WO2006040945A1 - 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 - Google Patents
接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 Download PDFInfo
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- WO2006040945A1 WO2006040945A1 PCT/JP2005/018120 JP2005018120W WO2006040945A1 WO 2006040945 A1 WO2006040945 A1 WO 2006040945A1 JP 2005018120 W JP2005018120 W JP 2005018120W WO 2006040945 A1 WO2006040945 A1 WO 2006040945A1
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- Y10T428/00—Stock material or miscellaneous articles
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- Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
Definitions
- Adhesive sheet Adhesive sheet, method for manufacturing the same, method for manufacturing semiconductor device, and semiconductor device
- the present invention relates to an adhesive sheet, a method for manufacturing the same, a method for manufacturing a semiconductor device, and a semiconductor device.
- paste materials have conventionally been used as adhesive members for stacked MCPs.
- the paste material has problems that the resin sticks out in the bonding process of the semiconductor element and the film thickness accuracy is low. These problems cause problems during wire-bonding and voids in the paste agent. Therefore, the use of a paste material has made it impossible to meet the above requirements.
- This film adhesive usually has a configuration in which an adhesive layer is formed on a release substrate.
- One of the typical methods of using a film adhesive is a wafer backside application method.
- the wafer back surface attaching method is a method in which a film adhesive is directly attached to the back surface of a silicon wafer used for manufacturing a semiconductor element.
- a film-like adhesive is attached to a semiconductor wafer, and then the release substrate is removed and a dicing tape is attached on the adhesive layer. Thereafter, the wafer is mounted on a wafer ring and the wafer is cut into a desired semiconductor element size together with the adhesive layer.
- the semiconductor element after dicing has a structure having an adhesive layer cut out to the same dimension on the back surface.
- the semiconductor element with the adhesive layer is picked up and attached to the substrate to be mounted by a method such as thermocompression bonding.
- the dicing tape used in this backside application method usually has a configuration in which an adhesive layer is formed on a base film, and is divided into two types: a pressure-sensitive dicing tape and a UV-type dicing tape. Broadly divided.
- a sufficient adhesive force is required so that the semiconductor element does not scatter due to a load accompanying wafer cutting.
- a semiconductor element with an adhesive layer with no adhesive remaining on each element can be easily picked up by a die bonder facility.
- a method in which such an adhesive sheet is added in advance to the shape of a wafer constituting a semiconductor element is known (for example, Patent Documents 5 and 6).
- Such pre-cut processing is a method in which the resin layer is punched in accordance with the shape of the wafer to be used, and the resin layer other than the part to which the wafer is attached is peeled off.
- a laminated adhesive sheet is generally a film.
- the adhesive layer is pre-cut according to the wafer shape, and this and the dicing tape are bonded together, and then this dicing tape is subjected to pre-cut processing according to the weno and ring shape, It is manufactured by bonding a dicing tape pre-cut into a ring shape with a pre-cut film adhesive.
- a single-layer type adhesive sheet generally forms a resin layer (hereinafter referred to as "adhesive layer") having both functions of an adhesive layer and an adhesive layer on a release substrate,
- This adhesive layer is prepared by a method such as pre-cut processing, removing unnecessary portions of the resin layer, and then bonding to the base film.
- Patent Document 1 Japanese Patent No. 3348923
- Patent Document 2 Japanese Patent Laid-Open No. 10-335271
- Patent Document 3 Japanese Patent No. 2678655
- Patent Document 4 Japanese Patent Publication No. 7-15087
- Patent Document 5 Actual Fairness 6-18383
- Patent Document 6 Registered Utility Model No. 3021645
- FIG. 14 is a series of process diagrams for performing precut processing on a single-layer type adhesive sheet.
- an adhesive sheet before pre-cutting is prepared by laminating a peeling substrate 10 and an adhesive film (dicing tape) 20 composed of an adhesive layer 12 and a substrate film 14.
- the precut blade C corresponding to the desired shape is entered from the surface F14 of the base film 14 until it reaches the release base material 10 to perform a cutting operation ((b) in FIG. 14). Thereafter, unnecessary portions of the adhesive layer 12 and the base film 14 are removed to complete the precut process ((c) in FIG. 14).
- the pre-cut processing is performed in the same manner as described above except that the adhesive layer 12 is an adhesive layer and an adhesive layer.
- the adhesive layer 12 is an adhesive layer and an adhesive layer.
- the adhesive layer 12 is cut into the release substrate 10 as shown in FIG.
- the present inventors have found that the interface between the release substrate 10 and the adhesive layer 12 is sealed in the part E and is sealed. Furthermore, the present inventors have found that when the adhesive sheet is to be laminated on the wafer in this state, it becomes difficult to peel off the adhesive layer 12 from the peeling substrate 10 and a peeling failure is likely to occur. .
- the pre-cutting of the adhesive film is performed by, for example, the method shown in FIG.
- FIG. 24 is a series of process diagrams for performing precut processing on a laminated adhesive sheet.
- a film-like adhesive composed of a peeling substrate 212 and an adhesive layer 214 and a dicing tape composed of a substrate film 224 and an adhesive layer 222 are bonded together to form an adhesive sheet before pre-cutting.
- the pre-cut blade C corresponding to the desired shape is entered from the surface F24 of the base film 224 until it reaches the release base 212, and the cutting operation is performed ((b) in FIG. 24).
- unnecessary portions of the adhesive layer 214, the pressure-sensitive adhesive layer 222, and the release film 224 are removed to complete the precut processing ((c) in FIG.
- pre-cut processing is performed in the same manner as described above except that an adhesive layer having both functions is used instead of the adhesive layer 214 and the adhesive layer 222. .
- the precut blade C does not reach the peeling substrate 212 at the time of the above precutting, the cutting process becomes insufficient, and a problem arises in which a necessary part is also peeled off during an unnecessary part peeling operation.
- the amount of advance of the precut blade C was set deeper than the interface between the adhesive layer 214 and the peeling substrate 212.
- the adhesive layer 214 and the adhesive layer 222 are separated from the release substrate 212.
- the present inventors have found that the interface between the peeling base material 212 and the adhesive layer 214 is sealed by being cut into the cut portion F. Furthermore, let's laminate the adhesive sheet on the wafer in this state In this case, the present inventors have found that it is difficult to peel the adhesive layer 214 from the peeling substrate 212, and a peeling failure is likely to occur.
- the present invention has been made in view of the above-described problems of the prior art, and has been subjected to pre-cut calorie, and peeling of a laminate including an adhesive layer and a substrate film from a peeling substrate.
- Adhesive sheet capable of sufficiently suppressing defects or poor peeling of a laminate including an adhesive layer, a pressure-sensitive adhesive layer, and a base film, a method for manufacturing the same, a method for manufacturing a semiconductor device using the adhesive sheet, and
- An object is to provide a semiconductor device.
- the present invention includes a release substrate, a substrate film, and a first adhesive layer disposed between the release substrate and the substrate film.
- a cut portion is formed in an annular shape from the surface on the first adhesive layer side in the release substrate, and the first adhesive layer is formed on the release substrate. It is laminated so as to cover the entire inner surface of the cut portion, and the cut depth of the cut portion is less than the thickness of the peeling substrate and is 25 m or less.
- the depth of cut in the present invention is determined by arbitrarily measuring the depth in the thickness direction of the peeling substrate at the cut portion formed in the peeling substrate by cross-sectional observation using an electron microscope. Mean average value.
- Such an adhesive sheet is an adhesive sheet to which the above-described precut force is applied.
- an adhesive sheet it is possible to sufficiently suppress the first adhesive layer from being squeezed into the cut portion when the cut depth of the cut portion in the release substrate is within the above range. . Therefore, the interface between the release substrate and the first adhesive layer is not sealed, and the first adhesive layer and substrate film from the release substrate can be easily peeled off, resulting in poor release. Can be sufficiently suppressed.
- the thickness of the release substrate is a (m) and the cut depth of the cut portion is ⁇ ( ⁇ m). It is preferable that the condition of 1) is satisfied.
- the first adhesive layer is a plane that matches a planar shape of an adherend to which the first adhesive layer is to be attached after the release substrate is peeled off. It is preferred to have a shape! / ,!
- Examples of the adherend include a semiconductor wafer.
- the first adhesive layer having a planar shape that matches the planar shape of the semiconductor wafer tends to facilitate the process of dicing the semiconductor wafer.
- the planar shape of the first adhesive layer does not need to completely match the planar shape of the semiconductor wafer.
- the planar shape of the semiconductor wafer may be similar to the planar shape of the semiconductor wafer. It may be slightly larger than the area.
- the first adhesive layer is formed on the substrate and the substrate film to which the first adhesive layer is to be attached after the release substrate is peeled off.
- the first adhesive layer has a lower adhesive force to the substrate film due to irradiation with high energy rays.
- the adhesive sheet further includes a second adhesive layer disposed between at least a part of the peripheral edge of the first adhesive layer and the release substrate. preferable.
- the second adhesive layer is affixed to the wafer ring used when dicing the semiconductor wafer, and the first adhesive layer Can be prevented from being applied directly to the wafer ring.
- the adhesive strength of the first adhesive layer is easily It is necessary to adjust the adhesive strength to such a low level that it can be peeled.
- the second adhesive layer By adhering the second adhesive layer to the wafer ring, such adjustment of the adhesive force becomes unnecessary. Therefore, the first adhesive layer should have a sufficiently high adhesive strength, and the second adhesive layer should have an adhesive strength that is low enough to easily peel off the wafer ring.
- the semiconductor wafer dicing operation and the subsequent wafer ring peeling operation can be performed more efficiently. Furthermore, since the adhesive strength of the second adhesive layer can be adjusted sufficiently low, it becomes easier to create a separation starting point between the release substrate and the second adhesive layer, and from the release substrate. The second adhesive layer, the first adhesive layer, and the base film can be easily peeled, and the occurrence of defective peeling can be more sufficiently suppressed.
- the second adhesive layer is attached to the adherend to which the second adhesive layer is to be attached and the first adhesive layer after the release substrate is peeled off. It is preferable to have adhesiveness at room temperature.
- the adhesive sheet further includes an intermediate layer disposed between at least a part of the peripheral edge portion of the first adhesive layer and the second adhesive layer. preferable.
- the degree of freedom in selecting the material of the second adhesive layer can be increased.
- the degree of freedom in selecting the material of the second adhesive layer can be increased. For example, when manufacturing an adhesive sheet having a second adhesive layer, it is necessary to pre-cut the second adhesive layer after laminating the second adhesive layer on the release substrate. is there. An inexpensive and readily available adhesive layer may be difficult to cleanly remove from a release substrate that itself lacks self-supporting properties.
- an intermediate layer on the second adhesive layer it is possible to easily remove the second adhesive layer together with this intermediate layer during precutting, and work efficiency can be improved.
- the degree of freedom in selecting the material for the second adhesive layer can be increased.
- the second adhesive layer, the first adhesive layer, and the base film can be easily peeled off, and the occurrence of poor peeling can be more sufficiently suppressed.
- the present invention provides a method for producing an adhesive sheet comprising a release substrate, a substrate film, and a first adhesive layer disposed between the release substrate and the substrate film.
- After the first laminating step cut from the surface of the base film opposite to the first adhesive layer side and the opposite side until reaching the release substrate, and cut into the release substrate.
- a first cutting step in which the part is formed in an annular shape, and in the first cutting step, the cut depth of the cut portion is less than the thickness of the release substrate, and
- notching so that it may become is provided.
- the present invention also provides a release substrate, a substrate film, a first adhesive layer disposed between the release substrate and the substrate film, and the release substrate and the first film. It is a manufacturing method of an adhesive sheet provided with the 2nd adhesive layer arrange
- a method for producing an adhesive sheet is provided, characterized in that incisions are made so that
- the present invention further provides a release substrate, a substrate film, a first adhesive layer disposed between the release substrate and the substrate film, the release substrate and the first viscosity.
- Adhesion comprising a second adhesive layer disposed between the adhesive layer and an intermediate layer disposed between the first adhesive layer and the second adhesive layer
- a method for producing a sheet comprising: a fourth lamination step of partially laminating the second adhesive layer and the intermediate layer on the release substrate; and the release substrate and the intermediate layer.
- the present invention provides a method for producing an adhesive sheet, characterized in that a cut is made so that the cut depth of the cut portion is less than the thickness of the release substrate and is 25 m or less.
- the thickness of the release substrate is am
- the depth of cut of the cut portion is d (m)
- the value of (dZa) is expressed by the following formula: It is preferable to make a cut to satisfy the condition of (1).
- the present invention provides a first laminate obtained by peeling the release substrate from the adhesive sheet of the invention to obtain a first laminate comprising the base film and the first adhesive layer.
- a method of manufacturing a semiconductor device comprising: a pickup step; and a first bonding step of bonding the semiconductor element to a support member for mounting a semiconductor element through the first adhesive layer. I will provide a.
