IL189314A0 - Tool with sintered body polishing surface and method of manufacturing the same - Google Patents

Tool with sintered body polishing surface and method of manufacturing the same

Info

Publication number
IL189314A0
IL189314A0 IL189314A IL18931408A IL189314A0 IL 189314 A0 IL189314 A0 IL 189314A0 IL 189314 A IL189314 A IL 189314A IL 18931408 A IL18931408 A IL 18931408A IL 189314 A0 IL189314 A0 IL 189314A0
Authority
IL
Israel
Prior art keywords
tool
manufacturing
same
sintered body
polishing surface
Prior art date
Application number
IL189314A
Other versions
IL189314A (en
Original Assignee
Ishizuka Hiroshi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishizuka Hiroshi filed Critical Ishizuka Hiroshi
Publication of IL189314A0 publication Critical patent/IL189314A0/en
Publication of IL189314A publication Critical patent/IL189314A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y10T428/24579—Parallel ribs and/or grooves with particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IL189314A 2005-08-25 2008-02-05 Tool with sintered body polishing surface and method of manufacturing the same IL189314A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005243529 2005-08-25
JP2006209236 2006-07-31
PCT/JP2006/316737 WO2007023949A1 (en) 2005-08-25 2006-08-25 Tool with sintered body polishing surface and method of manufacturing the same

Publications (2)

Publication Number Publication Date
IL189314A0 true IL189314A0 (en) 2008-06-05
IL189314A IL189314A (en) 2013-01-31

Family

ID=37771687

Family Applications (1)

Application Number Title Priority Date Filing Date
IL189314A IL189314A (en) 2005-08-25 2008-02-05 Tool with sintered body polishing surface and method of manufacturing the same

Country Status (12)

Country Link
US (1) US20090215366A1 (en)
EP (1) EP1944125B1 (en)
JP (1) JP5033630B2 (en)
KR (1) KR101293461B1 (en)
CN (2) CN101247923B (en)
AU (1) AU2006282293B2 (en)
BR (1) BRPI0615020A2 (en)
CA (1) CA2620407A1 (en)
IL (1) IL189314A (en)
RU (1) RU2430827C2 (en)
TW (1) TWI406736B (en)
WO (1) WO2007023949A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009113133A (en) * 2007-11-05 2009-05-28 Hiroshi Ishizuka Cmp-pad conditioner
KR101849797B1 (en) * 2010-04-27 2018-04-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP5809880B2 (en) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 Polishing cloth dresser
WO2013102177A1 (en) 2011-12-30 2013-07-04 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle and method of forming same
CN104736299A (en) * 2012-08-02 2015-06-24 3M创新有限公司 Abrasive articles with precisely shaped features and method of making thereof
CN102862121B (en) * 2012-09-17 2015-05-20 上海华力微电子有限公司 Chemical mechanical polishing (CMP) grinding pad finishing structure
EP2835220B1 (en) * 2013-08-07 2019-09-11 Reishauer AG Trimming tool, and method for manufacturing the same
JP5976228B2 (en) * 2013-08-26 2016-08-23 株式会社東京精密 Dicing blade
KR20160071416A (en) * 2013-10-18 2016-06-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Coated abrasive article and method of making the same
KR102304574B1 (en) * 2014-03-21 2021-09-27 엔테그리스, 아이엔씨. Chemical mechanical planarization pad conditioner with elongated cutting edges
TWI609742B (en) * 2015-04-20 2018-01-01 中國砂輪企業股份有限公司 Grinding tool
WO2017145491A1 (en) 2016-02-22 2017-08-31 株式会社アライドマテリアル Abrasive tool
CN106078516B (en) * 2016-06-21 2018-09-04 大连理工大学 A kind of CMP pad trimmer
JP2020519468A (en) * 2017-05-12 2020-07-02 スリーエム イノベイティブ プロパティズ カンパニー Tetrahedral abrasive particles in abrasive articles
WO2019102329A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
WO2019102332A1 (en) 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
JP6899490B2 (en) 2017-11-21 2021-07-07 スリーエム イノベイティブ プロパティズ カンパニー Coated polishing disc and its manufacturing method and usage method
KR102026250B1 (en) 2018-02-05 2019-09-27 에스케이실트론 주식회사 Wafer polishing pad and Manufacturing Method of it
KR20210002494A (en) * 2018-04-27 2021-01-08 스미토모덴키고교가부시키가이샤 Polycrystalline abrasive grain and grinding wheel equipped with it
TWI735795B (en) * 2018-08-24 2021-08-11 宋健民 Polishing pad dresser and chemical mechanical planarization method
KR102440315B1 (en) * 2020-05-11 2022-09-06 한국생산기술연구원 Pad for chemical mechanical polishing having pattern structure and manufacturing method therefor
DK180350B1 (en) * 2019-09-18 2021-01-22 Flex Trim As GRINDING ELEMENT FOR USE IN ROTARY GRINDING OR GRINDING TOOLS
CN112677062B (en) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 Special abrasive grain landform for polishing steel grinding disc, diamond grinding disc and preparation method thereof

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739106A (en) * 1980-08-14 1982-03-04 Hiroshi Ishizuka Production of diamond ultrahard alloy composite
JPS58199776A (en) * 1982-05-12 1983-11-21 住友電気工業株式会社 Diamond sintered body for tool and manufacture
JPS6184303A (en) * 1984-09-28 1986-04-28 Ishizuka Kenkyusho:Kk Manufacture of composite sintered body
JP2601284B2 (en) * 1987-09-01 1997-04-16 株式会社石塚研究所 Sintered diamond composite and manufacturing method thereof
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US4954139A (en) * 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
JPH08243927A (en) * 1995-03-02 1996-09-24 Fuji Xerox Co Ltd Grinding tool and its manufacture and grinding device
US5560754A (en) * 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
JPH09254042A (en) * 1996-03-15 1997-09-30 Symtec:Kk Grinding wheel for cutting groove and manufacture thereof
JP2957519B2 (en) * 1996-05-23 1999-10-04 旭ダイヤモンド工業株式会社 Dresser for semiconductor wafer polishing pad and method of manufacturing the same
JPH10138120A (en) * 1996-10-31 1998-05-26 Kyocera Corp Jig for dressing
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JPH11267902A (en) * 1998-03-23 1999-10-05 Hiroshi Hashimoto Tool having ultra-fine cutting blade and processing tool having ultra-fine cutting blade
JP2000190200A (en) * 1998-12-25 2000-07-11 Mitsubishi Materials Silicon Corp Seasoning jig for polishing cloth
JP4332980B2 (en) * 1999-03-18 2009-09-16 株式会社デンソー Manufacturing method of mold for forming honeycomb structure
JP2001088028A (en) * 1999-09-17 2001-04-03 Koremura Toishi Seisakusho:Kk Rotary dressor
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
KR100387954B1 (en) * 1999-10-12 2003-06-19 (주) 휴네텍 Conditioner for polishing pad and method of manufacturing the same
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
JP2001347454A (en) * 2000-06-09 2001-12-18 Koremura Toishi Seisakusho:Kk Dresser and method of manufacturing the same
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix

Also Published As

Publication number Publication date
RU2008110905A (en) 2009-09-27
JP5033630B2 (en) 2012-09-26
CN101247923A (en) 2008-08-20
AU2006282293A1 (en) 2007-03-01
KR101293461B1 (en) 2013-08-07
BRPI0615020A2 (en) 2009-08-04
CN101247923B (en) 2010-12-08
JPWO2007023949A1 (en) 2009-03-05
EP1944125B1 (en) 2012-01-25
US20090215366A1 (en) 2009-08-27
IL189314A (en) 2013-01-31
RU2430827C2 (en) 2011-10-10
TWI406736B (en) 2013-09-01
EP1944125A1 (en) 2008-07-16
AU2006282293B2 (en) 2011-06-23
WO2007023949A1 (en) 2007-03-01
CN101693353A (en) 2010-04-14
KR20080037693A (en) 2008-04-30
TW200714416A (en) 2007-04-16
CA2620407A1 (en) 2007-03-01
EP1944125A4 (en) 2009-12-16

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Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees