DE602006021193D1 - Leiterplatteneinheit und Verfahren zur Herstellung dazu - Google Patents

Leiterplatteneinheit und Verfahren zur Herstellung dazu

Info

Publication number
DE602006021193D1
DE602006021193D1 DE602006021193T DE602006021193T DE602006021193D1 DE 602006021193 D1 DE602006021193 D1 DE 602006021193D1 DE 602006021193 T DE602006021193 T DE 602006021193T DE 602006021193 T DE602006021193 T DE 602006021193T DE 602006021193 D1 DE602006021193 D1 DE 602006021193D1
Authority
DE
Germany
Prior art keywords
circuit board
laminate
smds
electrically insulating
board unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006021193T
Other languages
English (en)
Inventor
Ernst Buehler
Amario Rino D
Reto Knaak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agie Charmilles New Technologies SA
Agie Charmilles SA
Original Assignee
Agie Charmilles New Technologies SA
Agie Charmilles SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agie Charmilles New Technologies SA, Agie Charmilles SA filed Critical Agie Charmilles New Technologies SA
Publication of DE602006021193D1 publication Critical patent/DE602006021193D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
    • B23H1/02—Electric circuits specially adapted therefor, e.g. power supply, control, preventing short circuits or other abnormal discharges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H11/00—Auxiliary apparatus or details, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Paper (AREA)
DE602006021193T 2006-10-27 2006-10-27 Leiterplatteneinheit und Verfahren zur Herstellung dazu Active DE602006021193D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06022498A EP1916884B1 (de) 2006-10-27 2006-10-27 Leiterplatteneinheit und Verfahren zur Herstellung dazu

Publications (1)

Publication Number Publication Date
DE602006021193D1 true DE602006021193D1 (de) 2011-05-19

Family

ID=37857135

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006021193T Active DE602006021193D1 (de) 2006-10-27 2006-10-27 Leiterplatteneinheit und Verfahren zur Herstellung dazu

Country Status (7)

Country Link
US (1) US7948758B2 (de)
EP (1) EP1916884B1 (de)
JP (1) JP2008112967A (de)
CN (1) CN101170873B (de)
AT (1) ATE505067T1 (de)
DE (1) DE602006021193D1 (de)
ES (1) ES2363025T3 (de)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5057221B2 (ja) * 2007-08-24 2012-10-24 中村製作所株式会社 放熱部付き金属ベースプリント基板及びその製造方法
ES2476596T3 (es) 2008-04-29 2014-07-15 Agie Charmilles Sa Unidad de placa de circuitos impresos y procedimiento para su fabricación
CN101594739A (zh) * 2008-05-27 2009-12-02 华为技术有限公司 器件埋入式电路板散热装置及加工方法
JP5065202B2 (ja) * 2008-08-28 2012-10-31 トヨタ自動車株式会社 半導体装置
US20100163427A1 (en) * 2008-12-31 2010-07-01 Yimin Zhan Methods and systems for electromachining of a workpiece
US8064198B2 (en) * 2009-06-29 2011-11-22 Honda Motor Co., Ltd. Cooling device for semiconductor element module and magnetic part
JP5515947B2 (ja) * 2010-03-29 2014-06-11 株式会社豊田自動織機 冷却装置
CN102316699B (zh) * 2010-07-07 2015-10-14 富泰华工业（深圳）有限公司 冷却方法、使用该冷却设备方法的电路板维修装置及设备
EP2447990B1 (de) * 2010-11-02 2020-12-23 ABB Power Grids Switzerland AG Grundplatte
US8737043B2 (en) * 2011-03-10 2014-05-27 Ericson Manufacturing Co. Electrical enclosure
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks
CN102510657B (zh) * 2011-10-08 2014-10-15 苏州佳世达电通有限公司 多层电路板及包括其的电子装置
DE102012213916A1 (de) * 2011-11-08 2013-05-08 Robert Bosch Gmbh Elektronikmodul für ein Steuergerät
US9600434B1 (en) 2011-12-30 2017-03-21 Bedrock Automation Platforms, Inc. Switch fabric having a serial communications interface and a parallel communications interface
US8862802B2 (en) 2011-12-30 2014-10-14 Bedrock Automation Platforms Inc. Switch fabric having a serial communications interface and a parallel communications interface
US9191203B2 (en) 2013-08-06 2015-11-17 Bedrock Automation Platforms Inc. Secure industrial control system
US8971072B2 (en) 2011-12-30 2015-03-03 Bedrock Automation Platforms Inc. Electromagnetic connector for an industrial control system
US10834094B2 (en) 2013-08-06 2020-11-10 Bedrock Automation Platforms Inc. Operator action authentication in an industrial control system
US11144630B2 (en) 2011-12-30 2021-10-12 Bedrock Automation Platforms Inc. Image capture devices for a secure industrial control system
US10834820B2 (en) * 2013-08-06 2020-11-10 Bedrock Automation Platforms Inc. Industrial control system cable
US9467297B2 (en) 2013-08-06 2016-10-11 Bedrock Automation Platforms Inc. Industrial control system redundant communications/control modules authentication
US11967839B2 (en) 2011-12-30 2024-04-23 Analog Devices, Inc. Electromagnetic connector for an industrial control system
US9437967B2 (en) 2011-12-30 2016-09-06 Bedrock Automation Platforms, Inc. Electromagnetic connector for an industrial control system
US9727511B2 (en) 2011-12-30 2017-08-08 Bedrock Automation Platforms Inc. Input/output module with multi-channel switching capability
US8868813B2 (en) 2011-12-30 2014-10-21 Bedrock Automation Platforms Inc. Communications control system with a serial communications interface and a parallel communications interface
US11314854B2 (en) 2011-12-30 2022-04-26 Bedrock Automation Platforms Inc. Image capture devices for a secure industrial control system
CN103296863B (zh) * 2012-02-24 2017-03-01 台达电子企业管理（上海）有限公司 电源转换装置
US20150123663A1 (en) * 2012-04-23 2015-05-07 Koninklijke Philips N.V. Integrated electronics module with cooling structure
KR101540146B1 (ko) * 2012-06-22 2015-07-28 삼성전기주식회사 전력 모듈용 방열 시스템
GB2505178A (en) * 2012-08-20 2014-02-26 Johnson Electric Sa Stackable Overlapping Security Wrap Film for Protecting Electronic Device.
US8897014B2 (en) * 2012-09-04 2014-11-25 General Electric Company Mechanical layout for half-bridge power module that is optimized for low inductance
DE102012215788B4 (de) * 2012-09-06 2014-05-22 Osram Gmbh Mehrlagige LED-Leiterplatte
WO2014173550A1 (en) * 2013-04-26 2014-10-30 Abb Technology Ag Power semiconductor module
US9449895B2 (en) * 2013-05-03 2016-09-20 Infineon Technologies Ag Cooling system for molded modules and corresponding manufacturing methods
JP6221392B2 (ja) * 2013-06-19 2017-11-01 富士通株式会社 パッケージ実装構造
US10613567B2 (en) 2013-08-06 2020-04-07 Bedrock Automation Platforms Inc. Secure power supply for an industrial control system
ES2660512T3 (es) 2013-08-29 2018-03-22 Agie Charmilles Sa Máquina de electroerosión por hilo
DE102013111067A1 (de) * 2013-10-07 2015-04-09 Hella Kgaa Hueck & Co. Elektronische Schaltung
FR3011713B1 (fr) * 2013-10-09 2017-06-23 Valeo Systemes De Controle Moteur Module electrique, systeme electrique comportant un tel module electrique, procedes de fabrication correspondants
CN103515850B (zh) * 2013-10-29 2015-08-19 浦江县科创进出口有限公司 一种能够双向抽气的处理器安装器件
US9642265B2 (en) * 2014-06-19 2017-05-02 Bae Systems Information And Electronic Systems Integration Inc. Dense out of plane interconnect inside hermetically sealed modules
