WO2009051094A1 - 高熱伝導性を有する金属－黒鉛複合材料およびその製造方法 - Google Patents

高熱伝導性を有する金属－黒鉛複合材料およびその製造方法 Download PDF

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Publication number
WO2009051094A1
WO2009051094A1 PCT/JP2008/068557 JP2008068557W WO2009051094A1 WO 2009051094 A1 WO2009051094 A1 WO 2009051094A1 JP 2008068557 W JP2008068557 W JP 2008068557W WO 2009051094 A1 WO2009051094 A1 WO 2009051094A1
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WO
WIPO (PCT)
Prior art keywords
metal
composite material
graphite composite
producing
thermal conductivity
Prior art date
Application number
PCT/JP2008/068557
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English (en)
French (fr)
Inventor
Toshiyuki Ueno
Takashi Yoshioka
Original Assignee
Shimane Prefectural Government
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimane Prefectural Government filed Critical Shimane Prefectural Government
Priority to EP08839705.4A priority Critical patent/EP2213756B1/en
Priority to US12/734,029 priority patent/US8501048B2/en
Priority to CN200880111001.6A priority patent/CN101821415B/zh
Priority to KR1020107007552A priority patent/KR101193991B1/ko
Priority to JP2009538087A priority patent/JP4441768B2/ja
Publication of WO2009051094A1 publication Critical patent/WO2009051094A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/14—Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　本発明は、熱の２次元的な拡散に好適である、二軸方向に高熱伝導率を有する金属－黒鉛複合材料およびその製造方法を提供する。本発明の金属－黒鉛複合材料は、２０～８０体積％の鱗状黒鉛粉末と、銅、アルミニウムまたはそれらの合金からなる群から選択されるマトリクスとを含み、金属－黒鉛複合材料の熱伝導容易面の法線ベクトルに対して鱗状面の法線ベクトルが２０゜以上傾いた鱗状黒鉛粉末は、前記鱗状黒鉛粉末全体に対して１５％以下であり、金属－黒鉛複合材料は９５％以上の相対密度を有することを特徴とする。
PCT/JP2008/068557 2007-10-18 2008-10-14 高熱伝導性を有する金属－黒鉛複合材料およびその製造方法 WO2009051094A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08839705.4A EP2213756B1 (en) 2007-10-18 2008-10-14 Metal-graphite composite material having high thermal conductivity and method for producing the same
US12/734,029 US8501048B2 (en) 2007-10-18 2008-10-14 Metal-graphite composite material having high thermal conductivity and production method therefor
CN200880111001.6A CN101821415B (zh) 2007-10-18 2008-10-14 具有高导热性的金属-石墨复合材料和其制造方法
KR1020107007552A KR101193991B1 (ko) 2007-10-18 2008-10-14 높은 열전도성을 갖는 금속-그라파이트 복합재료 및 그 제조방법
JP2009538087A JP4441768B2 (ja) 2007-10-18 2008-10-14 高熱伝導性を有する金属−黒鉛複合材料およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271660 2007-10-18
JP2007271660 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009051094A1 true WO2009051094A1 (ja) 2009-04-23

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ID=40567358

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068557 WO2009051094A1 (ja) 2007-10-18 2008-10-14 高熱伝導性を有する金属－黒鉛複合材料およびその製造方法

Country Status (6)

Country Link
US (1) US8501048B2 (ja)
EP (1) EP2213756B1 (ja)
JP (1) JP4441768B2 (ja)
KR (1) KR101193991B1 (ja)
CN (1) CN101821415B (ja)
WO (1) WO2009051094A1 (ja)

