TWI680832B - 被加工物的磨削方法 - Google Patents
被加工物的磨削方法 Download PDFInfo
- Publication number
- TWI680832B TWI680832B TW104140326A TW104140326A TWI680832B TW I680832 B TWI680832 B TW I680832B TW 104140326 A TW104140326 A TW 104140326A TW 104140326 A TW104140326 A TW 104140326A TW I680832 B TWI680832 B TW I680832B
- Authority
- TW
- Taiwan
- Prior art keywords
- thickness
- workpiece
- grinding
- measuring device
- ultrasonic measuring
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/003—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving acoustic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Acoustics & Sound (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015006442A JP6388545B2 (ja) | 2015-01-16 | 2015-01-16 | 被加工物の研削方法 |
JP2015-006442 | 2015-01-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201632309A TW201632309A (zh) | 2016-09-16 |
TWI680832B true TWI680832B (zh) | 2020-01-01 |
Family
ID=56437233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104140326A TWI680832B (zh) | 2015-01-16 | 2015-12-02 | 被加工物的磨削方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6388545B2 (ja) |
KR (1) | KR102234882B1 (ja) |
CN (1) | CN105798774B (ja) |
TW (1) | TWI680832B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7015139B2 (ja) * | 2017-10-18 | 2022-02-02 | 株式会社ディスコ | 被加工物の研削方法及び研削装置 |
JP7018452B2 (ja) * | 2017-11-22 | 2022-02-10 | 東京エレクトロン株式会社 | 基板処理システム、基板処理方法及びコンピュータ記憶媒体 |
JP7034683B2 (ja) * | 2017-11-29 | 2022-03-14 | 株式会社ディスコ | 剥離装置 |
CN111479654B (zh) * | 2017-12-22 | 2022-07-01 | 东京毅力科创株式会社 | 基板处理***、基板处理方法以及计算机存储介质 |
JP7123583B2 (ja) * | 2018-03-14 | 2022-08-23 | 株式会社ディスコ | ウエーハの生成方法およびウエーハの生成装置 |
JP7027215B2 (ja) * | 2018-03-27 | 2022-03-01 | 株式会社ディスコ | ウエーハの生成方法およびウエーハの生成装置 |
JP7068096B2 (ja) * | 2018-08-14 | 2022-05-16 | 株式会社ディスコ | 被加工物の研削方法 |
CN109291432A (zh) * | 2018-10-30 | 2019-02-01 | 华侨大学 | 一种用于增材制造粉床粉层厚度的测量方法 |
JP2020097089A (ja) * | 2018-12-19 | 2020-06-25 | 株式会社ディスコ | 研削装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08210833A (ja) * | 1995-02-06 | 1996-08-20 | Tokyo Seimitsu Co Ltd | ウエハ板厚測定方法及び装置 |
WO2006072456A1 (de) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co. Kg | Werkstückdickenmessung mit ultra- oder megaschall |
TW200725722A (en) * | 2005-10-31 | 2007-07-01 | Tokyo Seimitsu Co Ltd | Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus |
TW200807538A (en) * | 2006-06-12 | 2008-02-01 | Disco Corp | Wafer grinding apparatus |
US20080254715A1 (en) * | 2007-04-13 | 2008-10-16 | Disco Corporation | Device grinding method |
JP2009107042A (ja) * | 2007-10-29 | 2009-05-21 | Disco Abrasive Syst Ltd | 研削装置及び研削方法 |
TW200941569A (en) * | 2008-03-21 | 2009-10-01 | Tokyo Seimitsu Co Ltd | Machining quality judging method for wafer grinding machine and wafer grinding machine |
TW200943405A (en) * | 2008-03-27 | 2009-10-16 | Tokyo Seimitsu Co Ltd | Wafer grinding method and wafer grinding machine |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63256360A (ja) | 1987-04-10 | 1988-10-24 | Sumitomo Electric Ind Ltd | 研削寸法測定装置 |
JP2000006018A (ja) | 1998-06-23 | 2000-01-11 | Disco Abrasive Syst Ltd | 研削装置 |
JP2001009716A (ja) | 1999-06-24 | 2001-01-16 | Okamoto Machine Tool Works Ltd | ウエハの厚み測定方法 |
US6494765B2 (en) * | 2000-09-25 | 2002-12-17 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
JP2007220775A (ja) * | 2006-02-15 | 2007-08-30 | Mitsubishi Electric Corp | 半導体基板の研削装置並びに半導体デバイスの製造方法 |
JP2009113149A (ja) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | 研削装置 |
JP5133046B2 (ja) * | 2007-12-28 | 2013-01-30 | 株式会社ディスコ | 板状物の研削方法 |
CN101614533B (zh) * | 2008-06-26 | 2012-01-11 | 中国科学院金属研究所 | 一种精确测量超薄工件厚度的方法及仪器 |
JP2010199227A (ja) * | 2009-02-24 | 2010-09-09 | Disco Abrasive Syst Ltd | 研削装置 |
JP5481264B2 (ja) * | 2010-04-16 | 2014-04-23 | 株式会社ディスコ | 研削装置 |
JP5573459B2 (ja) * | 2010-07-27 | 2014-08-20 | 株式会社ジェイテクト | 研削方法および研削盤 |
-
2015
- 2015-01-16 JP JP2015006442A patent/JP6388545B2/ja active Active
- 2015-12-02 TW TW104140326A patent/TWI680832B/zh active
- 2015-12-29 CN CN201511009874.4A patent/CN105798774B/zh active Active
-
2016
- 2016-01-14 KR KR1020160004667A patent/KR102234882B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08210833A (ja) * | 1995-02-06 | 1996-08-20 | Tokyo Seimitsu Co Ltd | ウエハ板厚測定方法及び装置 |
WO2006072456A1 (de) * | 2004-12-30 | 2006-07-13 | Supfina Grieshaber Gmbh & Co. Kg | Werkstückdickenmessung mit ultra- oder megaschall |
TW200725722A (en) * | 2005-10-31 | 2007-07-01 | Tokyo Seimitsu Co Ltd | Method of grinding back surface of semiconductor wafer and semiconductor wafer grinding apparatus |
TW200807538A (en) * | 2006-06-12 | 2008-02-01 | Disco Corp | Wafer grinding apparatus |
US20080254715A1 (en) * | 2007-04-13 | 2008-10-16 | Disco Corporation | Device grinding method |
JP2009107042A (ja) * | 2007-10-29 | 2009-05-21 | Disco Abrasive Syst Ltd | 研削装置及び研削方法 |
TW200941569A (en) * | 2008-03-21 | 2009-10-01 | Tokyo Seimitsu Co Ltd | Machining quality judging method for wafer grinding machine and wafer grinding machine |
TW200943405A (en) * | 2008-03-27 | 2009-10-16 | Tokyo Seimitsu Co Ltd | Wafer grinding method and wafer grinding machine |
Also Published As
Publication number | Publication date |
---|---|
KR20160088815A (ko) | 2016-07-26 |
TW201632309A (zh) | 2016-09-16 |
KR102234882B1 (ko) | 2021-03-31 |
JP2016132047A (ja) | 2016-07-25 |
CN105798774A (zh) | 2016-07-27 |
JP6388545B2 (ja) | 2018-09-12 |
CN105798774B (zh) | 2019-06-14 |
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