WO2012053488A1 - マザーガラス基板孔あけ加工方法及びマザーガラス基板 - Google Patents

マザーガラス基板孔あけ加工方法及びマザーガラス基板 Download PDF

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Publication number
WO2012053488A1
WO2012053488A1 PCT/JP2011/073863 JP2011073863W WO2012053488A1 WO 2012053488 A1 WO2012053488 A1 WO 2012053488A1 JP 2011073863 W JP2011073863 W JP 2011073863W WO 2012053488 A1 WO2012053488 A1 WO 2012053488A1
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Prior art keywords
drill
glass substrate
hole
mother glass
drilling
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Application number
PCT/JP2011/073863
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English (en)
French (fr)
Japanese (ja)
Inventor
盛吉 ▲鄭▼
田中　宏樹
寧 野中
和也 石川
Original Assignee
旭硝子株式会社
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Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to KR1020137010061A priority Critical patent/KR20130122624A/ko
Priority to JP2012539725A priority patent/JPWO2012053488A1/ja
Priority to CN2011800506728A priority patent/CN103180255A/zh
Publication of WO2012053488A1 publication Critical patent/WO2012053488A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/14—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by boring or drilling
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/26—Punching reheated glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/38—Exhausting, degassing, filling, or cleaning vessels

Definitions

  • the present invention relates to a mother glass substrate drilling method and a mother glass substrate for drilling a mother glass substrate.
  • a plasma display panel (PDP: Plasma Display Panel) has a front glass substrate on which electrodes are formed, and a back surface in which red, green, and blue phosphor layers and electrodes are formed in grooves partitioned by ribs.
  • the glass substrate and the glass substrate are opposed and integrally joined. Then, between the two glass substrates, after a sealed minute gap having a sealed peripheral edge is formed, the glass substrate is sealed in a state filled with a gas containing argon and neon for generating discharge.
  • a through hole communicating with the minute gap is provided outside the display area.
  • This through hole is used as an exhaust hole for exhausting the air in the minute gap after joining the two glass substrates in the manufacturing process, and then a gas supply hole for filling the gas in the minute gap. Used as.
  • a drilling drill having fine diamond abrasive grains on its surface is rotated at high speed to drill the mother glass substrate (for example, see Patent Document 1).
  • a mother glass substrate is a glass substrate for making two or more panels from a single mother glass, so-called “multi-face drawing”.
  • a single mother glass substrate has two exhaust holes. The above is created.
  • the first drill from below and the second drill from above are used.
  • the first drill is pulled out first.
  • the second drill from above is further fed in the axial direction, and the first hole machined from below and the second hole machined from above are communicated.
  • chipping hammer chipping
  • a heat treatment is performed in which the glass substrate is heated to a high temperature (eg, 500 ° C. to 600 ° C.).
  • a high temperature eg, 500 ° C. to 600 ° C.
  • thermal stress compressive stress, tensile stress
  • the present invention provides a mother glass substrate drilling method and a mother glass substrate that solve the above problems by defining a stop position in the drill rotation direction when the drill is pulled out after drilling. With the goal.
  • the present invention provides a mother glass substrate drilling method for a plasma display panel in which a rotating drill is moved to a mother glass substrate side and a hole is processed in the mother glass substrate.
  • a second step of stopping or decelerating the rotation of the drill after the drilling of the mother glass substrate is completed;
  • the maximum radius position of the drill is within a preset safety area in the circumferential direction of the hole, the drill is pulled out, and when the maximum radius position of the drill is not within the safety area of the hole
  • a third step of adjusting the stop position or the deceleration position of the drill Have
  • the present invention includes a fourth step in which the maximum radial position is set in accordance with the direction of application of thermal stress acting on the mother glass substrate so that the maximum radial position of the drill enters the safety region of the hole.
