WO2008078739A1 - 多層回路基板およびモータ駆動回路基板 - Google Patents
多層回路基板およびモータ駆動回路基板 Download PDFInfo
- Publication number
- WO2008078739A1 WO2008078739A1 PCT/JP2007/074828 JP2007074828W WO2008078739A1 WO 2008078739 A1 WO2008078739 A1 WO 2008078739A1 JP 2007074828 W JP2007074828 W JP 2007074828W WO 2008078739 A1 WO2008078739 A1 WO 2008078739A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- conductor layer
- layer
- motor drive
- drive circuit
- Prior art date
Links
- 239000004020 conductor Substances 0.000 abstract 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 238000007906 compression Methods 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Power Steering Mechanism (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
導体層11と樹脂製の絶縁層12とを交互に積層して積層回路部13を形成し、最下層の絶縁層12に接するように金属基板14を設ける。導体層11と絶縁層12と金属基板14は熱圧着される。電子部品31が載置される最上層の導体層11と最下層の絶縁層12と接続するために、内面に銅メッキなどで導体層22を形成し、内部に樹脂23を充填した放熱ビア21を設ける。最上層の導体層11にはニッケルメッキを下地とした金メッキ15を施す。最上層の導体層11にモータ駆動用の電子部品31を載置すれば、電動パワーステアリングシステム用のモータ駆動回路基板として利用できる。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07860057A EP2104408B1 (en) | 2006-12-26 | 2007-12-25 | Multilayer circuit board and motor drive circuit board |
CN2007800483965A CN101606446B (zh) | 2006-12-26 | 2007-12-25 | 多层电路基板和电动机驱动电路基板 |
AT07860057T ATE546034T1 (de) | 2006-12-26 | 2007-12-25 | Mehrschichtige leiterplatte und motorantriebs- leiterplatte |
US12/492,429 US20090260858A1 (en) | 2006-12-26 | 2009-06-26 | Multi-layer circuit substrate and motor drive circuit substrate |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-348738 | 2006-12-26 | ||
JP2006348738 | 2006-12-26 | ||
JP2007227937A JP4962228B2 (ja) | 2006-12-26 | 2007-09-03 | 多層回路基板およびモータ駆動回路基板 |
JP2007-227937 | 2007-09-03 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/492,429 Continuation-In-Part US20090260858A1 (en) | 2006-12-26 | 2009-06-26 | Multi-layer circuit substrate and motor drive circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008078739A1 true WO2008078739A1 (ja) | 2008-07-03 |
Family
ID=39562528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/074828 WO2008078739A1 (ja) | 2006-12-26 | 2007-12-25 | 多層回路基板およびモータ駆動回路基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090260858A1 (ja) |
EP (1) | EP2104408B1 (ja) |
JP (1) | JP4962228B2 (ja) |
CN (1) | CN101606446B (ja) |
AT (1) | ATE546034T1 (ja) |
WO (1) | WO2008078739A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2166823A1 (en) | 2008-09-17 | 2010-03-24 | JTEKT Corporation | Multilayer circuit substrate |
US10548213B2 (en) | 2016-03-07 | 2020-01-28 | Mitsubishi Electric Corporation | Electronic controlling apparatus |
Families Citing this family (36)
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KR100825766B1 (ko) * | 2007-04-26 | 2008-04-29 | 한국전자통신연구원 | Ltcc 패키지 및 그 제조방법 |
JP4764393B2 (ja) * | 2007-09-06 | 2011-08-31 | 三菱重工業株式会社 | インバータ一体型電動圧縮機 |
JP5444619B2 (ja) * | 2008-02-07 | 2014-03-19 | 株式会社ジェイテクト | 多層回路基板およびモータ駆動回路基板 |
JP5417804B2 (ja) * | 2008-11-06 | 2014-02-19 | 株式会社ジェイテクト | 気泡率演算方法及び気泡率演算装置 |
JP5262619B2 (ja) * | 2008-11-25 | 2013-08-14 | 株式会社ジェイテクト | モータ駆動用の複合回路基板 |
US8248803B2 (en) * | 2010-03-31 | 2012-08-21 | Hong Kong Applied Science and Technology Research Institute Company Limited | Semiconductor package and method of manufacturing the same |
CN101853822B (zh) * | 2010-04-14 | 2012-01-25 | 星弧涂层科技(苏州工业园区)有限公司 | 散热器件及其制造方法 |
JP2012009828A (ja) | 2010-05-26 | 2012-01-12 | Jtekt Corp | 多層回路基板 |