- a second substrate comprising the substrate film, the first adhesive layer, and the second adhesive layer is peeled off from the adhesive sheet of the present invention.
- a second peeling step a second adhesive step in which the first adhesive layer in the second laminate is attached to a semiconductor wafer, and the second adhesive layer is attached to a wafer ring.
- Bonding step a second dicing step for obtaining a semiconductor element to which the first adhesive layer is attached by dicing the semiconductor wafer and the first adhesive layer, and the first Adhesive
- a method of manufacturing a semiconductor device comprising: a bonding step.
- the present invention further includes separating the release substrate from the adhesive sheet of the present invention to form the substrate film, the first adhesive layer, the intermediate layer, and the second adhesive layer.
- a third pasting step for pasting, and a third dicing step for obtaining a semiconductor element to which the first adhesive layer is adhered by dicing the semiconductor wafer and the first adhesive layer
- a third pick-up step for picking up the semiconductor element to which the first adhesive layer is attached, and picking up the semiconductor element via the first adhesive layer;
- a third bonding step for bonding to the support member A method for manufacturing a semiconductor device is provided.
- the present invention further provides a semiconductor device manufactured by the method for manufacturing a semiconductor device of the present invention.
- the present invention is an adhesive sheet having a configuration in which a release substrate, an adhesive layer, an adhesive layer, and a substrate film are sequentially laminated, and the adhesive layer has a predetermined first planar shape. And partly formed on the release substrate.
- the release substrate has a first surface from the surface in contact with the adhesive layer along the periphery of the first flat surface.
- An adhesive sheet is provided, wherein a cut depth of the first cut portion is less than a thickness of the release substrate and is 25 m or less. .
- the depth of cut in the present invention is determined by arbitrarily measuring the depth in the thickness direction of the release substrate at the cut portion formed in the release substrate by cross-sectional observation using an electron microscope. Mean average value.
- the adhesive sheet is an adhesive sheet to which the above-described precut force is applied. In such an adhesive sheet, when the cut depth of the first cut portion in the release substrate is in the above range, the adhesive layer and the adhesive layer are sufficiently suppressed from being swallowed into the first cut portion. can do. Therefore, the interface between the peeling substrate and the adhesive layer is not sealed, and the peeling of the adhesive layer, the pressure-sensitive adhesive layer, and the substrate film from the peeling substrate is facilitated, and the occurrence of defective peeling can be sufficiently suppressed. it can.
- the thickness of the release substrate is am
- the depth of cut of the first cut portion is dl ( ⁇ m)
- the value of (dlZa) is expressed by the following formula (2) It is preferable that the above conditions are satisfied!
- the pressure-sensitive adhesive layer is laminated so as to cover the adhesive layer and to be in contact with the release substrate around the adhesive layer.
- the adhesive layer and the substrate film have a predetermined second planar shape and are partially formed on the release substrate over the adhesive sheet on which the adhesive layer is laminated.
- the release substrate is formed with a second cut portion on the side in contact with the adhesive layer along the peripheral edge of the second planar shape, and the second cut portion.
- the cutting depth is preferably less than the thickness of the release substrate and not more than 25 m.
- the adhesive sheet has a pre-cut force applied to the adhesive layer, and separately separates the adhesive layer and the substrate film laminated so as to cover the adhesive layer. Processing has been applied.
- a strong adhesive sheet it is possible to sufficiently suppress the adhesive layer from being squeezed into the second cut portion by making the cut depth of the second cut portion in the release substrate within the above range. it can. For this reason, the adhesive layer and the base film from the peeling base material can be easily peeled off without the interface between the peeling base material and the pressure sensitive adhesive layer being sealed, and the occurrence of defective peeling can be sufficiently suppressed.
- the thickness of the release substrate is am
- the depth of the second notch is d2 ( ⁇ m)
- the value of (d2Za) is expressed by the following formula (3) Meet the conditions! / It is preferable.
- the adhesive layer can be more sufficiently suppressed from being squeezed into the second cut portion, and the occurrence of peeling failure can be more sufficiently suppressed.
- the adhesive layer preferably has a planar shape that matches the planar shape of the adherend to which the adhesive layer is to be attached after the release substrate is peeled off. .
- Examples of the adherend include a semiconductor wafer. Since the adhesive layer has a planar shape that matches the planar shape of the semiconductor wafer, the process of dicing the semiconductor wafer tends to be facilitated. Note that the planar shape of the adhesive layer does not need to completely match the planar shape of the semiconductor wafer. For example, the planar shape may be slightly larger than the planar shape of the semiconductor wafer.
- the adhesive layer preferably has an adhesive force at room temperature to the adherend to which the adhesive layer is to be attached and the adhesive layer after the release substrate is peeled off.
- the pressure-sensitive adhesive layer has a lower pressure-sensitive adhesive force with respect to the adhesive layer when irradiated with high energy rays.
- peeling when peeling the adhesive layer and the pressure-sensitive adhesive layer, peeling can be easily performed by irradiating with high energy rays such as radiation.
- the present invention is also a method for producing an adhesive sheet having a structure in which a release substrate, an adhesive layer, a pressure-sensitive adhesive layer, and a substrate film are sequentially laminated, the adhesive layer, A first laminating step of sequentially laminating the pressure-sensitive adhesive layer and the base film, and cutting from the surface of the base film opposite to the side in contact with the pressure-sensitive adhesive layer until reaching the release base, and the adhesive layer
- the adhesive layer and the substrate film are cut into a predetermined planar shape.
- a first cutting step for forming a first cut portion in the release substrate, and in the first cutting step, a cutting depth force of the first cut portion of the release substrate Provided is a method for producing an adhesive sheet, characterized in that a cut is made so that the thickness is less than 25 m or less.
- the thickness of the release substrate is a (m)
- the depth of cut of the first cut portion is dl ( ⁇ m)
- the value of (dlZa) is It is preferable to make a notch so as to satisfy the condition of the following formula (2).
- the present invention further relates to a method for producing an adhesive sheet having a structure in which a release substrate, an adhesive layer, an adhesive layer and a substrate film are sequentially laminated, wherein the adhesive layer is formed on the release substrate.
- a second laminating step for laminating and cutting from the surface of the adhesive layer opposite to the side in contact with the release substrate until the release substrate is reached, so that the adhesive layer has a predetermined first planar shape.
- a method for producing an adhesive sheet is provided.
- the thickness of the release substrate is a (m), and the first It is preferable to make a cut so that the value of (dlZa) satisfies the condition of the following formula (2), where the cut depth of the cut portion is dl ( ⁇ m).
- the pressure-sensitive adhesive layer covers the adhesive layer and contacts the release substrate around the adhesive layer.
- the adhesive layer and the base film are laminated, the surface force on the side opposite to the side in contact with the adhesive layer of the base film is cut until reaching the release base, and the base film and the adhesive
- the method further includes a third cutting step of cutting the layer into a predetermined second planar shape and forming a second cut portion in the release substrate, wherein the second cut is performed in the third cutting step. Incision depth force of the part It is preferable to make an incision so that it is less than the thickness of the release substrate and is 25 m or less.
- the cut depth of the second cut portion formed on the release substrate by pre-cut processing is set to be in the above range, so that the obtained contact is obtained.
- the landing sheet can sufficiently suppress the occurrence of peeling failure.
- the thickness of the release substrate is am), and the cutting depth of the second cutting portion is d2 ( ⁇ m), and the value of (d2Za) It is preferable to make a cut so that satisfies the condition of the following formula (3).
- the present invention also provides the adhesive sheet of the present invention, wherein a laminate comprising the adhesive layer, the pressure-sensitive adhesive layer and the base film is peeled off from the release substrate, and the laminate is attached to the adhesive layer.
- Bonding step to obtain a semiconductor wafer with a laminated body by attaching to the semiconductor wafer
- dicing step to obtain a semiconductor element with a laminated body of a predetermined size by dicing the semiconductor wafer with the laminated body, and the laminated body
- the adhesive layer is irradiated with high energy rays to reduce the adhesive force of the adhesive layer to the adhesive layer, and then the adhesive layer and A peeling process for peeling the base film from the adhesive layer to obtain a semiconductor element with an adhesive layer, and an adhesion for bonding the semiconductor element with an adhesive layer to a supporting member for mounting a semiconductor element via the adhesive layer And a process for manufacturing a semiconductor device.
- the adhesive sheet of the present invention is used in the manufacturing process, the occurrence of defective peeling in the manufacturing process is sufficiently suppressed, and the semiconductor device is manufactured efficiently and reliably. be able to.
- the present invention further provides a semiconductor device manufactured by the method for manufacturing a semiconductor device of the present invention.
- the laminate including the adhesive layer and the base film from the release substrate is poorly peeled, or includes the adhesive layer, the adhesive layer, and the base film. It is possible to provide an adhesive sheet capable of sufficiently suppressing the peeling failure of the laminate and a method for manufacturing the same, and a semiconductor device manufacturing method and a semiconductor device using the adhesive sheet.
- FIG. 1 is a plan view showing a first embodiment of the adhesive sheet of the present invention.
- FIG. 2 is a schematic cross-sectional view when the adhesive sheet 1 shown in FIG. 1 is cut along the line A1-A1 in FIG.
- FIG. 3 shows the first laminate 20 and the semiconductor wafer 32 in the adhesive sheet and the Ueno ring.
- FIG. 34 is a schematic cross-sectional view showing a state where 34 is bonded.
- FIG. 4 is a plan view showing a second embodiment of the adhesive sheet of the present invention.
- FIG. 5 is a schematic cross-sectional view when the adhesive sheet 2 shown in FIG. 4 is cut along the line A2-A2 in FIG.
- FIG. 6 is a plan view showing a third embodiment of the adhesive sheet of the present invention.
- FIG. 7 is a schematic cross-sectional view when the adhesive sheet 3 shown in FIG. 6 is cut along line A3-A3 in FIG.
- FIG. 8 is a series of process diagrams for manufacturing the adhesive sheet 1.
- FIG. 9 is a series of process diagrams for manufacturing the adhesive sheet 2.
- FIG. 10 is a series of process diagrams for manufacturing the adhesive sheet 3.
- FIG. 11 is a series of process charts for performing an operation of attaching the second stacked body 20 to the semiconductor wafer 32.
- FIG. 12 is a series of process diagrams for dicing the semiconductor wafer 32.
- FIG. 12 is a series of process diagrams for dicing the semiconductor wafer 32.
- FIG. 13 is a schematic cross-sectional view showing one embodiment of a semiconductor element of the present invention.
- FIG. 14 is a series of process charts for pre-cutting force on a single-layer type adhesive sheet.
- FIG. 15 is a schematic cross-sectional view enlarging the vicinity of a cut portion E formed in the release substrate 10 by a conventional precut process.
- FIG. 16 is a plan view showing a seventh embodiment of the adhesive sheet of the present invention.
- FIG. 17 is a schematic cross-sectional view when the adhesive sheet 201 shown in FIG. 16 is cut along the Al l—Al l line of FIG.
- FIG. 18 is a plan view showing an eighth embodiment of the adhesive sheet of the present invention.
- FIG. 19 is a schematic cross-sectional view when the adhesive sheet 202 shown in FIG. 18 is cut along the line A12-A12 of FIG.
- FIG. 20 is a plan view showing a ninth embodiment of the adhesive sheet of the present invention.
- FIG. 21 is a schematic cross-sectional view when the adhesive sheet 203 shown in FIG. 20 is cut along line A13-A13 in FIG.
- FIG. 22 is a series of process diagrams in which the operation of attaching the laminate 210 to the semiconductor wafer 32 is performed.
- FIG. 23 is a schematic cross-sectional view showing one embodiment of a semiconductor element of the present invention.
- FIG. 24 is a series of process diagrams for performing precut processing on a laminated adhesive sheet.
- FIG. 25 is a schematic cross-sectional view enlarging the vicinity of a cut portion F formed in the peeling substrate 212 by a conventional pre-cut process.
- Second laminate 24 the third stack, 32, semiconductor Ueno, 33, 72, semiconductor element, 34, wafer ring, 36, stage, 42, 242 '.' First Roll, 44 ⁇ 'Core, 52, 252 ⁇ ⁇ ⁇ Second roll, 54 ⁇ ' Core, 62, 68 ⁇ Roll, 70 ⁇ ⁇ ⁇ Organic substrate, 71 ⁇ ⁇ Supporting member, 74 ⁇ Circuit pattern, 76 ⁇ ⁇ ⁇ Terminal, 78 ⁇ ⁇ 'Wire bond, 80 ⁇ ⁇ ' Encapsulant, 210 ⁇ ⁇ ⁇ Laminate, 214 ⁇ ⁇ ⁇ Adhesive layer, 220 ⁇ ⁇ 'Adhesive film, 222 ⁇ Adhesive layer.
- FIG. 1 is a plan view showing a first embodiment of the adhesive sheet of the present invention
- FIG. 2 is a schematic cross-section when the adhesive sheet 1 shown in FIG. 1 is cut along the line A1-A1 in FIG. FIG.