  • (3) The present invention determines whether or not the maximum radius position of the drill whose drilling process on the mother glass substrate is finished and whose rotation is stopped or decelerated is in the safety area of the hole. It has 6 steps, In the sixth step, when it is determined in the sixth step that the maximum radial position of the drill is in the safety area of the hole, the drill is pulled out, and the maximum radial position of the drill is If it is determined that the hole is not in the safety area, it is preferable to adjust the stop or deceleration position of the drill.
  • the present invention provides a mother glass substrate for a plasma display panel, in which a rotating drill moves in the axial direction and is drilled.
  • a rotating drill moves in the axial direction and is drilled.
  • the streak defect generated on the inner peripheral wall of the hole is formed in a predetermined range where the tensile force due to the thermal stress of the heat treatment does not act.
  • the present invention relates to a back glass substrate for a plasma display panel in which a rotating drill moves in the axial direction and is drilled.
  • a streak defect generated on the inner peripheral wall of at least one of the holes is caused by a line parallel to the short side of the rear glass substrate, It is preferable that the angle formed with the line passing through the center of the hole is formed in the region of the inner peripheral surface of the hole that is within ⁇ 50 °.
  • a safety region in which a tensile force due to thermal stress in the circumferential direction of the hole does not act on the periphery of the hole is set in advance, and when the maximum radial position of the drill is in the safety region, the drill is pulled out. If the maximum radial position of the drill is not within the safe area, adjust the stop position or deceleration position in the direction of drill rotation. For this reason, the drill can be pulled out from the through hole when the position of the streak defect on the inner peripheral surface of the hole is in a safe region that is not easily affected by thermal stress, and the mother starting from the streak defect in the subsequent heat treatment Breaking of the glass substrate can be prevented.
  • FIG. 1 is a schematic configuration diagram for explaining one embodiment of a mother glass substrate drilling apparatus according to the present invention.
  • 2A to 2E are diagrams showing the procedure of each step of drilling.
  • FIG. 3 is an enlarged view of the tip shape of the drill.
  • FIG. 4 is a diagram showing a laser interferometer that measures the maximum radial position of the outer periphery of the tip of each drill.
  • FIG. 5 is a plan view of a mother glass substrate for explaining the drilling process.
  • FIG. 6 is a diagram showing measurement data of each rotation position of the drill and the radius of the outer periphery of the tip.
  • FIG. 7A is a diagram for explaining a firing process of the mother glass substrate.
  • FIG. 7B is a diagram for explaining the thermal stress acting on the through hole of the mother glass substrate.
  • FIG. 8 is a flowchart for explaining a drilling control process executed by the control device.
  • FIG. 1 is a schematic configuration diagram for explaining one embodiment of a mother glass substrate drilling apparatus according to the present invention.
  • a mother glass substrate drilling device hereinafter referred to as “drilling device” 10 includes a clamp device 12, a lower hole processing device 14, an upper hole processing device 16, a drill measuring unit 60, The drill rotation stop position control unit 70 is configured.
  • the mother glass substrate G to be punched by the punching apparatus 10 is a mother glass substrate G used for a plasma display panel, and has a thickness of 1.8 mm to 2.8 mm manufactured by, for example, a float process. Mother glass substrate G.
  • the clamping device 12 of the drilling device 10 is a device that clamps the mother glass substrate G between the clamp table 18 and the upper surface of the mother glass substrate G placed on the table 20 of the drilling device 10 body. T is pressed and clamped by a clamp plate 22 formed in a ring shape.
  • the upper hole processing device 16 processes the upper hole (first hole) into the mother glass substrate G by inserting the tip of a first drill 24 described later into the inner peripheral portion of the clamp plate 22.
  • the lower hole processing device 14 is a device that processes a lower hole (second hole) having a predetermined depth on the lower surface B of the mother glass substrate G as will be described later.
  • the second drill 28 is disposed substantially perpendicular to the clamp table 18 and is attached to the rotating shaft 32 of the second motor 30 via the holder 34.
  • the second motor 30 is attached to the lower motor attachment portion 36 through a lower linear motion guide 38 so as to be movable up and down, and is substantially perpendicular to the mother glass substrate G by a lower lifting feed screw device (not shown). Moved up and down.
  • the pilot hole (second hole) can be processed by pressing the second drill 28 against the lower surface B of the mother glass substrate G and applying rotation and feed.
  • an insertion hole is formed in the clamp table 18, and the tip of the second drill 28 contacts the lower surface B of the mother glass substrate G through the insertion hole.
  • the upper hole processing device 16 is a device that processes an upper hole on the upper surface T of the mother glass substrate G, and presses the rotating first drill 24 against the upper surface T of the mother glass substrate G to process the upper hole.
  • the first drill 24 is arranged coaxially with the lower second drill 28 in the vertical direction and is arranged substantially perpendicular to the clamp table 18.
  • the first drill 24 is mounted on the rotating shaft 44 of the first motor 42 with a holder 46. Is attached through.
  • the first motor 42 is attached to the upper motor mounting portion 48 through an upper linear motion guide 50 so as to be movable up and down, and is moved up and down substantially perpendicularly to the mother glass substrate G by an upper lifting feed screw device (not shown).
  • the upper hole can be processed by pressing the first drill 24 against the upper surface T of the mother glass substrate G and applying rotation and feed.
  • the drill measuring unit 60 includes a first laser interferometer 62, a second laser interferometer 64, and a laser position detector 66.
  • the first laser interferometer 62 measures the distance at the irradiation position by irradiating the outer periphery of the tip of the first drill 24 with laser light and receiving the reflected light from the irradiation position.
  • the laser position detector 66 calculates the distance from the irradiation position when the first drill 24 is shifted in the rotation direction by a predetermined angle (for example, 5 ° to 10 °) from the measurement value from the first laser interferometer 62.
  • the drill radius at the irradiation position is output as measurement data.
  • the second laser interferometer 64 measures the distance at the irradiation position by irradiating the outer periphery of the tip of the second drill 28 with laser light and receiving the reflected light from the irradiation position.
  • the laser position detector 66 calculates the distance from the irradiation position when the second drill 28 is shifted in the rotation direction by a predetermined angle (for example, 5 ° to 10 °) from the measurement value from the second laser interferometer 64.
  • the drill radius at the irradiation position is output as measurement data.
  • the drill rotation stop position control unit 70 includes a control device 72, a memory 73, a first motor rotation detector 74, a second motor rotation detector 75, a first motor driver 76, and a second motor driver 77.
  • the control device 72 controls the lower hole processing device 14 and the upper hole processing device 16 to drill the mother glass substrate G, and adjust the drill rotation stop position when the drill is pulled out after the drilling processing. Perform control processing.
  • the memory 73 has a database that stores map data including measurement data of the drill radius corresponding to the rotation direction positions of the respective drills 24 and 28 for each measurement data input from the laser position detector 66.
  • the first motor rotation detector 74 includes rotation detection means such as a rotary encoder and resolver, detects the rotation angle of the rotation shaft 44 of the first motor 42, and outputs the angle detection signal to the control device 72.
  • the second motor rotation detector 75 includes rotation detection means such as a rotary encoder and a resolver, detects the rotation angle of the rotation shaft 32 of the second motor 30, and detects the angle. A detection signal is output to the control device 72.
  • the first motor driver 76 generates a drive signal corresponding to the rotation speed or rotation angle of the first motor 42 based on the motor control signal output from the control device 72 and outputs the drive signal to the first motor 42.
  • the second motor driver 77 generates a drive signal corresponding to the rotation speed or rotation angle to the second motor 30 based on the motor control signal output from the control device 72, and the second Output to the motor 30.
