeezed into the structure of a face of diamond sinter (PCD) or c-BN sintered body (PcBN) as liner with the carbide of periodic table of elements 6a family metal, by bonding agent etc. the composite side is fixedly installed in tool substrate, and forms at opposition side and to divide groove and use as grind section.
This sintered body, that sells on the market is typically the discoideus mechanism that is adjusted by the superhigh-pressure high-temp hydrostatic pressing pressure of single shaft compression type.Under the situation of the sintered body that can't obtain aimed dia, particularly under the situation of not strict flatness, also can partly make milling tool of the present invention, and be assembled into a milling tool and use.
Being cut apart under the situation that grind section constitutes grind section by a plurality of, for the generally speaking configuration for units polish is arranged equably of grind section, the boundary portion that is adapted at cutting apart grind section forms groove.At this moment, if two or four cut apart cut apart on the grind section, 2 groups of parallel slot groups that form that mutually orthogonal intersects also make quadrangular pyramid shape or quadrangular pyramid platform shape with units polish, then can obtain not having except that peripheral part the arrangement of chaotic units polish.On the other hand, under three or six situations of cutting apart of cutting apart grind section, form 3 groups of mutual 120 ° of intersections uniformly-spaced straight parallel line-groups, so form three pyramid sides and make the triangle taper or the units polish of triangular cone table shape row too.
That is, under the situation of quadrangular pyramid body,, at first form the groove of linearity by electric spark on the grind section surface along the metal wire that grind section surface feeding spark machined is used.Then, drive metal wire, cut off grind section, create side thus with awl (platform) the shape body of groove adjacency along the side profile portion of quadrangular pyramid body in the Z-direction of grind section.By carrying out this operation repeatedly, form the parallel slot group.
Pyramidal in the present invention top is made of one or more diamond particles.Even use fine particle also because diamond has limited size, therefore from geometric angle, can't obtain cone.Thereby, compare enough hour with the base when the diameter at top, be referred to as cone.As its name suggests, frustum is meant that the size of all directions at top compares big situation with cone.
In the making of quadrangular pyramid (platform) shape units polish, example (is represented one of them with symbol 12 on the surface of grind section 10 with the parallel slot group that certain groove interval (pitch) forms first direction 11 as shown in Figures 7 and 8 typically.Below same) and awl (platform) shape body two sides (represent one of them typically with symbol 13.Below same) after, each is installed with substrate half-twist around circle ring center's axle of grind section 10, similarly, form the parallel slot group 16 of second direction 15 at interval with certain groove, and with the cone inclined side 17,18 of each groove adjacency, can obtain 2 groups of parallel slot groups of quadrature and quadrangular pyramid (platform) the shape units polish 19 of arranging thus along groove.A-A among Fig. 7 partly is shown in cutaway view 5.
Under the situation of triangle cone, as Fig. 9 and shown in Figure 10, in above-mentioned, the parallel slot group 22 who forms first direction 21 and with the inclined plane 23,24 of the pyramid of groove adjacency after, grind section 20 is rotated 120 ° around grind section 25 central shafts, form the parallel slot 27 of second direction 26 and the inclined side 28,29 of adjacency at certain intervals by line cutting spark machined equally.After operation is over,, thereby obtain, and obtain the triangle taper units polish 34 of arranging along groove with the parallel slot group 31 of the third direction 30 of 120 ° of intersections and the inclined side 32,33 of adjacency further with 120 ° of grind section rotations and operate equally.
In above-mentioned units polish, cone or frustum body top all are adapted at more than the following 30um of 200um for the projecting height diabolo of groove bottom and quadrangle.If shallowly excessively outstanding, then workpiece such as grind section main body and pad directly contact, and the tendency that exists adjustment to carry out effectively.On the contrary, if outstanding too much, units polish insufficient strength then must have the thickness of superfluous super abrasive grain layer.On the other hand, the gap between adjacent channels (pitch) is below the 1500um, and lower limit is subjected to the restriction of the diameter of the metal wire that employed line cutting spark machined uses, and for example can be made as about 200um.