- the adhesive sheet 1 has a configuration in which a release substrate 10, a first adhesive layer 12, and a substrate film 14 are sequentially laminated.
- the first laminated body 20 including the first adhesive layer 12 and the base film 14 is cut into a predetermined planar shape and is partially laminated on the release substrate 10.
- the peeling substrate 10 has a surface force on the first adhesive layer 12 side cut along the thickness direction of the peeling substrate 10 along the flat peripheral edge of the first laminate 20. Is formed in a ring shape.
- the first laminated body 20 is laminated so as to cover the entire inner surface of the cut portion D in the peeling substrate 10.
- the predetermined planar shape of the first laminate 20 is not particularly limited as long as the first laminate 20 is partially laminated on the peeling substrate 10.
- the predetermined planar shape of the first laminated body 20 is preferably a planar shape that matches the planar shape of an adherend such as a semiconductor wafer.
- a circle or a wafer shape is preferable in order to reduce a waste portion other than the semiconductor wafer mounting portion.
- the release substrate 10 is peeled from the adhesive sheet 1, the wafer ring 34 is attached to the first adhesive layer 12, and the semiconductor wafer 32 is attached to the inside thereof.
- the wafer ring 34 has a circular or square frame.
- the first laminate 20 in the adhesive sheet 1 further has a planar shape that matches the wafer ring 34! / I like to talk ⁇ .
- the first adhesive layer 12 can sufficiently fix an adherend such as a semiconductor wafer or a wafer ring at room temperature (25 ° C), and can also be attached to a wafer or a ring. On the other hand, it is preferable to have such a degree of adhesiveness that it can be peeled off after dicing.
- the cut depth d of the cut portion D formed in the release substrate 10 is less than the thickness of the release substrate 10 and is 25 m or less. .
- the release substrate 10 serves as a carrier film when the adhesive sheet 1 is used.
- strong release substrates 10 include polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyvinyl acetate films such as polyolefin films, polychlorinated films, and the like.
- Plastic films such as a bull film and a polyimide film can be used. Paper, non-woven fabric, metal foil and the like can also be used.
- the surface of the release substrate 10 on the first adhesive layer 12 side is surface-treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. It is preferable to meet.
- a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. It is preferable to meet.
- the thickness of the release substrate 10 can be appropriately selected as long as the workability during use is not impaired.
- the thickness of the release substrate 10 is preferably 10 to 500 m, more preferably 25 to: more preferably LOO m, and particularly preferably 30 to 50 ⁇ m.
- the first adhesive layer 12 includes, for example, a thermoplastic component, a thermopolymerizable component, and a radiation polymerizable component. Minutes and the like can be included. By setting it as the composition containing such a component, the 1st adhesive layer 12 can be given the characteristic which hardens
- a radiation for example, ultraviolet light
- a component that is polymerized by a high energy beam other than radiation for example, an electron beam
- the first adhesive layer 12 is attached to an adherend such as a semiconductor wafer, and then dicing is performed. Picking up can be facilitated by irradiating with light before carrying out to improve the adhesive strength during dicing, or conversely after dicing and irradiating with light to reduce the adhesive strength.
- a radiation-polymerizable component a compound that has been conventionally used for a radiation-polymerizable dicing sheet can be used without any particular limitation.
- the first adhesive layer 12 is cured by heat when the semiconductor element is mounted on a support member on which the semiconductor element is mounted, heat when passing through the solder reflow, or the like.
- the reliability of the semiconductor device can be improved.
- the thermoplastic component used in the first adhesive layer 12 may be a resin having thermoplasticity, or a resin having thermoplasticity at least in an uncured state and forming a crosslinked structure after heating.
- Tg glass transition temperature
- Tg is- Those having a temperature of 50 to 10 ° C. and a weight average molecular weight of 10,000 to 100,000 are preferably used.
- thermoplastic resin of the above (1) examples include polyimide resin, polyamide resin, polyesterimide resin, polyamideimide resin, polyester resin, polyesterimide resin, phenoxy resin, Examples thereof include polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, and polyether ketone resin. Among these, it is preferable to use polyimide resin. Further, as the thermoplastic resin (2), it is preferable to use a polymer containing a functional monomer.
- thermoplastic resins one preferable example is polyimide resin.
- a powerful polyimide resin for example, tetracarboxylic dianhydride and diamine It can be obtained by a condensation reaction by a method. That is, equimolar or nearly equimolar amounts of tetracarboxylic dianhydride and diamine are used in an organic solvent (the order of addition of each component is arbitrary), and the reaction temperature is 80 ° C or lower, preferably 0 to 60 ° C. React. As the reaction proceeds, the viscosity of the reaction solution gradually increases, and polyamic acid, which is a polyimide precursor, is produced.
- thermoplastic resins a polymer containing a functional monomer may be mentioned.
- the functional group in the strong polymer include a glycidyl group, an attalyloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, and an amide group, and among them, a glycidyl group is preferable. More specifically, a glycidyl group-containing (meth) acrylic copolymer containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate is preferred, and a thermosetting resin such as epoxy resin. Preferred to be incompatible with.
- the polymer containing the functional monomer having a weight average molecular weight of 100,000 or more includes, for example, a functional monomer such as glycidyl atylate or glycidyl metatalylate, and Examples thereof include glycidyl group-containing (meth) acrylic copolymers having a weight average molecular weight of 100,000 or more. Among them, those that are incompatible with epoxy resin are preferable.
- the glycidyl group-containing (meth) acrylic copolymer for example, (meth) acrylic ester copolymer, acrylic rubber and the like can be used, and acrylic rubber is more preferable.
- the acrylic rubber is a rubber mainly composed of an acrylate ester, mainly a copolymer such as butyl acrylate and alicyclic nitrile, or a copolymer such as ethyl acrylate and acrylonitrile.
- the functional monomer is a monomer having a functional group, and it is preferable to use glycidyl atylate or glycidyl metatalylate as such a monomer.
- glycidyl group-containing (meth) acrylic copolymer having a weight average molecular weight of 100,000 or more include HTR-860P-3 (trade name) manufactured by Nagase ChemteX Corporation.
- Monomers containing epoxy resin such as glycidyl acrylate or glycidyl methacrylate The amount of the mer unit is preferably 0.5 to 50% by weight based on the total amount of the monomer in order to cure by heating and effectively form a network structure. In addition, 0.5 to 6.0% by weight is preferable, and 0.5 to 5.0% by weight is more preferable from the viewpoint of ensuring adhesive strength and preventing gelling. It is particularly preferably 0.8 to 5.0% by weight.
- Examples of the above functional monomers other than glycidyl acrylate and glycidyl methacrylate include ethyl (meth) acrylate and butyl (meth) acrylate, and these may be used alone or in combination of two or more. Can be used.
- ethyl (meth) acrylate refers to ethyl acrylate or ethyl methacrylate.
- the mixing ratio is determined in consideration of the Tg of the glycidyl group-containing (meth) acrylic copolymer, and the Tg is preferably set to ⁇ 10 ° C. or higher. When Tg is ⁇ 10 ° C. or higher, the tackiness of the adhesive layer in the B-stage state is appropriate, and the handleability tends to be good.
- the polymerization method is not particularly limited, for example, pearl polymerization, solution polymerization, etc. Can be used.
- the weight average molecular weight of the high molecular weight component containing the functional monomer is 100,000 or more, preferably 300,000 to 3,000,000, more preferably 500,000 to 2,000,000. When the weight average molecular weight is within this range, the strength, flexibility, and tackiness of a sheet or film are appropriate, and the flowability is appropriate. Tends to be secured.
- the weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.
- the amount of the high molecular weight component containing a functional monomer and having a weight average molecular weight of 100,000 or more is preferably 10 to 400 parts by weight with respect to 100 parts by weight of the thermally polymerizable component. Within this range, storage elastic modulus and flowability during molding can be ensured, and handling at high temperatures tends to be good.
- the amount of the high molecular weight component used is particularly preferably 20 to 300 parts by weight, more preferably 15 to 350 parts by weight with respect to 100 parts by weight of the thermally polymerizable component.
- the thermopolymerizable component used in the first adhesive layer 12 is not particularly limited as long as it is polymerized by heat.
- thermosetting resin that is cured by heat and exerts an adhesive action.
- thermosetting resin examples include epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, urea resin, and the like.
- epoxy resin it is preferable to use epoxy resin because an adhesive sheet excellent in heat resistance, workability and reliability can be obtained.
- the epoxy resin is not particularly limited as long as it is cured and has an adhesive action! ⁇ .
- epoxy resin for example, bifunctional epoxy resin such as bisphenol A type epoxy, novolac type epoxy resin such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, etc. should be used. Can do. Also, generally known ones such as polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic ring-containing epoxy resins or alicyclic epoxy resins can be used.
- the bisphenol A type epoxy resin includes the Epoxy Coat series manufactured by Japan Epoxy Resin Co., Ltd. (Epico ⁇ 807, Epicote 815, Epicote 825, Epicote 827, Epicote 828, Epicote 834, Epicote 1001, Epicote 1004, Epicourt 1007, Epico 1009), DER-330, DER-301, DER-361 manufactured by Dow Chemical Company, YD8125, YDF8170 manufactured by Tohto Kasei Co., Ltd., and the like.
- Epoxy Coat series manufactured by Japan Epoxy Resin Co., Ltd. (Epico ⁇ 807, Epicote 815, Epicote 825, Epicote 827, Epicote 828, Epicote 834, Epicote 1001, Epicote 1004, Epicourt 1007, Epico 1009), DER-330, DER-301, DER-361 manufactured by Dow Chemical Company, YD8125, YDF8170 manufactured by Tohto Kasei Co.,
- Phenolic novolac type epoxy resins include Epicoat 152 and Epicoat 154 manufactured by Japan Epoxy Resin Co., Ltd., EPPN-201 manufactured by Nippon Kayaku Co., Ltd., DEN-438 Isobaru manufactured by Dow Chemical Co., Ltd., and o-Crezo As a one-novolak type epoxy resin, EOCN-102S, EOCN-103S, EOCN-104S, EOC N-1012, EOCN-1025, EOCN-1027 made by Nippon Kayaku Co., Ltd., YDCN70 1 YDCN702, YDCN703, YDCN704 etc.
- Epon 1031 manufactured by Japan Epoxy Resin Co., Ltd. S
- VALALDITE 0163 manufactured by Ciba Specialty Chemicals
- Denacol manufactured by Nagase ChemteX Corporation EX—611, EX—614, EX—614B, EX—622, EX—512, EX—521, EX—421, EX-411, EX-321 and so on.
- Epoxy Coat 604 manufactured by Japan Epoxy Resin Co., Ltd., YH-434 manufactured by Toto Kasei Co., Ltd., TETRAD-X and TETRAD-C manufactured by Mitsubishi Gas Chemical Co., Ltd., Sumitomo ELM-120 manufactured by Gaku Inc.
- heterocyclic ring-containing epoxy resin examples include Araldite PT810 manufactured by Ciba Specialty Chemicals, ERL4234, ERL4299, ERL4221, and ERL4206 manufactured by UCC. These epoxy resins can be used alone or in combination of two or more.
- an epoxy resin hardener When using epoxy resin, it is preferable to use an epoxy resin hardener.
- the epoxy resin hardener known hardeners that are usually used can be used. For example, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, dicyandiamide, bisphenol A, Bisphenols such as bisphenol F, bisphenol S, bisphenols having 2 or more phenolic hydroxyl groups in one molecule, phenol novolac resin, bisphenol A novolac resin and cresol novolac resin. And so on.
- phenolic resin such as phenol novolac resin, bisphenol A novolac resin and cresol novolac resin is preferable in terms of excellent electric corrosion resistance at the time of moisture absorption.
- the epoxy resin curing agent includes V, a so-called curing accelerator, which acts as a catalyst on the epoxy group to promote crosslinking.
- Preferred examples of the above-mentioned phenol succinic hardener include, for example, Dainippon Ink Chemical Co., Ltd., trade names: Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH—4150, Phenolite VH4170, manufactured by Meiwa Kasei Co., Ltd., trade name: H—1, manufactured by Japan Epoxy Resin Co., Ltd., trade name: Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65 and Mitsui Chemicals, Inc., trade name: Mirex XL, Mirex XLC, Mirex RN, Mirex RS, Mirex VR and so on.
- the radiation-polymerizable component used for the first adhesive layer 12 is not particularly limited.
- the first adhesive layer 12 has a photopolymerization initiator.
- photopolymerization initiators include benzophenone, ⁇ , ⁇ , monotetramethyl-1,4,4, 1-daminobenzophenone (Michler's ketone), ⁇ ⁇ , ⁇ , -tetraethyl-4,4'-diaminobenzophenone, 4-methoxy.
- the first adhesive layer 12 may contain a photoinitiator that generates a base and a radical upon irradiation.