  • the control device 72 reads each control program stored in the memory 73 and executes a drilling control process described later. That is, at the time of drilling, the control device 72 drives the first motor 42 and the second motor 30 through the motor drivers 76 and 77 at a high-speed rotation of several thousand r / min (times per minute) or more. Holes are processed in the glass substrate G. Further, when the drilling process is finished and the drills 24 and 28 are pulled out from the holes, the control device 72 stops the rotational positions of the drills 24 and 28 detected by the motor rotation detectors 74 and 75 ( It is determined which region in the circumferential direction of the hole (the maximum radius position) is located (either a safety region or a stress concentration region described later).
  • the control device 72 then pulls the drills 24, 28 so that the drills 24, 28 are pulled out when the maximum radial position of each drill 24, 28 is in a safe region where the tensile force due to thermal stress does not act.
  • the upper hole machining device 16 is feedback controlled.
  • FIG. 2 is a diagram showing the procedure of each step of drilling. As shown in FIG. 2, in this embodiment, drilling is performed according to the following procedure 1 to procedure 5. In this embodiment, the upper hole is processed and then the lower hole is processed. However, the upper hole may be processed after the lower hole is processed.
  • the first drill 24 is positioned on the upper surface T side with the mother glass substrate G interposed therebetween, and the second drill 28 is positioned on the lower surface B side facing the first drill 24.
  • the horizontal mechanical error (center misalignment) between the first drill 24 and the second drill 28 is within several tens of microns.
  • each drill 24 and 28 is a predetermined position (depth H1) of the front-end
  • the second motor 30 is lowered through the lower linear motion guide 38 and the second drill 28 is pulled out from the through hole 5 downward. This completes the processing of the through hole 5 that becomes the exhaust hole of the mother glass substrate G.
  • each drill 24, 28 When the first drill 24 and the second drill 28 are pulled out from the through hole 5, the maximum radial position of each drill 24, 28 is in a safety region where the tensile force due to the thermal stress of the through hole 5 does not act. Each of the drills 24 and 28 is pulled out on the condition.
  • the processing stop position that is, the depth of the lower hole 26 is such that the stepped portion 6 formed in the inner peripheral portion of the through hole 5 by overlapping the lower hole 26 and the upper hole 40 is the thickness direction of the mother glass substrate G. It is determined so that it may be located on the upper surface T side from the central portion S. Therefore, since the step part 6 formed in the inner peripheral part of the through-hole 5 by overlapping the lower hole 26 and the upper hole 40 is located on the upper surface T side from the central part S in the thickness direction of the mother glass substrate G, It is possible to prevent thermal cracking (cracking due to thermal stress) due to the stepped portion 6 formed in the inner peripheral portion of the through hole 5 that is an exhaust hole formed in the mother glass substrate G.
  • FIG. 3 is an enlarged view showing the tip shape of the drill.
  • each of the drills 24 and 28 has the same shape, and includes a grinding part 120 (shown with a satin pattern in FIG. 3) and a shank 130.
  • the grinding part 120 has fine diamond abrasive grains fixed on the surface of a metal material, and is provided so as to form a substantially uniform grinding surface over the entire circumference.
  • diamond abrasive grains having a particle size of 200 to 800 mesh are preferably fixed to the grinding portion 120.
  • a chamfer 122 is formed at the outer peripheral side edge of the tip 121 of the grinding part 120.
  • the chamfer 122 of the tip 121 acts to suppress chipping when contacting the glass surface.
  • FIG. 4 is a diagram showing a laser interferometer that measures the maximum radial position of the outer periphery of the tip of each drill.
  • the drill is worn. In this case, the position of the outer peripheral portion 124 of the grinding portion 120 of each drill 24, 28 is measured for each predetermined rotation angle.
  • Each of the laser interferometers 62 and 64 has an outer periphery of each grinding portion 120 from the horizontal direction when the drills 24 and 28 are at a height position (standby position) that is a predetermined distance away from the upper surface T and the lower surface B of the mother glass substrate G.
  • the part 124 is irradiated with laser light, and the distance to each grinding part 120 is measured.
