1294758 曰修(更)正本 九、發明說明： •【發明所屬之技術領域】 : 本發明係關於一種柔性電路板之製作方法。 - 【先前技術】 隨著科學技術的不斷發展，超小型移動電話、便攜式計算機及汽車用 • 電子產品等都對產品之小型化、輕型化提出了更高的要求。為了適應這一 - 需求，電子產品中之電路集成度不斷提高，印刷電路之圖型亦日趨高密度 Φ 化，電路之導體寬度、導體間隔、通孔尺寸等亦隨之日趨細小。因此，柔 性印刷電路板(Flexible Printed Circuit，簡寫FPC，亦稱軟板、軟性電路板或 撓性電路板)以其輕薄、韌性及可撓性、線路可微細性等優良性能而逐漸替 代剛性電路板或電路板模組，越來越多地應用於各類電子元件間電性連接。 於製作時，該柔性印刷電路板一般係由一至少一表面具有銅膜之基材 經複雜的操作製作而成。最終形成之產品一般具有複數孔洞及位於表面之 線路’該孔洞一般係由形成於銅膜之銅孔及形成於基材之膜孔構成。 _ 傳統之柔性印刷電路板之製作方法係採用乾膜蝕刻工藝製作而成。請 參閱第一圖，係傳統採用蝕刻工藝之印刷電路板之製作方法示意圖，其中 除(C)、（D)圖為俯視圖外，其餘均為剖示圖，具體步驟詳述如下： 職 ⑴如第一圖(A)所示，首先提供一基材11〇,該基材no具有一第一表 面hi及一相對之第二表面112，其材質為聚酰亞胺(p〇lyimide，ρι)，亦可 為聚 i旨(Polyester，PET)等； (2)如第一圖⑼所示，於該第一表面ιη形成一第一銅膜121，於該第 一表面112形成一第二銅膜122，該第一銅膜121及該第二銅膜122係採用 1294758 : ,卜 V : y - 濺射(Sputtering)法形成，得到物件101 ; 丨丨 • (3)分條，如第一圖(C)所示，將步驟(2)得到之物件1〇1沿切割平行線 1〇2以切割(Cutting)或沖切(Punching)方式分成複數平行排列之加工件1〇〇 , • 每一加工件100均包括一基材no及形成於其兩表面之第一銅膜121、第二 銅膜122 ; (4)如第-_)所示，於每—加工件⑽兩側沖設鏈輪孔(亦稱軌道 孔)103 ; _ (5)採用微影製程於該加工件1〇〇之第一銅膜121表面形成所需之銅孔 130，該孔洞13〇如第一圖(H)中所*。該微影製程包括如下步驟： 首先，清潔該第一銅膜121表面； 然後，如第一圖(E)所示，於該第一銅膜121絲塗佈一乾膜㈣1294758 曰修(更)本本9. Description of the invention: • [Technical field to which the invention pertains]: The present invention relates to a method of fabricating a flexible circuit board. - [Prior Art] With the continuous development of science and technology, ultra-small mobile phones, portable computers, and automotive electronic products have put forward higher requirements for miniaturization and light weight of products. In order to meet this demand, the degree of circuit integration in electronic products continues to increase, and the pattern of printed circuits is becoming increasingly high-density Φ. The conductor width, conductor spacing, and via size of the circuit are also becoming smaller and smaller. Therefore, Flexible Printed Circuit (FPC, also known as soft board, flexible circuit board or flexible circuit board) gradually replaces rigid circuit with its excellent properties such as lightness, toughness and flexibility, and line fineness. Board or circuit board modules are increasingly used for electrical connections between various electronic components. At the time of fabrication, the flexible printed circuit board is generally fabricated by a complicated operation of a substrate having at least one surface having a copper film. The resulting product generally has a plurality of holes and a line on the surface. The hole is generally formed by a copper hole formed in the copper film and a film hole formed in the substrate. _ The traditional method of making flexible printed circuit boards is made by dry film etching. Please refer to the first figure, which is a schematic diagram of a manufacturing method of a conventional printed circuit board using an etching process. Except that the (C) and (D) drawings are top views, the rest are cross-sectional views, and the specific steps are detailed as follows: As shown in the first figure (A), a substrate 11 is first provided. The substrate no has a first surface hi and an opposite second surface 112. The material is polyimide (p〇lyimide, ρι). a second copper film 121 is formed on the first surface ι, and a second copper is formed on the first surface 112, as shown in the first figure (9). The film 122, the first copper