TWI721191B - 板狀物搬送裝置及加工裝置 - Google Patents
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Abstract
提供一種無需增加用以調整裝置之各部位的位置之所需工時,便可抑制裝置的破損之板狀物搬送裝置及加工裝置。
板狀物搬送裝置(1),係具備有:保持單元(2),保持被加工物;及移動機構,使保持單元(2)移動。保持單元(2),係包含有:至少2個保持構件(10),保持被加工物的外周緣;支撐板部(20),可在接近或遠離被加工物之外周緣的接近遠離方向移動地支撐保持構件(10);及移動單元(30),使保持構件(10)往接近遠離方向移動。保持構件(10),係具有:桿部(11),可在支撐板部(20)上下移動地垂下;卡合部(12),卡合於被形成在桿部(11)的下端外周之被加工物的外周緣;及噴嘴部(13),從桿部(11)之下面(11a)朝向保持面噴射流體,使被加工物從保持面浮起。
Description
本發明,係關於板狀物搬送裝置及加工裝置。
已知一種對半導體晶圓或封裝基板、玻璃基板等板狀物進行加工例如薄化,或分割成一個個元件晶片的加工裝置。在該些加工裝置中,一般雖係以真空吸盤等吸附並搬送板狀物,但當不欲使異物附著於板狀物之表面的情況下,抑或當在板狀物之表面存在有凹凸、或在板狀物之背面具有圓形凹部與圍繞該圓形凹部的環狀凸部之如所謂“TAIKO”晶圓般外周部以外非常薄且脆弱等的情況下,考慮一種使板狀物之外周卡合而搬送的搬送機構(端緣夾持)(參閱專利文獻1)。
然而,在記載於專利文獻1的搬送機構中,可從背側保持板狀物的端緣之至少板狀物之外周的一部分,係必需使用如從保持面突出般之特殊形狀的夾頭座(專利文獻2),或必需以使卡合於外周之保持部碰撞保持面而夾頭座不會破損的方式調整裝置。
[專利文獻1]日本特開2007-258450號公報
[專利文獻2]日本特開2012-064872號公報
但是,專利文獻1及專利文獻2所示的搬送機構,係有以使卡合於外周之保持部碰撞保持面而夾頭座不會破損的方式,用以調整裝置之各部位的位置之所需工時增加的問題。
本發明,係有鑑於該問題點而進行研究者,其目的,係在於提供一種無需增加用以調整裝置之各部位的位置之所需工時,便可抑制裝置的破損之板狀物搬送裝置及加工裝置。
根據本發明之一方面,提供一種板狀物搬送裝置,係在夾頭座之保持面搬入或搬出板狀物,該板狀物搬送裝置,其特徵係,具備有:保持單元,保持板狀物;及移動機構,使該保持單元移動,該保持單元,係包含有:至少2個保持構件,保持板狀物之外周緣;支撐板部,可在接近或遠離板狀物之外周緣的接近遠離方向移動地支撐該保持構件;及移動單元,使該保持構件往接近遠
離方向移動,該保持構件,係具有:桿部,可在該支撐板部上下移動地垂下;卡合部,被形成於該桿部之下端外周,且卡合於板狀物的外周緣;及噴嘴部,從該桿部之下面朝向該保持面噴射流體,使板狀物從該保持面浮起。
較佳為:該桿部,係被鬆插至該支撐板部而可擺動地垂下,當噴射來自該噴嘴部的流體時,則該桿部之該下面以與該保持面平行的方式調整傾斜。
較佳為:該板狀物搬送裝置,係在被保持於該保持構件之板狀物的外周,更具備有可在該支撐板部上下移動地垂下的限制銷,在該限制銷的下面,係設置有限制銷噴嘴,該限制銷噴嘴,係朝向該保持面噴射流體,將該限制銷之下面定位於該保持面附近。
根據本發明之另一方面,提供一種加工裝置,其特徵係,具備有:夾頭座,保持被加工物;加工單元,對被保持於該夾頭座的被加工物進行加工;及搬送單元,在該夾頭座搬入或搬出被加工物,該搬送單元,係前述板狀物搬送裝置。
本案發明之板狀物搬送裝置及加工裝置,係無需增加用以調整裝置之各部位的位置之所需工時,便可抑制裝置的破損。
1、1A、1B、1-2:板狀物搬送裝置(搬送單元)
2:保持單元
3:移動機構
10、10-2:保持構件
11、11-2:桿部
11a:下面
12:卡合部
13:噴嘴部
20:支撐板部
30:移動單元
41、41-4:限制銷
41c:下面
42:限制銷噴嘴
100‧‧‧切割裝置(加工裝置)
110、181‧‧‧夾頭座
110a‧‧‧保持面
120‧‧‧切割手段(加工單元)
W‧‧‧被加工物(板狀物)
[圖1]圖1,係表示具備有第1實施形態之板狀物搬送裝置之加工裝置即切割裝置之構成例的立體圖。
[圖2]圖2,係表示第1實施形態之板狀物搬送裝置之構成的立體圖。
[圖3]圖3,係表示第1實施形態之板狀物搬送裝置的分解立體圖。
[圖4]圖4,係表示圖2所示之板狀物搬送裝置之保持構件之配置的平面圖。
[圖5]圖5,係沿著圖2中之V-V線的剖面圖。
[圖6]圖6,係表示圖5所示之保持構件之桿部進行上下移動之狀態的剖面圖。
