EP1884981A1 - Removable wafer expander for die bonding equipment. - Google Patents

Removable wafer expander for die bonding equipment. Download PDF

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Publication number
EP1884981A1
EP1884981A1 EP06118420A EP06118420A EP1884981A1 EP 1884981 A1 EP1884981 A1 EP 1884981A1 EP 06118420 A EP06118420 A EP 06118420A EP 06118420 A EP06118420 A EP 06118420A EP 1884981 A1 EP1884981 A1 EP 1884981A1
Authority
EP
European Patent Office
Prior art keywords
wafer
die bonding
bonding equipment
wafer expander
expander
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06118420A
Other languages
German (de)
French (fr)
Inventor
Kevin Formosa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Malta Ltd
Original Assignee
STMicroelectronics Malta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Malta Ltd filed Critical STMicroelectronics Malta Ltd
Priority to EP06118420A priority Critical patent/EP1884981A1/en
Priority to US11/833,605 priority patent/US7675170B2/en
Publication of EP1884981A1 publication Critical patent/EP1884981A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Definitions

  • the present invention concerns a removable wafer expander for die bonding equipment.
  • a wafer In the assembly of semiconductor devices, a wafer is mounted onto a flexible sticky foil held by a metal ring.
  • every individual die has to be picked from the sticky foil and placed directly on a substrate over a die attach material (package).
  • a pick and place equipment with a die ejector system that pushes the die back side to break the adhesion forces of the sticky foil.
  • a vacuum pick-up tool (robotic arm) picks the die and through coordinated motion places the picked die over the targeted placement position.
  • Critical parameters for pick-up process are the die back side adhesion to the sticky foil and the separation between each die. The latter is mainly governed by the "wafer street width" and consequently by the cutting blade thickness.
  • the wafer remains expanded by the wafer expander of the die bonding equipment until the full process is completed, namely until all the dies are removed from the sticky foil.
  • Object of the present invention is to provide a wafer expander for die bonding equipment by which is possible to load and reload the same wafer several times, maintaining said wafer expanded.
  • a removable wafer expander for a die bonding equipment for singularized wafer supported by flexible sticky means characterized in that it is provided with a first ring member to be coupled with a second ring member for a remote expansion of said flexible sticky means comprises therebetween before the mounting of said wafer expander onto the die bonding equipment.
  • removable wafer expander onto a multi-chip die bonding equipment.
  • Several removable wafer expanders can be prepared for the same equipment and mounted in turn thereon maintaining several wafers contemporaneously expanded.
  • a removable wafer expander 1 for a multi-chip die bonding equipment comprises a superior ring 2 and an inferior ring 3.
  • Said superior ring 2 is provided with an annular cavity 4 to be coupled with an annular protrusion 5 of said inferior ring 3.
  • Both rings 2-3 are provided with holes 11 for locking means to maintain the rings in a work position (Fig.6).
  • Dies 6 of a singularized wafer 7 are mounted onto a sticky foil 8 supported by a metal ring 9 (wafer assembly 20).
  • the equipment comprises also a robotic arm 10 for the die pick-up process.
  • a multi-chip die bonding equipment is useful for package to be loaded with dies of different size.
  • a wafer assembly 20 is positioned between the superior and the inferior rings 2-3 in the rest position of Fig. 5.
  • the wafer expander is mounted on the multi-chip die bonding equipment for the pick-up process.
  • a control unit calls a different die supported by a different wafer expander 1
  • the previous wafer expander 1 is unloaded from the equipment and a new wafer expander 1 is loaded thereon.

Abstract

The present invention relates to a removable wafer expander for a die bonding equipment for singularized wafer (7) supported by flexible sticky means (8). Said removable wafer expander is provided with a first ring member (2) to be coupled with a second ring member (3) for a remote expansion of said flexible sticky means (8) comprises therebetween before the mounting of said wafer expander onto the die bonding equipment.

