TWI450941B - 再剝離性加工薄膜 - Google Patents

再剝離性加工薄膜 Download PDF

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Publication number
TWI450941B
TWI450941B TW098108526A TW98108526A TWI450941B TW I450941 B TWI450941 B TW I450941B TW 098108526 A TW098108526 A TW 098108526A TW 98108526 A TW98108526 A TW 98108526A TW I450941 B TWI450941 B TW I450941B
Authority
TW
Taiwan
Prior art keywords
peelable
film
processed film
mass
processed
Prior art date
Application number
TW098108526A
Other languages
English (en)
Chinese (zh)
Other versions
TW200951197A (en
Inventor
Kenji Nasu
Akihito Yamada
Yuichi Kurata
Kouji Tabata
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200951197A publication Critical patent/TW200951197A/zh
Application granted granted Critical
Publication of TWI450941B publication Critical patent/TWI450941B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW098108526A 2008-03-18 2009-03-17 再剝離性加工薄膜 TWI450941B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008069899 2008-03-18
JP2008267698 2008-10-16
JP2009039490A JP5554503B2 (ja) 2008-03-18 2009-02-23 再剥離性工程フィルム

Publications (2)

Publication Number Publication Date
TW200951197A TW200951197A (en) 2009-12-16
TWI450941B true TWI450941B (zh) 2014-09-01

Family

ID=41091075

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098108526A TWI450941B (zh) 2008-03-18 2009-03-17 再剝離性加工薄膜

Country Status (5)

Country Link
JP (1) JP5554503B2 (ja)
KR (1) KR101568443B1 (ja)
CN (1) CN101978798B (ja)
TW (1) TWI450941B (ja)
WO (1) WO2009116685A1 (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011068822A (ja) * 2009-09-28 2011-04-07 Hitachi Kasei Polymer Co Ltd セパレータ付き接着フィルム
JP2011243502A (ja) 2010-05-20 2011-12-01 Ichikoh Ind Ltd 車両用灯具
JP5875318B2 (ja) * 2010-11-30 2016-03-02 日東電工株式会社 表面保護シート
JP2013177603A (ja) * 2010-11-30 2013-09-09 Nitto Denko Corp 表面保護シート
JP6231254B2 (ja) * 2010-11-30 2017-11-15 日東電工株式会社 表面保護シート
JP2013147664A (ja) * 2010-11-30 2013-08-01 Nitto Denko Corp 表面保護シート
JP6001258B2 (ja) * 2011-11-28 2016-10-05 日東電工株式会社 保護シートおよびその製造方法
CN103366636B (zh) * 2012-03-28 2016-08-17 深圳坤邦标价用品有限公司 一种模内标签及其制造方法
JP6009189B2 (ja) * 2012-03-28 2016-10-19 リンテック株式会社 電子部品加工用粘着シートおよび半導体装置の製造方法
JP5850498B2 (ja) * 2012-07-13 2016-02-03 フィスコ インタ−ナショナル株式会社 再剥離性絶縁シート
JP6557214B2 (ja) 2014-03-06 2019-08-07 リンテック株式会社 フィルム付き固体電解質膜およびその製造方法
JP6291679B2 (ja) * 2014-03-31 2018-03-14 リンテック株式会社 透明導電性基板用表面保護フィルムの製造方法、透明導電性基板用表面保護フィルムおよび積層体
JP6613516B2 (ja) * 2014-07-07 2019-12-04 リンテック株式会社 表面保護フィルム
WO2016006719A1 (ja) * 2014-07-07 2016-01-14 リンテック株式会社 表面保護フィルム
JP6418872B2 (ja) * 2014-09-26 2018-11-07 ソマール株式会社 配線基板製造工程用バックアップフィルム
JP6537248B2 (ja) * 2014-10-31 2019-07-03 株式会社康井精機 機能性物質薄膜素材の製造方法並びに機能性物質薄膜素材およびその積層体
JP6176270B2 (ja) * 2015-02-21 2017-08-09 三菱ケミカル株式会社 離型フィルム
WO2016142966A1 (ja) * 2015-03-11 2016-09-15 中島ゴム工業株式会社 接着シート
JP6263812B2 (ja) * 2015-06-24 2018-01-24 藤森工業株式会社 粘着フィルム及び表面保護フィルム
JP6611252B2 (ja) * 2016-03-28 2019-11-27 リンテック株式会社 半導体加工用シート
JP6337059B2 (ja) * 2016-10-26 2018-06-06 藤森工業株式会社 粘着フィルム及び表面保護フィルム
TWI645005B (zh) * 2017-03-03 2018-12-21 得萬利科技股份有限公司 熱壓用保護離型膠及其應用
JP6601884B2 (ja) * 2018-05-07 2019-11-06 藤森工業株式会社 粘着剤組成物、粘着フィルム及び表面保護フィルム
JP2020063425A (ja) * 2018-10-05 2020-04-23 三菱ケミカル株式会社 活性エネルギー線硬化性剥離型粘着剤組成物および剥離型粘着シート
JP7137434B2 (ja) * 2018-10-15 2022-09-14 大塚化学株式会社 粘着剤組成物および粘着フィルム
JP7038091B2 (ja) * 2019-09-30 2022-03-17 三菱製紙株式会社 粘着シート
JP7437629B2 (ja) 2020-06-18 2024-02-26 ダイニック株式会社 衣料用工程シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200407404A (en) * 2002-08-29 2004-05-16 Lintec Corp Pressure sensitive adhesive articles
TW200525662A (en) * 2004-01-23 2005-08-01 Nitto Denko Corp Process for producing semiconductor devices, and heat resistant adhesive tape used in this process
JP2005281423A (ja) * 2004-03-29 2005-10-13 Lintec Corp 再剥離性工程フィルム及び再剥離性工程フィルムの貼合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3323276B2 (ja) * 1992-07-13 2002-09-09 株式会社日本触媒 高分子量アクリル系重合体およびその用途
JP4880877B2 (ja) * 2004-01-16 2012-02-22 リンテック株式会社 フレキシブルプリント配線基板の製造方法及び該製造方法に用いる再剥離性剥離材付き工程フィルム
JP2006332419A (ja) * 2005-05-27 2006-12-07 Nitto Denko Corp 固体撮像デバイス保護用粘着テープおよびそれを用いた映像センサの実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200407404A (en) * 2002-08-29 2004-05-16 Lintec Corp Pressure sensitive adhesive articles
TW200525662A (en) * 2004-01-23 2005-08-01 Nitto Denko Corp Process for producing semiconductor devices, and heat resistant adhesive tape used in this process
JP2005281423A (ja) * 2004-03-29 2005-10-13 Lintec Corp 再剥離性工程フィルム及び再剥離性工程フィルムの貼合方法

Also Published As

Publication number Publication date
CN101978798A (zh) 2011-02-16
CN101978798B (zh) 2013-04-24
KR20100127222A (ko) 2010-12-03
TW200951197A (en) 2009-12-16
JP2010116532A (ja) 2010-05-27
WO2009116685A1 (ja) 2009-09-24
KR101568443B1 (ko) 2015-11-20
JP5554503B2 (ja) 2014-07-23

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