[圖7]圖7,係圖5所示之保持構件之桿部之下面的平面圖。
[圖8]圖8,係沿著圖2中之VIII-VIII線的剖面圖。
[圖9]圖9,係板狀物搬送裝置接近夾頭座之狀態之保持單元之主要部分的剖面圖。
[圖10]圖10,係圖9所示之板狀物搬送裝置的保持構件被定位之狀態之保持單元之主要部分的剖面圖。
[圖11]圖11,係從圖10所示之夾頭座噴出了氣體之狀態之保持單元之主要部分的剖面圖。
[圖12]圖12,係圖11所示之板狀物搬送裝置的保持構件保持了被加工物之狀態之保持單元之主要部分的剖面圖。
[圖13]圖13(a),係第1實施形態之板狀物搬送裝置的保持構件保持被加工物之狀態的平面圖;圖13(b),係圖13(a)所示的保持構件從被加工物遠離之狀態的平面圖。
[圖14]圖14(a),係不具備有比較例之限制銷之板狀物搬送裝置的保持構件保持被加工物之狀態的平面圖;圖14(b),係圖14(a)所示的保持構件從被加工物遠離之狀態的平面圖。
[圖15]圖15,係表示第2實施形態之板狀物搬送裝置之主要部分的剖面圖。
[圖16]圖16,係表示圖15所示之保持構件產生擺動之狀態的剖面圖。
[圖17]圖17,係表示各實施形態之第1變形例之板狀物搬送裝置之保持構件之配置的平面圖。
[圖18]圖18,係表示各實施形態之第2變形例之保持構件之移動方向的平面圖。
[圖19]圖19,係表示各實施形態之第3變形例之板狀物搬送裝置之保持構件的立體圖。
[圖20]圖20,係表示各實施形態之第4變形例之板狀物搬送裝置之限制銷等的剖面圖。
[圖21]圖21,係表示圖20所示之限制銷產生擺動之狀態的剖面圖。
參閱圖面,詳細地說明關於本發明的實施方
式(實施形態)。本發明並不限定於以下之實施形態所記載的內容。又,在以下所記載的構成要素中,係含有該發明技術領域中具有通常知識者可輕易設想之實質上相同的內容。而且,以下所記載的構成,係可適當地進行組合。又,在不脫離本發明之要旨的範圍內,可進行各種構成的省略、置換或變更。
基於圖面,說明本發明之第1實施形態之板狀物搬送裝置及加工裝置。圖1,係表示具備有第1實施形態之板狀物搬送裝置之加工裝置即切割裝置之構成例的立體圖。圖2,係表示第1實施形態之板狀物搬送裝置之構成的立體圖。圖3,係表示第1實施形態之板狀物搬送裝置的分解立體圖。圖4,係表示圖2所示之板狀物搬送裝置之保持構件之配置的平面圖。圖5,係沿著圖2中之V-V線的剖面圖。圖6,係表示圖5所示之保持構件之桿部進行上下移動之狀態的剖面圖。圖7,係圖5所示之保持構件之桿部之下面的平面圖。
第1實施形態之板狀物搬送裝置1,係構成圖1所示之加工裝置即切割裝置100。切割裝置100,係對板狀物即被加工物W進行切割(加工)的裝置。
在第1實施形態中,被加工物W,係將矽、藍寶石、鎵等設成為母材之圓板狀的半導體晶圓或光裝置晶圓。被加工物W,係藉由複數個跡道S,使形成於表面的
複數個元件D被劃分成格子狀。又,第1實施形態之被加工物W,雖係厚度為一定的半導體晶圓或光裝置晶圓,但本發明之被加工物W,係亦可為中央部被薄化而在外周部形成有厚壁部之所謂的TAIKO晶圓,或除了晶圓以外,亦可為具有複數個被樹脂密封的元件之矩形狀的封裝基板、陶瓷板、玻璃板等。
圖1所示之切割裝置100,係對被加工物W進行切割(加工)而將被加工物W分割成一個個元件D的加工裝置。切割裝置10,係如圖1所示,具備有在保持面110a吸引保持被加工物W的夾頭座110、切割被保持於夾頭座110之被加工物W的加工單元即切割手段120及搬送單元即板狀物搬送裝置1。
又,切割裝置100,係如圖1所示,至少具備有:未圖示之X軸移動手段,將夾頭座110沿與水平方向及裝置本體102之短邊方向平行的X軸方向加工進給;Y軸移動手段140,將切割手段120沿與水平方向平行及與裝置本體102之長邊方向且X軸方向正交的Y軸方向分度進給;Z軸移動手段150,將切割手段120沿平行於和X軸方向與Y軸方向兩者正交之垂直方向的Z軸方向切入進給;及控制裝置160。切割裝置100,係如圖1所示,具備有2個切割手段120之亦即雙主軸的切割機(dicer),就是所謂的對向軸雙刃型(facing dual type)的切割裝置。
夾頭座110,係具備有保持部111與環狀之框部112的圓盤形狀,該保持部111,係設置有保持被加工物
W之保持面110a,且由多孔陶瓷等所形成,該框部112,係圍繞保持部111且由導電性的金屬所構成。又,夾頭座110,係被設置為藉由X軸移動手段移動自如,且藉由旋轉驅動源旋轉自如。夾頭座110,係經由切換閥113與真空吸引源114連接,以被真空吸引源114吸引的方式,夾頭座110吸引、保持被加工物W。夾頭座110,係藉由切換閥113與氣體供給源115連接,以藉由氣體供給源115供給所加壓之氣體的方式,解除被加工物W的吸引、保持。