- a photoinitiator that generates a base and a radical upon irradiation.
- radicals are generated by photoirradiation before or after dicing, and the photocuring component is cured, and a base that is a curing agent for the thermosetting resin is generated in the system. Since the thermosetting reaction of the 1 adhesive layer 12 can be efficiently performed, it is not necessary to add initiators for the photoreaction and the thermosetting reaction.
- Photoinitiators that generate bases and radicals upon such irradiation are, for example, 2-methyl-1 (4 (methylthio) ferro 2 morpholinopropan 1-one (Ciba Specialty Chemicals, Irgacure 907).
- the amount of epoxy resin used is increased or an epoxy resin having a high glycidyl group concentration is used. Any method can be used when the crosslink density of the whole polymer is increased by using a fat or a phenolic resin having a high hydroxyl group concentration, or by adding a filler.
- the first adhesive layer 12 has a flexible layer for the purpose of improving the reflow crack resistance. It is possible to add a high molecular weight resin having compatibility with the thermopolymerizable component.
- a high molecular weight resin is not particularly limited, and examples thereof include phenoxy resin, a high molecular weight thermopolymerizable component, and an ultrahigh molecular weight thermopolymerizable component. These can be used alone or in combination of two or more.
- the amount of the high molecular weight resin compatible with the thermally polymerizable component is preferably 40 parts by weight or less with respect to 100 parts by weight of the total amount of the thermally polymerizable component. Within this range, the Tg of the thermopolymerizable component layer tends to be secured.
- an inorganic filler may be added to the first adhesive layer 12 for the purpose of improving the handleability, improving the thermal conductivity, adjusting the melt viscosity, and imparting thixotropic properties.
- the inorganic filler include, but are not limited to, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, acid Examples thereof include aluminum, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, and amorphous silica, and the shape of the filler is not particularly limited. These fillers can be used alone or in combination of two or more.
- a compound that generates a base upon irradiation is a compound that generates a base upon irradiation, and the generated base increases the curing reaction rate of the thermosetting resin. Also called.
- a strongly basic compound is preferable from the viewpoint of reactivity and curing speed.
- the pKa value which is the logarithm of the acid dissociation constant, is used as a basic index, and a base having a pKa value of 7 or more in an aqueous solution is preferred, and a base of 9 or more is more preferred.
- the compound that generates a base by irradiation with radiation described above efficiently generates a base when a general light source that preferably uses a compound that generates a base by irradiation with light having a wavelength of 150 to 750 nm is used. More preferred is a compound that generates a base upon irradiation with light of 250 to 500 nm.
- Examples of such a compound that generates a base upon irradiation are imidazole derivatives such as imidazole, 2,4 dimethylimidazole, 1-methylimidazole, piperazine such as piperazine, 2,5 dimethylbiperazine, and the like.
- imidazole derivatives such as imidazole, 2,4 dimethylimidazole, 1-methylimidazole
- piperazine such as piperazine, 2,5 dimethylbiperazine, and the like.
- Razine derivatives piperidine, 1,2 dimethyl Piperidine derivatives such as piperidine, proline derivatives, trialkylamine derivatives such as trimethylamine, triethylamine, triethanolamine, 4-methylaminopyridine, 4-dimethylaminopyridine, etc.
- pyrrolidine derivatives substituted with alkylamino groups pyrrolidine derivatives such as pyrrolidine, n-methylpyrrolidine, alicyclic amines such as triethylenediamine, 1,8-diazabiscyclo (5, 4, 0) undecene l (DBU) Derivatives, benzylamine derivatives such as benzylmethylamine, benzyldimethylamine, and benzyljetylamine.
- the thickness of the first adhesive layer 12 does not affect the bonding operation to the semiconductor wafer and the dicing operation after bonding, while ensuring sufficient adhesion to the mounting substrate.
- a range is desirable.
- the thickness of the first adhesive layer 12 is preferably 1 to 300 / ⁇ ⁇ , more preferably 5 to 150 / ⁇ ⁇ , 10 to: LOO / zm It is particularly preferred that there is. If the thickness is less than 1 ⁇ m, it tends to be difficult to ensure sufficient die bond adhesion. When the thickness force exceeds 300 m, there is a tendency for problems such as effects on pasting and dicing operations to occur.
- the film used for the release base 10 or the same film as the sheet can be used.
- polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyolefin film such as polyvinyl acetate film, plastic such as polychlorinated bure film, polyimide film A film etc. are mentioned.
- the base film 14 may be laminated on these film strength layers or more.
- the thickness of the base film 14 is preferably 10 to 500 ⁇ m, 25 to: L00 ⁇ m, and more preferably 30 to 50 ⁇ m. preferable.
- the adhesive sheet 1 includes the release substrate 10, the first adhesive layer 12, and the substrate film 14 as described above.
- the release substrate 10 includes a first laminate 20 having a first laminate 20 composed of a first adhesive layer 12 and a substrate film 14 along the periphery of the planar shape.
- the cut surface D is also formed in the thickness direction of the release substrate 10 on the adhesive force of the adhesive layer 12 side.
- the cut depth d of the cut portion D is less than the thickness of the release substrate 10 and is 25 m or less.
- the cutting depth d is preferably 15 m or less, more preferably 10 m or less, and even more preferably 5 m or less. .
- the cutting depth d is preferably closer to 0 m, and most preferably larger than O / zm and 0.5 m or less.
- the adhesive sheet 1 can sufficiently suppress the first adhesive layer 12 from being swallowed into the cut portion D. . Therefore, the first laminate 20 can be easily peeled from the release substrate 10 without the interface between the release substrate 10 and the first adhesive layer 12 being sealed, and the first laminate It is possible to sufficiently suppress the occurrence of defective peeling when the body 20 is attached to the adherend.
- the cutting depth d is preferably 5 to 15 ⁇ m in terms of the balance between production efficiency and separation failure suppression.
- the adhesive sheet 1 has the thickness of the release substrate 10 as am) and the value of (dZa) satisfies the condition of the following formula (1).
- the upper limit of the value of (dZa) in the above formula (1) is more preferably 0.5, and still more preferably 0.3.
- a value of 0.25 is particularly preferred.
- a value of 0.15 is very particularly preferred, and a value of 0.1 is most preferred.
- the depth of cut d was measured by arbitrarily measuring the depth of the cut portion D formed in the release substrate 10 by cross-sectional observation using an electron microscope. Means the average value of From the standpoint of sufficiently suppressing the occurrence of peeling failure, it is preferable that all of the depths of the cut portions D measured arbitrarily at 10 points are within the above range.
- FIG. 4 is a plan view showing a second embodiment of the adhesive sheet of the present invention
- FIG. 5 is a schematic cross section when the adhesive sheet 2 shown in FIG. 4 is cut along the line A2-A2 in FIG. FIG.
- the adhesive sheet 2 includes a release substrate 10, a first adhesive layer 12, and a peripheral portion of the first adhesive layer 12 and the release substrate 10.
- the second adhesive layer 16 and the base film 14 are arranged on the substrate. Further, the first adhesive layer 12 and the base film 14 are cut into a predetermined planar shape and are partially laminated on the release base material 10.
- the second adhesive layer 16 is also cut into a predetermined planar shape, and is a second laminate comprising the base film 14, the first adhesive layer 12, and the second adhesive layer 16.
- the peeling substrate 10 has a surface force on the side of the first adhesive layer 12 and the second adhesive layer 16 in the thickness direction of the peeling substrate 10 along the planar shape of the second laminate 22.
- the notch D is formed in an annular shape.
- the cut depth d of the cut portion D formed in the release substrate 10 is less than the thickness of the release substrate 10 and is 25 m or less.
- the preferable ranges of the cutting depths d and (dZa) of the powerful cutting portion D are the same as the preferable ranges of the cutting depths d and (dZa) in the adhesive sheet 1 in the first embodiment.
- the second laminate 22 is peeled off from the release substrate 10, and the first adhesive layer 12 in the second laminate 22 is attached to the semiconductor wafer. Then, the second adhesive layer 16 is attached to the wafer ring.
- the release substrate 10 the first adhesive layer 12, and the substrate film 14 are the same as those described in the adhesive sheet 1 according to the first embodiment. be able to.
- the second adhesive layer 16 in the adhesive sheet 2 is formed, for example, containing acrylic, rubber-based, or silicone-based resin.
- the thickness of the second adhesive layer 16 that is covered is preferably 5 to 50 m.
- This second adhesive layer 16 is attached to the well and the ring between the peripheral edge of the first adhesive layer 12 and the release substrate 10, that is, when the adhesive sheet 2 is used. Be placed in a position Thus, it is possible to prevent the first adhesive layer 12 from being directly attached to the wafer and the ring.
- the adhesive strength of the first adhesive layer 12 is adjusted to such a low adhesive strength that the wafer ring force can be easily peeled off. Need arises.
- by adhering the second adhesive layer 16 to the well and the ring such adjustment of the adhesive force is not necessary.
- the first adhesive layer 12 should have a sufficiently high adhesive strength
- the second adhesive layer 16 should have an adhesive strength that is low enough to easily peel off the wafer ring.
- the adhesive strength of the second adhesive layer 16 can be adjusted sufficiently low, it becomes easier to create a separation starting point between the release substrate 10 and the second adhesive layer 16, and The second adhesive layer 16, the first adhesive layer 12 and the base film 14 from the material 10 can be easily peeled off, and the occurrence of poor peeling can be more sufficiently suppressed.
- FIG. 6 is a plan view showing a third embodiment of the adhesive sheet of the present invention
- FIG. 7 is a schematic cross section when the adhesive sheet 3 shown in FIG. 6 is cut along the line A3-A3 in FIG. FIG.
- the adhesive sheet 3 includes a release substrate 10, a first adhesive layer 12, a peripheral portion of the first adhesive layer 12, and the release substrate 10.
- the second adhesive layer 16 disposed on the substrate, the intermediate layer 18 disposed between the second adhesive layer 16 and the substrate film 14, and the substrate film 14.
- the first adhesive layer 12 and the base film 14 are cut into a predetermined planar shape and are partially laminated on the release base material 10.
- the second adhesive layer 16 and the intermediate layer 18 are also cut into a predetermined planar shape, and these are the base film 14, the first adhesive layer 12, the intermediate layer 18 and the second adhesive layer.
- the third stacked body 24 composed of the adhesive layer 16 is attached to the semiconductor wafer, the wafer, and the ring, the third laminate body 24 is disposed at a position to be attached to the wafer and the ring.
- the surface force on the first adhesive layer 12 and second adhesive layer 16 side is also increased in the thickness direction of the release substrate 10.
- the notch D is formed in an annular shape.
- the cut depth d of the cut portion D formed in the release substrate 10 is less than the thickness of the release substrate 10 and is 25 m or less.
- the preferable range of the cutting depth d and (dZa) of the strong cutting portion D is the same as the preferable range of the cutting depth d and (dZa) in the adhesive sheet 1 in the first embodiment.
- the third laminate 24 is peeled off from the release substrate 10, and the first adhesive layer 12 in the third laminate 24 is attached to the semiconductor wafer. Then, the second adhesive layer 16 is attached to the wafer ring.
- the adhesive sheet 3 as the peeling substrate 10, the first adhesive layer 12, and the substrate film 14, the same materials as those described in the adhesive sheet 1 according to the first embodiment are used.
- the second adhesive layer 16 may be the same as that described in the adhesive sheet 2 according to the second embodiment.
- Examples of the intermediate layer 18 in the adhesive sheet 3 include polyethylene, polypropylene, polychlorinated butyl, polyethylene terephthalate, ethylene acetate butyl copolymer, ionomer resin, other engineering plastic films, A plate or foil is used.
- the thickness of the intermediate layer 18 is preferably 5 to: LOO / zm.
- the second adhesive layer 16 includes the peripheral portion of the first adhesive layer 12, the release substrate 10, and the like.
- the adhesive sheet 2 is disposed at a position where it is attached to the wafer ring when the adhesive sheet 2 is used.
- the first adhesive layer 12 can be prevented from being directly attached to the wafer ring.
- the first adhesive layer 12 has a sufficiently high adhesive strength
- the second adhesive layer 16 has an adhesive strength that is low enough to easily peel off the wafer ring.
- the semiconductor wafer dicing operation and the subsequent wafer ring peeling operation can be performed more efficiently.
- the intermediate layer 18 is disposed between the second adhesive layer 16 and the first adhesive layer 12, thereby providing the second adhesive.
- the degree of freedom in material selection for layer 16 can be increased.
- the intermediate layer 18 makes it possible to easily remove the second adhesive layer 16 together with the intermediate layer 18 at the time of pre-cutting, thereby improving work efficiency and the material of the second adhesive layer 16.
- the degree of freedom in selecting the fee can be increased.
- FIG. 8 is a series of process diagrams for manufacturing the adhesive sheet 1.
