TWI265612B - A heat spreader and a heat sink - Google Patents

A heat spreader and a heat sink

Info

Publication number
TWI265612B
TWI265612B TW094101033A TW94101033A TWI265612B TW I265612 B TWI265612 B TW I265612B TW 094101033 A TW094101033 A TW 094101033A TW 94101033 A TW94101033 A TW 94101033A TW I265612 B TWI265612 B TW I265612B
Authority
TW
Taiwan
Prior art keywords
heat
present
spreader
layers
heat spreader
Prior art date
Application number
TW094101033A
Other languages
Chinese (zh)
Other versions
TW200529394A (en
Inventor
Katsuro Tsukamoto
Toshiharu Sakura
Hiroaki Tsukamoto
Original Assignee
Japan Matex Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Matex Kabushiki Kaisha filed Critical Japan Matex Kabushiki Kaisha
Publication of TW200529394A publication Critical patent/TW200529394A/en
Application granted granted Critical
Publication of TWI265612B publication Critical patent/TWI265612B/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K47/00—Beehives
    • A01K47/06—Other details of beehives, e.g. ventilating devices, entrances to hives, guards, partitions or bee escapes
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K47/00—Beehives
    • A01K47/02—Construction or arrangement of frames for honeycombs
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K47/00—Beehives
    • A01K47/04—Artificial honeycombs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This provides a heat spreader and a heat sink capable of effectively radiating heat resulting from a note type personal computer, plasma television and so on. The present invention has excellent heat conductivity which enables heat to be conducted not only along the surface but also through layers of a heat spreader or a heat sink. In addition, it should be emphasized that graphite layers of the present invention is hardly exfoliated from the other layers. The present heat spreader has metal wire nets on both surfaces of an expanded graphite sheet. The expanded graphite sheet and the metal wire nets are drawn together. The present heat sink is produced by changing the shape of the heat spreader as desired designs.
TW094101033A 2004-01-13 2005-01-13 A heat spreader and a heat sink TWI265612B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004006061 2004-01-13
JP2004367252A JP2005229100A (en) 2004-01-13 2004-12-20 Heat-dissipating sheet and heatsink

Publications (2)

Publication Number Publication Date
TW200529394A TW200529394A (en) 2005-09-01
TWI265612B true TWI265612B (en) 2006-11-01

Family

ID=35003516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094101033A TWI265612B (en) 2004-01-13 2005-01-13 A heat spreader and a heat sink

Country Status (3)

Country Link
JP (1) JP2005229100A (en)
KR (1) KR100798833B1 (en)
TW (1) TWI265612B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8929076B2 (en) 2011-12-21 2015-01-06 Tsinghua University Heat-dissipation structure and electronic device using the same
TWI474446B (en) * 2007-05-16 2015-02-21 Toshiba Kk Heat conductor
US9017503B2 (en) 2011-12-21 2015-04-28 Tsinghua University Method for making carbon nanotube paper
US9576879B2 (en) 2011-12-21 2017-02-21 Tsinghua University Heat-dissipation structure and electronic device using the same

