WO2013054786A1 - 金属フィルターの製造方法 - Google Patents
金属フィルターの製造方法 Download PDFInfo
- Publication number
- WO2013054786A1 WO2013054786A1 PCT/JP2012/076103 JP2012076103W WO2013054786A1 WO 2013054786 A1 WO2013054786 A1 WO 2013054786A1 JP 2012076103 W JP2012076103 W JP 2012076103W WO 2013054786 A1 WO2013054786 A1 WO 2013054786A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensitive resin
- resin composition
- metal filter
- layer
- copper substrate
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 98
- 239000002184 metal Substances 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000011342 resin composition Substances 0.000 claims abstract description 92
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000007747 plating Methods 0.000 claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 claims abstract description 48
- 239000010949 copper Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 48
- 238000011161 development Methods 0.000 claims abstract description 23
- 239000000126 substance Substances 0.000 claims abstract description 14
- 238000004090 dissolution Methods 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 206010028980 Neoplasm Diseases 0.000 claims description 30
- 201000011510 cancer Diseases 0.000 claims description 30
- 239000011889 copper foil Substances 0.000 claims description 28
- 210000004369 blood Anatomy 0.000 claims description 8
- 239000008280 blood Substances 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 11
- 230000037303 wrinkles Effects 0.000 abstract description 9
- 239000000047 product Substances 0.000 description 27
- 210000004027 cell Anatomy 0.000 description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 239000010408 film Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 239000007864 aqueous solution Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 239000011521 glass Substances 0.000 description 8
- 210000005266 circulating tumour cell Anatomy 0.000 description 7
- 239000011324 bead Substances 0.000 description 6
- 210000000601 blood cell Anatomy 0.000 description 6
- 238000005323 electroforming Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 210000000265 leukocyte Anatomy 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 210000004204 blood vessel Anatomy 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 206010027476 Metastases Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 210000001772 blood platelet Anatomy 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000034994 death Effects 0.000 description 2
- 231100000517 death Toxicity 0.000 description 2
- 210000003743 erythrocyte Anatomy 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- WMFOQBRAJBCJND-UHFFFAOYSA-M lithium hydroxide Inorganic materials [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 230000009401 metastasis Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002504 physiological saline solution Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical class OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 208000005443 Circulating Neoplastic Cells Diseases 0.000 description 1
- 208000003788 Neoplasm Micrometastasis Diseases 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- XBYNNYGGLWJASC-UHFFFAOYSA-N barium titanium Chemical compound [Ti].[Ba] XBYNNYGGLWJASC-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 210000002751 lymph Anatomy 0.000 description 1
- 210000001365 lymphatic vessel Anatomy 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- DFIWJEVKLWMZBI-UHFFFAOYSA-M sodium;dihydrogen phosphate;phosphoric acid Chemical compound [Na+].OP(O)(O)=O.OP(O)([O-])=O DFIWJEVKLWMZBI-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 210000001519 tissue Anatomy 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M1/00—Suction or pumping devices for medical purposes; Devices for carrying-off, for treatment of, or for carrying-over, body-liquids; Drainage systems
- A61M1/36—Other treatment of blood in a by-pass of the natural circulatory system, e.g. temperature adaptation, irradiation ; Extra-corporeal blood circuits
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/01—Filters implantable into blood vessels
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M1/00—Suction or pumping devices for medical purposes; Devices for carrying-off, for treatment of, or for carrying-over, body-liquids; Drainage systems
- A61M1/14—Dialysis systems; Artificial kidneys; Blood oxygenators ; Reciprocating systems for treatment of body fluids, e.g. single needle systems for hemofiltration or pheresis
- A61M1/15—Dialysis systems; Artificial kidneys; Blood oxygenators ; Reciprocating systems for treatment of body fluids, e.g. single needle systems for hemofiltration or pheresis with a cassette forming partially or totally the flow circuit for the treating fluid, e.g. the dialysate fluid circuit or the treating gas circuit
- A61M1/156—Constructional details of the cassette, e.g. specific details on material or shape
- A61M1/1563—Details of incorporated filters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M1/00—Suction or pumping devices for medical purposes; Devices for carrying-off, for treatment of, or for carrying-over, body-liquids; Drainage systems
- A61M1/36—Other treatment of blood in a by-pass of the natural circulatory system, e.g. temperature adaptation, irradiation ; Extra-corporeal blood circuits
- A61M1/3621—Extra-corporeal blood circuits
- A61M1/3627—Degassing devices; Buffer reservoirs; Drip chambers; Blood filters
- A61M1/3633—Blood component filters, e.g. leukocyte filters
- A61M1/3635—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
- B01D29/012—Making filtering elements
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
- A61F2/01—Filters implantable into blood vessels
- A61F2002/018—Filters implantable into blood vessels made from tubes or sheets of material, e.g. by etching or laser-cutting
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/75—General characteristics of the apparatus with filters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2207/00—Methods of manufacture, assembly or production
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- the present invention relates to a method for producing a metal filter. More specifically, the present invention relates to a method for producing a metal filter that can efficiently capture circulating cancer cells in the blood.