The nonferromagnetic substance of above-mentioned units polish depends on the granularity of the super abrasive particle that the top comprised of awl (platform) shape body.At super abrasive particle is under the situation of diamond particles, the sintered body that promptly constitutes grind section is under the situation of sintered diamond (PCD) layer, granularity (nominal particle size) as diamond particles, can utilize that 40-60um is following, the PCD layer of each granularity such as 8-16um or 0-2um, and be preferably nominal particle size below the 8-16um, be preferably 0-2um especially.
Adoptable diamond sinter on the grind section of the present invention, be with diamond particles with as the superhard alloy of lining material and required in case of necessity bond material metals such as cobalt, under high pressure high temperature condition stable on the thermodynamics, supply with diamond and obtain.The processing of sintered body being processed into grind section of the present invention is by accurate spark machined, is typically that units polish realizes by forming by the excision of line cutting spark machined and by Surface Machining.In the online cutting spark machined, generally be that the contact spark machined moves horizontally metal wire to obtain desirable groove width with metal wire and discharge on super abrasive particle sintered body, further move to form the side of units polish.
In addition, as shown in figure 11, after spark machined is adjacent to super abrasive particle sintered body 42 with metal wire 41, do not move horizontally, but the direction of arrow moves in the figure, adjacent units polish 43,44 relative two inclined planes form groove in the mode of the contact-making surface that becomes metal wire 41, can be datum level also, from forming the side of both sides here with this level.Forming under the situation of groove like this, the shape of the bottom of groove becomes the cross section and roughly is circular-arc curved surface, compares with the situation of the bottom of groove being made plane or angle, and the stress that has alleviated when grinding is concentrated, and has improved the intensity (durability) of units polish.
Instrument of the present invention as Figure 12～shown in Figure 17, can be made several shapes.For more small-sized instrument, for example grind section can be made into as Figure 12 and single continuous circular shown in Figure 13 and circular, and in the present invention as Figure 14～shown in Figure 17, certainly constitute grind section by a plurality of grind section of cutting apart, therefore in these cases, also can easily obtain the above bigger circular grind section of profile of diameter 95mm.
In circular formation, preferably, the radial direction width is more than the 15mm.Particularly do not need in design under the situation of centre bore, grind section also can not be circular (not having centre bore) and be made as discoideus.In addition, as Figure 12 and shown in Figure 13, in order to prevent damage because of the workpiece that causes with most advanced and sophisticated EDGE CONTACT, under the situation of toroidal grind section, be on outer peripheral portion, and be under the situation of circular grind section on periphery and interior circumferential portion, the rake 58,68 and 69 of 1mm above (radial direction width) preferably, is set respectively.
Cutting apart under the situation that grind section constitutes grind section by a plurality of, as Figure 14～shown in Figure 17, the boundary portion (junction surface) of cutting apart grind section with two of adjacency becomes the mode of groove and sets the configuration of grinding the location, can avoid thus or suppresses to greatest extent by confusion that constitutes the units polish configuration that causes cutting apart of grind section and the baneful influence of bringing for workpiece (grinding pad) thus.At this moment, the number of cutting apart of grind section is associated with the shape of available units polish, cut apart (central angle 180 degree) or four two and cut apart in the grind section of (central angle 90 degree) and be quadrangular pyramid shape (Figure 14 and Figure 15), cut apart three in the grind section of (central angle 120 degree) and be triangle taper (Figure 16 and Figure 17).
In order to make large diameter milling tool, the super abrasive particle sintered body of minor diameter (being preferably diamond sinter) that preparation can be carried out even sintering is by cutting off and processing forms the grind section of cutting apart of the size of regulation and shape.And, use bonding agent etc. to cut apart on the smooth plectane face or circular surface that grind section is engaged in the rigid substrates that is made of various steel etc. with a plurality of, thus, can form the grind section of large diameter discoideus or circular (central authorities of plectane have the shape of concentric circular port).
