CN101978798B - 再剥离性工程薄膜 - Google Patents

再剥离性工程薄膜 Download PDF

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Publication number
CN101978798B
CN101978798B CN2009801095985A CN200980109598A CN101978798B CN 101978798 B CN101978798 B CN 101978798B CN 2009801095985 A CN2009801095985 A CN 2009801095985A CN 200980109598 A CN200980109598 A CN 200980109598A CN 101978798 B CN101978798 B CN 101978798B
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China
Prior art keywords
film
releasable
engineering
engineering film
nappe
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CN2009801095985A
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English (en)
Chinese (zh)
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CN101978798A (zh
Inventor
那须健司
山田晃史
仓田雄一
田畠浩司
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Lintec Corp
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Lintec Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
CN2009801095985A 2008-03-18 2009-03-18 再剥离性工程薄膜 Active CN101978798B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2008069899 2008-03-18
JP2008-069899 2008-03-18
JP2008-267698 2008-10-16
JP2008267698 2008-10-16
JP2009-039490 2009-02-23
JP2009039490A JP5554503B2 (ja) 2008-03-18 2009-02-23 再剥離性工程フィルム
PCT/JP2009/056024 WO2009116685A1 (ja) 2008-03-18 2009-03-18 再剥離性工程フィルム

Publications (2)

Publication Number Publication Date
CN101978798A CN101978798A (zh) 2011-02-16
CN101978798B true CN101978798B (zh) 2013-04-24

Family

ID=41091075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801095985A Active CN101978798B (zh) 2008-03-18 2009-03-18 再剥离性工程薄膜

Country Status (5)

Country Link
JP (1) JP5554503B2 (ja)
KR (1) KR101568443B1 (ja)
CN (1) CN101978798B (ja)
TW (1) TWI450941B (ja)
WO (1) WO2009116685A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011068822A (ja) * 2009-09-28 2011-04-07 Hitachi Kasei Polymer Co Ltd セパレータ付き接着フィルム
JP2011243502A (ja) 2010-05-20 2011-12-01 Ichikoh Ind Ltd 車両用灯具
JP5875318B2 (ja) * 2010-11-30 2016-03-02 日東電工株式会社 表面保護シート
JP2013177603A (ja) * 2010-11-30 2013-09-09 Nitto Denko Corp 表面保護シート
JP6231254B2 (ja) * 2010-11-30 2017-11-15 日東電工株式会社 表面保護シート
JP2013147664A (ja) * 2010-11-30 2013-08-01 Nitto Denko Corp 表面保護シート
JP6001258B2 (ja) * 2011-11-28 2016-10-05 日東電工株式会社 保護シートおよびその製造方法
CN103366636B (zh) * 2012-03-28 2016-08-17 深圳坤邦标价用品有限公司 一种模内标签及其制造方法
JP6009189B2 (ja) * 2012-03-28 2016-10-19 リンテック株式会社 電子部品加工用粘着シートおよび半導体装置の製造方法
JP5850498B2 (ja) * 2012-07-13 2016-02-03 フィスコ インタ−ナショナル株式会社 再剥離性絶縁シート
JP6557214B2 (ja) 2014-03-06 2019-08-07 リンテック株式会社 フィルム付き固体電解質膜およびその製造方法
JP6291679B2 (ja) * 2014-03-31 2018-03-14 リンテック株式会社 透明導電性基板用表面保護フィルムの製造方法、透明導電性基板用表面保護フィルムおよび積層体
JP6613516B2 (ja) * 2014-07-07 2019-12-04 リンテック株式会社 表面保護フィルム
WO2016006719A1 (ja) * 2014-07-07 2016-01-14 リンテック株式会社 表面保護フィルム
JP6418872B2 (ja) * 2014-09-26 2018-11-07 ソマール株式会社 配線基板製造工程用バックアップフィルム
JP6537248B2 (ja) * 2014-10-31 2019-07-03 株式会社康井精機 機能性物質薄膜素材の製造方法並びに機能性物質薄膜素材およびその積層体
JP6176270B2 (ja) * 2015-02-21 2017-08-09 三菱ケミカル株式会社 離型フィルム
WO2016142966A1 (ja) * 2015-03-11 2016-09-15 中島ゴム工業株式会社 接着シート
JP6263812B2 (ja) * 2015-06-24 2018-01-24 藤森工業株式会社 粘着フィルム及び表面保護フィルム
JP6611252B2 (ja) * 2016-03-28 2019-11-27 リンテック株式会社 半導体加工用シート
JP6337059B2 (ja) * 2016-10-26 2018-06-06 藤森工業株式会社 粘着フィルム及び表面保護フィルム
TWI645005B (zh) * 2017-03-03 2018-12-21 得萬利科技股份有限公司 熱壓用保護離型膠及其應用
JP6601884B2 (ja) * 2018-05-07 2019-11-06 藤森工業株式会社 粘着剤組成物、粘着フィルム及び表面保護フィルム
JP2020063425A (ja) * 2018-10-05 2020-04-23 三菱ケミカル株式会社 活性エネルギー線硬化性剥離型粘着剤組成物および剥離型粘着シート
JP7137434B2 (ja) * 2018-10-15 2022-09-14 大塚化学株式会社 粘着剤組成物および粘着フィルム
JP7038091B2 (ja) * 2019-09-30 2022-03-17 三菱製紙株式会社 粘着シート
JP7437629B2 (ja) 2020-06-18 2024-02-26 ダイニック株式会社 衣料用工程シート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1642407A (zh) * 2004-01-16 2005-07-20 琳得科株式会社 释放工艺薄膜

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JP3323276B2 (ja) * 1992-07-13 2002-09-09 株式会社日本触媒 高分子量アクリル系重合体およびその用途
JP4047103B2 (ja) * 2002-08-29 2008-02-13 リンテック株式会社 貼着体
JP4566568B2 (ja) * 2004-01-23 2010-10-20 日東電工株式会社 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
JP4667759B2 (ja) * 2004-03-29 2011-04-13 リンテック株式会社 フレキシブルプリント配線基板用再剥離性工程フィルム及びその貼合方法
JP2006332419A (ja) * 2005-05-27 2006-12-07 Nitto Denko Corp 固体撮像デバイス保護用粘着テープおよびそれを用いた映像センサの実装方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1642407A (zh) * 2004-01-16 2005-07-20 琳得科株式会社 释放工艺薄膜

Non-Patent Citations (1)

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Title
JP特开2005-281423A 2005.10.13

Also Published As

Publication number Publication date
CN101978798A (zh) 2011-02-16
KR20100127222A (ko) 2010-12-03
TW200951197A (en) 2009-12-16
JP2010116532A (ja) 2010-05-27
WO2009116685A1 (ja) 2009-09-24
KR101568443B1 (ko) 2015-11-20
JP5554503B2 (ja) 2014-07-23
TWI450941B (zh) 2014-09-01

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