切割手段120,係具備裝設有可對被保持於夾頭座110之被加工物W進行切割之切割刀121之未圖示的主軸。切割手段120,係分別相對於被保持於夾頭座110的被加工物W,被設置為藉由Y軸移動手段140在Y軸方向上移動自如,且被設置為藉由Z軸移動手段150在Z軸方向上移動自如。
一方之切割手段120,係如圖1所示,經由Y軸移動手段140、Z軸移動手段150等,被設置於從裝置本體102豎立設置之一方的柱部103a。另一方之切割手段120,係如圖1所示,經由Y軸移動手段140、Z軸移動手段150等,被設置於從裝置本體102豎立設置之另一方的柱部103b。另外,柱部103a、103b,係上端被水平梁103c連接。
切割手段120,係可藉由Y軸移動手段140及Z軸移動手段150,將切割刀121定位於夾頭座110之保持面110a的任意位置。又,一方之切割手段120,係被固定為
可與對被加工物W之上面Wa進行拍攝的攝像手段一體地移動。攝像手段,係具備有:CCD攝像機,對被保持於夾頭座110之切割前的被加工物W之應分割區域進行拍攝。CCD攝像機,係對被保持於夾頭座110的被加工物W進行拍攝,獲得用以執行校準(alignment)的圖像,並將所獲得的圖像輸出至控制裝置160,該校準,係進行被加工物W與切割刀121之對位。
切割刀121,係具有大致呈圓環形狀之極薄的切割研磨石。主軸,係以使切割刀121旋轉的方式,切割被加工物W。主軸,係被收容於主軸殼體內,主軸殼體,係被支撐於Z軸移動手段150。切割手段120之主軸及切割刀121的軸心,係被設定為與Y軸方向平行。
X軸移動手段,係以使夾頭座110往X軸方向移動的方式,將夾頭座110沿X軸方向加工進給的加工進給手段。Y軸移動手段140,係以使切割手段120往Y軸方向移動的方式,將切割手段120分度進給的分度進給手段。Z軸移動手段150,係以使切割手段120往Z軸方向移動的方式,將切割手段120切入進給者。X軸移動手段、Y軸移動手段140及Z軸移動手段150,係具備有:周知的滾珠螺桿,被設置為繞軸心旋轉自如;周知的步進馬達,使滾珠螺桿繞軸心旋轉;及周知的導引軌,在X軸方向、Y軸方向或Z軸方向移動自如地支撐夾頭座110或切割手段120。
又,切割裝置100,係具備有:匣盒升降機170,載置有收容切割前後之被加工物W的匣盒171,且使
匣盒171往Z軸方向移動;洗淨裝置180,洗淨切割後的被加工物W;及搬送手段190,在匣盒171,將被加工物W取出放入。洗淨裝置180,係將切割後之被加工物W吸引保持於夾頭座181,並洗淨被加工物W。由於洗淨裝置180之夾頭座181的構成,係與夾頭座110的構成相同,因此,對相同部分賦予相同符號而省略說明。
控制裝置160,係分別控制上述的構成要素,使切割裝置100實施對於被加工物W的加工動作者。另外,控制裝置160,係包含有電腦系統。控制裝置160,係具有:運算處理裝置,具有如CPU(central processing unit)般之微處理器;記憶裝置,具有如ROM(read only memory)或RAM(random access memory)般之記憶體;及輸出入介面裝置。控制裝置160之運算處理裝置,係根據被記憶於記憶裝置的電腦程式來實施運算處理,經由輸出入介面裝置,將用以控制切割裝置100之控制信號輸出至切割裝置100之上述的構成要素。又,控制裝置160,係與藉由顯示加工動作之狀態或畫像等的液晶顯示裝置等所構成之未圖示的顯示手段,或操作員登錄加工內容資訊等之際所使用的輸入手段連接。輸入手段,係藉由被設置於顯示手段之觸控面板與鍵盤等中的至少一個所構成。
在第1實施形態中,雖將切割裝置100表示為加工裝置,但本發明並不限定於此,洗淨裝置、雷射加工裝置或研磨裝置亦可作為加工裝置。又,在第1實施形態中,雖將切割手段120表示為加工單元,但並不限定於
此,洗淨單元、雷射光線照射單元或研磨單元亦可作為加工單元。亦即,在第1實施形態中,雖表示加工為切割的例子,但並不限定於此,加工亦可為洗淨、雷射加工或研磨。
搬送單元即板狀物搬送裝置1,係在夾頭座110、181的保持面110a搬入或搬出被加工物W。在第1實施形態中,切割裝置100,係具備有:第1板狀物搬送裝置1A,在搬送手段190與夾頭座110之間搬送被加工物W;及第2板狀物搬送裝置1B,在夾頭座110與洗淨裝置180的夾頭座181之間搬送被加工物W。第1板狀物搬送裝置1A,係從搬送手段190搬出切割前的被加工物W,並搬入至夾頭座110。第2板狀物搬送裝置1B,係從夾頭座110搬出切割後的被加工物W,並搬入至洗淨裝置180的夾頭座181。第1板狀物搬送裝置1A,係從夾頭座181搬出洗淨後的被加工物W,並搬入至搬送手段190。