- CTC circulating tumor cells
- Blood contains many blood cell components such as red blood cells, white blood cells, and platelets, and the number is said to be 3.5 to 9 ⁇ 10 9 in 1 mL of blood. Among them, there are only a few CTCs. In order to efficiently detect CTC from blood cell components, it was necessary to separate the blood cell components, and observation and measurement were very difficult.
- Cancer cells such as CTC are slightly larger in size than blood cells in blood, such as red blood cells, white blood cells, or platelets. Therefore, theoretically, it is possible to apply these mechanical filtration methods to remove these blood cell components and concentrate the cancer cells.
- leukocytes there are cells having the same size as CTC, and only CTC may not be distinguished with high accuracy only by the difference in size.
- leukocytes are more deformable than cancer cells, they can pass through smaller pores and can be separated from CTCs by an external force such as suction or pressurization. It is conceivable to use a metal filter as a filter for performing the mechanical filtration method.
- an electroforming (electroforming) plating method using photolithography is known.
- a first photosensitive resin layer is formed on a conductive substrate, and a first photomask on which a mesh pattern is formed is overlaid on the first photosensitive resin layer.
- the first plated layer is exposed and developed to remove unnecessary portions, and the removed portion is electroformed using the substrate as one electrode so that the thickness does not exceed the first photosensitive resin layer.
- a conductive thin film is formed on the surfaces of the first plating layer and the first photosensitive resin layer by a sputtering method, and a second photosensitive resin layer is formed on the surface of the thin film.
- a second photomask formed with a layer is exposed on the second photosensitive resin layer, exposed, developed to remove unnecessary portions, and the thin film is used as one electrode for the removed portions by electroforming.
- the thickness does not exceed the second photosensitive resin layer
- the substrate is peeled after the second plating layer is formed, and the exposed portion of the first photosensitive resin layer, the second photosensitive resin layer, and the thin film is removed.
- a method for manufacturing a metal mask is described
- Patent Document 2 discloses a step of laminating or coating a photoresist on the surface of a base made of a flat plate, and a pattern film overlaid on the photoresist, and the photoresist is irradiated with light that goes straight to the base. Exposing the pattern film, peeling the pattern film and transferring the photoresist to the electroforming mother mold side, developing and drying to form a pattern resist film on the electroforming mother mold, and electroforming A method for manufacturing a metal mask is described which includes a step of forming an electrodeposited metal on a surface not covered with a matrix pattern resist film and a step of peeling the electrodeposited metal from the electroformed mother die.
- an object of the present invention is to provide a method for manufacturing a metal filter that does not cause damage such as wrinkles, breakage, scratches, curls, or deformation of fine through holes.
- the present invention relates to a method for producing a metal filter, comprising a step of laminating a photosensitive resin composition on a copper substrate to form a photosensitive resin composition layer, and an active portion of the photosensitive resin composition layer.
- the substrate is removed by chemical dissolution to obtain a structure composed of a plated layer and a cured product of the photosensitive resin composition, and the cured product of the photosensitive resin composition is removed from the structure to form a plated layer.
- a peeling step to obtain Plated layer is a metal filter, to provide
- the plating layer that becomes a metal filter can be collected without removing the copper substrate by chemical dissolution, regardless of manual work (hand peeling). For this reason, a metal filter can be manufactured without causing damage such as wrinkles, creases, scratches, and curls, and deformation of fine through holes. Since the metal filter produced by the production method of the present invention has little variation in the size of the through-holes, cancer cells can be separated and concentrated with high separation accuracy.
- the adhesion between the substrate and the photosensitive resin composition is not sufficient, it is necessary to increase the adhesion area of the resist pattern, which may make it difficult to produce a metal filter having fine through holes. .
- a copper substrate is used as the substrate. Since copper is excellent in adhesive strength with a photoresist, sufficient adhesive strength with the photosensitive resin composition can be obtained. For this reason, according to the manufacturing method of the present invention using a copper substrate, it is possible to manufacture a metal filter having fine through holes.
- the metal filter has a plurality of through holes, and the opening shape of the through holes is preferably one or more shapes selected from the group consisting of a circle, an ellipse, a rounded rectangle, a rectangle, and a square. Further, the opening shape of the through hole includes a rectangular shape or a rounded rectangular shape, and the length of the short side of the rectangular shape or the rounded rectangular shape is preferably 5 to 15 ⁇ m.