film 121 and the second copper film 122 are formed by a method of 1294758:, V: y - sputtering, to obtain an object 101; 丨丨• (3) strip, as in the first As shown in Fig. (C), the object 1〇1 obtained in the step (2) is divided into a plurality of parallel-arranged workpieces 1 by cutting or punching along the cutting parallel line 1〇2, • each A processing member 100 includes a substrate no and a first copper film 121 and a second copper film 122 formed on both surfaces thereof; (4) as shown in the first -_), is punched on each side of the workpiece (10) a sprocket hole (also called a track hole) 103; _ (5) forming a desired copper hole 130 on the surface of the first copper film 121 of the workpiece 1 by a lithography process, the hole 13 is as shown in the first figure ( H) in the *. The lithography process includes the following steps: First, cleaning the surface of the first copper film 121; then, as shown in the first figure (E), applying a dry film to the first copper film 121 (4)
Film)m ’該乾臈m為一感光性薄膜，為一抵抗姓刻藥液之介質，可為正 光阻材料或負光阻材料； 曝光如第-圖(py斤不，利用一具有與所需銅孔圖案相反之光罩_ Ϊ進仃曝光將讀轉移；由於光德學侧，正光阻經紫外轉光後變為 可命解’負光阻則因聚合物之交連作用而变為不可溶解，該方案係採用正 光阻，該光罩140之材質為塑膠； 顯影’如第-圖(G)所示，於曝光後利用顯影液將乾膜ΐ3ΐ之可溶性部 伤予以々去，留下之部份於侧時可倾銅面不被侧液舰，從而形成 所需之圖型132 ; 如第一_所示，_織刻液對該圖型132區域所對應之第-麵Film)m 'The dry 臈m is a photosensitive film, which is a medium resisting the surname of the liquid, which can be a positive photoresist material or a negative photoresist material; the exposure is as shown in the figure - (Py, no, use one with The mask with the opposite copper hole pattern _ Ϊ 仃 仃 仃 将 仃 ; ; ; ; ; ; ; ; ; ; ; ; ; 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于 由于Dissolving, the scheme adopts positive photoresist, the material of the reticle 140 is plastic; the development 'as shown in the first-figure (G), after exposure, the developer is used to remove the soluble portion of the dry film ΐ 3ΐ, leaving When the part is on the side, the tiltable copper surface is not side-by-side, so as to form the desired pattern 132; as shown in the first_, the _ etched liquid corresponds to the first side of the pattern 132 area
1294758 m進行餘刻以形成複數銅孔130，從而裸露出該銅孔130解對I之 ^ 110 ; • 如第一圖(1)所示，去除剩餘之乾膜131，即剝膜； ⑹如第一圖(J)所示，採用化學蝕刻液蝕刻該銅孔13〇對應之基材 110，以形成基材110上之膜孔15〇，該膜孔15〇與該銅孔13〇係一一對應； ⑺於形成之膜孔150之孔壁鍍銅； (8) 與步驟(5)相似，採用微影製程，於第一銅膜ι21上形成所需之線 餐路’該製程包括如下步驟：清潔第一銅膜m表面、塗佈乾膜、曝光、顯 影、蝕刻裸露出之銅、剝膜； (9) 重複(5)至⑻之步驟，對第二銅膜122進行同樣之操作； (1〇)於形成所需孔洞及線路之基材11〇表面印刷一保護層（圖未示），並 對該保護層進行曝光、顯影，使該銅線路不與外界接觸，避免銅氧化及線 路污染。 (11) 鍍金； (12) 裁切； (13) 電气檢查，以檢測形成之柔性電路板，並標示不良位置。 ' •上財法製作過程存在如下缺陷：首先，該製作過程係_乾舰刻， .=整面塗佈光阻，織再曝光、顯影，整面塗佈之目的係保護不需要姓 7部份不被_。然而，因乾賴合時會產生氣泡，附著性差，於製作過 =鏈輪孔係藉由鏈輪之帶動實現連續操作，因此鏈輪孔周圍之乾膜因鍵 輪之運動而魏落、較難附著完好，於後續製錢程巾，經曝光、顯影、 12947581294758 m is left to form a plurality of copper holes 130, so that the copper holes 130 are exposed to dissociate 110; • as shown in the first figure (1), the remaining dry film 131 is removed, that is, stripping; (6) As shown in FIG. 1(J), the substrate 110 corresponding to the copper hole 13〇 is etched by a chemical etching solution to form a film hole 15〇 on the substrate 110, and the film hole 15〇 is tied to the copper hole 13 Corresponding to; (7) copper plating on the hole wall of the formed film hole 150; (8) similar to the step (5), using a lithography