板狀物搬送裝置1,係如圖2及圖3所示,具備有:保持單元2,保持被加工物W;及移動機構3,使保持單元2移動(圖1所示)。移動機構3,係具備有:Y軸移動機構5,使在前端設置有保持單元2的單元支撐臂4往Y軸方向移動;及未圖示的升降機構,使被設置於單元支撐臂4的前端且保持單元2往Z軸方向移動。Y軸移動機構5,係被設置於水平梁104c,該水平梁104c,係連結從裝置本體102豎立設置的一對柱部104a、104b彼此。Y軸移動機構5,係藉由被設置為繞軸心旋轉自如之周知的滾珠螺桿、
使滾珠螺桿繞軸心旋轉之周知的步進馬達及在Y軸方向移動自如地支撐單元支撐臂4之周知的導引軌所構成。升降機構,係藉由周知的氣缸所構成。
保持單元2,係如圖2及圖3所示,具備有:至少2個保持構件10,保持被加工物W的外周緣;支撐板部20,可在接近或遠離被加工物W之外周緣的接近遠離方向亦即放射方向移動地支撐保持構件10;及移動單元30,使保持構件10往接近遠離方向移動。
在第1實施形態中,如圖4所示,於周方向等間隔地隔著間隔設置有3個保持構件10。保持構件10,係如圖5及圖6所示,具備有:桿部11,可在支撐板部20上下移動地垂下;卡合部12,卡合於被形成在桿部11的下端外周之被加工物W的外周緣;及噴嘴部13,從桿部11之下面11a朝向保持面110a噴射流體,使被加工物W從保持面110a浮起。桿部11,係被形成為外徑逐步變化的圓筒狀。流體,係例如空氣。
桿部11,係具備有:被***部11b,形成比被設置於支撐板部20之長孔21之寬度小的外徑,且軸方向之長度比支撐板部20的厚度長,並且被***至長孔21內;大徑部11c,被設置於被***部11b之軸方向的中央部,且外徑比長孔21的寬度大。桿部11,係被***部11b被***(鬆插)至支撐板部20的長孔21內,如圖6之實線及虛線所示,可上下移動地垂下。又,在桿部11的上端,係安裝有外徑比長孔21之寬度大的圓盤狀構件14。桿部11,係藉由圓盤
狀構件14與大徑部11c接觸於支撐板部20的方式,限制來自支撐板部20的脫落。
卡合部12,係被形成為從桿部11之下端外周往外周方向突出的圓盤狀。卡合部12之外周部,係隨著接近外周而形成較薄的厚度。在第1實施形態中,桿部11的下面11a與同一面之卡合部12的下面,係平坦地形成,並隨著卡合部12之外周部的上面接近外周而慢慢地傾斜於靠近下面的方向。
噴嘴部13,係具備有:噴嘴13a,開口於桿部11之下面11a;及流體供給部13e(圖2所示),可經由切換閥13b(圖2所示)及流量調節閥13c(圖2所示),將來自流體供給源13d(圖2所示)的流體供給至噴嘴13a。噴嘴13a,係如圖7所示,開口於桿部11之下面11a的中央部。在第1實施形態中,噴嘴部13從流體供給部13e所供給而噴射至保持面110a的流體,係經加壓的氣體。
支撐板部20,係圓形狀之板體。支撐板部20,係在外周部於周方向隔著預定間隔設置3個長孔21,該3個長孔21,係沿支撐板部20之徑方向(放射方向)呈長形且***保持構件10的被***部11b。長孔21之寬度,係被設定為僅比保持構件10之被***部11b的外徑大之尺寸。像這樣形成的長孔21,係如圖3所示,保持構件10之被***部11b從支撐板部20的下面側被***。又,在支撐板部20之上面的中心部,係安裝有凸肩螺帽22,該凸肩螺帽22,係具有大徑部22a與小徑部22b。
移動單元30,係使3個保持構件10沿著長孔21的長邊方向亦即支撐板部20的徑方向移動,該3個保持構件10,係分別被***至設置在支撐板部20的3個長孔21。移動單元30,係由下述者所構成:3個連桿31,一端部分別被可轉動地連結於3個保持構件10的被***部11b;轉動板32,可轉動地支撐3個連桿31的各個另一端部;及氣缸33,作為使轉動板32轉動的驅動手段。在連桿31的一端部,係如圖3所示,設置有孔31a,該孔31a,係鬆插有保持構件10的被***部11b。若將被***部11b鬆插至連桿31的孔31a,則將圓盤狀構件14安裝於保持構件10的被***部11b。
轉動板32,係在中央部具備有孔32a,並且具備有3個臂部32b,該孔32a,係可轉動地嵌合於被安裝在支撐板部20的中央部之凸肩螺帽22的小徑部22b,該3個臂部32,係於周方向隔著預定間隔,從外周面往徑方向(放射方向)突出設置。該3個臂部32b的前端部,係分別藉由連桿31的另一端部與樞軸35,可轉動地連結於彼此。又,在3個臂部32b的1個,係設置有用以與氣缸33之活塞桿33a連結的連結突起32c。另外,轉動板32,係在被設置於中央部之孔32a的外側,於周方向隔著預定間隔地設置有3個開白32d。轉動板32,係如圖3所示,設置於中央部的孔32a可轉動地被嵌合於凸肩螺帽22的小徑部22b。而且,藉由將防脫落用之螺栓34螺合於凸肩螺帽22的方式,限制轉動板32之拔脫。