- a first laminate 20 composed of a first adhesive layer 12 and a substrate film 14 is laminated on a release substrate 10 (first laminate).
- FIGS. 8 (b) to (c) until the base material 14 reaches the release substrate 10 from the surface F14 opposite to the first adhesive layer 12 side by the pre-cut blade C.
- a cut is made, the base film 14 and the first adhesive layer 12 are cut into a predetermined planar shape, and a cut portion D is formed in the release base 10 (first cutting step). Thereby, the production of the adhesive sheet 1 is completed.
- a cut is made so that the cut depth d of the cut portion D is less than the thickness of the release substrate 10 and 25 m or less.
- first laminating step first, a material constituting the first adhesive layer 12 is dissolved or dispersed in a solvent to obtain a first adhesive layer forming varnish, which is used as a base material. After coating on the film 14, the solvent is removed by heating to form the first laminate 20.
- the solvent used for preparing the varnish is not particularly limited as long as it can dissolve or disperse each constituent material. Considering the volatility during layer formation, for example, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, xylene, etc. It is preferable to use a low boiling point solvent.
- a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone can be used. These solvents can be used alone or in combination of two or more.
- bubbles in the varnish can be removed by vacuum degassing or the like.
- a known method can be used as a method for applying the varnish to the base film 14.
- pre-cut an adhesive sheet before pre-cut (hereinafter referred to as “precursor sheet”) is formed, and the first lamination process is completed.
- the bonding of the first laminate 20 and the release substrate 10 can be performed by a conventionally known method, for example, using a laminator or the like.
- the precursor sheet can also be produced by the following method. For example, after the first adhesive layer forming varnish is applied on the release substrate 10, the solvent is removed by heating to form the first adhesive layer 12, and then the first adhesive layer 12 is formed. A method of sticking the base film 14 on 12 using a laminator or the like can also be adopted.
- the release substrate 10 is separated from the surface F14 opposite to the first adhesive layer 12 side of the base film 14 with respect to the precursor sheet produced as described above.
- the first laminated body 20 composed of the first adhesive layer 12 and the base film 14 is cut into a predetermined planar shape, and the cut portion D is formed in the release base 10. .
- the cutting of the first laminate 20 can be performed by the precut blade C corresponding to a predetermined planar shape.
- a cut is made so that the cut depth d of the cut portion D is less than the thickness of the release substrate 10 and 25 m or less.
- the cut depth d of the cut portion D is 15 m or less, more preferably 10 m or less. Is more preferable, and it is particularly preferable that the distance be 5 m or less.
- the cutting depth d is close to O / z m, and it is most preferable that the cutting depth d is larger than 0 m and 0.5 m or less.
- the cutting depth d is 5 to 15 ⁇ m.
- the thickness of the release substrate 10 is a (m), and the value of (dZa) It is preferable to make a cut so that satisfies the condition of the following formula (1).
- the upper limit of the value of (dZa) in the above formula (1) is more preferably 0.5, and still more preferably 0.3. 0.25 is particularly preferred, and 0.15 is very particularly preferred. Most preferred is 0.1.
- FIG. 9 is a series of process diagrams for manufacturing the adhesive sheet 2.
- a second adhesive layer 16 is laminated on the release substrate 10.
- the second adhesive layer 16 is cut with the pre-cut blade C, and the second adhesive layer 16 is partially removed, and as shown in FIG.
- An exposed surface F10 is formed on the surface of the second adhesive layer 16 side (second laminating step).
- the first adhesive layer 12 and the base film 14 are laminated on the exposed surface F10 and the second adhesive layer 16 of the release substrate 10 ( (3rd lamination process).
- the first adhesive layer 12 and the release substrate 10 are within the predetermined planar shape region (inside the cut portion D). Cutting is performed so that the first adhesive layer 12 and the second adhesive layer 16 are in contact with each other at the peripheral edge in the region. At the same time, a cut is made so that the cut depth d of the cut portion D is less than the thickness of the exfoliated base material 10 and is 25 m or less. [0164] Hereinafter, each manufacturing process will be described in detail.
- the material constituting the second adhesive layer 16 is dissolved or dispersed in a solvent to obtain a second adhesive layer forming varnish, which is applied to the release substrate 10. After coating, the solvent is removed by heating to form the second adhesive layer 16.
- the second adhesive layer 16 produced as described above, from the surface F16 on the side opposite to the release substrate 10 side of the second adhesive layer 16 by the pre-cut blade C. A cut is made until the release substrate 10 is reached, the second adhesive layer 16 is partially removed from the release substrate 10, and the second adhesive layer 16 side surface of the release substrate 10 is removed. Exposed surface F10 is formed. As a result, the second adhesive layer 16 is partially laminated on the release substrate 10, and the second lamination step is completed.
- the material constituting the first adhesive layer 12 is dissolved or dispersed in a solvent to obtain the first adhesive layer forming varnish, which is used as the base material. After coating on the film 14, the solvent is removed by heating to produce the first laminate 20.
- the first stacked body 20 can be manufactured by the same procedure as that described in the fourth embodiment.
- the first laminate 20 produced as described above is laminated on the exposed surface F10 of the release substrate 10 and the second adhesive layer 16. Thereby, an adhesive sheet (precursor sheet) before pre-cut is formed, and the third lamination step is completed.
- the release substrate 10 is separated from the surface F14 opposite to the first adhesive layer 12 side of the base film 14 with respect to the precursor sheet produced as described above.
- the substrate film 14, the first adhesive layer 12 and the second adhesive layer 16 are cut into a predetermined planar shape, and the notch D is formed in the release substrate 10. Form.
- the base film 14, the first adhesive layer 12 and the second adhesive layer 16 can be cut by the pre-cut blade C corresponding to a predetermined planar shape.
- FIG. 10 is a series of process diagrams for manufacturing the adhesive sheet 3.
- the second adhesive layer 16 and the intermediate layer 18 are laminated on the release substrate 10.
- the second adhesive layer 16 and the intermediate layer 18 are cut with the pre-cut blade C, and the second adhesive layer 16 and the intermediate layer 18 are partially removed, and (b) in FIG.
- the exposed surface F10 is formed on the surface of the peeling substrate 10 on the second adhesive layer 16 side (fourth laminating step).
- the first adhesive layer 12 and the substrate film 14 are laminated on the exposed surface F10 and the intermediate layer 18 of the release substrate 10 (the fifth laminate). Process).
- FIG. 10 is a series of process diagrams for manufacturing the adhesive sheet 3.
- the exposed surfaces of the first adhesive layer 12 and the release substrate 10 in the region having the predetermined planar shape in the region inside the cut portion D.
- Cutting is performed such that the first adhesive layer 12 and the intermediate layer 18 are in contact with each other at the peripheral edge in the region, and the cutting depth of the cutting portion D is A cut is made so that the thickness d is less than the thickness of the release substrate 10 and 25 m or less.
- the material constituting the second adhesive layer 16 is dissolved or dispersed in a solvent to obtain a second adhesive layer forming varnish, which is used as a release group. After application to the material 10, the solvent is removed by heating to form the second adhesive layer 16.
- the material constituting the intermediate layer 18 is dissolved or dispersed in a solvent to form an intermediate layer forming varnish, which is applied to the second adhesive layer 16 and then the solvent is removed by heating to remove the intermediate layer 16 Form.
- the material constituting the first adhesive layer 12 is dissolved or dispersed in a solvent to obtain a first adhesive layer forming varnish, which is used as a base material.
- the solvent is removed by heating to produce the first laminate 20.
- the first stacked body 20 can be manufactured by the same procedure as that described in the fourth embodiment.
- the first laminate 20 produced as described above is laminated on the exposed surface F10 of the release substrate 10 and the intermediate layer 18. Thereby, an adhesive sheet (precursor sheet) before pre-cut is formed, and the fifth lamination step is completed.
- the release substrate 10 from the surface F14 opposite to the first adhesive layer 12 side of the base film 14 with respect to the precursor sheet prepared as described above.
- the base film 14, the first adhesive layer 12, the intermediate layer 18 and the second adhesive layer 16 are cut into a predetermined planar shape and cut into the release base material 10 until the thickness reaches Form part D.
- the base film 14, the first adhesive layer 12, the intermediate layer 18 and the second adhesive layer 16 are cut by the precut blade C corresponding to a predetermined planar shape. it can.
- the preferable ranges of the cutting depths d and (dZa) of the cutting portions D to be formed are as described in the fourth embodiment.
- FIG. 11 is a series of process diagrams in which the operation of attaching the second laminate 22 of the adhesive sheet 2 to the semiconductor wafer 32 is performed.
- the release substrate 10 serves as a carrier film, and is supported by two rolls 62 and 66 and a wedge-shaped member 64.
- the adhesive sheet 2 is wound with one end connected to the cylindrical core 44 to form the first roll 42, and the other end is wound with the other end connected to the cylindrical core 54.
- a second roll 52 is formed.
- a core driving motor (not shown) for rotating the core 54 is connected to the core 54 of the second roll 52.
- the core 54 of the second roll 52 rotates, and the adhesive sheet 2 wound around the core 44 of the first roll 42 becomes the first roll. Pulled out of 42.
- the drawn adhesive sheet 2 is guided onto a disk-shaped semiconductor wafer 32 disposed on a movable stage 36 and a wafer ring 34 disposed so as to surround the semiconductor wafer 32.
- the second laminate 22 composed of the substrate film 14, the first adhesive layer 12, and the second adhesive layer 16 is peeled from the release substrate 10.
- the wedge-shaped member 64 is applied from the peeling base material 10 side of the adhesive sheet 2, and the peeling base material 10 is bent at an acute angle toward the member 64 side.
- a peeling start point is created between the peeling substrate 10 and the second laminate 22.
- air is blown to the boundary surface between the peeling substrate 10 and the second laminate 22 so that the peeling starting point can be created more efficiently.
- the second adhesive layer 16 is formed as shown in Fig. 11 (b).
- the second stacked body 22 is attached so that the first adhesive layer 12 and the semiconductor wafer 32 are in close contact with the wafer ring 34.
- the second laminated body 22 is pressed against the semiconductor wafer 32 and the wafer ring 34 by the roll 68. Thereafter, as shown in FIG. No, the attachment of the second laminate 22 onto the ring 34 is completed.
- the second laminated body 22 can be attached to the semiconductor wafer 32 continuously in an automated process.
- An example of an apparatus for performing the operation of attaching the second laminated body 22 to the semiconductor wafer 32 is RAD-2500 (trade name) manufactured by Lintec Corporation.
- the peeling start point between the peeling substrate 10 and the second laminated body 22 is obtained by using the adhesive sheet 2.
- the peeling starting point between the peeling substrate 10 and the second adhesive layer 16 can be easily created, and the occurrence of poor peeling can be sufficiently suppressed.
- the semiconductor wafer 32 (FIG. 12 (a)) to which the second laminated body 22 is bonded by the above-described process is required by the dicing blade G as shown in FIG. 12 (b).
- the semiconductor element 33 to which the first adhesive layer 12 is attached is obtained.
- steps such as washing and drying may be further performed.
- the semiconductor element 33 after dicing the semiconductor wafer 32 falls off during each of the above steps. Is sufficiently suppressed.
- the first adhesive layer 12 is irradiated with high energy rays such as radiation, and a part of the first adhesive layer 12 is polymerized and cured. At this time, heating may be further performed for the purpose of accelerating the curing reaction simultaneously with or after irradiation with the high energy beam.
- Irradiation of the high energy ray to the first adhesive layer 12 also performs surface force on the side of the base film 14 where the first adhesive layer 12 is not provided. Therefore, when ultraviolet rays are used as the high energy rays, the base film 14 needs to be light transmissive. In the case where an electron beam is used as the high-energy line, the base film 14 does not necessarily have to be light transmissive.
- the semiconductor element 33 to be picked up is picked up by, for example, a suction collet.
- the semiconductor element 33 to be picked up can be pushed up from the lower surface of the base film 14 by, for example, a needle rod.
- the first adhesive layer 12 is easily peeled off at the interface between the first adhesive layer 12 and the base film 14 when the semiconductor element 33 is picked up.
- the pick-up layer 12 is picked up in a state where it adheres to the lower surface of the semiconductor element 33.
- the semiconductor element 33 to which the first adhesive layer 12 is attached is supported via the first adhesive layer 12 for mounting the semiconductor element. Place on member 71 and heat
- FIG. 13 is a schematic cross-sectional view showing an embodiment of the semiconductor element of the present invention manufactured by the above-described method for manufacturing a semiconductor device.
- the semiconductor device 100 As shown in FIG. 13, in the semiconductor device 100, two semiconductor elements 33 are stacked on the organic substrate 70 serving as a support member for mounting the semiconductor elements via the first adhesive layer 12. ing. Further, a circuit pattern 74 and a terminal 76 are formed on the organic substrate 70, and the circuit pattern 74 is connected to the two semiconductor elements 33 by force wire bonds 78. These are sealed with a sealing material 80 to form the semiconductor device 100.