process to form a desired line meal on the first copper film ι21' Step: cleaning the surface of the first copper film m, coating the dry film, exposing, developing, etching the exposed copper, stripping the film; (9) repeating the steps (5) to (8), performing the same operation on the second copper film 122 (1) printing a protective layer (not shown) on the surface of the substrate 11 which forms the desired holes and lines, and exposing and developing the protective layer so that the copper line is not in contact with the outside to avoid copper oxidation. And line pollution. (11) Gold plating; (12) Cutting; (13) Electrical inspection to detect the formed flexible circuit board and marking the defective position. 'The production process of the above-mentioned financial method has the following defects: First, the production process is _ dry ship engraving, .= full-surface coating photoresist, woven re-exposure, development, the whole surface coating purpose protection does not need to surname 7 The share is not _. However, due to air bubbles, the adhesion is poor, and the production of the sprocket hole is continuously operated by the sprocket. Therefore, the dry film around the sprocket hole is lifted due to the movement of the key wheel. Difficult to adhere to the good, in the subsequent money-making towel, after exposure, development, 1294758
曰修(更)正本 侧，無乾嶋制圍之_聽材亦會鏈 輪孔易破裂。其次，鏈輪孔於孔洞及線路製作過程中起定位作用，經上述 之钕刻後，定位不準，使躲路及制之良率定。再次，該方法於曝 2、顯影時_轉解，瓣鮮钱錢形，影雜斜無法達到所 h線寬尺t 4成良率降低。最後，採用乾膜钱刻技術，因乾膜厚度較 厚且附著性差，導難生晴航，域形絲路讀細度較低。 有鑑於此，提供一種可提高鏈輪孔剛性、線路精細度高、良率穩定之 • 柔性電路板之製作方法實為必需。 【發明内容】 以下，將以實施例說明一種可提高鏈輪孔剛性、線路精細度高、良率 穩定之柔性電路板之製作方法。 該柔性電路板之製作方法包括如下步驟：提供一待加工件，其具有一 基材，該基材之至少一面具有銅膜；於該加工件兩側沖設複數鏈輪孔，該 鏈輪孔穿過該基材與該銅膜；及採用微影製程於銅膜上形成複數銅孔，該 微影製程包括塗佈光阻層、曝光、顯影、蝕刻及剝膜之步驟，該塗佈之光 阻係液態光阻，該曝光步驟使用之光罩係玻璃光罩。 該微影製程於塗佈光阻層之後進一步包括曝光、顯影、蝕刻及剝膜之 步驟。 該曝光步驟使用之光罩係玻璃光罩。 相較於先前技術固態乾膜而言，該發明實施例採用液態光阻，由於液 態光阻之流動性佳、附著性好之特性，其可均勻塗佈，包括鏈輪孔附近亦 1294758 :产年?月Μ曰修(更〗正本 可塗佈液態光阻，因此，於後續曝光、顯^^^7在液態光阻之 :保5蔓下’鏈輪孔附近之銅膜或^'材不會被餘刻掉，因而可提高鏈輪孔剛性； ·_並且，因雜孔純酿_ 擁巾蚊位制，未被侧之鍵輪孔 m 亦會提供精準對位，從而提昇製作良率。 且，液悲光阻之赫性使得該液態光阻層之厚度低於嶋乾膜，而該 ^ 薄層之光阻有利於製作精細度高之線路。 相較於先前技術採用塑膠光罩而言，本發明實施例於曝光、顯影過程 _ 巾採用玻璃光罩，因玻璃受熱均勻、膨W生弱，因而不易受熱變形，且玻 璃透光性好，因此可以保證孔洞及線路之製作良率穩定。 【實施方式】 本發明實補錄電雜係由-至少—表面具有細之基材經複雜的 操作製作而成，其具有複數孔洞及位於基材表面之線路，該孔洞一般係由 形成於銅膜之銅孔及形成於基材之膜孔構成。其中該基材之材質可為聚酰 亞胺、聚酯、鐵氟龍、聚甲基丙烯酸甲酯或碳酸酯等。 籲 4參_二® ’縣發明實施例柔性電路板之製作方法示細。該發 明實施例包括如下步驟： (1) 如第二圖(A)所示，首先提供一基材210,其具有一第一表面211及 • 相對之第二表面212，其材質為聚酰亞胺，亦可為聚酯等； (2) 如第二圖(b)所示，於該第一表面211形成一第一銅膜221，於該第 一表面212形成一第二銅膜222,該第一銅膜221及該第二銅膜222係採用 濺射(Sputtering)法形成，得到物件2〇1 ; 1294758 ψ a. j " · 一〜〜·—.—〜· ⑶分條，如第二圖(Q所示，將步驟(2)得到之物件2〇i沿切割平行線 :2〇2购割(CUtting)或沖切(Punching)方式分成複數平行排列之加工件200， 每一加工件勘均包括-基材110及形成於其兩表面之第一銅膜121、第二 w 銅膜122 ; ⑷如第二圖(D)所示，於每一加工件200兩側沖設鏈輪孔(亦稱執道 - 孔)203 ’鏈輪孔203穿過基材11〇、第一銅膜121及第二銅膜122 ; 審 （5)採用微影製程於該加工件勘之第一鋪221表面形成所需之銅孔 231。該製程包括如下步驟： 首先，清潔該第一銅膜221表面； 然後，如第二圖(E)所示，於該第一銅膜221表面塗佈一液態光阻層 231該液I、光阻層231可為正光阻材料或負光阻材料，本發明實施例採用 正光阻材料。 该液感光阻層231由樹脂(Resin)、感光劑(Sensitizer)及溶劑三種材料組 馨合而成。樹脂對入射光線不產生反應，但提供光阻對底材的黏著性、供給 光阻抗蝕刻之能力、決定光阻塗佈後之厚度及熱穩定性等材料性質，且可 被驗性顯影液分解。感光劑為液態光阻層故之主體，其對特殊光線具有 莖敏性’所収被稱域細；在與人射統產生反應之前，錢劑可抑 制”、’員心劑對树月曰之为解，所以又被稱為抑制劑(Inhibitor)，但光阻一旦曝光 後，產生光化學反應的感應劑將以數百至上千倍的速率與顯影液發生反 應。因此，由未曝光與經曝光區域之顯影速率的巨大差異，使得圖案得以 疋義元成。溶劑則讓光阻保持為液態形式，使得光阻可利用旋轉的方式塗 11 1294758On the side of the repair (more), there is no cognac. The material will also be broken. Secondly, the sprocket hole plays a role in the process of making the hole and the line. After the above engraving, the positioning is not accurate, so that the escape and the yield are determined. Again, the method is in the exposure 2, the development is _ transfer, the fresh money and the money shape, the shadow can not reach the h line wide ruler t 4 into a lower yield. Finally, the dry film engraving technique is adopted, because the thickness of the dry film is thick and the adhesion is poor, the navigation is difficult, and the fineness of the domain-shaped silk path is low. In view of the above, it is necessary to provide a flexible circuit board which can improve the rigidity of the sprocket hole, the fineness of the line, and the stability of the yield. SUMMARY OF THE INVENTION Hereinafter, a method of manufacturing a flexible circuit board capable of improving rigidity of a sprocket hole, high line fineness, and stable yield will be described by way of embodiments. The manufacturing method of the flexible circuit board comprises the following steps: providing a workpiece to be processed, having a substrate, at least one side of the substrate has a copper film; and a plurality of sprocket holes are punched on both sides of the workpiece, the sprocket hole Passing through the substrate and the copper film; and forming a plurality of copper holes on the copper film by a lithography process, the lithography process comprising the steps of coating a photoresist layer, exposing, developing, etching, and stripping, the coating The photoresist is a liquid photoresist, and the photomask used in the exposure step is a glass mask. The lithography process further includes the steps of exposing, developing, etching, and stripping after coating the photoresist layer. The reticle used in this exposure step is a glass reticle. Compared with the prior art solid dry film, the embodiment of the invention adopts a liquid photoresist, and because of the good fluidity and good adhesion of the liquid photoresist, it can be uniformly coated, including the vicinity of the sprocket hole, also 1294758: Years and months of repair (more) can be coated with liquid photoresist, therefore, in the subsequent exposure, display ^ ^ ^ 7 in the liquid photoresist: Bao 5 vine under the 'sprocket hole near the copper film or ^ ' material It will not be engraved, so it can improve the rigidity of the sprocket hole; · _ and, because of the pure hole _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Moreover, the thickness of the liquid-resistance photoresist makes the thickness of the liquid photoresist layer lower than that of the dry film, and the photoresist of the thin layer is favorable for making a fine-grained line. Compared with the prior art, plastic light is used. In the case of the cover, in the exposure and development process, the glass mask is used for the exposure and development process, because the glass is heated uniformly, the expansion W is weak, and thus is not easily deformed by heat, and the glass has good light transmittance, so that the hole and the line can be ensured. The yield is stable. [Embodiment] The present invention is