氣缸33,係被配設於支撐板部20的上面。該氣缸33之活塞桿33a的前端被連結於連結突起32c,該連結突起32c,係被設置於3個臂部32b中的1個。
保持單元2,係於周方向隔開預定間隔地安裝有3個限制銷41,該3個限制銷41,係用以限制所搬入之被加工物W往保持面110a的面方向移動。圖8,係沿著圖2中之VIII-VIII線的剖面圖。
3個限制銷41,係被等間隔地配置於支撐板部20的周方向,並被配置於彼此相鄰的保持構件10間。3個限制銷41,係如圖8所示,具備有:長孔23,與徑方向平行地被設置於支撐板部20;被***部41a,穿過被設置於支撐構件60的孔61內,該孔61,係被設置於支撐板部20上;及大徑部41b,被設置於被***部41a的上端且比孔61大。限制銷41,係被***部41a穿過孔61及長孔23,大徑部41b被重疊於支撐構件60上,可上下移動地往支撐板部20垂下。
限制銷41,係在板狀物搬送裝置1將被加工物W搬入至保持面110a之際,被定位於幾乎擦到保持面110a的高度,並被設置於保持在保持構件10之被加工物W的外周。限制銷41,係在將被加工物W搬入至保持面110a之際,在使保持構件10往徑方向移動而從被加工物W遠離時,以防止緊貼於保持構件10而被加工物W側向偏移的目的而加以設置。
複數個限制銷41,係被配置於與被加工物W之
外周略微相距一間隙的外側。插通限制銷41之孔61的內徑,係被形成為稍微比限制銷41之被***部41a的外徑大。限制銷41,係以使下端在支撐板部20的徑方向亦即保持構件10的移動單元30所致之移動方向上位移一被***部41a與孔61之間之晃動量的方式,可進行擺動。由於限制銷41,係被配置於與被加工物W之外周略微相距一間隙的外側,且擺動自如一晃動量,因此,在抑制被加工物W的側向偏移之際,下面41c與被加工物W不會接觸。
又,保持單元2,係藉由彈性支撐手段50而支撐於單元支撐臂4的前端。彈性支撐手段50,係具備有:3根支撐柱51,以豎立設置的方式,被設置於支撐板部20的上面;3根螺旋彈簧52,分別被嵌插於3根支撐柱51;及安裝板53,被安裝於單元支撐臂4的前端。3根支撐柱51,係分別被配置於插通3個開口32d的位置,該3個開口32d,係被設置於轉動板32,在上端部設置有母螺栓孔。在安裝板53,係於與3根支撐柱51相對應的位置分別設置有插通孔53a。插通孔53a,係被形成為比支撐柱51之外徑大且比螺旋彈簧52之外徑小的內徑。因此,將支撐柱51插通至插通孔53a,並將防脫落用之螺栓54螺合於被設置在支撐柱51之上端部的母螺栓孔,藉此,保持單元2,係在藉由螺旋彈簧52而朝向下方彈壓的狀態下,被彈性支撐於單元支撐臂4的前端。
其次,說明第1實施形態之板狀物搬送裝置的動作。另外,以下,雖係以板狀物搬送裝置1A,1B從夾
頭座110、181搬出被加工物W的動作為代表而進行說明,但第1板狀物搬送裝置1A從搬送手段190搬出的動作亦相同。圖9,係板狀物搬送裝置接近夾頭座之狀態之保持單元之主要部分的剖面圖。圖10,係圖9所示之板狀物搬送裝置的保持構件被定位之狀態之保持單元之主要部分的剖面圖。圖11,係從圖10所示之夾頭座噴出了氣體之狀態之保持單元之主要部分的剖面圖。圖12,係圖11所示之板狀物搬送裝置的保持構件保持了被加工物之狀態之保持單元之主要部分的剖面圖。
板狀物搬送裝置1,係如圖9所示,在從夾頭座110、181搬出被加工物W之際,藉由控制裝置160,伸展氣缸33之活塞桿33a,且在從噴嘴13a噴出了預定流量之來自流體供給源13d之流體的狀態下,接近夾頭座110、181。此時,夾頭座110、181,係如圖9所示,藉由控制裝置160,使來自真空吸引源114的負壓作用於保持面110a,而將被加工物W吸引保持於保持面110a。
板狀物搬送裝置1,係當保持單元2之保持構件10接近夾頭座110、181的框部112時,為了從噴嘴13a噴出流體,而保持構件10不會與夾頭座110、181的框部112接觸,並且從噴嘴13a所噴出之流體沿著框部112的表面流動而產生白努利效應,藉由白努利效應,桿部11之下面11a被吸引至夾頭座110、181的框部112。而且,如圖10所示,板狀物搬送裝置1,係保持構件10的高度藉由流體之白努利效應而被定位於與保持面110a稍微遠離的位置。此時,
如圖10所示,限制銷41不會與夾頭座110、181的框部112接觸,並被定位於比被加工物W之上面低的位置。