For cutting apart grind section, with central angle is 60,90,120,180 ° fan-shaped, 6,4,3 or 2 of placements arranged side by side adjacent to each other on radius (contacts side surfaces configuration) are used respectively, and for 60 ° situation, can use one 120 ° fan-shaped to replace 2 60 ° identical shaped fan-shaped.In this case, fan-shaped with 2 120 ° about central point ground configuration.
In each grind section 51,61,71,81,91,101, the smooth circular face of superhard alloy side with circular substrate 52,62,72,82,92,102 engaged, thereby integral body is rounded or the grind section of ring-type.
For the super abrasive particle sintered body that on substrate, engages, then carry out line cutting spark machined, and, on super abrasive particle sintered body surface, form parallel at certain intervals one group of linearity groove group 53,63,73,83,93,103 by the discharge operation between online cutting spark machined usefulness metal wire and the super abrasive particle sintered body.At this moment, metal wire drives abreast with respect to real estate or substrate bottom surface, enter in the sintered body layer (typically, sintered diamond (PCD) layer) from the smooth surface of preparation, to such an extent as in the sintered body layer, carve or under the thin situation of sintered body layer, carve the superhard alloy layer.
At this moment, make metal wire drive and carry out cutting and make grooving along the thickness direction (Z-direction) of super abrasive particle sintered body.Initial groove among groove group forms as follows, no matter that is: be any of triangle cone and quadrangular pyramid shape body on 360 ° of continuous circular or circumferentia, can be from the optional position, but grind section by a plurality of situations about combining of cutting apart grind section under, must on the junction surface 54,64,74,84,94,104 of cutting apart grind section, groove be set, then form abreast on whole with certain interval in its both sides.
If on the surface of super abrasive particle sintered body, form the parallel slot group of a direction, then then will surpass the abrasive particle sintered body with substrate swivelling chute flock-mate fork angle [alpha] around the central shaft of substrate, and similarly with above-mentioned certain interval form the second linearity parallel slot group 55,65,75,85,95,105 and with the inclined side of each groove adjacency.The α here is 90 ° for the fan-shaped of 180 ° and 90 °, and units polish is quadrangular pyramid shape or frustum.Fan-shaped for 120 ° and 60 ° on the other hand, rotation 60 (or 120) °, and similarly with above-mentioned certain intervals form the second linearity parallel slot group and with the inclined side of each groove group adjacency after, and then rotate 60 (or 120) ° (for initial groove group 240 °) form the 3rd linearity parallel slot group 56,66,76,86,96,106 and with the inclined side of each groove group adjacency.For continuous circular and endless member, α can adopt any one of 90 ° and 60 °.
In the operation of above-mentioned line cutting electric spark, drive by the height (level) that electric spark is equally separated on thickness direction from this substrate bottom surface with metal wire, can on the parallel level of relative substrate bottom surface, form the top of above-mentioned groove group and triangle or quadrangular pyramid shape or frustum body.
In the present invention, the pyrometric cone of units polish or quadrangular pyramid need not whole be made of super abrasive particle sintered body, if comprising the part (highly) of the 60um degree on awl (platform) shape body summit at least is super abrasive particle sintered body, even then its below part also can be utilized for superhard alloy.Then, utilize embodiment that the present invention is specifically described.
Made the milling tool 1 of the structure that summary is represented among Fig. 1.By with the sintered diamond layer of thickness 0.6mm and superhard alloy sintering and PCD piece incorporate, diameter 90mm uses as the instrument raw material simultaneously.
On above-mentioned PCD piece, make the having an even surface of sintered diamond layer, utilize the groove 3 of warp cutting spark machined and the straight parallel wire by scribing width 560um to form and have the units polish 2 of the length of side for the foursquare top of 260um by electrical discharge machining (EDM).In this case, the area of the top of units polish 2 (not shown) be equivalent to remove periphery (part of groove 3) super abrasive particle sinter layer sectional area about 10%.