supplemented by an electrical system - at least - The thin substrate has a complicated operation, and has a plurality of holes and a line on the surface of the substrate. The hole is generally formed by a copper hole formed in the copper film and a film hole formed in the substrate. The material of the substrate may be polyimide, polyester, Teflon, polymethyl methacrylate or carbonate, etc. The method for producing a flexible circuit board of the invention is described in detail. The embodiment of the invention comprises the following steps: (1) As shown in the second diagram (A), a substrate 210 is first provided, which has a first surface 211 and an opposite second surface 212 made of polyimide. a second copper film 221 is formed on the first surface 211, and a second copper film 222 is formed on the first surface 212, as shown in the second figure (b). The first copper film 221 and the second copper film 222 are formed by a sputtering method to obtain an object 2〇1; 1294758 ψ a. j " · a ~~·-.-~· (3) strip, such as In the second figure (Q, the object 2〇i obtained in step (2) is divided into plural numbers along the cutting parallel line: 2〇2 CUtting or Punching. The row of processed workpieces 200, each of which includes a substrate 110 and a first copper film 121 and a second w copper film 122 formed on both surfaces thereof; (4) as shown in the second figure (D), Each of the workpieces 200 is punched with a sprocket hole (also known as a road-hole) 203 'the sprocket hole 203 passes through the substrate 11〇, the first copper film 121 and the second copper film 122; The lithography process forms a desired copper hole 231 on the surface of the first 221 of the workpiece. The process includes the following steps: First, cleaning the surface of the first copper film 221; and then, as shown in the second figure (E) A liquid photoresist layer 231 is coated on the surface of the first copper film 221. The liquid I and the photoresist layer 231 may be a positive photoresist material or a negative photoresist material. The embodiment of the present invention uses a positive photoresist material. The liquid photosensitive resist layer 231 is composed of a combination of a resin (Resin), a sensitizer (Sensitizer) and a solvent. The resin does not react to the incident light, but provides the adhesion of the photoresist to the substrate, the ability to provide optical impedance etching, the thickness of the photoresist after coating, and the thermal stability, and can be decomposed by the developer. . The sensitizer is the main body of the liquid photoresist layer, and its stem sensitivity to special light is 'received to be fine; before the reaction with the human system, the money can be suppressed", and the heart agent is on the tree For the solution, it is also called an inhibitor (Inhibitor), but once the photoresist is exposed, the photocatalytic reaction agent will react with the developer at a rate of hundreds to thousands of times. Therefore, from the unexposed and the The large difference in the development rate of the exposed area allows the pattern to be formed into a liquid. The solvent keeps the photoresist in a liquid form, so that the photoresist can be coated by rotation 11 1294758