而,如圖11所示,控制裝置160控制切換閥113,從夾頭座110、181之保持面110a噴射從氣體供給源115所供給的氣體。於是,被加工物W,係從保持面110a稍微上浮。又,從噴嘴13a所噴射之流體進入至夾頭座110、181的保持面110a與被加工物W之間,藉由控制裝置160,氣缸33之活塞桿33a被縮小,如圖12所示,被加工物W從保持面110a上浮保持構件10之卡合部12滑入被加工物W的下方之程度的同時,卡合部12會卡合於被加工物W之外周緣,板狀物搬送裝置1,係保持被加工物W而朝向下一工程搬出。
第1實施形態之板狀物搬送裝置1及切割裝置100,係在卡合於被加工物W的外周緣之桿部11的下面11a形成噴嘴13,並且將保持構件10上下移動地垂下,從噴嘴13a使流體噴出,藉此,可相對於保持面110a,將卡合部12自動地定位於預定距離而無需進行調整,且抑制保持構件10接觸於夾頭座110、181的保持面110a。又,板狀物搬送裝置1及切割裝置100,係發揮如下述之效果:以從保持構件10的噴嘴13a所噴出之流體沿著保持面110a流動的方式,可促進將被加工物W從保持面110a浮起,使卡合部12輕易地滑入被加工物W的下面側。
藉此,板狀物搬送裝置1及切割裝置100,係亦具有如下述之效果:亦可防止卡合部12接觸於保持面
110a而破損的情況,且移動單元30的調整亦變得容易。其結果,板狀物搬送裝置1及切割裝置100,係無需增加用以調整裝置之各部位的位置之所需工時,便可抑制裝置的破損。
又,由於第1實施形態之板狀物搬送裝置1及切割裝置100,係在被保持於保持構件10之被加工物W的外周,具備有可在支撐板部20上下移動地垂下的限制銷41,因此,即便從保持了圖13(a)所示之被加工物W的狀態,使保持構件10從被加工物W遠離,亦如圖13(b)所示,被加工物W的移動會被限制銷41限制,相較於圖14(a)及圖14(b)所示的比較例,可抑制被加工物W的位置偏移。因此,第1實施形態之板狀物搬送裝置1及切割裝置100,係可將被加工物W搬入至相同的位置。
另外,圖13(a),係第1實施形態之板狀物搬送裝置的保持構件保持被加工物之狀態的平面圖;圖13(b),係圖13(a)所示的保持構件從被加工物遠離之狀態的平面圖。圖14(a),係不具備有比較例之限制銷之板狀物搬送裝置的保持構件保持被加工物之狀態的平面圖;圖14(b),係圖14(a)所示的保持構件從被加工物遠離之狀態的平面圖。由於圖14(a)所示的比較例,係不具備有限制銷41,因此,當從保持了圖14(a)之被加工物W的狀態,使保持構件10從被加工物W遠離時,則導致被加工物W緊貼於任一個保持構件10,如圖14(b)的虛線或二點鏈線所示,被加工物W沿著保持面110a移動。
基於圖面,說明本發明之第2實施形態之板狀物搬送裝置及加工裝置。圖15,係表示第2實施形態之板狀物搬送裝置之主要部分的剖面圖。圖16,係表示圖15所示之保持構件產生擺動之狀態的剖面圖。另外,圖15及圖16,係對與第1實施形態相同部分賦予相同符號而省略說明。
第2實施形態之加工裝置即切割裝置100的板狀物搬送裝置1-2,係如圖15所示,被設置於連桿31的一端部,且***有保持構件10之被***部11b的孔31a-2被形成為徑比第1實施形態大的孔,以便桿部11如圖15般自如地傾斜。第2實施形態之板狀物搬送裝置1-2的保持構件10,係以使卡合部12在支撐板部20的徑方向亦即保持構件10的移動單元30所致之移動方向上位移的方式,如圖15的實線所示,可在支撐板部20擺動地垂下。為此,第2實施形態之板狀物搬送裝置1-2的保持構件10,係當從噴嘴部13之噴嘴13a噴射流體時,則如圖16所示,藉由流體之白努利效應,以使桿部11之下面11a成為與夾頭座110,181之保持面110a平行的方式,調整桿部11之擺動方向的傾斜。
由於第2實施形態之板狀物搬送裝置1-2及切割裝置100,係在卡合於被加工物W的外周緣之桿部11的下面11a形成噴嘴13a,並且將保持構件10上下移動地垂下,從噴嘴13a使流體噴出,因此,與第1實施形態相同
地,無需增加用以調整裝置之各部位的位置之所需工時,便可抑制裝置的破損。
又,由於第2實施形態之板狀物搬送裝置1-2及切割裝置100,係可將保持構件10的桿部11擺動地垂下,因此,即便以成為與保持面110a平行的方式,不調整桿部11之下面11a,亦由於下面11a藉由噴射的流體之白努利效應而自動地與保持面110a平行,因此,可發揮不需調整保持構件10朝保持面110a之角度的效果。
參閱圖17~圖21,說明本發明之各實施形態之變形例之板狀物搬送裝置及加工裝置。另外,在圖17~圖21中,係對與第1實施形態相同部分賦予相同符號而省略說明。
