TWI692394B - 線鋸裝置 - Google Patents

線鋸裝置 Download PDF

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Publication number
TWI692394B
TWI692394B TW105106853A TW105106853A TWI692394B TW I692394 B TWI692394 B TW I692394B TW 105106853 A TW105106853 A TW 105106853A TW 105106853 A TW105106853 A TW 105106853A TW I692394 B TWI692394 B TW I692394B
Authority
TW
Taiwan
Prior art keywords
steel wire
workpiece
slurry
nozzle
coolant
Prior art date
Application number
TW105106853A
Other languages
English (en)
Chinese (zh)
Other versions
TW201639680A (zh
Inventor
北川幸司
清水裕一
Original Assignee
日商信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越半導體股份有限公司 filed Critical 日商信越半導體股份有限公司
Publication of TW201639680A publication Critical patent/TW201639680A/zh
Application granted granted Critical
Publication of TWI692394B publication Critical patent/TWI692394B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW105106853A 2015-05-01 2016-03-07 線鋸裝置 TWI692394B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015094358A JP6304118B2 (ja) 2015-05-01 2015-05-01 ワイヤソー装置
JP2015-094358 2015-05-01

Publications (2)

Publication Number Publication Date
TW201639680A TW201639680A (zh) 2016-11-16
TWI692394B true TWI692394B (zh) 2020-05-01

Family

ID=57217580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106853A TWI692394B (zh) 2015-05-01 2016-03-07 線鋸裝置

Country Status (8)

Country Link
US (1) US10589446B2 (ja)
JP (1) JP6304118B2 (ja)
KR (1) KR102568196B1 (ja)
CN (1) CN107427986B (ja)
DE (1) DE112016001209T5 (ja)
SG (2) SG11201707726YA (ja)
TW (1) TWI692394B (ja)
WO (1) WO2016178297A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110962248A (zh) * 2018-09-28 2020-04-07 胜高股份有限公司 线锯用加工液供给喷嘴及向线锯供给加工液的方法
CN110039673A (zh) * 2019-04-26 2019-07-23 西安奕斯伟硅片技术有限公司 一种切割装置和方法
JP7372097B2 (ja) * 2019-09-20 2023-10-31 コマツＮｔｃ株式会社 ワイヤソー及びワイヤソーのワークの搬入出方法
CN111361030B (zh) * 2020-04-24 2021-11-23 西安奕斯伟材料科技有限公司 多线切割装置及多线切割方法
CN113601741B (zh) * 2021-08-09 2023-06-23 西安奕斯伟硅片技术有限公司 为切割硅棒的多条切割线供应砂浆的装置及硅棒切割设备
CN115816664A (zh) * 2022-12-28 2023-03-21 泉州市品河精密科技有限公司 石材切割方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1148119A (ja) * 1997-06-05 1999-02-23 Nippei Toyama Corp ワイヤソー

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US3325949A (en) * 1964-11-24 1967-06-20 Cincinnati Milling Machine Co Workpiece cooling apparatus for grinding machines
FR1600356A (ja) * 1968-01-09 1970-07-20
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
TW383249B (en) * 1998-09-01 2000-03-01 Sumitomo Spec Metals Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board
JP2000153460A (ja) 1998-11-16 2000-06-06 Tokyo Seiko Co Ltd 液体供給装置
JP2000218615A (ja) * 1999-01-29 2000-08-08 Nippei Toyama Corp ワイヤソー及びワークの脱着方法
US6468134B1 (en) * 2000-06-30 2002-10-22 Lam Research Corporation Method and apparatus for slurry distribution
JP3967969B2 (ja) * 2002-06-27 2007-08-29 京セラ株式会社 ワイヤーソー
JP2004195555A (ja) * 2002-12-16 2004-07-15 Komatsu Electronic Metals Co Ltd ワイヤソー用スラリーノズル
JP4083152B2 (ja) 2004-07-29 2008-04-30 日本碍子株式会社 ワイヤーソー装置
JP5072204B2 (ja) * 2005-08-31 2012-11-14 信越半導体株式会社 ウエーハの表面のナノトポグラフィを改善する方法及びワイヤソー装置
JP5080769B2 (ja) * 2006-09-15 2012-11-21 株式会社東京精密 研磨方法及び研磨装置
JP4816511B2 (ja) * 2007-03-06 2011-11-16 信越半導体株式会社 切断方法およびワイヤソー装置
JP5003294B2 (ja) * 2007-06-08 2012-08-15 信越半導体株式会社 切断方法
JP5045378B2 (ja) * 2007-11-08 2012-10-10 信越半導体株式会社 ワイヤソー装置
JP5234010B2 (ja) 2008-02-19 2013-07-10 信越半導体株式会社 ワイヤソーおよびワークの切断方法
JP5056645B2 (ja) 2008-07-23 2012-10-24 信越半導体株式会社 ワークの切断方法及びワイヤソー
JP5540072B2 (ja) * 2009-04-01 2014-07-02 キャボット マイクロエレクトロニクス コーポレイション 自浄式ワイヤソー装置および方法
JP2011143504A (ja) * 2010-01-14 2011-07-28 Mitsubishi Electric Corp ワイヤソー装置
KR101185683B1 (ko) * 2011-02-23 2012-09-24 주식회사 엘지실트론 단결정 잉곳 절단장치
JP5775381B2 (ja) * 2011-06-28 2015-09-09 コマツＮｔｃ株式会社 ワイヤソーの加工液ノズル
JP2013129046A (ja) * 2011-12-22 2013-07-04 Shin Etsu Handotai Co Ltd ワークの切断方法
CN202685118U (zh) * 2012-07-03 2013-01-23 浙江昱辉阳光能源有限公司 一种金刚线切片机
DE102014208187B4 (de) * 2014-04-30 2023-07-06 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben mit besonders gleichmäßiger Dicke von einem Werkstück

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1148119A (ja) * 1997-06-05 1999-02-23 Nippei Toyama Corp ワイヤソー

Also Published As

Publication number Publication date
SG11201707726YA (en) 2017-10-30
SG10201807320WA (en) 2018-09-27
JP2016209947A (ja) 2016-12-15
DE112016001209T5 (de) 2017-12-07
TW201639680A (zh) 2016-11-16
US10589446B2 (en) 2020-03-17
US20180079108A1 (en) 2018-03-22
JP6304118B2 (ja) 2018-04-04
CN107427986A (zh) 2017-12-01
KR20180004111A (ko) 2018-01-10
CN107427986B (zh) 2019-07-09
KR102568196B1 (ko) 2023-08-18
WO2016178297A1 (ja) 2016-11-10

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