JP2011253890A (ja) * | 2010-06-01 | 2011-12-15 | Jtekt Corp | 多層回路基板の製造方法 |
WO2012071795A1 (zh) * | 2010-11-30 | 2012-06-07 | 乐健线路板(珠海)有限公司 | 带有绝缘微散热器的印刷电路板 |
US10433414B2 (en) * | 2010-12-24 | 2019-10-01 | Rayben Technologies (HK) Limited | Manufacturing method of printing circuit board with micro-radiators |
CN102026496A (zh) * | 2010-12-24 | 2011-04-20 | 乐健线路板(珠海)有限公司 | 带有绝缘微散热器的印刷电路板的制备方法 |
CN102811554A (zh) * | 2011-06-02 | 2012-12-05 | 熊大曦 | 大功率电子器件模组用基板及其制备方法 |
JP5884611B2 (ja) * | 2012-04-10 | 2016-03-15 | 株式会社デンソー | 電子装置 |
DE102012215788B4 (de) | 2012-09-06 | 2014-05-22 | Osram Gmbh | Mehrlagige LED-Leiterplatte |
KR101989516B1 (ko) * | 2012-09-24 | 2019-06-14 | 삼성전자주식회사 | 반도체 패키지 |
US9686854B2 (en) * | 2012-09-25 | 2017-06-20 | Denso Corporation | Electronic device |
JP5716972B2 (ja) * | 2013-02-05 | 2015-05-13 | 株式会社デンソー | 電子部品の放熱構造およびその製造方法 |
JP5408376B2 (ja) * | 2013-04-01 | 2014-02-05 | 株式会社ジェイテクト | 気泡率演算方法及び気泡率演算装置 |
JP5408377B2 (ja) * | 2013-04-01 | 2014-02-05 | 株式会社ジェイテクト | 気泡率演算方法及び気泡率演算装置 |
US20150136357A1 (en) * | 2013-11-21 | 2015-05-21 | Honeywell Federal Manufacturing & Technologies, Llc | Heat dissipation assembly |
US9741635B2 (en) | 2014-01-21 | 2017-08-22 | Infineon Technologies Austria Ag | Electronic component |
JP2015211204A (ja) * | 2014-04-30 | 2015-11-24 | イビデン株式会社 | 回路基板及びその製造方法 |
JP6469435B2 (ja) * | 2014-10-30 | 2019-02-13 | 太陽誘電ケミカルテクノロジー株式会社 | 構造体及び構造体製造方法 |
FR3036917B1 (fr) * | 2015-05-28 | 2018-11-02 | IFP Energies Nouvelles | Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore. |
CN105163485A (zh) * | 2015-09-25 | 2015-12-16 | 湖南三一电控科技有限公司 | 发热装置和发热器件的导热基板及其制作方法 |
JPWO2017094589A1 (ja) * | 2015-11-30 | 2018-04-26 | 日本精工株式会社 | コントロールユニット及び電動パワーステアリング装置 |
CN109196637B (zh) * | 2016-06-01 | 2022-02-18 | 三菱电机株式会社 | 半导体装置 |
FR3065112A1 (fr) * | 2017-04-11 | 2018-10-12 | Valeo Systemes De Controle Moteur | Unite electronique et dispositif electrique comprenant ladite unite electronique |
DE102017220417A1 (de) * | 2017-11-16 | 2019-05-16 | Continental Automotive Gmbh | Elektronisches Modul |
KR102505443B1 (ko) * | 2017-11-16 | 2023-03-03 | 삼성전기주식회사 | 인쇄회로기판 |
WO2019194200A1 (ja) * | 2018-04-04 | 2019-10-10 | 太陽誘電株式会社 | 部品内蔵基板 |
CN108617079A (zh) * | 2018-05-02 | 2018-10-02 | 皆利士多层线路版(中山)有限公司 | 厚铜线路板及其制备方法 |
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CN113438801A (zh) * | 2021-07-06 | 2021-09-24 | 上海应用技术大学 | 便于散热的pcb板电路 |
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- 2007-12-25 AT AT07860057T patent/ATE546034T1/de active
- 2007-12-25 WO PCT/JP2007/074828 patent/WO2008078739A1/ja active Application Filing
- 2007-12-25 EP EP07860057A patent/EP2104408B1/en not_active Not-in-force
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2166823A1 (en) | 2008-09-17 | 2010-03-24 | JTEKT Corporation | Multilayer circuit substrate |
US8415565B2 (en) | 2008-09-17 | 2013-04-09 | Jtekt Corporation | Multilayer circuit substrate |
US10548213B2 (en) | 2016-03-07 | 2020-01-28 | Mitsubishi Electric Corporation | Electronic controlling apparatus |
Also Published As
Publication number | Publication date |
---|---|
CN101606446A (zh) | 2009-12-16 |
US20090260858A1 (en) | 2009-10-22 |
EP2104408A4 (en) | 2010-05-19 |
EP2104408A1 (en) | 2009-09-23 |
CN101606446B (zh) | 2012-03-07 |
EP2104408B1 (en) | 2012-02-15 |
JP2008182184A (ja) | 2008-08-07 |
JP4962228B2 (ja) | 2012-06-27 |
ATE546034T1 (de) | 2012-03-15 |
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