; 於塗佈時’適當地控制旋轉式塗佈機之轉速可得到厚度均勻之液態光 /阻層，其厚度約為光波長之數倍，即約為數百至上千奈米之間。 +光如第一圖(F)所不，利用—具有與所需銅孔圖案相反之光罩· 進行曝光，將影像轉移，該光罩240之材質為玻璃； .、、、 帛一圖⑼所示’於曝光後利用顯景嫌將液態光阻層231之可 W味予：W去’留下之部份於侧時可保護銅面不被侧液侵钱，從 _ My成所⑸之圖型232。相較於採用乾膜光阻而言，本發明實細因採用液 悲光卿成之騎㈣，更有直錄小之孔之圖案域細絲之形成。 如第二圖(H)所示’利用銅侧液對該圖型232區域所對應之第一銅膜 221進行侧以形成複數銅孔23〇，從而裸露出該銅孔咖所對應之紐 210 ； 如第二圖(I)所示，去除剩餘之液態光阻層231，即剝膜； (6) 如第一圖⑺所示，採用化學蝕刻液蝕刻該銅孔230對應之基材 籲210 ’以形成基材210上之膜孔25〇，該膜孔25〇與該銅孔23〇係--對應， 此時因膜孔250之形成露出其對應之部份第二銅膜222 ; (7) 孔壁鍍銅。可限定僅於膜孔250之孔壁，還可於形成之銅孔230與 膜孔25()之孔壁均鍍銅。該步驟具體製作係先以整孔劑使孔壁帶正電荷， 然後使帶負電微粒之碳粉附著於孔壁表面，再以微蝕將露出之第二銅膜222 上之碳粉剝離’僅留孔壁絕緣位置上之一層碳粉，經鑛銅而成。 ⑻與步驟(5)相似，採用微影製程，於第一銅膜221上形成所需之線 12 1294758 %牛~|月Ί丨日修(更)正本 路，該製程包括如下步驟：__鋪料面、_賴光阻層、曝 光、顯影、餘刻裸露出之銅、剝膜； (9)若雙面均需加工銅孔及線路，則卿)至⑻之步驟，對第二銅膜 222進行同樣之操作； ⑽於形成所需孔洞及線路之基材別表面印刷一保護層(圖未示)，並 對該保護驗行曝光、齡，舰崎料齡卜界_，避油氧化及線 路污染。 (11)鍍金； (12) 裁切； (13) 電气檢查，以檢測形成之柔性電路板，並標示不良位置。 相較於先前技術固態乾膜而言，本發明實施例採用液態光阻，由於液 態光阻之流動性佳、附著性好之特性，其可均勻塗佈，包括鍵輪孔附近亦 可塗佈液態光阻，因此，於後續曝光、顯影、蝕刻過程中，在液態光阻之 保瘦下’鏈輪孔附近之銅膜或基材不會被餘刻掉，因而可提高鏈輪孔剛性； • 並且，因鍵輪孔於孔洞及線路製作過程中起定位作用，未被餘刻之鍵輪孔 亦會提供精準對位，從而提昇製作良率。 另’液態光阻之流動性使得該液態光阻層之厚度低於固態乾膜，而該 薄層之光阻有利於製作精細度高之線路。 相較於先前技術採用塑膠光罩而言，本發明實施例於曝光、顯影過程 中採用玻璃光罩，因玻璃受熱均勻、膨脹性弱，因而不易受熱變形，且坡 璃透光性好，因此可以保證孔洞及線路之製作良率穩定。 13 1294758 %Λ - ν 綜上所述，本發明確已符合發明專利之要件，爰依法提出專利申請。 惟，以上所述者僅為本發明之較佳實施方式，本發明之範圍並不以上述實 施方式為限，舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾 或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】At the time of coating, the rotational speed of the rotary coater is appropriately controlled to obtain a liquid light/resist layer having a uniform thickness, which is about several times the wavelength of the light, that is, between several hundreds and thousands of nanometers. + Light, as shown in the first figure (F), is used to expose the image by using a photomask opposite to the desired copper hole pattern. The material of the photomask 240 is glass; ., ,, and (1) Shown 'Using the exposure after the exposure to use the liquid photoresist layer 231 can give the taste: W to 'left' part of the side can protect the copper surface from the side liquid invading money, from _ My Cheng (5) Figure 232. Compared with the use of dry film photoresist, the actual thinness of the present invention is due to the use of liquid sorrow light (C), and the formation of filaments in the pattern of straight holes. As shown in the second figure (H), the first copper film 221 corresponding to the pattern 232 region is side-by-side with a copper side liquid to form a plurality of copper holes 23〇, thereby exposing the button 210 corresponding to the copper hole coffee. As shown in the second figure (I), the remaining liquid photoresist layer 231 is removed, that is, stripped; (6) as shown in the first figure (7), the substrate corresponding to the copper hole 230 is etched by a chemical etching solution 210 'To form a film hole 25〇 on the substrate 210, the film hole 25〇 corresponds to the copper hole 23, at which time the corresponding portion of the second copper film 222 is exposed by the formation of the film hole 250; 7) Copper plating on the hole wall. The wall of the hole of the film hole 250 can be defined, and the wall of the hole formed by the copper hole 230 and the film hole 25 can be plated with copper. In this step, the pores are positively charged by