WO2012071795A1 - 带有绝缘微散热器的印刷电路板 - Google Patents

带有绝缘微散热器的印刷电路板 Download PDF

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Publication number
WO2012071795A1
WO2012071795A1 PCT/CN2011/070042 CN2011070042W WO2012071795A1 WO 2012071795 A1 WO2012071795 A1 WO 2012071795A1 CN 2011070042 W CN2011070042 W CN 2011070042W WO 2012071795 A1 WO2012071795 A1 WO 2012071795A1
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Prior art keywords
printed circuit
circuit board
heat sink
micro heat
pcb
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Application number
PCT/CN2011/070042
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English (en)
French (fr)
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WO2012071795A9 (zh
Inventor
王征
Original Assignee
乐健线路板（珠海）有限公司
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Application filed by 乐健线路板（珠海）有限公司 filed Critical 乐健线路板（珠海）有限公司
Priority to US13/514,998 priority Critical patent/US20120241810A1/en
Priority to CN201180037321.3A priority patent/CN103069936B/zh
Priority to EP11845874.4A priority patent/EP2621256A4/en
Publication of WO2012071795A1 publication Critical patent/WO2012071795A1/zh
Publication of WO2012071795A9 publication Critical patent/WO2012071795A9/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • This invention relates to the field of printed circuit board technology, and more particularly to a novel printed circuit board that combines an ultra-thin heat sink with a conventional printed circuit board. Background technique
  • PCB Principal Ci rcui t Board
  • the conventional printed circuit board has a metallized structure with a hole, and the material between the layers is FR4 material, and its thermal conductivity is 0.4 W/mk, and the heat transfer capability is low; the metal-based circuit board developed in recent years
  • the thermal conductivity of the material between the layers is 1. 3-2. 2W/mk, and the heat transfer capacity is still limited.
  • LEDs high-power light-emitting diodes
  • the thermal conductivity of the printed circuit board is required to reach tens or hundreds of W/mk, which obviously exceeds the thermal conductivity of the prior art extrudate. Summary of the invention
  • the object of the invention is achieved by the following technical solutions: a miniature radiator
  • the printed circuit board of the specification comprises a printed circuit board substrate comprising a plurality of layers of copper-clad lines and a plurality of layers of solidified layers laminated in turn, which are provided with a micro heat sink
  • the printed circuit board further includes a cylindrical micro heat sink embedded in the cylindrical through hole penetrating the printed circuit board substrate, the height of the micro heat sink is the same as the thickness of the printed circuit board substrate, and the upper and lower surfaces thereof are Covered with a copper layer, one of the bottom surfaces is provided with a heat generating component, and the other bottom surface is insulated from the copper layer circuit.
  • the micro heat sink is made of an electrical insulating material such as alumina ceramic, aluminum nitride ceramic, silicon carbide or diamond.
  • the micro heat sink has an elliptical cylindrical shape, a cubic shape, or a cylindrical shape in which both the upper and lower bottom surfaces are diamond, triangular or trapezoidal.
  • the micro heat sink is one or more.
  • the heat generating component is a light emitting diode chip.
  • the heat generating component is a light emitting diode.
  • the layer coated with the copper layer is provided with a copper layer on one side.
  • the layer coated with the copper layer is provided with a copper layer on both sides.
  • the heat generating component is electrically connected to the copper layer line.
  • the printed circuit board is a four-layer, six-layer, eight-layer or sixteen-layer printed circuit board.
  • the invention combines a micro heat sink with high thermal conductivity with a conventional rigid printed circuit board, and has the high thermal conductivity of the micro heat sink, the heat transfer stability and the walking of the traditional printed circuit board.
