WO2009054105A1 - 部品内蔵プリント配線基板およびその製造方法 - Google Patents
部品内蔵プリント配線基板およびその製造方法 Download PDFInfo
- Publication number
- WO2009054105A1 WO2009054105A1 PCT/JP2008/002892 JP2008002892W WO2009054105A1 WO 2009054105 A1 WO2009054105 A1 WO 2009054105A1 JP 2008002892 W JP2008002892 W JP 2008002892W WO 2009054105 A1 WO2009054105 A1 WO 2009054105A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring
- wiring board
- printed wiring
- electronic part
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
第1配線回路(3)を有し電子部品(7)が実装されたコア層(1)と第2配線回路(14a)を有する配線層(12)とが積層して構成され、電子部品(7)は第1配線回路(3)を構成する接続用の電極(3a)に半田接合され、電子部品(7)と電極(3a)との半田接合部(6c)は樹脂コート部(9)で覆われ、電子部品(7)および樹脂コート部(9)を周囲から固定する部品固定層(11a)がコア層(1)に形成され、第1配線回路(3)と第2配線回路(14a)とを接続する層間配線部(19)がコア層(1)および配線層(12)に設けられた構成を有し、簡便な工程で効率よく半導体部品などを内蔵したプリント配線基板を製造することができる。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-278557 | 2007-10-26 | ||
JP2007278557A JP5172275B2 (ja) | 2007-10-26 | 2007-10-26 | 部品内蔵プリント配線基板および部品内蔵プリント配線基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054105A1 true WO2009054105A1 (ja) | 2009-04-30 |
Family
ID=40579215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002892 WO2009054105A1 (ja) | 2007-10-26 | 2008-10-14 | 部品内蔵プリント配線基板およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5172275B2 (ja) |
TW (1) | TW200920197A (ja) |
WO (1) | WO2009054105A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011060875A (ja) * | 2009-09-08 | 2011-03-24 | Panasonic Corp | 電子部品内蔵基板及びその製造方法とこれを用いた半導体装置 |
WO2011040480A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板 |
JP2013187359A (ja) * | 2012-03-08 | 2013-09-19 | Panasonic Corp | 部品内蔵基板の製造方法および部品内蔵基板 |
JP2013191620A (ja) * | 2012-03-12 | 2013-09-26 | Panasonic Corp | 部品内蔵基板の製造方法および部品内蔵基板 |
KR101455533B1 (ko) | 2013-06-27 | 2014-10-27 | 주식회사 코리아써키트 | 부품실장형 인쇄회로기판 제조방법 |
TWI667945B (zh) * | 2019-01-04 | 2019-08-01 | 力成科技股份有限公司 | 包覆成型封裝結構及方法 |
JP7347984B2 (ja) | 2019-07-26 | 2023-09-20 | 株式会社鷺宮製作所 | 温度式膨張弁及び冷凍サイクルシステム |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077536A (ja) * | 1999-09-01 | 2001-03-23 | Sony Corp | 電子回路内蔵プリント配線板およびその製造方法 |
JP2004152943A (ja) * | 2002-10-30 | 2004-05-27 | Denso Corp | 電子部品の実装構造およびそれに用いる基板ならびにその基板の製造方法 |
JP2004311736A (ja) * | 2003-04-08 | 2004-11-04 | Nec Toppan Circuit Solutions Inc | チップ部品内蔵ビルドアップ多層配線板の製造方法 |
WO2007034629A1 (ja) * | 2005-09-20 | 2007-03-29 | Murata Manufacturing Co., Ltd. | 部品内蔵モジュールの製造方法および部品内蔵モジュール |
JP2007214535A (ja) * | 2006-01-13 | 2007-08-23 | Cmk Corp | 半導体素子内蔵プリント配線板及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2606610B2 (ja) * | 1994-12-20 | 1997-05-07 | 日本電気株式会社 | ソルダーペースト、半導体装置の接続方法および接続構造 |
KR19990036355A (ko) * | 1995-08-11 | 1999-05-25 | 케네쓰 제이 커스텐 | 에폭시 수지 기재 땜납 페이스트 |
JP2001244299A (ja) * | 2000-02-29 | 2001-09-07 | Sony Corp | 配線基板及びその製造方法 |
JP4442353B2 (ja) * | 2004-07-28 | 2010-03-31 | 株式会社デンソー | 配線基板の製造方法 |
JP2006093493A (ja) * | 2004-09-27 | 2006-04-06 | Cmk Corp | 部品内蔵型プリント配線板及びその製造方法 |
JP4471825B2 (ja) * | 2004-12-09 | 2010-06-02 | 日本電波工業株式会社 | 電子部品、及び電子部品の製造方法 |
JP2007049004A (ja) * | 2005-08-11 | 2007-02-22 | Cmk Corp | プリント配線板とその製造方法 |
JP2007214230A (ja) * | 2006-02-08 | 2007-08-23 | Cmk Corp | プリント配線板 |
-
2007
- 2007-10-26 JP JP2007278557A patent/JP5172275B2/ja active Active
-
2008
- 2008-10-14 WO PCT/JP2008/002892 patent/WO2009054105A1/ja active Application Filing
- 2008-10-23 TW TW097140626A patent/TW200920197A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077536A (ja) * | 1999-09-01 | 2001-03-23 | Sony Corp | 電子回路内蔵プリント配線板およびその製造方法 |
JP2004152943A (ja) * | 2002-10-30 | 2004-05-27 | Denso Corp | 電子部品の実装構造およびそれに用いる基板ならびにその基板の製造方法 |
JP2004311736A (ja) * | 2003-04-08 | 2004-11-04 | Nec Toppan Circuit Solutions Inc | チップ部品内蔵ビルドアップ多層配線板の製造方法 |
WO2007034629A1 (ja) * | 2005-09-20 | 2007-03-29 | Murata Manufacturing Co., Ltd. | 部品内蔵モジュールの製造方法および部品内蔵モジュール |
JP2007214535A (ja) * | 2006-01-13 | 2007-08-23 | Cmk Corp | 半導体素子内蔵プリント配線板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200920197A (en) | 2009-05-01 |
JP2009110992A (ja) | 2009-05-21 |
JP5172275B2 (ja) | 2013-03-27 |
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