如圖17及圖18所示,於支撐板部20之周方向,等間隔地隔著間隔設置有4個各實施形態之第1變形例及第2變形例之板狀物搬送裝置1的保持構件10。圖17所示的4個保持構件10,係與第1實施形態相同地,往支撐板部20的徑方向移動,圖18所示的4個保持構件10,係沿著彼此平行的二條直線L(圖18中以一點鏈線所示)移動。
於支撐板部20之周方向,等間隔地隔著間隔設置有2個各實施形態之第3變形例之板狀物搬送裝置1之圖19所示的保持構件10-2。圖19所示的保持構件10-2,係被配置於彼此間夾著支撐板部20之中央部的位置。保持構件10-2,係被形成為桿部11-2之平面視圖的長邊方向與被
加工物W之外周緣的切線平行之矩形狀,且與保持構件10之被加工物W的外周緣對向之內面11d會彎曲成與被加工物W的外周緣平行。又,卡合部12,係涵蓋內面11d的全長而設置。
各實施形態之第4變形例之插通板狀物搬送裝置1之限制銷41-4的孔61,係被形成為在支撐板部20的徑方向,亦即保持構件10的移動單元30所致之移動方向上較長的長孔。限制銷41,係以使下端在支撐板部20的徑方向亦即保持構件10的移動單元30所致之移動方向上位移的方式,如圖21的虛線所示,可在支撐板部20擺動地垂下。
又,各實施形態之第4變形例之板狀物搬送裝置1之限制銷41-4的下面41c,係如圖20所示,設置有限制銷噴嘴42,該限制銷噴嘴42,係朝向保持面110a噴射流體,將限制銷41-4的下面41c定位於保持面110a附近。流體,係例如空氣。在限制銷噴嘴42,係連接有將來自未圖示之流體供給源的流體供給至限制銷噴嘴42的流體供給部43。流體供給部43,係具備有:供給通路43a,被設置於限制銷41-4內且連接於限制銷噴嘴42;及供給管43b,連接於供給通路43a與流體供給源。
第4變形例之板狀物搬送裝置1的限制銷41-4,係當保持單元2之保持構件10接近夾頭座110、181的框部112時,為了從限制銷噴嘴42噴出流體,而限制銷41不會與夾頭座110、181的框部112接觸,並且從限制銷噴嘴42所噴出之流體沿著框部112的表面流動而產生白努利效
應,藉由白努利效應,限制銷41之下面41c被吸引至夾頭座110、181的框部112。而且,板狀物搬送裝置1,係藉由流體之白努利效應,將限制銷41之下面41c定位於與保持面110a稍微遠離之保持面110a附近的,並且藉由流體之白努利效應,以使限制銷41之下面41c與夾頭座110、181之保持面110a平行的方式,調整限制銷41之擺動方向的傾斜。
又,在本發明中,限制銷41、41-4,係亦可與保持構件10、10-2相同地,被設定為以氣缸33等的致動器等而可徑方向地往支撐板部20移動,除了被加工物W搬入時以外,係退避至徑方向外側,而僅在搬入時,被定位於徑方向內側的作用位置(防止被加工物W之側向偏移的位置)。又,在本發明中,限制銷41-4,係亦可為不進行擺動的構造。
由於圖17~圖21所示之第1變形例、第2變形例、第3變形例及第4變形例之板狀物搬送裝置1及切割裝置100,係在卡合於被加工物W的外周緣之桿部11的下面11a形成噴嘴13a,並且將保持構件10上下移動地垂下,從噴嘴13a使流體噴出,因此,與第1實施形態相同地,無需增加用以調整裝置之各部位的位置之所需工時,便可抑制裝置的破損。
又,由於圖20及圖21所示之第4變形例之板狀物搬送裝置1及切割裝置100,係從被設置為可擺動之限制銷41的下面41c噴射流體,因此,限制銷與第2實施形態之
保持構件10相同地,被自動地定位於距離保持面110a預定高度處,並且保持面110a與下面41c被保持為平行。由於限制銷41,係以自動地被定位於幾乎擦到保持面110a之高度的方式,使得保持面110a與限制銷41不會衝撞,因此,確實不需進行板狀物搬送裝置1的位置調整。
另外,本發明,係不限定於上述實施形態者。亦即,在不脫離本發明之主旨的範圍內,可進行各種變形並實施。
1、1A、1B‧‧‧板狀物搬送裝置(搬送單元)
2‧‧‧保持單元
10‧‧‧保持構件
11‧‧‧桿部
11a‧‧‧下面
11b‧‧‧被***部
11c‧‧‧大徑部
12‧‧‧卡合部
13‧‧‧噴嘴部
13a‧‧‧噴嘴
14‧‧‧圓盤狀構件
20‧‧‧支撐板部
21‧‧‧長孔
30‧‧‧移動單元
31‧‧‧連桿
31a‧‧‧孔
Claims (4)
- 一種板狀物搬送裝置,係在夾頭座之保持面搬入或搬出板狀物,該板狀物搬送裝置,其特徵係,具備有:保持單元,保持板狀物;及移動機構,使該保持單元移動,該保持單元,係包含有:至少2個保持構件,保持板狀物之外周緣;支撐板部,可在接近或遠離板狀物之外周緣的接近遠離方向移動地支撐該保持構件;及移動單元,使該保持構件往接近遠離方向移動,該保持構件,係具有:桿部,可在該支撐板部上下移動地垂下;卡合部,被形成於該桿部之下端外周,且卡合於板狀物的外周緣;及噴嘴部,從該桿部之下面朝向該保持面噴射流體,使板狀物從該保持面浮起。