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JP2009256117A (ja) * 2008-04-14 2009-11-05 Toyo Tanso Kk 炭素繊維炭素複合成形体及び炭素繊維強化炭素複合体材料並びにその製造方法
JP2010248064A (ja) * 2009-03-26 2010-11-04 Shimane Prefecture 鱗状黒鉛粉末成形体の製造方法および焼結成形体
JP2010275605A (ja) * 2009-05-29 2010-12-09 Shimane Prefecture 金属−黒鉛複合材料の製造方法および金属−黒鉛複合材料
JP2016014090A (ja) * 2014-07-01 2016-01-28 Dic株式会社 熱接着シート及び物品
JP2017534552A (ja) * 2014-09-29 2017-11-24 ベイカー ヒューズ インコーポレイテッド 炭素複合体及びその製造方法
JP2017535499A (ja) * 2014-09-17 2017-11-30 ベイカー ヒューズ インコーポレイテッド 炭素複合体
JP2017537861A (ja) * 2014-10-15 2017-12-21 ベイカー ヒューズ インコーポレイテッド 炭素複合体を含有する物品及びその製造方法
JP2018087372A (ja) * 2016-11-30 2018-06-07 昭和電工株式会社 金属−炭素粒子複合材の製造方法
WO2019215867A1 (ja) * 2018-05-10 2019-11-14 日産自動車株式会社 軸受部材
JP2020191347A (ja) * 2019-05-21 2020-11-26 昭和電工株式会社 冷却装置
JP2022533706A (ja) * 2019-05-20 2022-07-25 バテル エナジー アライアンス，エルエルシー 緻密なグラファイトを作製するための放電プラズマ焼結方法
WO2022210298A1 (ja) * 2021-03-31 2022-10-06 Ｕｂｅ株式会社 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法

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JP6755779B2 (ja) * 2016-11-11 2020-09-16 昭和電工株式会社 金属−炭素粒子複合材及びその製造方法
IT201700000485A1 (it) 2017-01-03 2018-07-03 St Microelectronics Srl Dispositivo a semiconduttore, apparecchiatura e procedimento corrispondenti
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CN110453101B (zh) * 2019-08-08 2020-09-01 长春工业大学 夹金属铜鳞片石墨增强铜基复合材料及其制备方法和应用
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JP2009256117A (ja) * 2008-04-14 2009-11-05 Toyo Tanso Kk 炭素繊維炭素複合成形体及び炭素繊維強化炭素複合体材料並びにその製造方法
JP2010248064A (ja) * 2009-03-26 2010-11-04 Shimane Prefecture 鱗状黒鉛粉末成形体の製造方法および焼結成形体
JP2010275605A (ja) * 2009-05-29 2010-12-09 Shimane Prefecture 金属−黒鉛複合材料の製造方法および金属−黒鉛複合材料
JP2016014090A (ja) * 2014-07-01 2016-01-28 Dic株式会社 熱接着シート及び物品
JP2017535499A (ja) * 2014-09-17 2017-11-30 ベイカー ヒューズ インコーポレイテッド 炭素複合体
JP2017534552A (ja) * 2014-09-29 2017-11-24 ベイカー ヒューズ インコーポレイテッド 炭素複合体及びその製造方法
JP2017537861A (ja) * 2014-10-15 2017-12-21 ベイカー ヒューズ インコーポレイテッド 炭素複合体を含有する物品及びその製造方法
JP2018087372A (ja) * 2016-11-30 2018-06-07 昭和電工株式会社 金属−炭素粒子複合材の製造方法
WO2019215867A1 (ja) * 2018-05-10 2019-11-14 日産自動車株式会社 軸受部材
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JP2022533706A (ja) * 2019-05-20 2022-07-25 バテル エナジー アライアンス，エルエルシー 緻密なグラファイトを作製するための放電プラズマ焼結方法
JP7455864B2 (ja) 2019-05-20 2024-03-26 バテル エナジー アライアンス，エルエルシー 緻密なグラファイトを作製するための放電プラズマ焼結方法
JP2020191347A (ja) * 2019-05-21 2020-11-26 昭和電工株式会社 冷却装置
WO2022210298A1 (ja) * 2021-03-31 2022-10-06 Ｕｂｅ株式会社 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法

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CN101821415B (zh) 2012-12-05
EP2213756B1 (en) 2015-03-04
JPWO2009051094A1 (ja) 2011-03-03
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