  • the advantages of flexible line and reliable electrical connection can transmit the heat radiated by the heat-emitting component such as the light-emitting diode to the outside of the printed circuit board in time, which is an ideal carrier for the heating element and its array.
  • Figure 1 is a cross-sectional view showing a preferred embodiment of the present invention. detailed description
  • FIG. 1 is a schematic cross-sectional view of a preferred embodiment of the present invention.
  • the printed circuit board is a rigid printed circuit board comprising three layers of copper-clad lines and two layers of cured layers 120, which are sequentially cross-lap laminated, wherein the top layer of the printed circuit board
  • the board and the bottom board are both a layer 110 on which a copper layer line is applied, and the upper and lower surfaces of each layer of the copper line layer 110 are provided with a copper layer line 130.
  • the printed circuit board further includes two cylindrical micro heat sinks 150 respectively embedded in two cylindrical through holes penetrating the printed circuit board, the height of the micro heat sink 150 being the same as the thickness of the printed circuit board.
  • the upper and lower bottom surfaces 151 are respectively covered with a copper layer, and the upper bottom surface 151 is respectively provided with a light-emitting diode chip 160 having an LED light emitting body, and a power signal input end (not shown) of the LED chip 160 and the printed circuit board
  • the inner layer circuit is electrically connected, and the other bottom surface 151 of the micro heat sink 150 is identical to the other circuits of the printed circuit board.
  • the micro heat sink 150 is made of a high thermal conductivity electrical insulating material such as alumina ceramic, aluminum nitride ceramic, silicon carbide, diamond, etc., and the thermal conductivity between the bottom surfaces of the micro heat sink 150 can reach 20 - 1000W/mk.
  • the LED chip 160 operates, and the LED illuminator emits heat, and the heat is conducted to the other bottom surface 151 of the micro heat sink 150 through the micro heat sink 150, and then the copper layer passes through the bottom surface 151. Conduct heat away from the printed circuit board.
  • a heat generating device such as an integrated circuit chip of one or more light emitting diode elements or non-light emitting diode chips may be disposed on the upper bottom surface 151 of the micro heat sink 150 embedded in the printed circuit board;
  • the rigid printed circuit board of the preferred embodiment of the specification can be connected to a conventional flexible printed circuit board to become a rigid/flexible printed circuit board;
  • the printed circuit board is not limited to a six-layer printed circuit board having six copper layer lines, and may also be a multi-layer printed circuit board of four layers, eight layers, and six layers;
  • the copper-clad layer 110 is not limited to being coated with a copper layer on both surfaces, and may also be provided with a copper layer on one side, and only needs to ensure that the outer surface of the top and bottom boards of the printed circuit board is coated with copper.
  • Layer line can be;
  • the shape of the micro heat sink is not limited to a cylindrical shape, and may be an elliptical cylinder, a cubic shape, a rhombic shape, a triangular shape, a trapezoidal shape, and the like;
  • the number of micro heat sinks placed on the printed circuit board is determined by actual circuit requirements and may be one or more;
  • the LED chip or other integrated circuit chip disposed on the bottom surface of the micro heat sink is not limited to being electrically connected to the inner layer circuit of the printed circuit board, and may be connected to the top or bottom line of the printed circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