On top, whet a knife, and use as the CMP trimmer.
Made the circular milling tool 4 that summary is represented among Fig. 2.From with the sintering c-BN layer of thickness 0.6mm by with hard alloy sintering and incorporate PcBN piece simultaneously, warp cutting spark machined, cutting goes out 90 degree fan-shaped of 4 outer radius 60mm, inner radius 24mm, and as the instrument raw material.
With the above-mentioned fan-shaped SUS of being closely attached on is stainless steel substrate, and is combined into complete circle.To grinding and make it smooth in the surface of sintering c-BN layer, utilize the group of the straight parallel wire groove 6 of width 560um to form by line cutting spark machined and have the units polish 5 of the length of side for the top of the equilateral triangle of 350um.In this case, the area at units polish top is 7% of super abrasive particle sinter layer integral body.
The instrument that is obtained is whetted a knife by operation similarly to Example 1, and is used in the grinding of silicon wafer surface.
Made the milling tool of the structure that summary is represented among Figure 12.The PCD layer of the thickness 0.5mm that is made of the diamond particles of nominal particle size 40-60um and superhard alloy (WC-8%Co) be sintering and diamond sinter incorporate, diameter 100mm uses as grind section simultaneously, and is fixedly installed in epoxide resin adhesive on the SUS316 stainless steel steel circular substrate of diameter 108mm.
Then, after have an even surface of mould spark machined, come cutting PCD layer by line cutting spark machined, and form the straight-line groove of the width 200um that passes donor center the PCD layer.In addition, metal wire is driven to the side, or make it to relative to substrate away from direction (Z direction) move, the groove and the cutting that form required width go out pyramidal side.
By repeatedly should operation, form the at interval projection of the roof shape of 90 ° of the parallel slot group of 800um and drift angles of groove on the whole at former charge level.
Then, make whole behind half-twist around the central shaft, carry out line cutting spark machined under the same conditions, form the second straight-line groove group thus with above-mentioned groove group quadrature, and carry out the cutting of the cone side of orthogonal direction simultaneously, and form the Fig. 7 of height 200um and quadrangular pyramid shape body group shown in Figure 8.
Diamond sinter that the PCD layer of the thickness 0.5mm that will be made of the diamond particles of nominal particle size 0-2um and superhard alloy are integrated, external diameter 100mm and internal diameter 70mm uses as grind section, and the milling tool of the units polish with quadrangular pyramid shape is made in the operation of embodiment 3 repeatedly.
At first, utilize line cutting spark machined, in planarization the surface of PCD layer on form the straight-line groove of the width 140um that passes donor center.In addition, operate the expansion of carrying out required groove width and the cutting of pyramidal side by metal wire.By repeatedly should operation, have formed the groove roof shape projection of 60 ° of the parallel slot group of 200um and drift angles at interval on the whole at former charge level.
Then, make wholely behind half-twist around the central shaft, carry out line cutting spark machined under the same conditions, form the second straight-line groove group thus, and cutting simultaneously goes out the second cone side, and form the quadrangular pyramid shape body group of height 200um.
Use the various grind section of cutting apart shown below, made the instrument of various formations.The diamond of diamond sinter is nominal particle size 20-30um.For the line cutting operation, under the situation of triangle taper units polish, on the instrument raw material being carried out twice this point of each 60 ° of rotations different with the quadrangular pyramid shape units polish of only carrying out 90 ° of rotations, as broad as long in essence.Operating condition and result are as shown in the table.
Table 1
*) vertex spacings is 2,4 the pyramidal situation of triangle.
The instrument that is obtained all can be used as CMP pad trimmer and uses, and has obtained good performance.
Utilizability on the industry
Milling tool of the present invention can be used as various milling tools and uses, and particularly can be suitable as the rotary-type milling tool of rondelle and use. As purposes, be particularly suitable as CMP pad trimmer and use, go in addition the direct grinding on the surfaces such as semiconductor wafer. In addition, also go for the various high-precision attrition process that are cut material.
