TWI680832B - 被加工物的磨削方法 - Google Patents

被加工物的磨削方法 Download PDF

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Publication number
TWI680832B
TWI680832B TW104140326A TW104140326A TWI680832B TW I680832 B TWI680832 B TW I680832B TW 104140326 A TW104140326 A TW 104140326A TW 104140326 A TW104140326 A TW 104140326A TW I680832 B TWI680832 B TW I680832B
Authority
TW
Taiwan
Prior art keywords
thickness
workpiece
grinding
measuring device
ultrasonic measuring
Prior art date
Application number
TW104140326A
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English (en)
Chinese (zh)
Other versions
TW201632309A (zh
Inventor
政田孝行
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201632309A publication Critical patent/TW201632309A/zh
Application granted granted Critical
Publication of TWI680832B publication Critical patent/TWI680832B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Acoustics & Sound (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW104140326A 2015-01-16 2015-12-02 被加工物的磨削方法 TWI680832B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015006442A JP6388545B2 (ja) 2015-01-16 2015-01-16 被加工物の研削方法
JP2015-006442 2015-01-16

Publications (2)

Publication Number Publication Date
TW201632309A TW201632309A (zh) 2016-09-16
TWI680832B true TWI680832B (zh) 2020-01-01

Family

ID=56437233

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104140326A TWI680832B (zh) 2015-01-16 2015-12-02 被加工物的磨削方法

Country Status (4)

Country Link
JP (1) JP6388545B2 (ja)
KR (1) KR102234882B1 (ja)
CN (1) CN105798774B (ja)
TW (1) TWI680832B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7015139B2 (ja) * 2017-10-18 2022-02-02 株式会社ディスコ 被加工物の研削方法及び研削装置
JP7018452B2 (ja) * 2017-11-22 2022-02-10 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体
JP7034683B2 (ja) * 2017-11-29 2022-03-14 株式会社ディスコ 剥離装置
CN111479654B (zh) * 2017-12-22 2022-07-01 东京毅力科创株式会社 基板处理***、基板处理方法以及计算机存储介质
JP7123583B2 (ja) * 2018-03-14 2022-08-23 株式会社ディスコ ウエーハの生成方法およびウエーハの生成装置
JP7027215B2 (ja) * 2018-03-27 2022-03-01 株式会社ディスコ ウエーハの生成方法およびウエーハの生成装置
JP7068096B2 (ja) * 2018-08-14 2022-05-16 株式会社ディスコ 被加工物の研削方法
CN109291432A (zh) * 2018-10-30 2019-02-01 华侨大学 一种用于增材制造粉床粉层厚度的测量方法
JP2020097089A (ja) * 2018-12-19 2020-06-25 株式会社ディスコ 研削装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08210833A (ja) * 1995-02-06 1996-08-20 Tokyo Seimitsu Co Ltd ウエハ板厚測定方法及び装置
WO2006072456A1 (de) * 2004-12-30 2006-07-13 Supfina Grieshaber Gmbh & Co. Kg Werkstückdickenmessung mit ultra- oder megaschall
TW200725722A (en) * 2005-10-31 2007-07-01 Tokyo Seimitsu Co Ltd Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
TW200807538A (en) * 2006-06-12 2008-02-01 Disco Corp Wafer grinding apparatus
US20080254715A1 (en) * 2007-04-13 2008-10-16 Disco Corporation Device grinding method
JP2009107042A (ja) * 2007-10-29 2009-05-21 Disco Abrasive Syst Ltd 研削装置及び研削方法
TW200941569A (en) * 2008-03-21 2009-10-01 Tokyo Seimitsu Co Ltd Machining quality judging method for wafer grinding machine and wafer grinding machine
TW200943405A (en) * 2008-03-27 2009-10-16 Tokyo Seimitsu Co Ltd Wafer grinding method and wafer grinding machine

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256360A (ja) 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd 研削寸法測定装置
JP2000006018A (ja) 1998-06-23 2000-01-11 Disco Abrasive Syst Ltd 研削装置
JP2001009716A (ja) 1999-06-24 2001-01-16 Okamoto Machine Tool Works Ltd ウエハの厚み測定方法
US6494765B2 (en) * 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2007220775A (ja) * 2006-02-15 2007-08-30 Mitsubishi Electric Corp 半導体基板の研削装置並びに半導体デバイスの製造方法
JP2009113149A (ja) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd 研削装置
JP5133046B2 (ja) * 2007-12-28 2013-01-30 株式会社ディスコ 板状物の研削方法
CN101614533B (zh) * 2008-06-26 2012-01-11 中国科学院金属研究所 一种精确测量超薄工件厚度的方法及仪器
JP2010199227A (ja) * 2009-02-24 2010-09-09 Disco Abrasive Syst Ltd 研削装置
JP5481264B2 (ja) * 2010-04-16 2014-04-23 株式会社ディスコ 研削装置
JP5573459B2 (ja) * 2010-07-27 2014-08-20 株式会社ジェイテクト 研削方法および研削盤

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08210833A (ja) * 1995-02-06 1996-08-20 Tokyo Seimitsu Co Ltd ウエハ板厚測定方法及び装置
WO2006072456A1 (de) * 2004-12-30 2006-07-13 Supfina Grieshaber Gmbh & Co. Kg Werkstückdickenmessung mit ultra- oder megaschall
TW200725722A (en) * 2005-10-31 2007-07-01 Tokyo Seimitsu Co Ltd Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus
TW200807538A (en) * 2006-06-12 2008-02-01 Disco Corp Wafer grinding apparatus
US20080254715A1 (en) * 2007-04-13 2008-10-16 Disco Corporation Device grinding method
JP2009107042A (ja) * 2007-10-29 2009-05-21 Disco Abrasive Syst Ltd 研削装置及び研削方法
TW200941569A (en) * 2008-03-21 2009-10-01 Tokyo Seimitsu Co Ltd Machining quality judging method for wafer grinding machine and wafer grinding machine
TW200943405A (en) * 2008-03-27 2009-10-16 Tokyo Seimitsu Co Ltd Wafer grinding method and wafer grinding machine

Also Published As

Publication number Publication date
KR20160088815A (ko) 2016-07-26
TW201632309A (zh) 2016-09-16
KR102234882B1 (ko) 2021-03-31
JP2016132047A (ja) 2016-07-25
CN105798774A (zh) 2016-07-27
JP6388545B2 (ja) 2018-09-12
CN105798774B (zh) 2019-06-14

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