说 明 书 带有绝 微散热器的印刷电路板 技术领域
本发明涉及印刷电路板技术领域， 尤其是一种将绝 微散热器与传统印刷 电路板相结合的新型的印刷电路板。 背景技术
印刷电路板 ( Pr inted Ci rcui t Board, PCB )是电子工业的重要部件之一。 PCB能为电子元件提供固定、装配的机械支撑，可实现电子元件之间的电气连接。 另外， PCB上都印有元件的编号和一些图形， 这为元件插装、 检查、 维修提供了 方便。 几乎每种电子设备， 小到电子手表、 计算器， 大到计算机、 通讯电子设 备、 军用武器***， 只要有集成电路等电子元件， 为了它们之间的电气互连， 都要使用印刷电路板。
传统的印刷电路板釆用孔金属化的结构， 层与层之间的绝 材料为 FR4 材 料， 其热导率为 0. 4W/mk，传热能力较低； 近年来发展的金属基电路板， 层与层 之间绝 材料的热导率为 1. 3-2. 2W/mk , 传热能力仍然有限。 对于设置有大量集 成电路的印刷电路板， 尤其是设置有大功率发光二极管 （LED ) 的印刷电路板， 由于集成电路或发光二极管阵列稳定运行时， 发热量大， 结工作温度低 （约 60 摄氏度）， 要求该印刷电路板的热导率达到数十或数百 W/mk, 显然， 这远远超出 了现有技术的绝 材料的热导率。 发明内容
针对以上现有的印刷电路板的不足， 本发明的目的是提供一种带有绝 微 散热器的印刷电路板。
本发明的目的是通过釆用以下技术方案来实现的： 一种带有绝 微散热器 说 明 书 的印刷电路板， 其包括一印刷电路板基板， 该印刷电路板基板包括依次交叉叠 压的多层敷有铜层线路的绝 层和多层固化绝 层， 该带有绝 微散热器的印 刷电路板还包括柱形的绝 微散热器， 其嵌设于贯穿该印刷电路板基板的柱形 通孔内， 该绝 微散热器的高度与印刷电路板基板的厚度相同， 其上下底面均 覆有铜层， 其中一底面设置有发热元件， 另一底面与所述铜层电路绝 。
作为本发明优选的技术方案， 所述绝 微散热器为氧化铝陶瓷、 氮化铝陶 瓷、 碳化硅、 金刚石等电气绝 材料制成。
作为本发明优选的技术方案， 所述绝 微散热器为椭圆柱形、 立方体形、 或上下底面均为菱形、 三角形或梯形的柱形。
作为本发明优选的技术方案， 所述绝 微散热器为一个或多个。
作为本发明优选的技术方案， 所述发热元件是发光二极管芯片。
作为本发明优选的技术方案， 所述发热元件是发光二极管。
作为本发明优选的技术方案， 所述敷有铜层线路的绝 层为单面敷有铜层 线路。
作为本发明优选的技术方案， 所述敷有铜层线路的绝 层为双面敷有铜层 线路。
作为本发明优选的技术方案， 所述发热元件与铜层线路电气连接。
作为本发明优选的技术方案， 所述印刷电路板为四层、 六层、 八层或十六 层印刷电路板。
相对于现有技术， 本发明将具有高热导率的绝 微散热器与传统刚性印刷 电路板相结合， 兼具了绝 微散热器的高热导率、 传热稳定以及传统的印刷电 路板的走线灵活、 电气连接可靠等两方面的优点， 可将发光二极管等发热元件 在工作时散发的热量及时有效地传导至印刷电路板外， 是发热元件及其阵列理 想的载板。 说 明 书 附图说明
下面结合附图与具体实施例对本发明作进一步说明：
图 1是本发明较佳实施方式剖面示意图。 具体实施方式
图 1为本发明较佳实施方式的剖面示意图。
如图 1 所示， 该印刷电路板为一刚性印刷电路板， 其包括依次交叉叠压的 三层敷有铜层线路的绝 层 110和二层固化绝 层 120， 其中， 印刷电路板的顶 层板及底层板均为表面敷有铜层线路的绝 层 110 ,每一层敷铜线绝 层 110的 上下表面均设有铜层线路 130。 该印刷电路板还包括二圆柱形的绝 微散热器 150 , 其分别嵌设于二贯穿印刷电路板的圆柱形通孔内， 该绝 微散热器 150的 高度与印刷电路板的厚度相同， 其上下底面 151 均覆有铜层， 在其上底面 151 分别设有一设有发光二极管发光体的发光二极管芯片 160 , 该发光二极管芯片 160的电源信号输入端（图中未示出）与印刷电路板的内层电路电气连接， 绝 微散热器 150的另一底面 151与印刷电路板的其他电路绝 。
所述绝 微散热器 150 为氧化铝陶瓷、 氮化铝陶瓷、 碳化硅、 金刚石等高 导热率的电气绝 材料制成， 该绝 微散热器 150 的两底面之间的热导率可达 到 20- 1000W/mk。
该印刷电路板应用过程中， 发光二极管芯片 160 工作， 发光二极管发光体 发光散发热量， 热量通过绝 微散热器 150传导至绝 微散热器 150的另一底 面 151， 再经该底面 151的铜层将热量传导至印刷电路板外。
本发明的印刷电路板不仅限于上述较佳实施方式， 凡是依本发明所作的等 效变化与修改， 都被本发明权利要求书的范围所覆盖。 例如：
在嵌设于印刷电路板内的绝 微散热器 150的上底面 151还可设置一个或 多个发光二极管元件或非发光二极管芯片的集成电路芯片等发热器件； 说 明 书 较佳实施方式之刚性印刷电路板可连接传统柔性印刷电路板， 成为刚 /柔性 相结合的印刷电路板；
印刷电路板不限于具有六层铜层线路的六层印刷电路板， 其还可为 4层、 8 层、 16层等多层印刷电路板；
所述敷铜线绝 层 110 不限于两个表面均敷有铜层线路， 其还可为单面敷 有铜层线路， 只需保证印刷电路板的顶层板及底层板的外表面敷有铜层线路即 可；
绝 微散热器的形状不限于圆柱形， 其还可为椭圆柱形、 立方体形、 上下 底面均为菱形、 三角形、 梯形的柱形等；
印刷电路板上设置的绝 微散热器的数目由实际电路需要决定， 可为一个 或多个；
设置于绝 微散热器一底面的发光二极管芯片或其他的集成电路芯片不限 于与印刷电路板的内层电路电气连接， 其还可与印刷电路板的顶层线路或底层 线路连接。