Claims (26)
1. a milling tool has the grind section that is made of super abrasive particle sintered body, and this milling tool is characterised in that grind section comprises a plurality of units polish with top, and each top is on the roughly same mutually plane.
2. milling tool according to claim 1 is characterized in that, the super abrasive particle sintered body that grind section is sintered in by one on the lining material of superhard alloy constitutes, and units polish forms by the straight-line groove group is set on this grind section.
3. milling tool according to claim 1 is characterized in that, is whetted a knife in the top.
4. milling tool according to claim 1 is characterized in that, units polish is quadrangular pyramid shape or quadrangular pyramid platform shape.
5. milling tool according to claim 4 is characterized in that, units polish is a quadrangular pyramid platform shape, is whetted a knife at least one limit at top.
6. milling tool according to claim 1 is characterized in that, units polish is triangle taper or triangular cone table shape.
7. milling tool according to claim 6 is characterized in that, units polish is the triangular cone table shape, is whetted a knife at least one limit at top.
8. milling tool according to claim 1 is characterized in that, units polish is the shape of the linearly crest line in top.
9. milling tool according to claim 1 is characterized in that, units polish is quadrangular pyramid shape or triangle taper, being spaced apart more than the following 200um of 1500um of units polish.
10. milling tool according to claim 9 is characterized in that, units polish is quadrangular pyramid shape or triangle taper, and the height of units polish is more than the following 30um of 200um.
11. milling tool according to claim 1 is characterized in that, super abrasive particle is a diamond.
12. milling tool according to claim 11 is characterized in that, adamantine nominal granularity is below the 40-60um.
13. milling tool according to claim 1 is characterized in that, the thickness of super abrasive particle sintered body is more than the 0.1mm.
14. milling tool according to claim 1 is characterized in that, it is discoideus or circular.
15. milling tool according to claim 14 is characterized in that, grind section is discoideus or circular.
16. milling tool according to claim 15 is characterized in that, the external diameter of grind section is more than the 90mm.
17. milling tool according to claim 2 is characterized in that, the top of grind section is below the 1mm with respect to the height of bottom land.
18. milling tool according to claim 14 is characterized in that, grind section is cut apart grind section by 2 or 4 and is constituted, this cut apart grind section be respectively central angle equate fan-shaped.
19. milling tool according to claim 18 is characterized in that, cuts apart grind section and has 2 groove groups, the first groove faciation is set up abreast for the edge of the radial direction of cutting apart grind section, the second groove group and the first groove group quadrature and form.
20. milling tool according to claim 14 is characterized in that, grind section is cut apart grind section by 3 or 6 and is constituted, this cut apart grind section be respectively central angle equate fan-shaped.
21. milling tool according to claim 20, it is characterized in that, cut apart grind section and have 3 groove groups, the first groove faciation is set up abreast for the edge of the radial direction of cutting apart grind section, and the second groove group and three-flute faciation form with 60 ° and 120 ° of crossing modes respectively the first groove group.
22. milling tool according to claim 2 is characterized in that, groove forms by line cutting spark machined.
23. milling tool according to claim 1 is characterized in that, it is a CMP pad trimmer.
24. the manufacture method of a milling tool, this milling tool have the grind section that is made of super abrasive particle sintered body, this manufacture method is characterised in that, comprising:
(1) will surpass on the lining material that the abrasive particle one is sintered in superhard alloy, obtain the operation of super abrasive particle sintered body,
The operation of the grind section planarization of the super abrasive particle sintered body that (2) will obtain,
(3) on the super abrasive particle sintered body of planarization, the straight-line groove group is set, forms a plurality of units polish, and as the operation of grind section.