  • the laser position detector 66 synchronizes with the rotation of the drills 24 and 28 by a predetermined angle (for example, 5 ° to 10 °) from the measured values from the laser interferometers 62 and 64.
  • the distance from the irradiation position of the grinding part 120 is calculated, and the drill radius at the irradiation position is output as measurement data.
  • FIG. 5 is a plan view of the mother substrate for explaining the drilling process of the mother glass substrate.
  • the mother glass substrate 200 on the back side is formed in a size having an area for six screens.
  • the through hole 5 is processed as an exhaust hole outside the display area 210 (indicated by the alternate long and short dash line) of each rear glass substrate 300.
  • the through hole 5 is formed in the vicinity of the peripheral edge of the mother substrate 200.
  • the mother substrate 200 is cut along a cutting line C indicated by a broken line after the baking process described later to become six back glass substrates.
  • FIG. 6 is a diagram showing measurement data of each rotation position of the drill and the radius of the tip outer periphery.
  • the measured values from the laser interferometers 62, 64 are constant. Therefore, the measured value overlaps with a reference line K0 (indicated by a two-dot chain line in FIG. 6) parallel to the horizontal axis.
  • the outer peripheral portion 124 has a portion with a large radius and a portion with a small radius.
  • the measured values from the laser interferometers 62 and 64 are not constant, but a sine wave shape (one-dot chain line in FIG. 6) consisting of a measured value larger than the reference line K0 and a measured value smaller than the reference line K0. Or a solid line).
  • the angular positions of the minimum radius A1 and the maximum radius A2 are detected at intervals of about 180 ° as shown in the graph A (indicated by the solid line in FIG. 6).
  • the angular positions of the minimum radius B1 and the maximum radius B2 are detected at intervals of about 180 ° as shown in the graph B (indicated by a dashed line in FIG. 6).
  • the control device 72 detects by calculation the angular position where the minimum radius A1, the maximum radius A2 or the minimum radius B1, and the maximum radius B2 occur from 0 ° to 360 °, and covers the entire circumference based on the measurement data. Map data is created and stored in the database of the memory 73.
  • the maximum radius differs according to the amount of runout of each drill 24, 28, the depth of the streak defect generated on the inner peripheral surface of the through hole 5 when the drill is pulled out after drilling is changed.
  • the depth of the streak defect exceeds a predetermined depth, the possibility of cracking due to thermal stress increases.
  • FIG. 7A is a diagram for explaining an example of a firing process of a mother glass substrate.
  • the mother glass substrate G (mother substrate 200 shown in FIG. 5) is placed on the upper surface of the transfer base 220 and heated along the long side direction of the mother glass substrate G.
  • it is conveyed in the furnace 230.
  • the inside of the heating furnace 230 is heated to a high temperature of about 500 ° C. to 600 ° C. and then cooled to a predetermined temperature.
  • a heating method of the heating furnace 230 a method of heating the mother glass substrate G by heating the atmosphere using a heater installed on the furnace wall of the heating furnace 230 is used.
  • the heated mother glass substrate is taken out of the heating furnace 230 and cooled when the baking process is completed.
  • FIG. 7B is a diagram for explaining the thermal stress acting on the through hole of the mother glass substrate during the firing step and the cooling step.
  • the action direction of the tensile stress Ft acting on the inner peripheral surface of the through hole 5 in the firing step and the cooling step is the long side direction (X direction) of the mother glass substrate G.
  • the temperature distribution of the mother glass substrate in the firing process and the cooling process is such that the temperature at the center of the mother glass substrate G is high and the temperature at the periphery of the mother glass substrate G may be low. This is because the deformation is crushed in the short side direction (Y direction).
  • the temperature distribution of the mother glass substrate G depends on the tensile stress Ft acting on the inner peripheral surface of the through hole 5. It has been confirmed by experiments that the strain is maximum in the Y direction of the through-hole 5 and is minimum in the X direction.
  • the region on the circumference of the through hole 5 to be formed is the region ⁇ , and the angle between the straight line passing through the center of the through hole 5 and the long side direction (X direction) of the mother glass substrate G is ⁇ 50 ° to A region on the circumference of the through hole 5 that forms an intersection with a straight line of + 50 ° is a region ⁇ .
  • the pressure resistance against compressive stress is strong, but the pressure resistance against tensile stress is weak. Therefore, when a streak defect generated on the inner peripheral surface of the through-hole 5 during drill extraction occurs in the stress concentration region, cracking due to tensile stress is likely to occur.
  • the position where the streak defect exists is a region of the inner peripheral surface of the through hole 5 in which an angle formed by a line parallel to the long side of the mother glass substrate and a line passing through the center of the through hole is within ⁇ 50 °. Is more preferable, and the region of the inner peripheral surface of the through hole 5 within ⁇ 25 ° is more preferable, and the region of the inner peripheral surface of the through hole 5 within ⁇ 10 ° is particularly preferable.
  • the mother glass substrate and the rear glass substrate have the positional relationship shown in FIG. For this reason, it is preferable from a viewpoint of preventing a crack that the streaky defects generated on the inner peripheral surface of the through hole 5 in the rear glass substrate exist in the following region.
  • the position where the streak defect exists is a region of the inner peripheral surface of the through hole 5 in which an angle formed by a line parallel to the short side of the rear glass substrate and a line passing through the center of the through hole is within ⁇ 50 °. Is more preferable, and the region of the inner peripheral surface of the through hole 5 within ⁇ 25 ° is more preferable, and the region of the inner peripheral surface of the through hole 5 within ⁇ 10 ° is particularly preferable.
  • FIG. 8 is a flowchart for explaining a drilling control process executed by the control device.
  • the control device 72 confirms that the mother glass substrate G is loaded on the table 20 and the clamp table 18 of the drilling device 10 and is held at a predetermined position
  • the control device 72 proceeds to S12, and each drill 24 , 28, the outer periphery of the grinding part 120 formed at the tip is measured.
  • the laser interferometers 62 and 64 irradiate the outer periphery of the grinding unit 120 with laser light, and the irradiation positions corresponding to the rotation angles of the respective drills 24 and 28 at predetermined angular intervals. And the measured value is stored in the memory 73.
  • the drills 24 and 28 are synchronized with the rotation of the drills 24 and 28 by a predetermined angle (for example, 5 ° to 10 °) from the measured values of the laser interferometers 62 and 64.
  • a predetermined angle for example, 5 ° to 10 °
  • the distance to the irradiation position is calculated and the measurement data of the drill radius at the irradiation position is obtained, for example, as shown in FIG. 6, a data map based on the measurement data of the drill radius corresponding to the rotation angle of each drill Is stored in the memory 73. That is, the process from S12 to here is the first step of detecting the position of the maximum radius when the drill rotates. Furthermore, referring to the range of the safety region in the circumferential direction of the hole 5 shown in FIG.
  • the maximum radial position of the drill at the time of processing is a through hole formed in the mother glass.
  • the maximum radial position of the drill is set in accordance with the direction of application of tensile stress due to thermal stress acting on the mother glass substrate G so as to enter the safety region (fourth step).
  • the process proceeds to S14, in which the rotation angle (circumferential address of the maximum radial position) of the set maximum radial position of each drill 24, 28 is extracted from the data map and stored in the memory 73 (fifth step). ).
  • the drills 24 and 28 are fed to the mother glass substrate G side to start drilling (see procedure 2 in FIG. 2B).
  • the stop angle position in the rotation direction of the rotation shaft 44 is read by the detection signal of the first motor rotation detector 74.
  • the process proceeds to S19, where the stop angle position (circumferential address of the stop position) of the rotating shaft 44 detected by the first motor rotation detector 74, that is, the stop angle position of the first drill 24 is stored in the memory 73 described above.
  • the maximum radius position (maximum radius circumferential address) of the first drill 24 is within the range of the safety area (area ⁇ ) of the inner peripheral surface of the through hole 5 described above by collating with the data map stored in the database. Is checked (sixth step).
  • next S22 it is checked whether or not the depth of the lower hole 26 on the lower surface side has reached a preset processing depth H2.
  • the process proceeds to S23, and the rotation of the second drill 28 is stopped (second process).
  • the rotation of the second drill 28 may be stopped after the tip of the second drill 28 reaches the predetermined depth of the mother glass substrate G, or the rotation speed of the second drill 28 may be set to 1r / min to 5r. You may decelerate to low speed rotation of / min.
  • the stop angle position of the rotary shaft 32 is read by the detection signal of the second motor rotation detector 75.
  • the stop angle position of the rotating shaft 32 detected by the second motor rotation detector 75 that is, the stop angle position of the second drill 28 is stored in the data map stored in the database of the memory 73 described above. By collating, it is checked whether or not the maximum radial position of the second drill 28 is within the range of the safety region (region ⁇ ) of the inner peripheral surface of the through hole 5 described above (sixth step).
  • next S28 it is checked whether or not the number of through holes 5 has been processed. For example, as shown in FIG. 5 described above, in the case of the mother substrate 200 corresponding to six screen sizes, the through holes 5 are processed at six locations. When the number of processed through holes 5 is less than 6 (in the case of NO), the control processing of S15 to S28 is repeated until the through holes 5 are processed into 6 locations.
  • the process proceeds to S29, and the mother glass substrate G in which the drilling has been completed is replaced with the table 20 and the clamp table of the drilling apparatus 10. 18 and the unprocessed new mother glass substrate 200 is held on the table 20 and the clamp table 18.
  • the replacement work of the mother glass substrate 200 is performed by a mother glass substrate transfer robot.
  • next S30 it is checked whether or not the drill replacement time specified by the number of drills used or the drilling time has been reached.
  • the drills 24 and 28 currently used have reached the drill replacement time (in the case of YES)
  • the replacement work of the drills 24 and 28 is performed.
  • the maximum radial position of each drill 24, 28 is measured, the rotation of each drill 24, 28 is stopped after drilling, and the stop position (from the detection signal of each motor rotation detector 74, 75) ( When the circumferential direction address) is within the safety region (region ⁇ ) of the inner peripheral surface of the through hole 5, the drills 24, 28 are pulled out by pulling the drills 24, 28 from the through hole 5. It is possible to prevent the streak-like defect from occurring in the stress concentration region (region ⁇ ) on the inner peripheral surface of the through hole 5 and to prevent the mother glass substrate G from being cracked due to thermal stress in the firing process.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Drilling And Boring (AREA)
  • Gas-Filled Discharge Tubes (AREA)
PCT/JP2011/073863 2010-10-20 2011-10-17 マザーガラス基板孔あけ加工方法及びマザーガラス基板 WO2012053488A1 (ja)

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CN106079109A (zh) * 2016-06-17 2016-11-09 天津市北闸口仪表机床厂 一种磁石相对钻孔方法

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KR102239170B1 (ko) 2015-01-29 2021-04-12 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN105922458A (zh) * 2016-06-20 2016-09-07 苏州市灵通玻璃制品有限公司 一种具有吸尘喷雾功能的玻璃生产钻孔机
KR102102878B1 (ko) 2018-01-31 2020-04-21 강구만 인라인 유리 공정 방법
CN111070426B (zh) * 2019-12-31 2021-09-07 重庆市耀城玻璃制品有限公司 一种气缸驱动的玻璃锅盖打孔控制***

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CN106079109A (zh) * 2016-06-17 2016-11-09 天津市北闸口仪表机床厂 一种磁石相对钻孔方法

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