Claims

权利要求书
1、 一种带有绝 微散热器的印刷电路板， 其包括一印刷电路板基板， 该印 刷电路板基板包括依次交叉叠压的多层敷有铜层线路的绝 层和多层固化绝 层， 其特征是： 该带有绝 微散热器的印刷电路板还包括柱形的绝 微散热器， 其嵌设于贯穿该印刷电路板基板的柱形通孔内， 该绝 微散热器的高度与印刷 电路板基板的厚度相同， 其上下底面均覆有铜层， 其中一底面设置有发热元件， 另一底面与所述铜层电路绝 。
2、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述绝 微散热器为氧化铝陶瓷、 氮化铝陶瓷、 碳化硅、 金刚石等电气绝 材料 制成。
3、根据权利要求 1或 2所述的带有绝 微散热器的印刷电路板，其特征是： 所述绝 微散热器为椭圆柱形、 立方体形、 或上下底面均为菱形、 三角形或梯 形的柱形。
4、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述绝 微散热器为一个或多个。
5、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述发热元件是发光二极管芯片。
6、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述发热元件是发光二极管。
7、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述敷有铜层线路的绝 层为单面敷有铜层线路。
8、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述敷有铜层线路的绝 层为双面敷有铜层线路。
9、 根据权利要求 1所述的带有绝 微散热器的印刷电路板， 其特征是： 所 述发热元件与铜层线路电气连接。
10、 根据权利要求 1 所述的带有绝 微散热器的印刷电路板， 其特征是： 权利要求书 所述印刷电路板为四层、 六层、 八层或十六层印刷电路板。
PCT/CN2011/070042 2010-11-30 2011-01-05 带有绝缘微散热器的印刷电路板 WO2012071795A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/514,998 US20120241810A1 (en) 2010-11-30 2011-01-05 Printing circuit board with micro-radiators
CN201180037321.3A CN103069936B (zh) 2010-11-30 2011-01-05 带有绝缘微散热器的印刷电路板
EP11845874.4A EP2621256A4 (en) 2010-11-30 2011-01-05 Printed circuit board with insulated micro radiator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010564877.5 2010-11-30
CN201010564877 2010-11-30

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WO2012071795A1 true WO2012071795A1 (zh) 2012-06-07
WO2012071795A9 WO2012071795A9 (zh) 2013-02-14

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US (1) US20120241810A1 (zh)
EP (1) EP2621256A4 (zh)
CN (2) CN103069936B (zh)
WO (1) WO2012071795A1 (zh)

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CN102291938B (zh) * 2011-05-27 2012-11-14 乐健线路板（珠海）有限公司 带有金属微散热器的印刷电路板的制备方法
US20130314920A1 (en) * 2012-05-25 2013-11-28 Myung Ho Park Direct Heat Sink Technology for LEDs and Driving Circuits
CN104105357A (zh) * 2014-07-31 2014-10-15 开平依利安达电子第三有限公司 一种将铜块压入pcb电路板的方法及其应用
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CN205491419U (zh) * 2015-09-22 2016-08-17 乐健集团有限公司 印刷电路板及led光源模组
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
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