WO2016059980A1 - 液状エポキシ樹脂組成物 - Google Patents

液状エポキシ樹脂組成物 Download PDF

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Publication number
WO2016059980A1
WO2016059980A1 PCT/JP2015/078065 JP2015078065W WO2016059980A1 WO 2016059980 A1 WO2016059980 A1 WO 2016059980A1 JP 2015078065 W JP2015078065 W JP 2015078065W WO 2016059980 A1 WO2016059980 A1 WO 2016059980A1
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epoxy resin
resin composition
liquid
liquid epoxy
component
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PCT/JP2015/078065
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English (en)
French (fr)
Japanese (ja)
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敏行 佐藤
洋希 本間
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ナミックス株式会社
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a liquid epoxy resin composition, and more particularly to a liquid epoxy resin composition suitable for an underfill agent for a semiconductor element for chip-on-film package.
  • Flip chip bonding is used in semiconductor packages such as COF (Chip On Film) packages, which are mounting methods for semiconductor elements that can support higher density and higher output of semiconductor devices such as liquid crystal driver ICs. Yes.
  • COF Chip On Film
  • a semiconductor element and a substrate are joined by bumps, and a gap between the semiconductor element and the substrate is sealed with a liquid semiconductor sealing agent called an underfill material.
  • FIG. 1 is a schematic diagram for explaining the migration of copper wiring.
  • the migration starts with the anode 2, Cu is eluted by the reaction formula: Cu + (OH ⁇ ) ⁇ Cu (OH), and Cu (OH) moves on the substrate 1 in the direction of the solid arrow, that is, toward the cathode 3,
  • Cu is deposited on the substrate 1 in the direction of the broken line arrow, that is, in the direction of the anode 2 by the reaction formula: CuOH + H 3 O + ⁇ Cu + 2H 2 O.
  • copper wiring is sealed with an epoxy resin-based resin composition, but migration occurs due to OH ⁇ or H 3 O + derived from H 2 O absorbed in the epoxy resin. Furthermore, migration is dramatically accelerated if there are Cl 2 ⁇ ions in the atmosphere.
  • This Cl ⁇ ion is usually present as an impurity of the epoxy resin.
  • Cu (OH) may be Cu (OH) 2 or Cu (OH) + precisely, and in the case of Cu (OH) 2 , it moves to the cathode side due to the concentration difference. In the case of Cu (OH) + , it moves electrically.
  • Patent Document 1 An underfill agent containing a metal ion binder has been reported (Patent Document 1). This underfill agent suppresses migration by immobilizing metal ions eluted by an electrochemical reaction with a metal ion binder.
  • the properties of the underfill agent such as the underfill agent thickening during storage and the glass transition temperature of the underfill agent are reduced. There's a problem.
  • a metal ion binder is included in the underfill agent, there is a problem of deterioration in adhesion and heat resistance due to the addition of a material that is not incorporated into the polymer skeleton, and a halogen concentration that easily induces migration. There is also a problem that the material cost required for the processing for lowering becomes high.
  • COF mounting sealant As a chip-on-film (hereinafter referred to as COF) mounting sealant, it includes (A) an epoxy resin, (B) an acid anhydride-based curing agent, and (C) an imidazole-based and / or triazine-based curing accelerator.
  • the present invention can be used as a fine-pitch COF mounting sealant, and maintains high flow performance while suppressing peeling during cooling or reliability testing in the sealing process, thereby enabling high-temperature and high-humidity testing. It aims at providing the liquid epoxy resin composition which can suppress generation
  • the present invention relates to a liquid epoxy resin composition, a liquid semiconductor sealing material, and a semiconductor device that have solved the above problems by having the following configuration.
  • [1] containing (A) a liquid epoxy resin, (B) an acid anhydride curing agent, (C) an imidazole compound curing accelerator, and (D) an elastomer having a core-shell structure subjected to a masterbatch treatment,
  • the liquid epoxy resin composition wherein the component (D) is 1 to 10 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition.
  • a liquid semiconductor encapsulant comprising the liquid epoxy resin composition according to any one of [1] to [3].
  • a liquid encapsulant for a liquid crystal driver comprising the liquid semiconductor encapsulant according to [4] above.