- This semiconductor device 100 is manufactured using the adhesive sheet 2 by the above-described method for manufacturing a semiconductor device of the present invention.
- FIG. 16 is a plan view showing a seventh embodiment of the adhesive sheet of the present invention
- FIG. 17 is a schematic view when the adhesive sheet 201 shown in FIG. 16 is cut along the Al 1—Al 1 line of FIG. FIG.
- the adhesive sheet 201 has a configuration in which a peeling substrate 212, an adhesive layer 214, an adhesive layer 222, and a substrate film 224 are sequentially laminated.
- contact A laminate 210 composed of an adhesive layer 214 and an adhesive film 220 composed of an adhesive layer 222 and a base film 224 is cut into a predetermined planar shape, and is partially laminated on the peeling base material 212.
- the first notch D 1 is formed in the thickness direction of the peeling base material 212 along the planar peripheral edge of the laminate 210 in the surface direction in contact with the adhesive layer 214.
- the predetermined planar shape of the laminate 210 is not particularly limited as long as the laminate 210 is partially laminated on the release substrate 212.
- the predetermined planar shape of the laminate 210 is preferably the same shape as the predetermined planar shape of the first laminate 20.
- the cut depth dl of the first cut portion D1 formed in the release base material 212 is less than the thickness of the release base material 212, and is 25 / zm or less. It is becoming.
- the laminate 210 is peeled off from the release substrate 212, and the laminate 210 is attached to an adherend such as a semiconductor wafer via the adhesive layer 214. It becomes.
- the release substrate 212 serves as a carrier film when the adhesive sheet 201 is used.
- the same release substrate 10 as the release substrate 10 can be used.
- the surface of the release substrate 212 on the side in contact with the adhesive layer 214 is surface-treated with a release agent such as a silicone release agent, a fluorine release agent, or a long-chain alkyl acrylate release agent. Is preferred.
- the thickness of the release substrate 212 can be appropriately selected as long as the workability during use is not impaired, but it is preferably 10 to 500 / ⁇ ⁇ . 25 to LOO m. More preferably, it is particularly preferably 30 to 50 m.
- thermosetting adhesive for the adhesive layer 214
- thermoplastic adhesive it is possible to use a resin having thermoplasticity or a resin having thermoplasticity at least in an uncured state and forming a crosslinked structure after heating.
- the Examples of powerful resins include polyimide resins, polyamide resins, polyetherimide resins, polyamideimide resins, polyester resins, polyesterimide resins, phenoxy resins, polysulfone resins, polyethersulfone resins, Polyphenylene sulfide resin, polyether ketone resin and the like.
- a polymer containing a functional monomer as a monomer unit can also be used.
- the functional group of this functional monomer include a glycidyl group, an attalyloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanurate group, an amino group, and an amide group.
- a glycidyl group-containing (meth) acrylic copolymer containing a functional monomer such as glycidyl acrylate or glycidyl methacrylate as a monomer unit may be used.
- the (meth) acrylic copolymer means both an acrylic copolymer and a methacrylic copolymer.
- the glycidyl group-containing (meth) acrylic copolymer for example, (meth) acrylic ester copolymer, acrylic rubber and the like can be used, and acrylic rubber is more preferable.
- the acrylic rubber is a rubber mainly composed of an acrylate ester, mainly a copolymer such as butyl acrylate and alicyclic nitrile, or a copolymer such as ethyl acrylate and acrylonitrile.
- specific examples of the glycidyl group-containing (meth) acrylic copolymer include, for example, HTR-860P-3 (trade name) manufactured by Nagase ChemteX Corporation.
- Examples of the above functional monomers other than glycidyl acrylate and glycidyl methacrylate include ethyl (meth) acrylate and butyl (meth) acrylate, and these may be used alone or in combination of two or more. It can also be used in combination.
- ethyl (meth) acrylate refers to both ethyl acrylate and ethyl methacrylate.
- the thermosetting adhesive is not particularly limited as long as it is a thermosetting resin that is cured by heat and exerts an adhesive action.
- compounds having a functional group such as an isocyanurate group, an amino group, an amide group, etc., and these can be used alone or in combination of two or more. More specifically, for example, epoxy resin, acrylic resin, silicone resin, Examples include enol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, and urea resin.
- the epoxy resin is not particularly limited as long as it is cured and has an adhesive action.
- bifunctional epoxy resin such as bisphenol A type epoxy resin, phenol novolac type epoxy resin, etc.
- a novolac-type epoxy resin such as a cresol novolac-type epoxy resin can be used.
- polyfunctional epoxy resins glycidylamine type epoxy resins, heterocyclic ring-containing epoxy resins or alicyclic epoxy resins can be used. These can be used alone or in combination of two or more.
- epoxy resin hardener When epoxy resin is used, it is preferable to use an epoxy resin hardener.
- the epoxy resin hardener known hardeners that are commonly used can be used. For example, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, dicyandiamide, bisphenol A, bis Examples include bisphenols having two or more phenolic hydroxyl groups in one molecule, such as phenol F and bisphenol S, phenol novolac resin, bisphenol A novolac resin or cresol novolac resin. It is done.
- These epoxy resin hardeners can be used alone or in combination of two or more.
- the thickness of the adhesive layer 214 is preferably within a range that does not affect the bonding operation to the semiconductor wafer and the dicing operation after the bonding while ensuring sufficient adhesion to the mounting substrate. . From this point of view, the thickness of the adhesive layer 214 is preferably 1 to 300 m, more preferably 5 to 150 / ⁇ ⁇ , and more preferably 10 to: LOO m. If the thickness is less than 1 ⁇ m, it tends to be difficult to ensure sufficient die bond adhesion. If the thickness exceeds 300 m, defects such as effects on dicing work tend to occur.
- the adhesive film 220 includes an adhesive layer 222 on the base film 224.
- the same film or sheet used for the release base 212 can be used.
- polyester film such as polyethylene terephthalate film, polytetrafluoroethylene film
- polyolefin films such as polyethylene film, polypropylene film, polymethylpentene film, and polyvinyl acetate film
- plastic films such as polychlorinated bure film and polyimide film.
- the base film 224 may be a laminate of these films in two or more layers.
- the thickness of the base film 224 is preferably 10 to 500 ⁇ m, 25 to 25, more preferably LOO ⁇ m, particularly 30 to 50 ⁇ m. preferable.
- the pressure-sensitive adhesive layer 222 constituting the pressure-sensitive adhesive film 220 is hardened by high energy rays such as ultraviolet rays and radiation, and is preferably cured by heat (decrease in adhesive strength). It is particularly preferable that the resin is cured by ultraviolet rays, which is more preferable.
- Various types of pressure-sensitive adhesives constituting the strong pressure-sensitive adhesive layer 222 are known. Among them, it is preferable to select and use a material whose adhesive strength to the adhesive layer 214 decreases by irradiation with high energy rays.
- Examples of the pressure-sensitive adhesive include, for example, a compound having a diol group, an isocyanate compound, a urethane (meth) atateroito compound, a diamine compound, a urea methacrylate compound, and an ethylenic side chain.
- Examples thereof include a high energy ray-polymerizable copolymer having an unsaturated group. These can be used alone or in combination of two or more.
- the thickness of the adhesive layer 222 is 1 to: LOO ⁇ m is preferably 2 to 20 ⁇ m, more preferably 3 to 10 ⁇ m. If the thickness is less than 1 ⁇ m, it tends to be difficult to ensure sufficient adhesion, and the semiconductor chip may be scattered during dicing. When the thickness exceeds 100 m, the thickness of the adhesive sheet 201 as a whole becomes too thick, and it tends to be difficult to affix to the adherend.
- the adhesive sheet 201 includes the peeling base material 212, the adhesive layer 214, the pressure-sensitive adhesive layer 22, and the base material film 224 having the configuration described above.
- the release substrate 212 has an adhesive layer 214, a pressure-sensitive adhesive layer 22, and a base film 224.
- the surface force on the contact side is also formed by forming the first cut portion D1 in the thickness direction of the peeling substrate 212.
- the cut depth dl of the first cut portion D1 is less than the thickness of the release substrate 212. And less than 25 / zm.
- the cutting depth dl is preferably 15 m or less, more preferably 10 m or less, and even more preferably 5 m or less. preferable.
- the cutting depth dl is larger than O / zm which is preferable as it is closer to O / zm, but not more than 0.5 / zm.
- the cut depth dl of the first cut portion D1 is in the above range, so that the adhesive layer 214 and the adhesive layer 222 are sufficiently swallowed into the first cut portion D1 in the adhesive sheet 201. Can be suppressed. Therefore, the laminate 210 can be easily peeled from the release substrate 212 without the interface between the release substrate 212 and the adhesive layer 214 being sealed, and the laminate 210 can be adhered to the adherend. Generation
- production of a peeling defect can fully be suppressed.
- the cutting depth dl is preferably 5 to 15 m from the viewpoint of balance between production efficiency and suppression of peeling failure.
- the adhesive sheet 201 satisfy the condition of the following formula (2), where the thickness of the release base material 212 is a (m) and the value of (dlZa) satisfies the following formula (2).
- the upper limit value of (dlZa) in the above formula (2) is more preferably 0.5, and still more preferably 0.3. 0.25 is particularly preferred 0.15 is very particularly preferred 0.1 is most preferred.
- the depth of cut dl was determined by arbitrarily measuring the depth of the cut portion D1 formed in the peeling substrate 212 by cross-sectional observation using an electron microscope. Means an average value. From the viewpoint of sufficiently suppressing the occurrence of peeling failure, it is preferable that all the depths of the cut portions D1 measured arbitrarily at 10 points are within the above range. The same applies to the cut depth d2 of the second cut portion D2 described later.
- FIG. 18 is a plan view showing an eighth embodiment of the adhesive sheet of the present invention
- FIG. 19 is a schematic cross-sectional view when the adhesive sheet 202 shown in FIG. 18 is cut along the line A12-A12 in FIG. It is.
- the adhesive sheet 202 has a configuration in which a peeling substrate 212, an adhesive layer 214, an adhesive layer 222, and a substrate film 224 are sequentially laminated. Further, the adhesive layer 214 is cut into a predetermined first planar shape, and is partially laminated on the peeling substrate 212.
- a first notch D 1 is formed in the peeling substrate 212 in the thickness direction of the peeling substrate 212 along the first planar shape of the bonding layer 214, and the surface force on the side in contact with the bonding layer 214 is also formed.
- the adhesive layer 222 is laminated so as to cover the adhesive layer 214 and to be in contact with the release substrate 212 around the adhesive layer 214.
- the pressure-sensitive adhesive film 220 including the pressure-sensitive adhesive layer 222 and the base film 224 is cut into a predetermined second planar shape, and the release base material 212 has a second planar shape along the periphery of the pressure-sensitive adhesive film 220.
- the surface force on the side in contact with the adhesive layer 222 is such that the second cut portion D2 is formed in the thickness direction of the peeling substrate 212.
- the cut depth dl of the first cut portion D1 and the cut depth d2 of the second cut portion D2 formed on the release base material 212 are both peel base materials.
- the thickness is less than 212 and less than 25 m.
- the cut depth dl of the first cut portion D1 and the cut depth d2 of the second cut portion D2 are each 15 m or less. It is particularly preferable that the force is preferably 10 m or less, more preferably 5 m or less.
- the cutting depths dl and d2 are preferably closer to 0 m, most preferably larger than 0 m and not more than 0.5 m.
- the cutting depths dl and d2 are preferably 5 to 15 ⁇ m in terms of balance between production efficiency and suppression of peeling defects.
- the adhesive sheet 202 satisfy the condition of the following formula (2), where the thickness of the release substrate 212 is am).
- the adhesive layer 214 and the adhesive layer 222 are more sufficiently prevented from being swallowed into the first cut portion D1. Can The occurrence of peeling failure can be more sufficiently suppressed. Further, when the value of (d2Za) satisfies the condition of the above formula (3), the adhesive layer 222 can be more sufficiently suppressed from being squeezed into the second cut portion D2, Generation of defective peeling can be more sufficiently suppressed. From the viewpoint of obtaining these effects more sufficiently, the upper limit value of (dlZa) in the above equation (2) and the upper limit value of (d2Za) in the above equation (3) are 0.5. A power of 0.3 is more preferable, 0.25 is particularly preferable, 0.15 is particularly preferable, and 0.1 is most preferable.
- the same materials as those described in the adhesive sheet 201 according to the seventh embodiment are used. can do.
- the adhesive sheet 202 having a powerful structure can make the adhesive layer 222 adhere to the wafer ring when the wafer ring is used when dicing the semiconductor wafer, and the dicing operation can be easily performed. .
- the cut depth dl of the first cut portion D1 and the cut depth d2 of the second cut portion D2 in the release substrate 212 are within the above ranges, respectively.