Description

  • The present invention concerns a removable wafer expander for die bonding equipment.
  • In the assembly of semiconductor devices, a wafer is mounted onto a flexible sticky foil held by a metal ring.
  • After wafer sawing for singularizing the dies within each wafer, every individual die has to be picked from the sticky foil and placed directly on a substrate over a die attach material (package).
  • Thus it is provided a pick and place equipment with a die ejector system that pushes the die back side to break the adhesion forces of the sticky foil. A vacuum pick-up tool (robotic arm) picks the die and through coordinated motion places the picked die over the targeted placement position.
  • Critical parameters for pick-up process are the die back side adhesion to the sticky foil and the separation between each die. The latter is mainly governed by the "wafer street width" and consequently by the cutting blade thickness.
  • The market trend is to continuously reduce the die size, maximizing the number of dies per wafer. Thus stretching the sawn wafer to uniformly enlarging the separation between each die is an option to be considered to optimise the die pick-up process.
  • The deformation of the sticky foil happens on a die bonding equipment and the expansion is not suddenly recovered on releasing the wafer expander of said die bonding equipment.
  • In some cases a permanent deformation occurs, therefore it is not possible to use the wafer anymore.
  • Thus it is highly advisable that the wafer remains expanded by the wafer expander of the die bonding equipment until the full process is completed, namely until all the dies are removed from the sticky foil.
  • This is a limitation for a multi-chip die bonding equipment. The bonding process is similar to the process described above, but after the completion of the first die the equipment has to change the wafer because a different die is required for the same package.
  • Therefore in such process where it is inherent to load and reload the same wafer several times, the setup process is provided without wafer expansion.
  • As a consequence the lack of clearance between adjacent dies will induce various pick-up process issues.
  • Object of the present invention is to provide a wafer expander for die bonding equipment by which is possible to load and reload the same wafer several times, maintaining said wafer expanded.
  • According to the invention said object is achieved by a removable wafer expander for a die bonding equipment for singularized wafer supported by flexible sticky means, characterized in that it is provided with a first ring member to be coupled with a second ring member for a remote expansion of said flexible sticky means comprises therebetween before the mounting of said wafer expander onto the die bonding equipment.
  • It is in particular advisable to use said removable wafer expander onto a multi-chip die bonding equipment. Several removable wafer expanders can be prepared for the same equipment and mounted in turn thereon maintaining several wafers contemporaneously expanded.
  • The characteristics and advantages of the present invention will appear evident from the following detailed description of an embodiment thereof illustrated as non-limiting example in the enclosed drawings, in which:
    • Fig.1 is a top view of a first coupling ring of a removable wafer expander;
    • Fig.2 is a sectional view according to line II-II of Fig.1;
    • Fig.3 is a top view of a second coupling ring of the removable wafer expander;
    • Fig.4 is a sectional view according to line IV-IV of Fig.1;
    • Fig.5 is a longitudinal sectional view of the wafer expander in a rest position with the flexible sticky foil supporting the wafer before its expansion;
    • Fig.6 is a longitudinal sectional view of the wafer expander in a work position with the flexible sticky foil expanded;
    • Fig.7 is a longitudinal sectional view of the wafer expander in a rest position after the sticky foil expansion.
  • A removable wafer expander 1 for a multi-chip die bonding equipment comprises a superior ring 2 and an inferior ring 3.
  • Said superior ring 2 is provided with an annular cavity 4 to be coupled with an annular protrusion 5 of said inferior ring 3.
  • Both rings 2-3 are provided with holes 11 for locking means to maintain the rings in a work position (Fig.6).
  • Dies 6 of a singularized wafer 7 are mounted onto a sticky foil 8 supported by a metal ring 9 (wafer assembly 20).
  • The equipment comprises also a robotic arm 10 for the die pick-up process.
  • A multi-chip die bonding equipment is useful for package to be loaded with dies of different size.
  • Away from the equipment, more than one wafer assembly 20 are expanded as follow.
  • A wafer assembly 20 is positioned between the superior and the inferior rings 2-3 in the rest position of Fig. 5.
  • Than the rings 2-3 clamp the wafer assembly 20 expanding the sticky foil 8 (Fig.6), due to the coupling between the protrusion 5 and the cavity 4.
  • The space between each die increase, thus pick-up process made by the robotic arm 10 is easier.
  • Therefore the critical parameters of each wafer assembly 20 increase.
  • After the wafer expansion, the wafer expander is mounted on the multi-chip die bonding equipment for the pick-up process.
  • If a control unit calls a different die supported by a different wafer expander 1, the previous wafer expander 1 is unloaded from the equipment and a new wafer expander 1 is loaded thereon.
  • When all the dies 6 are picked-up from its sticky foil 8, the rings 2-3 release the permanently deformed die empty sticky foil 8 (Fig.7) for a new not deformed die full sticky foil 8.

Claims (4)

  1. Removable wafer expander for a die bonding equipment for singularized wafer (7) supported by flexible sticky means (8), characterized in that it is provided with a first ring member (2) to be coupled with a second ring member (3) for a remote expansion of said flexible sticky means (8) comprises therebetween before the mounting of said wafer expander onto the die bonding equipment.
  2. Removable wafer expander according to claim 1, characterized in that said first ring member (2) is provided with an annular cavity (4) to be coupled in a work position with an annular protrusion (5) of said second ring member (3), being the flexible sticky means (8) included between said first (2) and second (3) ring members, and expanded thereby.
  3. Removable wafer expander according to any of the preceding claims, characterized in that it is for a multi-chip die bonding equipment.
  4. Removable wafer expander according to any of the preceding claims, characterized in that said ring members (2-3) are held in work position by locking means (11).
EP06118420A 2006-08-03 2006-08-03 Removable wafer expander for die bonding equipment. Withdrawn EP1884981A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP06118420A EP1884981A1 (en) 2006-08-03 2006-08-03 Removable wafer expander for die bonding equipment.
US11/833,605 US7675170B2 (en) 2006-08-03 2007-08-03 Removable wafer expander for die bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06118420A EP1884981A1 (en) 2006-08-03 2006-08-03 Removable wafer expander for die bonding equipment.

Publications (1)

Publication Number Publication Date
EP1884981A1 true EP1884981A1 (en) 2008-02-06

Family

ID=38468854

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06118420A Withdrawn EP1884981A1 (en) 2006-08-03 2006-08-03 Removable wafer expander for die bonding equipment.

Country Status (2)

Country Link
US (1) US7675170B2 (en)
EP (1) EP1884981A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054803A (en) * 2007-08-27 2009-03-12 Seiko Epson Corp Expanding tool, expanding method, and method of manufacturing unit element
TWI360207B (en) * 2007-10-22 2012-03-11 Advanced Semiconductor Eng Chip package structure and method of manufacturing
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (en) 2010-03-22 2013-10-01 Advanced Semiconductor Eng Semiconductor package and manufacturing method thereof
FR2961014A1 (en) 2010-06-08 2011-12-09 St Microelectronics Tours Sas PROCESS FOR PRODUCING SEMICONDUCTOR CHIPS FROM A SEMICONDUCTOR WAFER
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US9003644B2 (en) 2012-10-15 2015-04-14 Stmicroelectronics Pte Ltd PNP apparatus and PNP tool head with direct bonding pressure pick-up tip
JP7080551B2 (en) * 2017-12-18 2022-06-06 株式会社ディスコ Processing method of work piece
CN107946251B (en) * 2017-12-28 2024-02-02 江阴长电先进封装有限公司 Packaging method of semiconductor product
US11171031B2 (en) * 2018-07-23 2021-11-09 Texas Instruments Incorporated Die matrix expander with partitioned subring
US11658056B2 (en) * 2019-11-05 2023-05-23 Nxp B.V. Technique for handling diced wafers of integrated circuits
US11508606B2 (en) * 2019-11-05 2022-11-22 Nxp B.V. Technique for handling diced wafers of integrated circuits
CN116825685B (en) * 2023-08-31 2023-11-07 常州铭赛机器人科技股份有限公司 Automatic opening and closing structure and automatic opening and closing method for wafer expanding mechanism