  • the present invention [1] it can be used as a fine pitch COF mounting sealant, and suppresses peeling during cooling or reliability testing in the sealing process without deteriorating fluidity.
  • the liquid epoxy resin composition which can suppress the migration which generate
  • the liquid epoxy resin composition of the present invention comprises (A) a liquid epoxy resin, (B) an acid anhydride curing agent, (C) an imidazole compound curing accelerator, and (D) an elastomer having a core-shell structure subjected to a masterbatch treatment. Contains, The component (D) is 1 to 10 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition.
  • component (A) aminophenol type epoxy resin, liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, liquid naphthalene type epoxy resin, liquid hydrogenated bisphenol type epoxy resin, liquid alicyclic epoxy resin, liquid alcohol
  • component (A) aminophenol type epoxy resin, liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, liquid naphthalene type epoxy resin, liquid hydrogenated bisphenol type epoxy resin, liquid alicyclic epoxy resin, liquid alcohol
  • ether type epoxy resins liquid cycloaliphatic type epoxy resins, liquid fluorene type epoxy resins, and liquid siloxane-based epoxy resins.
  • a type epoxy resin is preferred.
  • the aminophenol type epoxy resin that can be contained in the component (A) suppresses the occurrence of migration of the liquid epoxy resin composition after curing by forming a resin skeleton having a high crosslinking density.
  • the aminophenol type epoxy resin is preferably represented by the formula (1):
  • the epoxy equivalent of the component (A) is preferably 80 to 250 g / eq from the viewpoint of adjusting the viscosity.
  • Commercially available products of component (A) include Daicel Chemical's bisphenol A type epoxy resin (product name: LX-01), Mitsubishi Chemical's aminophenol type epoxy resin (grade: JER630, JER630LSD), Nippon Steel Chemical's bisphenol A type.
  • Epoxy resin product name: YDF8170
  • Nippon Steel Chemicals bisphenol F type epoxy resin product name: YDF870GS
  • DIC naphthalene type epoxy resin product name: HP4032D
  • Shin-Etsu Chemical siloxane epoxy resin product name: TSL9906), etc.
  • a component may be individual or may use 2 or more types together.
  • Component (B) imparts good reactivity (curing speed) and appropriate viscosity imparting to the liquid epoxy resin composition.
  • component (B) methyltetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl hymic acid Examples include anhydrides, succinic anhydrides substituted with alkenyl groups, methyl nadic anhydrides, glutaric anhydrides, and the like, and methylbutenyl tetrahydrophthalic anhydride is preferred. Examples of commercially available products include acid anhydrides (grade: YH306, YH307) manufactured by Mitsubishi Chemical. (B) A component may be individual or may use 2 or more types together.
  • component (C) The component imparts an appropriate curing rate to the liquid epoxy resin composition.
  • examples of the component (C) include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and the like.
  • Commercially available products of component (C) include 2-phenyl-4-methylimidazole (product name: 2P4MZ) manufactured by Shikoku Chemicals, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] manufactured by Shikoku Chemicals -Ethyl-s-triazine (product name: 2MZA).
  • a component may be individual or may use 2 or more types together.
  • the component (D) imparts injectability to the liquid epoxy resin composition and suppresses peeling and migration of the liquid epoxy resin composition after curing.
  • the elastomer having a core-shell structure that is masterbatch-treated with the component (D) include core: polybutadiene, shell: acrylic copolymer, core: silicone resin, shell: acrylic copolymer, and the like, and a liquid epoxy resin composition Since the shrinkage stress of the liquid epoxy resin composition can be lowered due to the low elastic modulus in the use temperature range, a core: polybutadiene and a shell: acrylic copolymer are preferable.
  • Commercially available elastomers having a core-shell structure include Kaneka core-shell rubber (product name: MX-137) and Mitsubishi Rayon core-shell rubber (product name: W5500).
  • Masterbatch processing to an elastomer having a core-shell structure can be performed with a curing agent such as an epoxy resin or an acid anhydride, and an epoxy resin, particularly a bisphenol type epoxy resin is preferred from the viewpoint of storage stability and presence or absence of adverse effects on humidity.
  • a curing agent such as an epoxy resin or an acid anhydride
  • an epoxy resin particularly a bisphenol type epoxy resin is preferred from the viewpoint of storage stability and presence or absence of adverse effects on humidity.
  • the bisphenol type epoxy resin include bisphenol A type epoxy resin and bisphenol F type epoxy resin, and bisphenol F type epoxy resin is more preferable.
  • (D) Although a form is not specifically limited, (D) Component dispersibility, Workability
  • the average particle diameter is measured with a laser diffraction particle size distribution measuring apparatus (model number: LS13320) manufactured by BECKMAN COULTER.
  • the elastomer having a core-shell structure as the component (D) is preferably 20 to 40 parts by mass with respect to 100 parts by mass in total of the elastomer having the core-shell structure and the epoxy resin subjected to the masterbatch treatment.
  • a component may be individual or may use 2 or more types together.
  • the component (B) is preferably a ratio of 0.6 to 1.2 equivalents, more preferably 0.6 to 1.0 equivalents with respect to the component (A): 1 equivalent.
  • the equivalent of (A) component is an epoxy equivalent
  • the equivalent of (B) component is an acid anhydride equivalent. If it is 0.6 or more, the reactivity, the moisture resistance reliability in the high temperature and high humidity test of the liquid epoxy resin composition after curing, and the migration resistance are good, while if it is 1.2 or less, the viscosity is increased. The magnification does not become too high, and the generation of voids is suppressed.
  • Component (C) is preferably 0.05 to 5 parts by weight, more preferably 0.1 to 5 parts by weight, and still more preferably 0.3 to 3.0 parts by weight with respect to 100 parts by weight of component (A). Part contained. When it is 0.05 parts by mass or more, the reactivity is good, and when it is 5 parts by mass or less, the moisture resistance reliability is good, and the thickening ratio is stable.
  • (D) Component is 1 to 10 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition.
  • component (D) is less than 1 part by mass, the liquid epoxy resin composition after curing is peeled off and migration resistance is lowered.
  • (D) component exceeds 10 mass parts, the injectability of a liquid epoxy resin will fall.
  • the liquid epoxy resin composition further contains (E) a coupling agent.
  • a coupling agent As the component (E), 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyltrimethoxysilane, 3-acrylic Examples include loxypropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, bis (triethoxysilylpropyl) tetrasulfide, and 3-isocyanatopropyltriethoxysilane. Trimethoxysilane and 3-aminopropyltrimethoxysilane are preferred. Examples of commercially available products include KBM403, KBE903, and KBE9103 manufactured by Shin-Etsu Chemical.
  • the component (E) is preferably contained in an amount of 0.05 to 5.0 parts by mass, more preferably 0.1 to 3.0 parts by mass with respect to 100 parts by mass of the component (A). Adhesion improves when it is 0.05 parts by mass or more, and the adhesive strength after the moisture resistance test of the liquid epoxy resin composition after curing becomes better, and when it is 5.0 parts by mass or less, the liquid resin composition Foaming of the product is suppressed.
  • a filler such as a silica filler, a leveling agent, an antifoaming agent, a decoloring agent, an antioxidant, a pigment, and a dye are added as necessary without departing from the object of the present invention.
  • Etc. can be mix
  • the viscosity of the liquid epoxy resin composition at a temperature of 25 ° C. is preferably 50 to 820 mPa ⁇ s from the viewpoint of injectability.
  • the viscosity is measured with an E-type viscometer (model number: TVE-22H) manufactured by Toki Sangyo Co., Ltd.
  • the liquid epoxy resin composition preferably has a viscosity increase rate after 24 hours of 150% or less, and preferably a viscosity increase rate after 48 hours of 300% or less.
  • the rate of increase in viscosity is measured by measuring the viscosity after storing the liquid epoxy resin composition at room temperature for 24 hours and 48 hours, [ ⁇ (viscosity after 24 or 48 hours) / (initial viscosity) ⁇ ⁇ 100]. Is a viscosity increase rate (unit:%).
  • the epoxy resin composition of the present invention is suitable as a sealant for semiconductor elements utilizing flip chip bonding, and is particularly suitable as a sealant for chip-on-film packages, especially a liquid sealant for liquid crystal drivers.
  • the liquid epoxy resin composition described above is manufactured by dispersing an elastomer having a core-shell structure in a bisphenol type epoxy resin, etc., forming the component (D) as a master batch, and then mixing the components (A) to (D). can do.
