WO2009037833A1 - 立体プリント配線板およびその製造方法ならびに電子部品モジュール - Google Patents

立体プリント配線板およびその製造方法ならびに電子部品モジュール Download PDF

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Publication number
WO2009037833A1
WO2009037833A1 PCT/JP2008/002564 JP2008002564W WO2009037833A1 WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1 JP 2008002564 W JP2008002564 W JP 2008002564W WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
solid printed
electronic component
component module
Prior art date
Application number
PCT/JP2008/002564
Other languages
English (en)
French (fr)
Inventor
Takayuki Kita
Masaaki Katsumata
Keiichi Nakao
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009533045A priority Critical patent/JPWO2009037833A1/ja
Priority to CN200880107929A priority patent/CN101803476A/zh
Publication of WO2009037833A1 publication Critical patent/WO2009037833A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

開口部（１８）を有する第１のプリント配線板（２２）と、開口部（１８）の下に、導電ペースト部（１９）を有する接着層（１７）を介して第１のプリント配線板（２２）に固定した第２のプリント配線板（２６）とからなる立体プリント配線板（１３）の、開口部（１８）内の第２のプリント配線板（２６）の第２の配線部（１４ｂ）に背の高い電子部品（１１ｂ）を設けることにより、第１のプリント配線板（２２）の第１配線部（１４ａ）に設けられた背の低い電子部品（１１ａ）と高さを揃えて、実装部品の低背化を図ることができる。
PCT/JP2008/002564 2007-09-21 2008-09-18 立体プリント配線板およびその製造方法ならびに電子部品モジュール WO2009037833A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009533045A JPWO2009037833A1 (ja) 2007-09-21 2008-09-18 立体プリント配線板およびその製造方法ならびに電子部品モジュール
CN200880107929A CN101803476A (zh) 2007-09-21 2008-09-18 立体印刷布线板及其制造方法以及电子部件模块

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-244838 2007-09-21
JP2007-244839 2007-09-21
JP2007244838 2007-09-21
JP2007244839 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009037833A1 true WO2009037833A1 (ja) 2009-03-26

Family

ID=40467660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002564 WO2009037833A1 (ja) 2007-09-21 2008-09-18 立体プリント配線板およびその製造方法ならびに電子部品モジュール

Country Status (4)

Country Link
JP (1) JPWO2009037833A1 (ja)
CN (1) CN101803476A (ja)
TW (1) TW200922417A (ja)
WO (1) WO2009037833A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148915A1 (ja) * 2010-05-26 2011-12-01 株式会社村田製作所 モジュール基板およびその製造方法
EP2473012A1 (en) * 2010-12-30 2012-07-04 Research In Motion Limited Combining printed circuit boards
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール
WO2018110383A1 (ja) * 2016-12-15 2018-06-21 株式会社村田製作所 電子モジュールおよび電子モジュールの製造方法
JP2021082771A (ja) * 2019-11-22 2021-05-27 株式会社ジェイテクト 電気機器

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105977364A (zh) * 2016-07-20 2016-09-28 广州硅能照明有限公司 多层led光引擎结构及其加工方法
CN108513432B (zh) * 2017-02-24 2021-06-29 泰连公司 电子元件组件和其组装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254788A (ja) * 1987-04-10 1988-10-21 松下電器産業株式会社 プリント配線板
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
JP2005504443A (ja) * 2001-08-31 2005-02-10 エプコス　アクチエンゲゼルシャフト 構成要素装置
JP2005236256A (ja) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332246A (ja) * 2005-05-25 2006-12-07 Matsushita Electric Ind Co Ltd 回路基板、回路基板の接続構造および電子機器
JP4879890B2 (ja) * 2005-05-25 2012-02-22 パナソニック株式会社 回路基板の接続方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254788A (ja) * 1987-04-10 1988-10-21 松下電器産業株式会社 プリント配線板
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
JP2005504443A (ja) * 2001-08-31 2005-02-10 エプコス　アクチエンゲゼルシャフト 構成要素装置
JP2005236256A (ja) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd コネクタシート及び配線基板、並びにコネクタシート及び配線基板の製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148915A1 (ja) * 2010-05-26 2011-12-01 株式会社村田製作所 モジュール基板およびその製造方法
CN102907188A (zh) * 2010-05-26 2013-01-30 株式会社村田制作所 模块基板及其制造方法
JP5454681B2 (ja) * 2010-05-26 2014-03-26 株式会社村田製作所 モジュール基板およびその製造方法
US9674970B2 (en) 2010-05-26 2017-06-06 Murata Manufacturing Co., Ltd. Module board and manufacturing method thereof
EP2473012A1 (en) * 2010-12-30 2012-07-04 Research In Motion Limited Combining printed circuit boards
JP2016039213A (ja) * 2014-08-06 2016-03-22 ローム株式会社 基板内蔵パッケージ、半導体装置およびモジュール
WO2018110383A1 (ja) * 2016-12-15 2018-06-21 株式会社村田製作所 電子モジュールおよび電子モジュールの製造方法
JPWO2018110383A1 (ja) * 2016-12-15 2019-10-24 株式会社村田製作所 電子モジュールおよび電子モジュールの製造方法
US10660227B2 (en) 2016-12-15 2020-05-19 Murata Manufacturing Co., Ltd. Electronic module and method of manufacturing electronic module
JP2021082771A (ja) * 2019-11-22 2021-05-27 株式会社ジェイテクト 電気機器
JP7427928B2 (ja) 2019-11-22 2024-02-06 株式会社ジェイテクト 電気機器

Also Published As

Publication number Publication date
CN101803476A (zh) 2010-08-11
TW200922417A (en) 2009-05-16
JPWO2009037833A1 (ja) 2011-01-06

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