EP2966934B1 (de) * 2014-07-08 2016-09-14 Eberspächer catem GmbH & Co. KG Steuervorrichtung für eine elektrische Heizvorrichtung und Verfahren zu deren Herstellung
CN106664799B (zh) * 2014-07-17 2020-04-10 Cedal装置有限公司 用于获得印刷电路的多层片材的设备和相关方法
JP6316164B2 (ja) * 2014-10-09 2018-04-25 新光電気工業株式会社 電源モジュール、電源モジュールに使用されるパッケージ、電源モジュールの製造方法、及びワイヤレスセンサーモジュール
DE102014015586B3 (de) * 2014-10-21 2016-03-31 Webasto SE Heizgerät
EP3242977B1 (de) * 2015-01-07 2019-10-02 Volvo Construction Equipment AB Steuerungsverfahren zur steuerung eines baggers und bagger mit einer steuerungseinheit zur implementierung solch eines steuerungsverfahrens
US9613885B2 (en) 2015-03-03 2017-04-04 Infineon Technologies Ag Plastic cooler for semiconductor modules
US9706662B2 (en) 2015-06-30 2017-07-11 Raytheon Company Adaptive interposer and electronic apparatus
EP3131377A1 (de) * 2015-08-14 2017-02-15 Siemens Aktiengesellschaft Phasenmodul für einen stromrichter
US9648729B1 (en) 2015-11-20 2017-05-09 Raytheon Company Stress reduction interposer for ceramic no-lead surface mount electronic device
WO2018010159A1 (zh) * 2016-07-15 2018-01-18 乐健科技（珠海）有限公司 散热电路板、功率模块及制备散热电路板的方法
DE102017200775A1 (de) * 2017-01-19 2018-07-19 Carl Zeiss Smt Gmbh Bauelement für eine Projektionsbelichtungsanlage
FR3062518B1 (fr) * 2017-01-31 2019-04-19 Supergrid Institute Module electronique de puissance comportant un support dielectrique
CN107608407B (zh) * 2017-09-06 2022-01-14 华为技术有限公司 一种负压液冷***及其控制方法
JP7027863B2 (ja) * 2017-12-15 2022-03-02 ヤマハ株式会社 増幅装置
DE102018204552A1 (de) * 2018-03-26 2019-09-26 Schweizer Electronic Ag Verfahren zur Herstellung einer Leiterplatte und Leiterplatte
US10658941B2 (en) * 2018-04-17 2020-05-19 General Electric Company Compact design of multilevel power converter systems
JP7159620B2 (ja) * 2018-05-30 2022-10-25 富士電機株式会社 半導体装置、冷却モジュール、電力変換装置及び電動車両
CN110600453B (zh) * 2018-06-12 2021-07-27 欣兴电子股份有限公司 封装载板
FR3083324B1 (fr) * 2018-06-29 2020-10-09 3D Plus Equipement de deverminage de composants electroniques
CN109148411B (zh) * 2018-08-15 2020-06-16 乐健科技（珠海）有限公司 散热基板及其制备方法
US11638353B2 (en) * 2018-09-17 2023-04-25 Hutchinson Technology Incorporated Apparatus and method for forming sensors with integrated electrical circuits on a substrate
DE102019200011A1 (de) * 2019-01-02 2020-07-02 Rolls-Royce Deutschland Ltd & Co Kg Elektrische Schaltung mit Kühlung insbesondere für Anwendungen in Luftfahrzeugen
CN113327904B (zh) * 2021-04-29 2023-06-02 中国电子科技集团公司第二十九研究所 一种双面高效散热气密封装结构及其制备方法
CN113286451B (zh) * 2021-05-24 2022-07-19 四川海英电子科技有限公司 一种hdi多层电路板叠层导盲孔制作方法
US11889614B2 (en) * 2021-07-22 2024-01-30 Borgwarner Inc. Cooling conduit for electrical components on a PCB
CN113939171A (zh) * 2021-09-22 2022-01-14 哈尔滨工业大学 一种光刻机电路板水冷屏蔽装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3952231A (en) * 1974-09-06 1976-04-20 International Business Machines Corporation Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
FR2519508A1 (fr) 1981-12-31 1983-07-08 Thomson Csf Dispositif de refroidissement pour carte de circuit imprime et procede de fabrication d'un tel dispositif
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
FR2579060B1 (fr) 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4835598A (en) 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
EP0408904A3 (en) * 1989-07-21 1992-01-02 Motorola Inc. Surface mounting semiconductor device and method
US5166775A (en) * 1990-01-16 1992-11-24 Cray Research, Inc. Air manifold for cooling electronic devices
DE4012100A1 (de) 1990-04-14 1991-10-17 Standard Elektrik Lorenz Ag Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
DE4240996C1 (de) 1992-12-05 1994-06-16 Bosch Gmbh Robert Verfahren zur Herstellung einer Verbundanordnung
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
JP2908881B2 (ja) 1995-01-25 1999-06-21 ノーザン・テレコム・リミテッド 印刷回路基板構造とヒートシンク構造との組立体を作成する方法および印刷回路基板構造とヒートシンク構造との組立体
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module
DE19647916C2 (de) 1996-11-20 1999-02-18 Ilfa Industrieelektronik Und L Leiterplattenanordnung
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
EP1276362B1 (de) 2001-07-13 2006-02-01 Lytron, Inc. Kühlplatte mit plattem Schlauch zur Flüssigkeitskühlung elektrischer Komponenten
US6606251B1 (en) * 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US20060044765A1 (en) * 2004-09-01 2006-03-02 Infowize Technologies Corporation Heat dissipation device

Also Published As

Publication number Publication date
EP1916884B1 (de) 2011-04-06
EP1916884A1 (de) 2008-04-30
ATE505067T1 (de) 2011-04-15
US7948758B2 (en) 2011-05-24
JP2008112967A (ja) 2008-05-15
CN101170873A (zh) 2008-04-30
ES2363025T3 (es) 2011-07-19
CN101170873B (zh) 2011-05-04
US20080160246A1 (en) 2008-07-03

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