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165415A (en) * 2005-12-09 2007-06-28 Japan Matekkusu Kk Composite substrate
KR100834149B1 (en) * 2006-08-22 2008-06-02 자화전자(주) A heat solution sheet and a electronic device included the sheet
US20080128067A1 (en) * 2006-10-08 2008-06-05 Momentive Performance Materials Inc. Heat transfer composite, associated device and method
TW200846499A (en) * 2007-05-24 2008-12-01 Liung Feng Ind Co Ltd Method of generating hydrogen using dissimilar metal
JP4978478B2 (en) * 2008-01-11 2012-07-18 ソニー株式会社 Electromagnetic wave suppressing heat radiation sheet and electronic device
CN102046528B (en) 2008-06-02 2013-04-24 松下电器产业株式会社 Graphite complex and manufacturing method thereof
TW201035513A (en) 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
JP4564586B1 (en) * 2010-01-26 2010-10-20 有限会社アイレックス Radiation sheet and method for producing the radiation sheet
JP5791984B2 (en) 2011-07-13 2015-10-07 株式会社Ｊｏｌｅｄ Display device
WO2013118168A1 (en) * 2012-02-08 2013-08-15 国立大学法人東北大学 Heat dissipation member and electronic device equipped with heat dissipation member
WO2014054842A1 (en) * 2012-10-04 2014-04-10 한국기계연구원 Heat sink comprising metal mesh layer, and method for manufacturing same
KR101422218B1 (en) * 2012-10-04 2014-07-30 한국기계연구원 A Heat Sink comprising a Metal Mesh and Fab ricating Method of the same
KR101425995B1 (en) * 2012-10-04 2014-08-06 한국기계연구원 A Heat Sink comprising a Metal Mesh and Fabricating Method of the same
CN102917574B (en) * 2012-10-24 2015-05-27 华为技术有限公司 Heat-conducting pad, method for manufacturing heat-conducting pad, radiating device and electronic device
CN103281888B (en) * 2013-05-11 2015-08-19 深圳市同安泰电子科技有限公司 A kind of preparation method of high heat conduction native graphite fin
KR101447878B1 (en) * 2013-05-13 2014-10-27 주식회사 데코미 Honeycomb heat sinking sheet
JP3216710U (en) 2015-06-12 2018-06-21 グラフテック インターナショナル ホールディングス インコーポレイティド Graphite composite and thermal management system
JP2017028280A (en) * 2015-07-20 2017-02-02 アールエヌユー カンパニー リミテッド High-performance electromagnetic wave shield and high heat-dissipation complex function sheet
ES2746161T3 (en) * 2015-09-07 2020-03-04 Hak Sik Joo Complex foil for absorption / extinction and shielding against electromagnetic waves, and for the high heat dissipation of an electronic device and its manufacturing process
WO2017043831A1 (en) * 2015-09-07 2017-03-16 주학식 Complex sheet for absorbing/extinguishing and shielding electromagnetic waves and highly dissipating heat from electronic device and manufacturing method therefor
KR101749460B1 (en) * 2015-09-07 2017-06-21 주학식 Fusion Sheet For Absorption extinction and Shielding of Electromagnetic Wave
KR101749461B1 (en) * 2015-09-07 2017-06-21 주학식 the fusion heat dissipation sheet for electronic equipment
KR102104331B1 (en) * 2015-12-31 2020-04-24 경북대학교 산학협력단 Heating radiating sheet having electromagnetic waves shielding and its manufacturing method
US11189420B2 (en) 2016-03-31 2021-11-30 Neograf Solutions, Llc Noise suppressing assemblies
KR20190021230A (en) * 2016-06-28 2019-03-05 니폰 제온 가부시키가이샤 Heat sink
JP6956565B2 (en) * 2017-08-29 2021-11-02 日本ピラー工業株式会社 Heat conductive molded body
JP7396204B2 (en) * 2020-06-01 2023-12-12 株式会社デンソー Cooling system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172799A (en) * 1986-01-24 1987-07-29 日本ピラ−工業株式会社 Electromagnetic wave shielding material
US5079900A (en) * 1990-09-26 1992-01-14 Minnesota Mining And Manufacturing Company Method and apparatus for forming a tape handle
JPH06134917A (en) * 1992-10-28 1994-05-17 Taenaka Kogyo Kk Expanded graphite laminated sheet, expanded graphite laminated composite material and production thereof
JP3417253B2 (en) 1997-05-30 2003-06-16 松下電器産業株式会社 Metal-graphite composite and radiator using the same
JPH1158591A (en) 1997-08-22 1999-03-02 Furukawa Electric Co Ltd:The Heat-conductive sheet
JP3515368B2 (en) 1998-05-22 2004-04-05 ポリマテック株式会社 High thermal conductive electromagnetic shielding sheet for mounting element, method of manufacturing the same, heat radiation of mounting element and electromagnetic shielding structure
JP2001240404A (en) * 2000-02-25 2001-09-04 Japan Matekkusu Kk Method for manufacturing expanded graphite and expanded graphite mold
US6503626B1 (en) 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
JP4116238B2 (en) 2000-05-19 2008-07-09 株式会社タイカ Thermally conductive sheet having electromagnetic shielding properties
JP2003008263A (en) 2001-06-27 2003-01-10 Sony Corp Heat conduction member and electronic device having heat conduction member
JP4062994B2 (en) * 2001-08-28 2008-03-19 株式会社豊田自動織機 Heat dissipation substrate material, composite material and manufacturing method thereof
JP3938681B2 (en) * 2001-11-21 2007-06-27 信越化学工業株式会社 Heat dissipation structure
KR20050001039A (en) * 2003-06-26 2005-01-06 주식회사 포스코 Micro processor safety annunciator
KR20050019232A (en) * 2003-08-18 2005-03-03 자화전자 주식회사 Heat conduction sheet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474446B (en) * 2007-05-16 2015-02-21 Toshiba Kk Heat conductor
US8929076B2 (en) 2011-12-21 2015-01-06 Tsinghua University Heat-dissipation structure and electronic device using the same
US9017503B2 (en) 2011-12-21 2015-04-28 Tsinghua University Method for making carbon nanotube paper
US9576879B2 (en) 2011-12-21 2017-02-21 Tsinghua University Heat-dissipation structure and electronic device using the same

Also Published As

Publication number Publication date
KR20050074287A (en) 2005-07-18
JP2005229100A (en) 2005-08-25
TW200529394A (en) 2005-09-01
KR100798833B1 (en) 2008-01-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees