BRPI0917289A8 - revestimento polimérico de halo-hidrocarboneto - Google Patents
revestimento polimérico de halo-hidrocarboneto Download PDFInfo
- Publication number
- BRPI0917289A8 BRPI0917289A8 BRPI0917289A BRPI0917289A BRPI0917289A8 BR PI0917289 A8 BRPI0917289 A8 BR PI0917289A8 BR PI0917289 A BRPI0917289 A BR PI0917289A BR PI0917289 A BRPI0917289 A BR PI0917289A BR PI0917289 A8 BRPI0917289 A8 BR PI0917289A8
- Authority
- BR
- Brazil
- Prior art keywords
- solder joint
- multilayer coating
- pcb
- halo
- polymeric coating
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title abstract 5
- 238000000576 coating method Methods 0.000 title abstract 5
- 125000001475 halogen functional group Chemical group 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 150000005826 halohydrocarbons Chemical class 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20754—Diameter ranges larger or equal to 40 microns less than 50 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20755—Diameter ranges larger or equal to 50 microns less than 60 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20756—Diameter ranges larger or equal to 60 microns less than 70 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20757—Diameter ranges larger or equal to 70 microns less than 80 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
"placas de circuito impresso, métodos e aparelhos". em algumas modalidades, uma placa de circuito impresso (pcb) compreende um substrato que compreende um material de isolamento. a pcb, compreende adicionalmente uma pluralidade das trilhas condutoras ligadas a pelo menos uma superfície do substrato. a pcb, compreende adicionalmente um revestimento das múltiplas camadas depositado na pelo menos uma superfície do substrato. o revestimento das múltiplas camadas (i) reveste pelo menos uma porção da pluralidade das trilhas condutoras e (ii) que compreende pelo menos uma camada formada de um polímero de halo-hidrocarboneto. a pcb, compreende adicionalmente pelo menos um componente elétrico ligado por meio de uma junta de solda a pelo menos uma trilha condutora, em que a junta de solda é soldada através do revestimento das múltiplas camadas de modo que a junta de solda está em contato com o revestimento das múltiplas camadas.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0815096A GB2462824A (en) | 2008-08-18 | 2008-08-18 | Printed circuit board encapsulation |
GB0815095A GB2462823A (en) | 2008-08-18 | 2008-08-18 | A switch |
GB0815094A GB2462822B (en) | 2008-08-18 | 2008-08-18 | Wire bonding |
PCT/GB2009/001966 WO2010020753A2 (en) | 2008-08-18 | 2009-08-11 | Halo-hydrocarbon polymer coating |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0917289A2 BRPI0917289A2 (pt) | 2015-11-10 |
BRPI0917289A8 true BRPI0917289A8 (pt) | 2019-09-17 |
Family
ID=41435248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0917289A BRPI0917289A8 (pt) | 2008-08-18 | 2009-08-11 | revestimento polimérico de halo-hidrocarboneto |
Country Status (15)
Country | Link |
---|---|
US (1) | US9055700B2 (pt) |
EP (1) | EP2327283A2 (pt) |
JP (2) | JP5645821B2 (pt) |
KR (2) | KR101574374B1 (pt) |
CN (3) | CN105744750B (pt) |
AU (1) | AU2009283992B2 (pt) |
BR (1) | BRPI0917289A8 (pt) |
CA (2) | CA2733765C (pt) |
MX (1) | MX2011001775A (pt) |
MY (1) | MY155804A (pt) |
PH (1) | PH12015500087A1 (pt) |
RU (2) | RU2533162C2 (pt) |
SG (2) | SG10201701218UA (pt) |
TW (1) | TWI459878B (pt) |
WO (1) | WO2010020753A2 (pt) |
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2009
- 2009-08-11 EP EP09784909A patent/EP2327283A2/en not_active Withdrawn
- 2009-08-11 CA CA2733765A patent/CA2733765C/en not_active Expired - Fee Related
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- 2009-08-11 US US13/059,602 patent/US9055700B2/en active Active
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- 2009-08-11 RU RU2011110260/07A patent/RU2533162C2/ru active
- 2009-08-11 WO PCT/GB2009/001966 patent/WO2010020753A2/en active Application Filing
- 2009-08-11 AU AU2009283992A patent/AU2009283992B2/en not_active Ceased
- 2009-08-11 CN CN2009801355060A patent/CN102150480A/zh active Pending
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- 2009-08-11 KR KR1020117006208A patent/KR101574374B1/ko active IP Right Grant
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