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122583A (en) * 1993-10-26 1995-05-12 Fujitsu Ltd Manufacture of semiconductor device and semiconductor manufacturing apparatus
US20050215033A1 (en) * 2004-03-29 2005-09-29 Nitto Denko Corporation Method of dicing semiconductor wafer into chips, and apparatus using this method
US20060128065A1 (en) * 2003-06-06 2006-06-15 Teiichi Inada Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899379A (en) * 1967-10-09 1975-08-12 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US4259365A (en) * 1978-03-02 1981-03-31 Wolfgang Ruppel Method for creating a ferroelectric or pyroelectric body
US4485125A (en) * 1982-03-19 1984-11-27 Energy Conversion Devices, Inc. Method for continuously producing tandem amorphous photovoltaic cells
US4684424A (en) * 1985-08-15 1987-08-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and apparatus for making an optical element having a dielectric film
JP2695348B2 (en) * 1992-04-28 1997-12-24 大日本印刷株式会社 Injection molding simultaneous painting device
US5407507A (en) * 1993-10-25 1995-04-18 The Procter & Gamble Company Method and apparatus for combining a tensioned elastic member with a moving substrate web
US5449429A (en) * 1993-12-03 1995-09-12 Langenbrunner; James R. Apparatus for stretching and mounting films
US5813893A (en) * 1995-12-29 1998-09-29 Sgs-Thomson Microelectronics, Inc. Field emission display fabrication method
US5904500A (en) * 1996-10-03 1999-05-18 The Dexter Corporation Method for the preparation of lead-on-chip assemblies
US5822038A (en) * 1997-08-14 1998-10-13 Eastman Kodak Company Apparatus for stretching and aligning film sheets
KR100319624B1 (en) * 1999-05-20 2002-01-09 김영환 Semiconductor chip package and method for fabricating thereof
US6794751B2 (en) * 2001-06-29 2004-09-21 Intel Corporation Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
US6713366B2 (en) * 2002-06-12 2004-03-30 Intel Corporation Method of thinning a wafer utilizing a laminated reinforcing layer over the device side
US6582983B1 (en) * 2002-07-12 2003-06-24 Keteca Singapore Singapore Method and wafer for maintaining ultra clean bonding pads on a wafer
US7176106B2 (en) * 2003-06-13 2007-02-13 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging
JP4677758B2 (en) * 2004-10-14 2011-04-27 日立化成工業株式会社 Die-bonded dicing sheet, method for manufacturing the same, and method for manufacturing a semiconductor device
JP4776188B2 (en) * 2004-08-03 2011-09-21 古河電気工業株式会社 Semiconductor device manufacturing method and wafer processing tape
JP4776189B2 (en) * 2004-08-03 2011-09-21 古河電気工業株式会社 Wafer processing tape
US7501034B2 (en) * 2004-10-15 2009-03-10 The Procter & Gamble Company Method for producing a corrugated stretch laminate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122583A (en) * 1993-10-26 1995-05-12 Fujitsu Ltd Manufacture of semiconductor device and semiconductor manufacturing apparatus
US20060128065A1 (en) * 2003-06-06 2006-06-15 Teiichi Inada Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
US20050215033A1 (en) * 2004-03-29 2005-09-29 Nitto Denko Corporation Method of dicing semiconductor wafer into chips, and apparatus using this method

Also Published As

Publication number Publication date
US7675170B2 (en) 2010-03-09
US20080032489A1 (en) 2008-02-07

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