- the adhesive layer 214 can be sufficiently suppressed from being squeezed into the first cut portion D1
- the adhesive layer 222 can be sufficiently suppressed from being squeezed into the second cut portion D2. be able to. Therefore, the interface between the release substrate 212 and the adhesive layer 214 and the interface between the release substrate 212 and the adhesive layer 222 are not sealed, and the stack 210 can be easily peeled from the release substrate 212. Thus, it is possible to sufficiently suppress the occurrence of defective peeling when the laminate 210 is attached to the adherend.
- FIG. 20 is a plan view showing a ninth embodiment of the adhesive sheet of the present invention
- FIG. 21 is a schematic cross-sectional view when the adhesive sheet 203 shown in FIG. 20 is cut along the line A13-A13 in FIG. It is.
- the adhesive sheet 203 has a configuration in which a peeling substrate 212, an adhesive layer 214, an adhesive layer 222, and a substrate film 224 are sequentially laminated.
- the adhesive layer 214 is cut into a predetermined planar shape and is partially laminated on the peeling substrate 212.
- the release substrate 212 has an adhesive layer 214 along the periphery of the planar shape of the adhesive layer 214.
- the first notch Dl is also formed in the thickness direction of the peeling substrate 212 in the surface force on the side in contact with the substrate. Further, the adhesive layer 222 and the base film 224 are laminated so as to cover the adhesive layer 214 and to be in contact with the peeling base material 212 around the adhesive layer 214.
- the cutting depth dl of the first cut portion D1 formed in the peeling base material 212 is less than the thickness of the peeling base material 212, and 25 m or less. There is.
- the depth of cut dl of the first cut portion D1 is more preferably 15 m or less, and even more preferably 10 m or less. It is particularly preferably 5 m or less.
- the depth of cut dl is preferably closer to 0 m, more preferably larger than O / z m and not more than 0.5 m.
- the cutting depth dl is preferably 5 to 15 ⁇ m in terms of the balance between production efficiency and separation failure suppression.
- the adhesive sheet 203 preferably has a value of (dl / a) that satisfies the condition of the following formula (2).
- the upper limit value of (dlZa) in the above formula (2) is more preferably 0.5, and still more preferably 0.3. 0.25 is particularly preferred 0.15 is very particularly preferred 0.1 is most preferred.
- the same materials as those described in the adhesive sheet 201 according to the seventh embodiment are used. can do.
- the adhesive sheet 203 since the cut depth dl of the first cut portion D1 in the release substrate 212 is within the above range, the adhesive layer 214 is cut into the first cut portion D1. Can be sufficiently suppressed. Therefore, the interface between the peeling substrate 212 and the adhesive layer 214 is not sealed, and peeling of the laminate 210 from the peeling substrate 212 becomes easy. Thus, it is possible to sufficiently suppress the occurrence of peeling failure when the laminate 210 is attached to the adherend.
- a method for manufacturing the adhesive sheet 201 according to the tenth embodiment for manufacturing the adhesive sheet 201 according to the seventh embodiment will be described.
- the adhesive sheet 201 includes a first laminating step of sequentially laminating the adhesive layer 214, the adhesive layer 222, and the base film 224 on the release base 212, and the side of the base film 224 that contacts the adhesive layer 222. Cut from the opposite surface until it reaches the peeling substrate 212, and cuts the adhesive layer 214, the adhesive layer 222, and the substrate film 224 into a predetermined plane shape, and the first notch D1 in the peeling substrate 212. And a first cutting step for forming the substrate.
- the cutting is performed so that the cutting depth dl of the first cutting portion D1 is less than the thickness of the peeling substrate 212 and is 25 m or less. Put in.
- the material constituting the adhesive layer 214 is dissolved or dispersed in a solvent to form an adhesive layer-forming varnish, which is applied onto the release substrate 212 and then heated to remove the solvent.
- the adhesive layer 214 is formed by removing.
- the material constituting the adhesive layer 222 is dissolved or dispersed in a solvent to form an adhesive layer forming varnish, which is applied onto the base film 224, and then the solvent is removed by heating to form the adhesive film 220. .
- the solvent used for the preparation of the varnish is not particularly limited as long as it can dissolve or disperse each constituent material. However, consideration is given to volatility during layer formation. And use relatively low boiling solvents such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene. Is preferred. Further, for the purpose of improving the coating properties, for example, a solvent having a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone can be used. These solvents can be used alone or in combination of two or more.
- the bubble in a varnish can also be removed by vacuum deaeration.
- a known method can be used, for example, a knife coating method, a roll coating method, a spray coating method, a dara via coating method, a bar coating. Method, curtain coating method, or the like.
- adheresive film the adhesive layer 214 formed on the release substrate 212 as described above (hereinafter referred to as “adhesive film”), and the adhesive layer 222 formed on the substrate film 224. (Adhesive film 2 20) is bonded together.
- adhesive sheet before pre-cut hereinafter referred to as “precursor sheet”.
- the bonding of the adhesive film and the pressure-sensitive adhesive film 220 can be performed by a conventionally known method, for example, using a laminator or the like.
- the precursor sheet can also be produced by the following method. That is, after the adhesive layer forming varnish is applied onto the release substrate 212, the solvent is removed by heating to form the adhesive layer 214, and then the adhesive layer forming varnish is applied onto the adhesive layer 214 and heated to remove the solvent.
- the adhesive layer 222 is formed by removing the adhesive, and after the varnish for forming the adhesive layer is applied onto the base film 224, the solvent is removed by heating to form the adhesive layer 222, and then the adhesive layer is formed on the adhesive layer 222.
- a method of forming the adhesive layer 214 by applying a forming varnish and removing the solvent by heating may be employed.
- the first cutting step in the precursor sheet produced as described above, cutting is performed until the surface force on the side opposite to the side in contact with the adhesive layer 222 of the base film 224 reaches the release substrate 212.
- the laminate 210 composed of the adhesive layer 214, the pressure-sensitive adhesive layer 222 and the base film 224 is cut into a predetermined planar shape, and the first cut portion D1 is formed in the release base 212.
- the laminate 210 can be cut by the pre-cut blade C corresponding to a predetermined planar shape.
- a cut is made so that the cut depth dl of the first cut portion D1 is less than the thickness of the release substrate 21 2 and is 25 m or less.
- the cutting depth dl of the first cut portion D1 is 15 ⁇ m or less, which is 10 ⁇ m or less. It is particularly preferable to make it 5 m or less. Cut like this
- the penetration depth is preferably closer to the dl force SO / zm, most preferably greater than or equal to 0.
- the cutting depth dl is 5 to 15 ⁇ m.
- the thickness of the release substrate 212 is a (m), and the value of (dl / a) may be cut so as to satisfy the following formula (2).
- the value of (dl / a) may be cut so as to satisfy the following formula (2).
- the upper limit value of (dl Za) in the above formula (2) is more preferably 0.5, and still more preferably 0.3. Particularly preferred is 0.25, most preferred is 0.15, and most preferred is 0.1.
- a method for manufacturing the adhesive sheet 202 according to the eleventh embodiment for manufacturing the adhesive sheet 202 according to the eighth embodiment will be described.
- the adhesive sheet 202 is applied to the release substrate 212 from the second lamination step of laminating the adhesive layer 214 on the release substrate 212, and from the surface of the adhesive layer 214 opposite to the side in contact with the release substrate 212.
- a cut is made until it reaches, a second cutting step of cutting the adhesive layer 214 into a predetermined first planar shape and forming the first cut portion D1 in the peeling base material 212, and on the adhesive layer 214,
- a third laminating step of sequentially laminating the adhesive layer 222 and the substrate film 224 so that the adhesive layer 222 covers the adhesive layer 214 and is in contact with the release substrate 212 around the adhesive layer 214; Cut the base film 224 and the adhesive layer 222 into a predetermined second planar shape while cutting the surface force on the side opposite to the side in contact with the adhesive layer 222 of the rum 224 until it reaches the release substrate 212.
- a third cutting step for forming a second cut portion D2 in the material 212. It is.
- the cutting is performed so that the cutting depth dl of the first cutting portion D1 is less than the thickness of the release substrate 212 and is 25 m or less.
- a cut is made so that the cut depth d2 of the second cut portion D2 is less than the thickness of the release substrate 212 and is 25 m or less.
- the material constituting the adhesive layer 214 is dissolved or dispersed in a solvent to form an adhesive layer-forming varnish, which is applied onto the release substrate 212, and then the solvent is removed by heating. Thus, the adhesive layer 214 is formed. This produces an adhesive film and completes the second lamination step.
- a cut is made from the surface of the adhesive layer 214 opposite to the side in contact with the release substrate 212 until the release substrate 212 is reached.
- the adhesive layer 214 is cut into a predetermined first planar shape, and the first cut portion D1 is formed in the peeling substrate 212.
- cutting of the adhesive layer 214 can be performed by a precut blade according to a predetermined first planar shape.
- a cut is made so that the cut depth dl of the first cut portion D1 is less than the thickness of the release substrate 21 2 and is 25 m or less.
- the cut depth dl of the first cut portion D1 is 15 ⁇ m or less, which is 10 ⁇ m or less. It is particularly preferable to make it 5 m or less.
- the cutting depth is close to the dl force SO / zm, and it is most preferable that the cutting depth is greater than O / zm and not more than 0.
- the cutting depth dl is 5 to 15 ⁇ m.
- the thickness of the release substrate 212 is a (m), and the value of (dl / a) may be cut so as to satisfy the condition of the following formula (2).
- the thickness of the release substrate 212 is a (m)
- the value of (dl / a) may be cut so as to satisfy the condition of the following formula (2).
- the upper limit value of (dl Za) in the above formula (2) is more preferably 0.5, and still more preferably 0.3. 0.25 is particularly preferred 0.15 is very particularly preferred 0.1 Most preferred.
- the adhesive layer 222 covers the adhesive layer 214 on the adhesive layer 214 that has been subjected to the pre-cut force in the second cutting step, and around the adhesive layer 214.
- An adhesive layer 222 and a base film 224 are sequentially laminated so as to be in contact with the release substrate 212, thereby producing a precursor sheet.
- Lamination is performed, for example, by applying a pressure-sensitive adhesive film 220 formed by forming a pressure-sensitive adhesive layer 222 on the base film 224 with a laminator or the like, or applying a pressure-sensitive adhesive layer-forming varnish on the adhesive layer 214 and heating.
- a method may be employed in which the solvent is removed to form the adhesive layer 222 and the base film 224 is adhered thereon.
- the third cutting step in the precursor sheet produced as described above, cutting is performed until the surface force on the side opposite to the side in contact with the adhesive layer 222 of the base film 224 reaches the release substrate 212. Then, the adhesive film 220 including the base film 224 and the adhesive layer 222 is cut into a predetermined second planar shape, and the second cut portion D2 is formed in the release base material 212.
- the adhesive film 220 can be cut by the precut blade C corresponding to a predetermined second planar shape.
- a cut is made so that the cut depth d2 of the second cut portion D2 is less than the thickness of the release substrate 212, and is 25 m or less.
- the cutting depth d2 of the second cut portion D2 is 15 ⁇ m or less, which is 10 ⁇ m or less. It is particularly preferable to make it 5 m or less.
- the cutting depth is d2 force SO / zm, and it is most preferable that the cutting depth is greater than O / zm and not more than 0.
- the cutting depth d2 is 5 to 15 ⁇ m.
- the thickness of the release substrate 212 is a (m), and the value of (d2 / a) may be cut so as to satisfy the condition of the following formula (3).
- the value of (d2 / a) may be cut so as to satisfy the condition of the following formula (3).
- the upper limit of the value of (d2 Za) in the above formula (3) is more preferably 0.5, and still more preferably 0.3. Particularly preferred is 0.25, most preferred is 0.15, and most preferred is 0.1.
- the adhesive sheet 202 having the configuration shown in FIGS. 18 and 19 may be configured such that the second cut portion D2 is not provided in the peeling substrate 212.
- the adhesive sheet having a strong structure is obtained by applying an adhesive film 220, which is obtained by laminating the adhesive layer 214 on the release substrate 212 and pre-cutting the adhesive layer 214, and then cutting the adhesive layer 220 into a predetermined planar shape in advance.
- it can be manufactured by sticking so as to cover the adhesive layer 214 and to be in contact with the release substrate 212 around the adhesive layer 214.
- the third cutting step may not be performed.
- an adhesive sheet that has not been pre-cut with respect to the pressure-sensitive adhesive film 220 that is, an adhesive sheet 203 having the configuration shown in FIGS. 20 and 21 can be obtained.
- FIG. 22 is a series of process diagrams in which the operation of attaching the laminated body 210 of the adhesive sheet 202 to the semiconductor wafer 32 is performed.
- the peeling substrate 212 serves as a carrier film, and is supported by two rolls 62 and 66 and a wedge-shaped member 64.
- the adhesive sheet 202 is wound with one end thereof connected to the cylindrical core 44 to form a first roll 242, and the other end is wound with the cylindrical core 54 being connected.
- the second roll 252 is formed.
- the core 54 of the second roll 252 A core driving motor (not shown) for rotating the core 54 is connected.
- the peeling base material 212 after the laminated body 210 has been peeled is wound around the core 54 at a predetermined speed.
- the core driving motor rotates
- the core 54 of the second roll 252 rotates
- the adhesive sheet 202 wound around the core 44 of the first roll 242 becomes the first roll. Pulled out of 242.
- the drawn adhesive sheet 202 is guided onto a disk-shaped semiconductor wafer 32 disposed on the movable stage 36 and a wafer ring 34 disposed so as to surround the semiconductor wafer 32.
- the laminate 210 composed of the adhesive layer 214 and the pressure-sensitive adhesive film 220 is peeled from the peeling substrate 212.
- the wedge-shaped member 64 is also applied to the peeling substrate 212 side force of the adhesive sheet 202, and the peeling substrate 212 is bent at an acute angle toward the member 64 side.
- a peeling start point is created between the peeling substrate 212 and the laminate 210.
- air is blown to the boundary surface between the peeling base material 212 and the laminate 210 so that the peeling starting point is created more efficiently.
- the adhesive film 220 is in close contact with the wafer ring 34 as shown in Fig. 22 (b)
- the laminate 210 is attached so that the adhesive layer 214 is in close contact with the semiconductor wafer 32.
- the laminate 210 is pressed against the semiconductor wafer 32 by the roll 68.
- FIG. 22 (c) the stacking of the laminated body 210 onto the semiconductor wafer 32 is completed, and a semiconductor wafer with a laminated body is obtained.
- the laminate 210 can be attached to the semiconductor wafer 32 continuously in an automated process.
- An example of an apparatus for performing the operation of attaching the laminate 210 to the semiconductor wafer 32 is RAD-2500 (trade name) manufactured by Lintec Corporation.
- the adhesive sheet 202 is used to remove the separation starting point between the release substrate 212 and the laminate 210 (the release substrate 212 and the adhesive The peeling start point between the layer 222 and the peeling start point between the peeling base material 212 and the adhesive layer 214) can be easily created, and the occurrence of peeling failure can be sufficiently suppressed.
- the semiconductor wafer with a laminated body obtained by the above steps is diced to obtain a semiconductor element with a laminated body having a required size.
- steps such as washing and drying may be further performed.
- the semiconductor wafer 32 is sufficiently adhered and held on the laminate 210 by the adhesive layer 214 and the adhesive layer 222, so that the semiconductor wafer is prevented from dropping during each of the above steps.
- the adhesive layer 222 of the laminate 210 is irradiated with high energy rays such as radiation, and a part or most of the adhesive layer 222 is polymerized and cured. At this time, heating may be further performed for the purpose of accelerating the curing reaction simultaneously with or after irradiation with the high energy beam.
- Irradiation of the adhesive layer 222 with the high energy ray also performs surface force on the side of the base film 224 where the adhesive layer 222 is not provided. Therefore, when ultraviolet rays are used as high energy rays, the base film 224 needs to be light transmissive. Note that in the case where an electron beam is used as the high energy beam, the base film 224 does not necessarily need to be light transmissive.
- the semiconductor element to be picked up is picked up by, for example, a suction collet.
- the semiconductor element to be picked up can be pushed up from the lower surface of the base film 224 by, for example, a needle rod.
- the adhesive force between the semiconductor element and the adhesive layer 214 is greater than the adhesive force between the adhesive layer 214 and the adhesive layer 222, so that the semiconductor element is picked up.
- peeling occurs at the interface between the adhesive layer 214 and the adhesive layer 222, and the semiconductor element with the adhesive layer in a state where the adhesive layer 214 is attached to the lower surface of the semiconductor element is picked up.
- the semiconductor element with the adhesive layer is placed on a support member for mounting the semiconductor element via the adhesive layer 214, and heated. By heating, the adhesive force of the adhesive layer 214 is developed, and the bonding between the semiconductor element and the supporting member for mounting the semiconductor element is completed.
- FIG. 23 is a schematic cross-sectional view showing an embodiment of the semiconductor element of the present invention manufactured by the above-described method for manufacturing a semiconductor device.
- the semiconductor device 300 two semiconductor elements with an adhesive layer made up of an adhesive layer 214 and a semiconductor element 72 are stacked on an organic substrate 70 which is a supporting member for mounting the semiconductor element. ing. Further, a circuit pattern 74 and a terminal 76 are formed on the organic substrate 70, and the circuit pattern 74 is connected to two semiconductor elements 72 by force wire bonds 78. These are sealed with a sealing material 80 to form the semiconductor device 300.
- the semiconductor device 300 is manufactured using the adhesive sheet 202 by the above-described method for manufacturing a semiconductor device of the present invention.
- the adhesive sheet 202 has been described as an embodiment of the method for manufacturing the semiconductor device
- the adhesive sheet 201 or the adhesive sheet 203 may be used as the adhesive sheet.
- the adhesive sheet 203 is used, the laminated body 210 in the adhesive sheet 203 is attached to the semiconductor wafer 32 and the wafer and the ring 34, and then the adhesive film 220 in the laminated body 210 is cut according to the diameter of the wafer ring 34.
- the apparatus that performs the work include PM-8500 (trade name) manufactured by Nitto Seiki Co., Ltd.
- Og akuzinore 2-ethylhexyl was added dropwise over 4 hours, kept warm for 2 hours, and then 0.06 g of 2,2-azobis (isobutyrate). Mouth-tolyl) in 8.5 g of 2-butanone was added dropwise over 30 minutes, and the mixture was kept warm for 5.5 hours. This gave a weight average molecular weight of 60,00 (measured by gel permeation chromatography and a standard polystyrene calibration curve An acrylic polymer having a nonvolatile content of 40% by mass was obtained.
- NK—ESTER BPE—200 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.), 2,2-bis (4-methacryloxyxetoxyphenyl) prono
- An adhesive layer is formed by adding 100 parts by mass of methyl ethyl ketone to a composition consisting of 22.05 parts by mass of 1-hydroxycyclohexyl phenol ketone and 0.5 parts by mass, stirring and mixing, and vacuum degassing. A varnish was prepared.
- This adhesive layer-forming varnish is coated on a 75 m thick polyethylene terephthalate (PET) film (Teijin Purex S31, manufactured by Teijin DuPont Films, Inc.) and heated at 100 ° C for 5 minutes. Drying was performed to form an adhesive layer having a thickness of 10 m. As a result, an adhesive film comprising a PET film and an adhesive layer was obtained.
- PET polyethylene terephthalate
- YDCN-703 (trade name, manufactured by Toto Kasei Co., Ltd., Cresol-one novolac type epoxy resin, epoxy equivalent 220) as epoxy resin
- XLC-LL (trade name, Mitsui) as a curing agent
- a first varnish was prepared by mixing 1500 parts by mass of cyclohexanone with 40 parts by mass of Chemical Xylene glycol xylene glycol dimethyl ether condensate).
- NUC A-189 (trade name, manufactured by Nippon-ukar Co., Ltd., y -glycidoxypropyltrimethoxysilane) as a coupling agent
- NC UA — 1160 (trade name, manufactured by Nippon Car Co., Ltd., ⁇ —ureidopropyltriethoxysilane) 1 part by mass
- R972V trade name, manufactured by Nippon Aerosil Co., Ltd., silica filler
- HTR-860- ⁇ 3 (trade name, manufactured by Nagase ChemteX Corp., epoxy group-containing talyl-based copolymer) and Curazole as a curing accelerator were added to this second case.
- 2 ⁇ -CN (trade name, manufactured by Shikoku Kasei Co., Ltd., 1-cyanoethyl-2-furimidazole) 0.5 parts by mass was added and mixed by stirring to prepare a varnish for forming an adhesive layer.
- PET Teijin DuPont Films Co., Ltd., Tijin Purex A31
- the fabric was heated and dried at 140 ° C for 5 minutes to form a B-stage adhesive layer with a thickness of 10 / zm.
- an adhesive film composed of a PET film (peeling substrate) and an adhesive layer was obtained.
- the obtained adhesive film was subjected to circular pre-cut processing (first pre-cut force) of ⁇ 210mm by adjusting the depth of cut into the release substrate to be 10 ⁇ m or less. .
- An adhesive sheet of Example 2 was produced in the same manner as in Example 1 except that the first and second precut processes were adjusted so that the depth of cut into the release substrate was 20 m or less. .
- An adhesive sheet of Comparative Example 1 was prepared in the same manner as in Example 1 except that the first and second precut processes were adjusted so that the depth of cut into the release substrate was 35 m or less. .
- the peeling failure when peeling the laminate comprising the adhesive layer and the adhesive film force was evaluated as follows. First, 100 adhesive sheets each of Examples 1-2 and Comparative Example 1 (adhesive sheets in which 100 laminates composed of an adhesive film and an adhesive layer were formed on one release substrate) were prepared. Subsequently, a wafer laminating test (RAD-2500) manufactured by Lintec Corporation was used to perform a lamination test on the wafer. At this time, the wafer size was 8 inches (203 mm), 150 ⁇ m thick, and the laminating speed was 35 mmZ seconds. In the evaluation, the case where the laminate was not peeled off from the peeling substrate and was stuck to the wafer was regarded as a peeling failure, and the number of peeling failures was determined for 100 tests. The results are shown in Table 1.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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US11/577,255 US20080261039A1 (en) | 2004-10-14 | 2005-09-30 | Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device |
CN2005800349933A CN101040023B (zh) | 2004-10-14 | 2005-09-30 | 粘接片及其制造方法、以及半导体装置的制造方法及半导体装置 |
US13/310,531 US8465615B2 (en) | 2004-10-14 | 2011-12-02 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
US13/310,515 US8470115B2 (en) | 2004-10-14 | 2011-12-02 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
US13/367,118 US20120135176A1 (en) | 2004-10-14 | 2012-02-06 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
US13/921,321 US20130302570A1 (en) | 2004-10-14 | 2013-06-19 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
US13/921,331 US20130295314A1 (en) | 2004-10-14 | 2013-06-19 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
Applications Claiming Priority (2)
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JP2004-300541 | 2004-10-14 | ||
JP2004300541A JP4677758B2 (ja) | 2004-10-14 | 2004-10-14 | ダイボンドダイシングシート及びその製造方法、並びに、半導体装置の製造方法 |
Related Child Applications (5)
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US10/577,255 A-371-Of-International US7611827B2 (en) | 2004-06-28 | 2005-06-24 | Photosensitive resin composition, ink jet head using photosensitive resin composition, and process for manufacturing ink jet head |
US11/577,255 A-371-Of-International US20080261039A1 (en) | 2004-10-14 | 2005-09-30 | Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device |
US13/310,531 Division US8465615B2 (en) | 2004-10-14 | 2011-12-02 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
US13/310,515 Division US8470115B2 (en) | 2004-10-14 | 2011-12-02 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
US13/367,118 Division US20120135176A1 (en) | 2004-10-14 | 2012-02-06 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device |
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PCT/JP2005/018120 WO2006040945A1 (ja) | 2004-10-14 | 2005-09-30 | 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 |
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US (6) | US20080261039A1 (ja) |
JP (1) | JP4677758B2 (ja) |
KR (3) | KR101022175B1 (ja) |
CN (5) | CN102169817B (ja) |
TW (1) | TW200627536A (ja) |
WO (1) | WO2006040945A1 (ja) |
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CN102169817A (zh) | 2011-08-31 |
CN101040023B (zh) | 2011-05-04 |
US20130295314A1 (en) | 2013-11-07 |
KR20080093078A (ko) | 2008-10-17 |
CN102174298A (zh) | 2011-09-07 |
CN102190978A (zh) | 2011-09-21 |
JP4677758B2 (ja) | 2011-04-27 |
US20080261039A1 (en) | 2008-10-23 |
US20120068312A1 (en) | 2012-03-22 |
US20120135176A1 (en) | 2012-05-31 |
US8470115B2 (en) | 2013-06-25 |
KR20070053326A (ko) | 2007-05-23 |
US20120073743A1 (en) | 2012-03-29 |
CN102190978B (zh) | 2013-09-18 |
CN102176407A (zh) | 2011-09-07 |
KR100892799B1 (ko) | 2009-04-10 |
CN102176407B (zh) | 2014-11-05 |
JP2006111727A (ja) | 2006-04-27 |
US20130302570A1 (en) | 2013-11-14 |
TW200627536A (en) | 2006-08-01 |
US8465615B2 (en) | 2013-06-18 |
CN101040023A (zh) | 2007-09-19 |
KR100915491B1 (ko) | 2009-09-03 |
KR101022175B1 (ko) | 2011-03-17 |
KR20080093079A (ko) | 2008-10-17 |
CN102169817B (zh) | 2014-10-22 |
TWI303454B (ja) | 2008-11-21 |
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