TWI557517B - A detection device, a lithographic apparatus, and a manufacturing method of the device - Google Patents

A detection device, a lithographic apparatus, and a manufacturing method of the device Download PDF

Info

Publication number
TWI557517B
TWI557517B TW103126742A TW103126742A TWI557517B TW I557517 B TWI557517 B TW I557517B TW 103126742 A TW103126742 A TW 103126742A TW 103126742 A TW103126742 A TW 103126742A TW I557517 B TWI557517 B TW I557517B
Authority
TW
Taiwan
Prior art keywords
light
substrate
optical member
indicator
range display
Prior art date
Application number
TW103126742A
Other languages
English (en)
Chinese (zh)
Other versions
TW201514634A (zh
Inventor
Akio Akamatsu
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW201514634A publication Critical patent/TW201514634A/zh
Application granted granted Critical
Publication of TWI557517B publication Critical patent/TWI557517B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW103126742A 2013-10-08 2014-08-05 A detection device, a lithographic apparatus, and a manufacturing method of the device TWI557517B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013211430A JP6228420B2 (ja) 2013-10-08 2013-10-08 検出装置、リソグラフィ装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
TW201514634A TW201514634A (zh) 2015-04-16
TWI557517B true TWI557517B (zh) 2016-11-11

Family

ID=52791741

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126742A TWI557517B (zh) 2013-10-08 2014-08-05 A detection device, a lithographic apparatus, and a manufacturing method of the device

Country Status (4)

Country Link
JP (1) JP6228420B2 (ja)
KR (2) KR101783514B1 (ja)
CN (1) CN104516214B (ja)
TW (1) TWI557517B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6926596B2 (ja) * 2017-03-31 2021-08-25 ウシオ電機株式会社 露光装置および露光方法
WO2020126810A1 (en) * 2018-12-20 2020-06-25 Asml Holding N.V. Apparatus for and method of simultaneously acquiring parallel alignment marks

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120099107A1 (en) * 2010-10-25 2012-04-26 Samsung Electronics Co., Ltd. Workpiece Alignment Device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721586B2 (ja) * 1985-09-30 1995-03-08 株式会社ニコン 像形成光学装置
JPS62262426A (ja) * 1986-05-09 1987-11-14 Canon Inc 露光装置
US5148214A (en) * 1986-05-09 1992-09-15 Canon Kabushiki Kaisha Alignment and exposure apparatus
JP3074579B2 (ja) * 1992-01-31 2000-08-07 キヤノン株式会社 位置ずれ補正方法
KR100464854B1 (ko) * 2002-06-26 2005-01-06 삼성전자주식회사 반도체 기판의 정렬 방법 및 정렬 장치
US7388663B2 (en) * 2004-10-28 2008-06-17 Asml Netherlands B.V. Optical position assessment apparatus and method
KR20080101865A (ko) * 2006-02-16 2008-11-21 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
SG10201507251TA (en) * 2006-08-31 2015-10-29 Nikon Corp Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method
CN101526750B (zh) * 2009-01-13 2011-06-29 上海微电子装备有限公司 用于光刻设备的对准***及应用其的光刻设备
CN101950132A (zh) * 2010-08-17 2011-01-19 中国科学院光电技术研究所 纳米光刻掩模硅片间隙测量及调平装置
CN102141738B (zh) * 2011-04-02 2012-09-19 中国科学院光电技术研究所 一种用于投影光刻纳米量级自动调焦***
US8842294B2 (en) * 2011-06-21 2014-09-23 Canon Kabushiki Kaisha Position detection apparatus, imprint apparatus, and position detection method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120099107A1 (en) * 2010-10-25 2012-04-26 Samsung Electronics Co., Ltd. Workpiece Alignment Device

Also Published As

Publication number Publication date
TW201514634A (zh) 2015-04-16
KR20170016421A (ko) 2017-02-13
KR20150041579A (ko) 2015-04-16
CN104516214A (zh) 2015-04-15
JP6228420B2 (ja) 2017-11-08
KR101828739B1 (ko) 2018-02-12
KR101783514B1 (ko) 2017-09-29
CN104516214B (zh) 2017-04-26
JP2015076491A (ja) 2015-04-20

Similar Documents

Publication Publication Date Title
JP6341883B2 (ja) 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法
US8159649B2 (en) Exposure method, exposure apparatus, photomask and method for manufacturing photomask
JP5032253B2 (ja) 測定装置および方法
JP5630628B2 (ja) 面位置検出装置、面位置検出方法、露光装置、およびデバイス製造方法
TWI461858B (zh) 表面位置偵測裝置、曝光裝置、表面位置偵測方法以及元件製造方法
US8922786B2 (en) Detector, imprint apparatus, and article manufacturing method
TWI432910B (zh) 面位置檢測裝置、曝光裝置及元件製造方法
TW200842511A (en) Position detection apparatus and exposure apparatus
JP2010066256A (ja) 面位置検出装置、露光装置、面位置検出方法およびデバイス製造方法
KR101573572B1 (ko) 임프린트 장치, 물품 제조 방법 및 패턴 전사 방법
JP7414576B2 (ja) 位置計測装置、重ね合わせ検査装置、位置計測方法、インプリント装置および物品の製造方法
JP2000081320A (ja) 面位置検出装置及びそれを用いたデバイスの製造方法
JP7152877B2 (ja) 検出装置、リソグラフィー装置および物品製造方法
JPH0566109A (ja) 位置検出装置
TWI557517B (zh) A detection device, a lithographic apparatus, and a manufacturing method of the device
TW200307182A (en) Exposing method, exposing device and manufacturing method for device
KR101760843B1 (ko) 마스크 정렬 마크, 포토마스크, 노광 장치, 노광 방법 및 디바이스의 제조 방법
JP2017092294A (ja) インプリント装置、型、および物品の製造方法
JP5401770B2 (ja) 面位置検出装置、露光装置及びデバイスの製造方法
WO2013168456A1 (ja) 面位置計測装置、露光装置、およびデバイス製造方法
JP2020122922A (ja) 光源装置、照明装置、露光装置及び物品製造方法
JP2014229803A (ja) 面位置計測装置、露光装置、およびデバイス製造方法
JP2011114209A (ja) 投影露光装置
TW200937145A (en) Surface position detecting device, exposure apparatus, and device manufacturing method
JP2002122412A (ja) 位置検出装置、露光装置およびマイクロデバイスの製造方法