25. the manufacture method of a milling tool, this milling tool have the grind section that is made of super abrasive particle sintered body, this manufacture method is characterised in that, comprising:
(1) will surpass on the lining material that the abrasive particle one is sintered in superhard alloy, obtain the operation of super abrasive particle sintered body,
(2) go out a fan-shaped operation of cutting apart grind section from the super abrasive particle sintered body cutting that obtains,
(3) obtain the operation of a plurality of fan-segmentation grind section of equating with the fan-segmentation grind section central angle that obtains in above-mentioned (2),
A plurality of fan-segmentation grind section that (4) will obtain are closely in abutting connection with also being fixedly installed on the smooth substrate surface, and as the operation of discoideus or circular grind section,
(5) cutting apart on the border between grind section of the discoideus or circular grind section that in above-mentioned (4), obtains groove is set, and forms the operation of a plurality of units polish.
26. the recasting method of a milling tool is characterized in that, this milling tool is the described milling tool of claim 1, and this recasting method comprises by the remake operation at groove and units polish top of line cutting spark machined.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005243529 | 2005-08-25 | ||
| JP2005-243529 | 2005-08-25 | ||
| JP2006209236 | 2006-07-31 | ||
| JP2006-209236 | 2006-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800307352A Division CN101247923B (en) | 2005-08-25 | 2006-08-25 | Grinding tool and method of manufacturing and re-manufacturing the same |
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| Publication Number | Publication Date |
|---|---|
| CN101693353A true CN101693353A (en) | 2010-04-14 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800307352A Expired - Fee Related CN101247923B (en) | 2005-08-25 | 2006-08-25 | Grinding tool and method of manufacturing and re-manufacturing the same |
| CN200910170789A Pending CN101693353A (en) | 2005-08-25 | 2006-08-25 | Tool with sintered body polishing surface and method of manufacturing the same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800307352A Expired - Fee Related CN101247923B (en) | 2005-08-25 | 2006-08-25 | Grinding tool and method of manufacturing and re-manufacturing the same |
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| Country | Link |
|---|---|
| US (1) | US20090215366A1 (en) |
| EP (1) | EP1944125B1 (en) |
| JP (1) | JP5033630B2 (en) |
| KR (1) | KR101293461B1 (en) |
| CN (2) | CN101247923B (en) |
| AU (1) | AU2006282293B2 (en) |
| BR (1) | BRPI0615020A2 (en) |
| CA (1) | CA2620407A1 (en) |
| IL (1) | IL189314A (en) |
| RU (1) | RU2430827C2 (en) |
| TW (1) | TWI406736B (en) |
| WO (1) | WO2007023949A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463379A (en) * | 2014-03-21 | 2017-02-22 | 恩特格里斯公司 | Chemical mechanical planarization pad conditioner with elongated cutting edges |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009113133A (en) * | 2007-11-05 | 2009-05-28 | Hiroshi Ishizuka | Cmp-pad conditioner |
| CA2797096C (en) * | 2010-04-27 | 2018-07-10 | 3M Innovative Properties Company | Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same |
| US20120171935A1 (en) * | 2010-12-20 | 2012-07-05 | Diamond Innovations, Inc. | CMP PAD Conditioning Tool |
| JP5809880B2 (en) * | 2011-08-25 | 2015-11-11 | 新日鉄住金マテリアルズ株式会社 | Polishing cloth dresser |
| KR20170018102A (en) * | 2011-12-30 | 2017-02-15 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | Shaped abrasive particle and method of forming same |
| US10710211B2 (en) * | 2012-08-02 | 2020-07-14 | 3M Innovative Properties Company | Abrasive articles with precisely shaped features and method of making thereof |
| CN102862121B (en) * | 2012-09-17 | 2015-05-20 | 上海华力微电子有限公司 | Chemical mechanical polishing (CMP) grinding pad finishing structure |
| ES2756849T3 (en) * | 2013-08-07 | 2020-04-27 | Reishauer Ag | Grinding tool and manufacturing procedure |
| WO2015029987A1 (en) * | 2013-08-26 | 2015-03-05 | 株式会社東京精密 | Dicing blade |
| EP3057739B1 (en) * | 2013-10-18 | 2020-12-09 | 3M Innovative Properties Company | Coated abrasive article and method of making the same |
| TWI609742B (en) * | 2015-04-20 | 2018-01-01 | 中國砂輪企業股份有限公司 | Grinding tool |
| CN108698202B (en) * | 2016-02-22 | 2021-06-04 | 联合材料公司 | Abrasive tool |
| CN106078516B (en) * | 2016-06-21 | 2018-09-04 | 大连理工大学 | A kind of CMP pad trimmer |
| WO2018207145A1 (en) * | 2017-05-12 | 2018-11-15 | 3M Innovative Properties Company | Tetrahedral abrasive particles in abrasive articles |
| CN111372726B (en) * | 2017-11-21 | 2022-06-07 | 3M创新有限公司 | Coated abrasive discs and methods of making and using the same |
| WO2019102332A1 (en) | 2017-11-21 | 2019-05-31 | 3M Innovative Properties Company | Coated abrasive disc and methods of making and using the same |
| WO2019102331A1 (en) | 2017-11-21 | 2019-05-31 | 3M Innovative Properties Company | Coated abrasive disc and methods of making and using the same |
| KR102026250B1 (en) * | 2018-02-05 | 2019-09-27 | 에스케이실트론 주식회사 | Wafer polishing pad and Manufacturing Method of it |
| CN112041117A (en) * | 2018-04-27 | 2020-12-04 | 住友电气工业株式会社 | Polycrystalline abrasive grain and grinding wheel comprising same |
| TWI735795B (en) * | 2018-08-24 | 2021-08-11 | 宋健民 | Polishing pad dresser and chemical mechanical planarization method |
| KR102440315B1 (en) * | 2020-05-11 | 2022-09-06 | 한국생산기술연구원 | Pad for chemical mechanical polishing having pattern structure and manufacturing method therefor |
| CN112677062B (en) * | 2019-10-18 | 2022-12-09 | 江苏韦尔博新材料科技有限公司 | Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5739106A (en) * | 1980-08-14 | 1982-03-04 | Hiroshi Ishizuka | Production of diamond ultrahard alloy composite |
| JPS58199776A (en) * | 1982-05-12 | 1983-11-21 | 住友電気工業株式会社 | Diamond sintered body for tool and manufacture |
| JPS6184303A (en) * | 1984-09-28 | 1986-04-28 | Ishizuka Kenkyusho:Kk | Manufacture of composite sintered body |
| JP2601284B2 (en) * | 1987-09-01 | 1997-04-16 | 株式会社石塚研究所 | Sintered diamond composite and manufacturing method thereof |
| US5049165B1 (en) * | 1989-01-30 | 1995-09-26 | Ultimate Abrasive Syst Inc | Composite material |
| US4925457B1 (en) * | 1989-01-30 | 1995-09-26 | Ultimate Abrasive Syst Inc | Method for making an abrasive tool |
| US4954139A (en) * | 1989-03-31 | 1990-09-04 | The General Electric Company | Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces |
| JPH08243927A (en) * | 1995-03-02 | 1996-09-24 | Fuji Xerox Co Ltd | Grinding tool and its manufacture and grinding device |
| US5560754A (en) * | 1995-06-13 | 1996-10-01 | General Electric Company | Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support |
| JPH09254042A (en) * | 1996-03-15 | 1997-09-30 | Symtec:Kk | Grinding wheel for cutting groove and manufacture thereof |
| JP2957519B2 (en) * | 1996-05-23 | 1999-10-04 | 旭ダイヤモンド工業株式会社 | Dresser for semiconductor wafer polishing pad and method of manufacturing the same |
| JPH10138120A (en) * | 1996-10-31 | 1998-05-26 | Kyocera Corp | Jig for dressing |
| US6054183A (en) * | 1997-07-10 | 2000-04-25 | Zimmer; Jerry W. | Method for making CVD diamond coated substrate for polishing pad conditioning head |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| JPH11267902A (en) * | 1998-03-23 | 1999-10-05 | Hiroshi Hashimoto | Tool having ultra-fine cutting blade and processing tool having ultra-fine cutting blade |
| JP2000190200A (en) * | 1998-12-25 | 2000-07-11 | Mitsubishi Materials Silicon Corp | Seasoning jig for polishing cloth |
| JP4332980B2 (en) * | 1999-03-18 | 2009-09-16 | 株式会社デンソー | Manufacturing method of mold for forming honeycomb structure |
| JP2001088028A (en) * | 1999-09-17 | 2001-04-03 | Koremura Toishi Seisakusho:Kk | Rotary dressor |
| TW467802B (en) * | 1999-10-12 | 2001-12-11 | Hunatech Co Ltd | Conditioner for polishing pad and method for manufacturing the same |
| KR100387954B1 (en) * | 1999-10-12 | 2003-06-19 | (주) 휴네텍 | Conditioner for polishing pad and method of manufacturing the same |
| TW436375B (en) * | 1999-11-16 | 2001-05-28 | Asia Ic Mic Process Inc | Formation method for dresser of chemical mechanical polishing pad |
| JP2001347454A (en) * | 2000-06-09 | 2001-12-18 | Koremura Toishi Seisakusho:Kk | Dresser and method of manufacturing the same |
| US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
| US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
-
2006
- 2006-08-25 CN CN2006800307352A patent/CN101247923B/en not_active Expired - Fee Related
- 2006-08-25 RU RU2008110905/02A patent/RU2430827C2/en not_active IP Right Cessation
- 2006-08-25 BR BRPI0615020-9A patent/BRPI0615020A2/en not_active IP Right Cessation
- 2006-08-25 US US11/990,562 patent/US20090215366A1/en not_active Abandoned
- 2006-08-25 TW TW095131436A patent/TWI406736B/en not_active IP Right Cessation
- 2006-08-25 CN CN200910170789A patent/CN101693353A/en active Pending
- 2006-08-25 EP EP06796810A patent/EP1944125B1/en not_active Not-in-force
- 2006-08-25 JP JP2007532202A patent/JP5033630B2/en not_active Expired - Fee Related
- 2006-08-25 CA CA002620407A patent/CA2620407A1/en not_active Abandoned
- 2006-08-25 KR KR1020087005076A patent/KR101293461B1/en not_active IP Right Cessation
- 2006-08-25 AU AU2006282293A patent/AU2006282293B2/en not_active Ceased
- 2006-08-25 WO PCT/JP2006/316737 patent/WO2007023949A1/en active Application Filing
-
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106463379A (en) * | 2014-03-21 | 2017-02-22 | 恩特格里斯公司 | Chemical mechanical planarization pad conditioner with elongated cutting edges |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1944125B1 (en) | 2012-01-25 |
| WO2007023949A1 (en) | 2007-03-01 |
| JP5033630B2 (en) | 2012-09-26 |
| IL189314A (en) | 2013-01-31 |
| TWI406736B (en) | 2013-09-01 |
| JPWO2007023949A1 (en) | 2009-03-05 |
| CN101247923A (en) | 2008-08-20 |
| TW200714416A (en) | 2007-04-16 |
| AU2006282293B2 (en) | 2011-06-23 |
| EP1944125A1 (en) | 2008-07-16 |
| RU2430827C2 (en) | 2011-10-10 |
| BRPI0615020A2 (en) | 2009-08-04 |
| CA2620407A1 (en) | 2007-03-01 |
| KR101293461B1 (en) | 2013-08-07 |
| RU2008110905A (en) | 2009-09-27 |
| EP1944125A4 (en) | 2009-12-16 |
| CN101247923B (en) | 2010-12-08 |
| KR20080037693A (en) | 2008-04-30 |
| AU2006282293A1 (en) | 2007-03-01 |
| US20090215366A1 (en) | 2009-08-27 |
| IL189314A0 (en) | 2008-06-05 |
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