- 如申請專利範圍第1項之板狀物搬送裝置,其中,該桿部,係被鬆插至該支撐板部而可擺動地垂下,當噴射來自該噴嘴部的流體時,則該桿部之該下面以與該保持面平行的方式調整傾斜。
- 如申請專利範圍第1或2項之板狀物搬送裝置,其中, 該板狀物搬送裝置,係在被保持於該保持構件之板狀物的外周,更具備有可在該支撐板部上下移動地垂下的限制銷,在該限制銷的下面,係設置有限制銷噴嘴,該限制銷噴嘴,係朝向該保持面噴射流體,將該限制銷之下面定位於該保持面附近。
- 一種加工裝置,其特徵係,具備有:夾頭座,保持被加工物;加工單元,對被保持於該夾頭座的被加工物進行加工;及搬送單元,在該夾頭座搬入或搬出被加工物,該搬送單元,係具備有:保持單元,保持板狀物;及移動機構,使該保持單元移動,該保持單元,係包含有:至少2個保持構件,保持板狀物之外周緣;支撐板部,可在接近或遠離板狀物之外周緣的接近遠離方向移動地支撐該保持構件;及移動單元,使該保持構件往接近遠離方向移動,該保持構件,係具有:桿部,可在該支撐板部上下移動地垂下;卡合部,被形成於該桿部之下端外周,且卡合於板狀物的外周緣;及噴嘴部,從該桿部之下面朝向該保持面噴射流體,使 板狀物從該保持面浮起。
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JP7205047B2 (ja) * | 2019-01-30 | 2023-01-17 | 株式会社東京精密 | 被搬送物の位置決め装置及び位置決め方法 |
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JP3162144B2 (ja) * | 1990-11-16 | 2001-04-25 | 株式会社渡邊商行 | 薄板状基体搬送装置 |
JP4256132B2 (ja) | 2002-09-27 | 2009-04-22 | 株式会社ディスコ | 板状物の搬送装置 |
JP2004235622A (ja) * | 2003-01-09 | 2004-08-19 | Disco Abrasive Syst Ltd | 板状物の搬送装置 |
JP4634950B2 (ja) * | 2006-03-23 | 2011-02-16 | 株式会社ディスコ | ウエーハの保持機構 |
JP5623213B2 (ja) | 2010-09-17 | 2014-11-12 | 株式会社ディスコ | 切削加工装置 |
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JP2014150153A (ja) * | 2013-01-31 | 2014-08-21 | Shin Etsu Handotai Co Ltd | ウェーハ保持装置 |
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JPH1159895A (ja) * | 1997-08-27 | 1999-03-02 | Matsushita Electric Ind Co Ltd | 基板取り離し装置およびそれを用いた基板取り離し方法 |
JP2000232148A (ja) * | 1999-02-10 | 2000-08-22 | Tabai Espec Corp | 平板状ワークの位置決め装置 |
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CN107785297A (zh) | 2018-03-09 |
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DE102017214522A1 (de) | 2018-03-01 |
US20180056525A1 (en) | 2018-03-01 |
DE102017214522B4 (de) | 2021-09-02 |
US10040204B2 (en) | 2018-08-07 |
JP6689160B2 (ja) | 2020-04-28 |
TW201807772A (zh) | 2018-03-01 |
CN107785297B (zh) | 2023-03-28 |
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