- the rounded rectangle is a shape composed of two long sides of equal length and two semicircles, and is a shape shown in FIG. The length of the short side of the rounded rectangle is the length indicated by a in FIG.
- the thickness of the metal filter is preferably 3 to 50 ⁇ m.
- cancer cells are less likely to clog the through-holes, and the concentration efficiency of cancer cells can be further improved.
- the thickness of the plating layer is preferably thinner than the thickness of the photosensitive resin composition layer (the thickness of the cured product of the photosensitive resin composition). Thereby, the through-hole of a metal filter can be formed reliably. If the thickness of the plating layer becomes thicker than the thickness of the photosensitive resin composition layer, the plating layer is connected at a portion thicker than the thickness of the cured product of the photosensitive resin composition, and no through hole is formed. There is a case.
- the copper substrate is preferably a peelable copper foil.
- peelable copper foil By using peelable copper foil, the amount of copper can be reduced, the amount and time of the chemical dissolving agent required for removing the copper substrate can be reduced, and productivity can be improved.
- the metal filter is preferably a cancer cell concentration metal filter.
- the metal filter has a structure particularly suitable for concentration of cancer cells. That is, the present invention also provides use of a metal filter produced by the above production method for cancer cell concentration.
- the cancer cell concentration metal filter is preferably a metal filter for concentration of cancer cells circulating in blood.
- the metal filter has a structure particularly suitable for separating cancer cells and blood cell components circulating in blood and concentrating the cancer cells. That is, the present invention also provides the use of the metal filter produced by the above production method for the concentration of cancer cells circulating in the blood.
- FIGS. 1 to (H) are process diagrams for explaining an embodiment of the production method of the present invention.
- FIG. 1 is the schematic which shows one Embodiment of a filter.
- FIG. 1 is a top view of the through hole of the filter of one embodiment.
- the method for producing a metal filter according to the embodiment includes a laminating step of laminating a photosensitive resin composition on a copper substrate to form a photosensitive resin composition layer, and an actinic ray at a predetermined portion of the photosensitive resin composition layer. Irradiation and photocuring the exposed portion to form a cured product of the photosensitive resin composition, and removing portions other than the cured product of the photosensitive resin composition from the photosensitive resin composition layer by development A development process for forming a resist pattern made of a cured product of the photosensitive resin composition on a copper substrate, a plating process for forming a plating layer by metal plating the copper substrate on which the resist pattern is formed, and a copper substrate.
- Plating layer is a metal filter.
- FIGS. 1A to 1H are process diagrams for explaining an embodiment of the production method of the present invention.
- a peelable copper foil is used as the copper substrate.
- FIG. 1A shows a peelable copper foil composed of a carrier layer 1 and a copper foil layer 2.
- the photosensitive resin composition is laminated on the copper foil layer 2 to form the photosensitive resin composition layer 3.
- the photosensitive resin composition layer 3 is irradiated with active light (UV light) through the photomask 4, and the exposed portion is photocured to form a photosensitive resin composition.
- the cured product 3a is formed.
- the development step shown in FIG. 1D a portion other than the cured product 3a of the photosensitive resin composition is removed from the photosensitive resin composition layer 3 to form the cured product 3a of the photosensitive resin composition.
- a resist pattern is formed.
- a plating layer 5 is formed on the copper foil layer 2 on which a resist pattern made of the cured product 3a of the photosensitive resin composition is formed.
- the copper foil layer 2 and the carrier layer 1 of the peelable copper foil are peeled off.
- the copper foil layer 2 is removed by chemical dissolution.
- the cured product 3a of the photosensitive resin composition and the plating layer 5 remain.
- the peeling step shown in FIG. 1 (H) the resist pattern made of the cured product 3a of the photosensitive resin composition is removed, and the metal filter made of the plating layer 5 is collected.
- a through hole 6 is formed in the metal filter.
- FIG. 1 F
- the copper substrate 2 ′ is thicker than the copper foil layer 2 of the above embodiment, in the step of removing the copper substrate 2 ′ by chemical dissolution in the melting step, more chemical dissolving agent and time than the above embodiment are required. Is required.
- the copper substrate is not particularly limited as long as it has copper or copper on the surface, and examples thereof include a copper foil having a thickness of 1 to 100 ⁇ m, a copper foil tape, and a peelable copper foil. From the viewpoint of workability, peelable copper foil is preferable.
- the peelable copper foil is a copper foil composed of at least two layers of an ultrathin copper foil and a carrier layer.
- the photosensitive resin composition either a negative type or a positive type can be used, but a negative type photosensitive resin composition is preferable.
- the negative photosensitive resin composition preferably contains at least a binder resin, a photopolymerizable compound having an unsaturated bond, and a photopolymerization initiator.
- a positive photosensitive resin composition since the solubility with respect to the developing solution of the part exposed by irradiation of actinic light among photosensitive resin composition layers increases, in a development process, The exposed part will be removed.
- a negative photosensitive resin composition is used will be described.
- the thickness of the manufactured metal filter is equal to or less than the thickness of the photosensitive resin composition layer. For this reason, it is necessary to form the photosensitive resin composition layer having a thickness suitable for the thickness of the target metal filter. For example, when producing a metal filter having a thickness of 15 ⁇ m or less, it is preferable to use a photosensitive resin composition having a thickness of 15 ⁇ m. In the case of producing a metal filter having a thickness of more than 15 ⁇ m and not more than 25 ⁇ m, it is preferable to use a photosensitive resin composition having a thickness of 25 ⁇ m. Moreover, it is preferable to use the photosensitive resin composition with a thin film thickness, so that the hole diameter of a through-hole becomes small.
- Lamination of the photosensitive resin composition on the copper substrate is performed, for example, after removing the protective film of the sheet-like photosensitive element comprising the support film, the photosensitive resin composition and the protective film, and then the photosensitive resin of the photosensitive element. This is performed by pressure-bonding the composition layer to a copper substrate while heating. Thereby, the laminated body which consists of a copper substrate, the photosensitive resin composition layer, and the support film, and these were laminated
- This stacking operation is preferably performed under reduced pressure from the viewpoint of adhesion and followability.
- the conditions such as the heating temperature and pressure for the photosensitive resin composition layer and / or the copper substrate during the pressure bonding, but it is preferably performed at a temperature of 70 to 130 ° C., and the pressure bonding is performed at a pressure of about 100 to 1000 kPa. It is preferable to do.
- the copper substrate may be preheated in order to improve the lamination property.
- a predetermined portion of the photosensitive resin composition layer on the copper substrate is irradiated with actinic rays, and the exposed portion is photocured to form a cured product of the photosensitive resin composition.
- the support film present on the photosensitive resin composition layer is transparent to actinic rays, it can be irradiated with actinic rays through the support film.
- the photosensitive resin composition layer is irradiated with actinic rays after removing the support film.
- Examples of the exposure method include a method of irradiating an image with active light through a negative or positive mask pattern called an artwork (mask exposure method).
- a method of irradiating actinic rays in an image form by a direct drawing exposure method such as an LDI (Laser Direct Imaging) exposure method or a DLP (Digital Light Processing) exposure method may be employed.
- LDI Laser Direct Imaging
- DLP Digital Light Processing
- a known light source can be used.
- a gas laser such as an argon laser
- a solid laser such as a YAG laser
- semiconductor laser etc.
- the wavelength of the actinic ray is preferably in the range of 350 to 410 nm, and more preferably in the range of 390 to 410 nm.
- development is performed by a known development method using a developer corresponding to the photosensitive resin composition.
- development methods include dip method, battle method, spray method, brushing, slapping, scrapping, rocking immersion, etc., and high-pressure spray method is most suitable from the viewpoint of improving resolution. Yes. These may be developed by combining two or more methods.
- Examples of the developer include an alkaline aqueous solution, an aqueous developer, and an organic solvent developer.
- the alkaline aqueous solution is safe and stable when used as a developer, and has good operability.
- Examples of the base of the alkaline aqueous solution include alkali metal hydroxides such as lithium, sodium or potassium hydroxide; carbonates or bicarbonates of lithium, sodium, potassium or ammonium; alkali metals such as potassium phosphate and sodium phosphate Phosphate: Alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used.
- Examples of the alkaline aqueous solution include a dilute solution of 0.1 to 5% by mass sodium carbonate, a dilute solution of 0.1 to 5% by mass potassium carbonate, a dilute solution of 0.1 to 5% by mass sodium hydroxide, and 0.1 to 5%.
- a dilute solution of mass% sodium tetraborate is preferred.
- the pH of the alkaline aqueous solution is preferably in the range of 9 to 11, and the temperature is adjusted according to the alkali developability of the photosensitive resin composition layer.
- a surfactant, an antifoaming agent, a small amount of an organic solvent for promoting development, and the like may be mixed.
- the portions other than the cured product of the photosensitive resin composition are removed by development to form a resist pattern made of the cured product of the photosensitive resin composition on the copper substrate, and then heated at about 60 to 250 ° C. as necessary.
- the resist pattern may be further cured by performing exposure at about 0.2 to 10 J / cm 2 .
- plating process Next, the plating process will be described. After the development step, plating is performed on the copper substrate to form a plating layer. Examples of the plating method include solder plating, nickel plating, and gold plating. This plating layer finally becomes a metal filter.
- the material for the metal filter examples include, but are not limited to, noble metals such as gold and silver, base metals such as aluminum, tungsten, nickel and chromium, and alloys of these metals.
- the metal may be used alone, or may be used as an alloy with another metal or an oxide of a metal in order to impart functionality.
- nickel and a metal containing nickel as a main component because corrosion is prevented and the processability and cost are excellent.
- the main component means a component occupying 50% by weight or more of the material.
- the dissolution process After forming the plating layer, the copper substrate is chemically dissolved and removed. Thereby, the structure which consists of the plating layer used as a metal filter and the hardened
- MEC BRIGHT SF-5420B (trade name, manufactured by MEC Co., Ltd.), copper selective etching solution-CSS (Nippon Chemical Industry Co., Ltd.), or the like can be used.
- the resist pattern is peeled off with a stronger alkaline aqueous solution than the alkaline aqueous solution used for development, for example.
- a stronger alkaline aqueous solution for example, a 1 to 10% by mass aqueous sodium hydroxide solution or an aqueous potassium hydroxide solution is preferably used, and a 1 to 5% by mass aqueous sodium hydroxide solution or an aqueous potassium hydroxide solution is more preferably used.
- This plating layer is a metal filter.
- Examples of the resist pattern peeling method include an immersion method, a spray method, a method using ultrasonic waves, and the like, and these may be used alone or in combination.
- the opening shape of the through hole of the metal filter examples include a circle, an ellipse, a rounded rectangle, a rectangle, a square, and a polygon. From the viewpoint of efficiently capturing cancer cells, a circle, rectangle, or rounded rectangle is preferable. Further, from the viewpoint of preventing clogging of the metal filter, a rectangle or a rounded rectangle is particularly preferable.
- the hole diameter of the through hole is set according to the size of the cancer cell to be captured.
- the hole diameter when the opening shape is other than a circle such as an ellipse, a rectangle, or a polygon means the maximum value of the diameter of a sphere that can pass through each through hole.
- the diameter of the through hole is, for example, the length of the short side of the rectangle when the opening shape is a rectangle, and the diameter of the inscribed circle of the polygon when the opening shape is a polygon.
- the average aperture ratio of the through holes of the metal filter is preferably 0.1 to 50%, more preferably 0.5 to 40%, still more preferably 1 to 30%, and most preferably 1 to 10%.
- the aperture ratio refers to the area occupied by the through hole with respect to the area of the predetermined area on the filter.
- the average aperture ratio refers to the area occupied by the through-holes relative to the entire filter area. If the average aperture ratio is 0.1 to 50%, sufficient filter strength can be secured and processing is easy. Moreover, the occurrence of clogging of the filter can be prevented, and the concentration performance of the filter can be ensured.
- the thickness of the metal filter is preferably 3 to 50 ⁇ m, more preferably 5 to 40 ⁇ m, and particularly preferably 5 to 30 ⁇ m.
- the film thickness of the filter is 3 to 50 ⁇ m, the strength of the filter is ensured and the handleability is also good.
- the productivity of the filter is good, and the fine processing is easy without being disadvantageous in terms of cost due to the consumption of materials more than necessary.
- FIG. 3A is a schematic view showing an embodiment of a metal filter that can be manufactured by the manufacturing method of the present invention.
- the metal filter 100 includes a substrate (plating layer) 20 in which a plurality of through holes 10 are formed.
- the opening shape of the through hole 10 is a rounded rectangle.
- the arrangement of the through holes 10 may be an arrangement as shown in FIG. 1A, a zigzag arrangement in which the arrangement is shifted for each column, or a random arrangement arbitrarily arranged.
- FIG. 3B is a top view of the through hole 10 of the metal filter of the above embodiment.
- the opening shape of the through-hole 10 is a rounded rectangle, and is a shape in which two semicircles having a radius of c are adjacent to a short side of a rectangle having a short side of a and a long side of b.
- a, b and c are 8, 22 and 4 ⁇ m, respectively.
- Example 1 A photosensitive element (PHOTEC RD-1225: thickness 25 ⁇ m, manufactured by Hitachi Chemical Co., Ltd.) is a 250 mm square substrate (MCL-E679F t0.5 ⁇ 250 ⁇ 250 N3DB: (MCL-E679F t0.5 ⁇ 250 ⁇ 250 18D). ), A pressure-sensitive adhesive resin composition layer was formed on the copper foil layer of Hitachi Chemical Co., Ltd.). The pressure bonding was performed under the conditions of a roll temperature of 90 ° C., a pressure of 0.3 MPa, and a conveyor speed of 2.0 m / min.
- the shape of the light transmitting portion was a rounded rectangle, and the rounded rectangle was aligned in the same direction at a pitch of 60 ⁇ m in both the major axis and minor axis directions.
- the size of the rounded rectangle was 8 ⁇ m for a, 22 ⁇ m for b, and 4 ⁇ m for c in FIG.
- ultraviolet rays having an exposure amount of 30 mJ / cm 2 were irradiated from above the photomask by an ultraviolet irradiation device.
- the copper foil layer on which the nickel plating layer was formed was peeled from the carrier of the peelable copper foil. Subsequently, the copper foil layer on which the nickel plating layer is formed is immersed in a chemical solubilizer (MEC BRIGHT SF-5420B, manufactured by MEC Co., Ltd.) and stirred at 40 ° C. for about 120 minutes to dissolve and remove the copper foil layer.
- a chemical solubilizer MEC BRIGHT SF-5420B, manufactured by MEC Co., Ltd.
- the recovered structure was immersed in a resist stripping solution (P3 Poleve, manufactured by Henkel) and subjected to ultrasonic treatment at 60 ° C. for about 40 minutes to remove the cured product of the photosensitive resin composition.
- a resist stripping solution P3 Poleve, manufactured by Henkel
- the metal filter of Example 1 having through holes with sufficient accuracy without damage such as wrinkles, bending, scratches, and curls was produced.
- Example 2 is the same as Example 1 except that the shape of the light transmitting portion of the photomask is changed to a rounded rectangle with a of 5 ⁇ m, b of 15 ⁇ m, and c of 2.5 ⁇ m in FIG. A metal filter was prepared.
- Example 3 A metal filter of Example 3 was produced in the same manner as in Example 1 except that the shape of the light transmission part of the photomask was changed to a circle of ⁇ 5 ⁇ m.
- Example 4 A metal filter of Example 4 was produced in the same manner as in Example 1 except that the nickel plating time was changed to about 3 minutes.
- the thickness of the metal filter was 3 ⁇ m as a result of measuring the thickness of the metal filter by sandwiching the filter between the measuring element (Digimatic Indicator ID-C112C, manufactured by Mitutoyo Corporation) and the pedestal.
- Comparative Example 1 Other than changing the copper substrate to a stainless steel plate (SUS304, finish 3 / 4H, thickness 100 ⁇ m, manufactured by Nisshin Steel Co., Ltd.) and peeling the filter from the substrate by hand instead of chemical dissolution removal by chemicals A metal filter of Comparative Example 1 was produced in the same manner as Example 1.
- Example 1 Glass beads (high-precision unibeads SPM-16: particle size 16 ⁇ 2 ⁇ m, titanium barium-based glass, manufactured by Union Co., Ltd.) were mixed with physiological saline, and the filtration test using the metal filter of Example 1 was performed. Glass beads were used as a replacement for cancer cells.
- the metal filter of Example 1 was set in a filter holder (Swinnex 13, manufactured by MILLIPORE), and a mixed solution of physiological saline and glass beads was injected with a syringe and filtered.
- a filter holder (Swinnex 13, manufactured by MILLIPORE)
- a mixed solution of physiological saline and glass beads was injected with a syringe and filtered.
- the glass beads having a particle size of about 16 ⁇ m did not pass through the holes having a short side of 8 ⁇ m and remained on the filter surface in a state of closing the holes.
- Table 2 shows the result of counting the number of supplements with respect to the number of glass beads introduced at this time. It was confirmed that the metal filter of Example 1 has a sufficient capture ability of glass beads. From this result, it is predicted that sufficient capture ability is shown even when cancer cells are used.
- SYMBOLS 1 Carrier layer, 2 ... Copper foil layer, 2 '... Copper plate, 3 ... Photosensitive resin composition layer, 3a ... Hardened
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Abstract
Description
まず、積層工程について説明する。銅基板としては、銅又は表面に銅を有するものであれば特に制限はないが、例えば、厚さ1~100μmの銅箔、銅箔テープ、ピーラブル銅箔等が挙げられる。作業性の観点からは、ピーラブル銅箔が好ましい。ピーラブル銅箔とは、極薄銅箔とキャリア層の少なくとも2層からなる銅箔である。
続いて、露光工程について説明する。銅基板上の感光性樹脂組成物層の所定部分に活性光線を照射し、露光された部分を光硬化させて感光性樹脂組成物の硬化物を形成する。この際、感光性樹脂組成物層上に存在する支持フィルムが活性光線に対して透過性を有する場合には、支持フィルムを通して活性光線を照射することができるが、支持フィルムが活性光線に対して遮光性を有する場合には、支持フィルムを除去した後に感光性樹脂組成物層に活性光線を照射する。
続いて、現像工程について説明する。感光性樹脂組成物層のうち、感光性樹脂組成物の硬化物以外の部分を銅基板上から除去することにより、銅基板上に、感光性樹脂組成物の硬化物からなるレジストパターンを形成する。感光性樹脂組成物層上に支持フィルムが存在している場合には、支持フィルムを除去してから、上記感光性樹脂組成物の硬化物以外の部分の除去(現像)を行う。現像方法には、ウェット現像とドライ現像とがあるが、ウェット現像が広く用いられている。
続いて、めっき工程について説明する。現像工程の後、銅基板上にめっきを行い、めっき層を形成する。めっきの方法としては、例えば、はんだめっき、ニッケルめっき、金めっきなどが挙げられる。このめっき層が最終的に金属フィルターとなる。
続いて、溶解工程について説明する。めっき層を形成した後、銅基板を化学的に溶解して除去する。これにより、人手作業(手剥がし)によらずに金属フィルターとなるめっき層及び感光性樹脂組成物の硬化物からなる構造物を回収することができる。このため、シワ・折れ・キズ・カール等のダメージや、微細な貫通孔の変形を生じることなく、金属フィルターを製造することができる。銅基板を溶解する化学的溶解剤としては、メックブライトSF-5420B(商品名、メック株式会社製)、銅選択エッチング液-CSS(日本化学産業株式会社)等を使用することができる。
続いて、剥離工程について説明する。溶解工程の後、レジストパターンは、例えば、現像に用いたアルカリ性水溶液より更に強アルカリ性の水溶液により剥離する。この強アルカリ性の水溶液としては、例えば、1~10質量%水酸化ナトリウム水溶液又は水酸化カリウム水溶液を用いることが好ましく、1~5質量%水酸化ナトリウム水溶液又は水酸化カリウム水溶液を用いることがより好ましい。レジストパターン(感光性樹脂組成物の硬化物)を剥離することにより、めっき層のみを回収することができる。このめっき層が金属フィルターである。
続いて、金属フィルターの形状について説明する。金属フィルターの貫通孔の開口形状として円、楕円、角丸長方形、長方形、正方形、多角形等が例示できる。効率良く癌細胞を捕獲できる観点からは、円、長方形又は角丸長方形が好ましい。また、金属フィルターの目詰まり防止の観点からは、長方形又は角丸長方形が特に好ましい。
感光性エレメント(PHOTEC RD-1225:厚さ25μm、日立化成工業株式会社製)を250mm角の基板(MCL-E679F t0.5×250×250 N3DB:(MCL-E679F t0.5×250×250 18D)の表面にピーラブル銅箔t18μmを貼り合わせた基板、日立化成工業株式会社製)の銅箔層上に圧着し、感光性樹脂組成物層を形成した。圧着は、ロール温度90℃、圧力0.3MPa、コンベア速度2.0m/分の条件で行った。
フォトマスクの光の透過部の形状を、図3(B)におけるaが5μm、bが15μm、cが2.5μmの角丸長方形に変更した以外は実施例1と同様にして、実施例2の金属フィルターを作製した。
フォトマスクの光の透過部の形状をφ5μmの円に変更した以外は実施例1と同様にして、実施例3の金属フィルターを作製した。
ニッケルめっきの時間を約3分間に変更した以外は実施例1と同様にして、実施例4の金属フィルターを作製した。金属フィルターの膜厚を膜厚測定器(デジマチックインジケータID-C112C、株式会社Mitutoyo製)の測定子と台座でフィルターを挟むようにして測定した結果、3μmであった。
銅基板をステンレス板(SUS304、仕上げ3/4H、厚さ100μm、日新製鋼株式会社製)に変更し、基板からのフィルターの剥離を薬液による化学的溶解除去の代わりに手で剥がした以外は実施例1と同様にして、比較例1の金属フィルターを作製した。
生理食塩水にガラスビーズ(高精度ユニビーズSPM-16:粒径16±2μm、チタンバリウム系ガラス、株式会社ユニオン製)を混合し、実施例1の金属フィルターによる濾過試験を実施した。ガラスビーズは、癌細胞の代わりとして使用した。
Claims (8)
- 金属フィルターの製造方法であって、
銅基板上に感光性樹脂組成物を積層して感光性樹脂組成物層を形成する積層工程と、
前記感光性樹脂組成物層の所定部分に活性光線を照射し、露光された部分を光硬化させて感光性樹脂組成物の硬化物を形成する露光工程と、
前記感光性樹脂組成物層のうち前記感光性樹脂組成物の硬化物以外の部分を現像により除去し、前記銅基板上に前記感光性樹脂組成物の硬化物からなるレジストパターンを形成する現像工程と、
前記レジストパターンが形成された銅基板を金属めっきしてめっき層を形成するめっき工程と、
前記銅基板を化学的溶解によって除去して、前記めっき層及び前記感光性樹脂組成物の硬化物からなる構造物を得る溶解工程と、
前記構造物から前記感光性樹脂組成物の硬化物を除去して、前記めっき層を得る剥離工程と、
を含み、前記めっき層が金属フィルターである、金属フィルターの製造方法。 - 前記金属フィルターは、複数の貫通孔を有し、前記貫通孔の開口形状は、円、楕円、角丸長方形、長方形及び正方形からなる群より選択される1種以上の形状である、請求項1に記載の金属フィルターの製造方法。
- 前記貫通孔の開口形状は、長方形又は角丸長方形の形状を含み、前記長方形又は前記角丸長方形の短辺の長さは5~15μmである、請求項1又は2に記載の金属フィルターの製造方法。
- 前記金属フィルターは、厚さが3~50μmである、請求項1~3のいずれか一項に記載の金属フィルターの製造方法。
- 前記銅基板は、ピーラブル銅箔である、請求項1~4のいずれか一項に記載の金属フィルターの製造方法。
- 前記金属フィルターは、癌細胞濃縮用金属フィルターである、請求項1~5のいずれか一項に記載の金属フィルターの製造方法。
- 前記癌細胞濃縮用金属フィルターは、血液中に循環する癌細胞の濃縮用金属フィルターである、請求項6に記載の金属フィルターの製造方法。
- 前記めっき層の厚さは、前記感光性樹脂組成物層の厚さよりも薄い、請求項1~7のいずれか一項に記載の金属フィルターの製造方法。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
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JP2013538541A JP6032207B2 (ja) | 2011-10-14 | 2012-10-09 | 金属フィルターの製造方法 |
US14/351,152 US20140238863A1 (en) | 2011-10-14 | 2012-10-09 | Method for producing metal filters |
KR1020187011438A KR20180049826A (ko) | 2011-10-14 | 2012-10-09 | 금속 필터의 제조 방법 |
KR1020147008623A KR20140074321A (ko) | 2011-10-14 | 2012-10-09 | 금속 필터의 제조 방법 |
CA2851477A CA2851477C (en) | 2011-10-14 | 2012-10-09 | Method for producing metal filters |
SG11201400946TA SG11201400946TA (en) | 2011-10-14 | 2012-10-09 | Method for producing metal filters |
EP12839364.2A EP2767618B1 (en) | 2011-10-14 | 2012-10-09 | Method for producing metal filters |
CN201280049165.7A CN103874788B (zh) | 2011-10-14 | 2012-10-09 | 金属过滤器的制造方法 |
US15/409,747 US10258906B2 (en) | 2011-10-14 | 2017-01-19 | Metal filter and method for concentrating cancer cells |
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US14/351,152 A-371-Of-International US20140238863A1 (en) | 2011-10-14 | 2012-10-09 | Method for producing metal filters |
US15/409,747 Continuation US10258906B2 (en) | 2011-10-14 | 2017-01-19 | Metal filter and method for concentrating cancer cells |
US15/409,747 Division US10258906B2 (en) | 2011-10-14 | 2017-01-19 | Metal filter and method for concentrating cancer cells |
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EP (2) | EP3239364A1 (ja) |
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CN (2) | CN107296991A (ja) |
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JP2015188314A (ja) * | 2014-03-27 | 2015-11-02 | 日立化成株式会社 | 細胞捕捉金属フィルタ、細胞捕捉金属フィルタシート、細胞捕捉デバイス、細胞捕捉金属フィルタの製造方法、及び、細胞捕捉金属フィルタシートの製造方法 |
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JP7157841B2 (ja) | 2017-08-28 | 2022-10-20 | マクセル株式会社 | 電鋳用母型 |
Also Published As
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EP2767618A1 (en) | 2014-08-20 |
CA2851477A1 (en) | 2013-04-18 |
CN103874788A (zh) | 2014-06-18 |
US10258906B2 (en) | 2019-04-16 |
JP2017036511A (ja) | 2017-02-16 |
CN103874788B (zh) | 2018-08-21 |
KR20140074321A (ko) | 2014-06-17 |
JPWO2013054786A1 (ja) | 2015-03-30 |
KR20180049826A (ko) | 2018-05-11 |
US20170128858A1 (en) | 2017-05-11 |
JP6032207B2 (ja) | 2016-11-24 |
EP2767618B1 (en) | 2017-07-19 |
US20140238863A1 (en) | 2014-08-28 |
SG11201400946TA (en) | 2014-10-30 |
EP3239364A1 (en) | 2017-11-01 |
CN107296991A (zh) | 2017-10-27 |
EP2767618A4 (en) | 2015-07-08 |
CA2851477C (en) | 2018-06-05 |
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