  • an elastomer having a core-shell structure (hereinafter referred to as a core-shell elastomer) is produced by emulsion polymerization in water.
  • a liquid epoxy resin composition has been produced by using a core-shell elastomer obtained by dehydrating a suspension containing a core-shell elastomer produced by emulsion polymerization in water as it is.
  • the core-shell elastomer obtained by this method aggregates in the liquid epoxy resin composition and is detected as a foreign substance.
  • a liquid sealant for a liquid crystal driver there is a filtering step using a fine mesh, and there is a problem that filtering cannot be performed if there are aggregates.
  • an epoxy resin is added to a suspension containing a core-shell elastomer prepared by emulsion polymerization in water, and the core-shell elastomer is coated with the epoxy resin and then dehydrated to prepare the component (D).
  • the core-shell elastomer is coated with the epoxy resin and then dehydrated to prepare the component (D).
  • a core-shell elastomer masterbatch can be obtained by substituting the water component with an epoxy resin from a core-shell elastomer-containing suspension prepared by emulsion polymerization.
  • an epoxy resin from a core-shell elastomer-containing suspension prepared by emulsion polymerization.
  • the core-shell elastomer is removed from the suspension by drying, aggregates are formed. Since it is difficult to disperse the aggregates in the primary particles in the epoxy resin, it is necessary to replace the aggregates with the liquid phase without taking them out of the suspension.
  • the liquid resin composition of the present invention is obtained, for example, by stirring, melting, mixing, and dispersing the components (A) to (D) and other additives simultaneously or separately, with heat treatment as necessary.
  • the mixing, stirring, dispersing and the like devices are not particularly limited, and a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill and the like can be used. . Moreover, you may use combining these apparatuses suitably.
  • the liquid epoxy resin composition of the present invention is formed and applied at a desired position on the substrate by a dispenser, printing or the like.
  • the liquid epoxy resin composition is formed between a substrate such as a flexible wiring substrate and a semiconductor element so that at least a part thereof is in contact with the wiring of the substrate.
  • Curing of the liquid resin composition of the present invention is preferably carried out at 120 to 160 ° C. for 5 to 120 minutes. Particularly when cured within 200 seconds, productivity when used as a sealant for chip-on-film packages is improved. From the viewpoint of
  • a desired semiconductor element and substrate can be used, but a combination of a flip chip bonding semiconductor element and a substrate for COF package is preferable.
  • the liquid resin composition of the present invention is very suitable for a liquid semiconductor encapsulant, particularly a liquid encapsulant for a liquid crystal driver, and a liquid crystal driver sealed using this liquid semiconductor encapsulant, etc.
  • the semiconductor device having the flip-chip type semiconductor element has excellent migration resistance and high reliability because peeling in the reliability test is suppressed.
  • Example 1 to 11 and Comparative Examples 1 to 7 Liquid resin compositions (hereinafter referred to as “resin compositions”) were prepared with the formulations shown in Tables 1 and 2.
  • the components (A) to (D) were mixed in the formulations shown in Tables 1 and 2 for 5 minutes at room temperature using a planetary stirring deaerator. Since the mass ratio of the core-shell rubber (D) component to the bisphenol F-type epoxy resin was 1: 2, the component (A) bisphenol F-type epoxy resin was used in the master batch of the (D) component. Was subtracted and added.
  • Comparative Example 4 the core-shell rubber obtained by drying the core-shell rubber-containing water suspension was used in place of the component (D).
  • the master batch of the component (D ′) used in Comparative Example 6 was performed using three rolls. The mass ratio of the solid rubber and the mold epoxy resin as the component (D ′) was 1: 2.
  • the prepared resin composition is sandwiched between a glass plate coated with a release agent and cured into a 350 ⁇ m sheet at 60 ° C. for 60 minutes.
  • the flexural modulus is preferably 2.0 to 4.2 GPa. Tables 1 and 2 show the evaluation results of the flexural modulus.
  • FIG. 1 the schematic diagram explaining the evaluation method of the injectability of a resin composition is shown.
  • a test piece in which a 20 ⁇ m gap 40 was provided on the substrate 20 and the glass plate 30 was fixed instead of the semiconductor element was produced.
  • a glass substrate was used instead of the flexible substrate.
  • this test piece is placed on a hot plate set at 110 ° C., and as shown in FIG. 2 (B), the prepared resin composition 10 is applied to one end side of the glass plate 30, and FIG. ), The time until the gap 40 was filled with the resin composition 11 was measured.
  • the case where the gap 40 was satisfied within 90 seconds was determined as “good”, and the case where it exceeded 90 seconds was determined as “bad”.
  • Tables 1 and 2 show the injectability evaluation results.
  • FIG. 3 shows a photograph of a portion where there is no separation after curing
  • FIGS. 4 and 5 show photographs of a portion where separation occurs after curing. In FIG. 3, there was no separation, whereas in FIGS. 4 and 5, separation was confirmed at the location indicated by the arrow. Tables 1 and 2 show the evaluation results of peeling after curing.
  • FIG. 6 shows an enlarged photograph of the appearance of Example 3
  • FIG. 7 shows an enlarged photograph of the appearance of Comparative Example 4.
  • the pattern pitch in FIGS. 6 and 7 is 30 ⁇ m.
  • Example 3 shown in FIG. 6 the appearance was “ ⁇ ”.
  • Comparative Example 4 shown in FIG. 7 peeling (delamination) was observed in a portion surrounded by a white broken line in the photograph.
  • Tables 1 and 2 show the results of evaluation of appearance peeling.
  • the test method is as follows.
  • the prepared resin composition is applied in a thickness of 20 ⁇ m onto a polyimide tape substrate having tin wiring (0.2 ⁇ 0.05 ⁇ m) copper wiring (pattern width: 15 ⁇ m, line width: 15 ⁇ m, pattern pitch: 30 ⁇ m). And it processed at 150 degreeC for 30 minute (s), the sealing agent was hardened, and the test piece was produced.
  • an ion migration evaluation system manufactured by Espec Co., Ltd. was used to measure a change in resistance value when a voltage of DC 60 V was applied at 85 ° C./85% humidity, and the resistance value was 1.00 ⁇ .
  • the migration of the copper wiring was evaluated (unit: time) with the time point below 10 7 ⁇ as a threshold value. For those whose resistance value did not fall below the threshold, the test was terminated when 1000 hours were exceeded. Tables 1 and 2 show the migration resistance evaluation results.
  • Comparative Example 4 using a core-shell rubber without a masterbatch treatment
  • Comparative Example 5 using a solid rubber without a corebatch without a masterbatch treatment
  • a solid rubber subjected to a masterbatch treatment are used instead of the component (D).
  • Comparative Example 6 was poor in injectability and poor in appearance.
  • Comparative Example 7 using liquid rubber instead of the component (D) had a large amount of extracted Cl and poor migration characteristics.
  • the liquid resin composition of the present invention can be used as a fine pitch COF mounting sealant, and suppresses peeling during cooling in a sealing process or during a reliability test without deteriorating fluidity.
  • the occurrence of migration that occurs in the high-temperature and high-humidity test can be suppressed, and is particularly suitable for a flip-chip type semiconductor element, particularly a semiconductor device including a liquid crystal driver.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2015/078065 2014-10-17 2015-10-02 液状エポキシ樹脂組成物 WO2016059980A1 (ja)

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JP2002146160A (ja) * 2000-11-17 2002-05-22 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2003082064A (ja) * 2001-06-28 2003-03-19 Harima Chem Inc 封止充填剤用液状エポキシ樹脂組成物
JP2013151642A (ja) * 2011-12-27 2013-08-08 Hitachi Chemical Co Ltd 電子部品用液状樹脂組成物及びその製造方法、並びに電子部品装置

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JP5593259B2 (ja) * 2011-03-16 2014-09-17 ナミックス株式会社 液状エポキシ樹脂組成物

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Publication number Priority date Publication date Assignee Title
JP2002146160A (ja) * 2000-11-17 2002-05-22 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2003082064A (ja) * 2001-06-28 2003-03-19 Harima Chem Inc 封止充填剤用液状エポキシ樹脂組成物
JP2013151642A (ja) * 2011-12-27 2013-08-08 Hitachi Chemical Co Ltd 電子部品用液状樹脂組成物及びその製造方法、並びに電子部品装置

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