the pore former, and then the carbon powder with negatively charged particles is attached to the surface of the pore wall, and the carbon powder on the exposed second copper film 222 is stripped by microetching. One layer of carbon powder on the insulation of the wall of the hole is made of ore. (8) Similar to the step (5), the lithography process is used to form the desired line 12 1294758 % of the original copper film 221 on the first copper film 221, and the process includes the following steps: __ Paving surface, _ ray photoresist layer, exposure, development, left exposed copper, stripping film; (9) If both sides need to process copper holes and lines, then step (8), the second copper film 222 Perform the same operation; (10) Print a protective layer on the surface of the substrate on which the required holes and lines are formed (not shown), and expose the exposure, age, and the oil-resistant oxidation. Line pollution. (11) Gold plating; (12) Cutting; (13) Electrical inspection to detect the formed flexible circuit board and marking the defective position. Compared with the prior art solid dry film, the embodiment of the invention adopts a liquid photoresist, which can be uniformly coated due to the good fluidity and good adhesion of the liquid photoresist, including coating near the key wheel hole. Liquid photoresist, therefore, in the subsequent exposure, development, etching process, in the thinness of the liquid photoresist, the copper film or substrate near the sprocket hole will not be left behind, thus improving the rigidity of the sprocket hole; • Also, because the key wheel holes are positioned during the hole and line production process, the key wheel holes that are not engraved will also provide accurate alignment, thus improving the production yield. The liquidity of the liquid photoresist makes the thickness of the liquid photoresist layer lower than that of the solid dry film, and the photoresist of the thin layer facilitates the fabrication of fine lines. Compared with the prior art, the plastic reticle adopts a glass reticle in the process of exposure and development. Because the glass is heated uniformly and has weak expansion, it is not easily deformed by heat, and the glass has good light transmittance. It can ensure the production yield of holes and lines is stable. 13 1294758 %Λ - ν In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes in accordance with the spirit of the present invention. It should be covered by the following patent application. [Simple description of the map]
211 221 201 200 230 240211 221 201 200 230 240
第一圖係先前技術柔性電路板之製作方法示意圖 第二圖係本發明實施例柔性電路板之製作方法示意圖 【主要元件符號說明】 基材 210 第一表面 第二表面 212 第一鋼膜 第二銅膜 222 物件 切割平行線 202 力口工件 鍵輪孔 203 銅孔 液態光阻層 231 光罩 圖型 232 膜孔 2501 is a schematic diagram of a method for fabricating a prior art flexible circuit board. FIG. 2 is a schematic diagram of a method for fabricating a flexible circuit board according to an embodiment of the present invention. [Main component symbol description] substrate 210 first surface second surface 212 first steel film second Copper film 222 object cutting parallel line 202 force port workpiece key wheel hole 203 copper hole liquid photoresist layer 231 reticle pattern 232 film hole 250