JP2016079293A - 液状エポキシ樹脂組成物 - Google Patents
液状エポキシ樹脂組成物 Download PDFInfo
- Publication number
- JP2016079293A JP2016079293A JP2014212325A JP2014212325A JP2016079293A JP 2016079293 A JP2016079293 A JP 2016079293A JP 2014212325 A JP2014212325 A JP 2014212325A JP 2014212325 A JP2014212325 A JP 2014212325A JP 2016079293 A JP2016079293 A JP 2016079293A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid
- resin composition
- liquid epoxy
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014212325A JP2016079293A (ja) | 2014-10-17 | 2014-10-17 | 液状エポキシ樹脂組成物 |
PCT/JP2015/078065 WO2016059980A1 (ja) | 2014-10-17 | 2015-10-02 | 液状エポキシ樹脂組成物 |
TW104133480A TWI664230B (zh) | 2014-10-17 | 2015-10-13 | 液狀環氧樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014212325A JP2016079293A (ja) | 2014-10-17 | 2014-10-17 | 液状エポキシ樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016079293A true JP2016079293A (ja) | 2016-05-16 |
Family
ID=55746528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014212325A Pending JP2016079293A (ja) | 2014-10-17 | 2014-10-17 | 液状エポキシ樹脂組成物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2016079293A (zh) |
TW (1) | TWI664230B (zh) |
WO (1) | WO2016059980A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019214666A (ja) * | 2018-06-12 | 2019-12-19 | 日立化成株式会社 | 樹脂組成物及びその硬化物、並びに半導体装置の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002146160A (ja) * | 2000-11-17 | 2002-05-22 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
JP2003082064A (ja) * | 2001-06-28 | 2003-03-19 | Harima Chem Inc | 封止充填剤用液状エポキシ樹脂組成物 |
JP2012193284A (ja) * | 2011-03-16 | 2012-10-11 | Namics Corp | 液状エポキシ樹脂組成物 |
JP2013151642A (ja) * | 2011-12-27 | 2013-08-08 | Hitachi Chemical Co Ltd | 電子部品用液状樹脂組成物及びその製造方法、並びに電子部品装置 |
-
2014
- 2014-10-17 JP JP2014212325A patent/JP2016079293A/ja active Pending
-
2015
- 2015-10-02 WO PCT/JP2015/078065 patent/WO2016059980A1/ja active Application Filing
- 2015-10-13 TW TW104133480A patent/TWI664230B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002146160A (ja) * | 2000-11-17 | 2002-05-22 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
JP2003082064A (ja) * | 2001-06-28 | 2003-03-19 | Harima Chem Inc | 封止充填剤用液状エポキシ樹脂組成物 |
JP2012193284A (ja) * | 2011-03-16 | 2012-10-11 | Namics Corp | 液状エポキシ樹脂組成物 |
JP2013151642A (ja) * | 2011-12-27 | 2013-08-08 | Hitachi Chemical Co Ltd | 電子部品用液状樹脂組成物及びその製造方法、並びに電子部品装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019214666A (ja) * | 2018-06-12 | 2019-12-19 | 日立化成株式会社 | 樹脂組成物及びその硬化物、並びに半導体装置の製造方法 |
JP7259219B2 (ja) | 2018-06-12 | 2023-04-18 | 株式会社レゾナック | 樹脂組成物及びその硬化物、並びに半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2016059980A1 (ja) | 2016-04-21 |
TWI664230B (zh) | 2019-07-01 |
TW201619283A (zh) | 2016-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170822 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181023 |
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A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181217 |
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A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20190108 |