TWI304003B - - Google Patents

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Publication number
TWI304003B
TWI304003B TW095136215A TW95136215A TWI304003B TW I304003 B TWI304003 B TW I304003B TW 095136215 A TW095136215 A TW 095136215A TW 95136215 A TW95136215 A TW 95136215A TW I304003 B TWI304003 B TW I304003B
Authority
TW
Taiwan
Prior art keywords
silver
powder
copper
particles
composite powder
Prior art date
Application number
TW095136215A
Other languages
English (en)
Chinese (zh)
Other versions
TW200714392A (en
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200714392A publication Critical patent/TW200714392A/zh
Application granted granted Critical
Publication of TWI304003B publication Critical patent/TWI304003B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
TW095136215A 2005-10-03 2006-09-29 Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder TW200714392A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005289930A JP5080731B2 (ja) 2005-10-03 2005-10-03 微粒銀粒子付着銀銅複合粉及びその微粒銀粒子付着銀銅複合粉製造方法

Publications (2)

Publication Number Publication Date
TW200714392A TW200714392A (en) 2007-04-16
TWI304003B true TWI304003B (ko) 2008-12-11

Family

ID=37906236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136215A TW200714392A (en) 2005-10-03 2006-09-29 Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder

Country Status (4)

Country Link
JP (1) JP5080731B2 (ko)
KR (1) KR101301634B1 (ko)
TW (1) TW200714392A (ko)
WO (1) WO2007040195A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556257B (zh) * 2013-08-07 2016-11-01 Mitsui Mining & Smelting Co Composite copper particles and methods for producing the same

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2009116349A1 (ja) * 2008-03-21 2011-07-21 旭硝子株式会社 銅ナノ粒子被覆銅フィラー、その製造方法、銅ペーストおよび金属膜を有する物品
KR101616703B1 (ko) * 2008-08-11 2016-04-29 지호우 도쿠리츠 교세이 호진 오사카 시리츠 고교 겐큐쇼 복합나노입자 및 그 제조방법
TWI453076B (zh) * 2009-02-11 2014-09-21 Univ Nat Cheng Kung 可調粒徑奈米核殼材料之合成方法及其應用
KR101101359B1 (ko) * 2009-11-30 2012-01-02 주식회사 지오션 은 코팅 구리 플레이크 분말의 제조방법 및 이의 제조방법에 의해 제조된 은 코팅 구리 플레이크 분말
WO2012133627A1 (ja) * 2011-03-31 2012-10-04 戸田工業株式会社 銀コート銅粉及びその製造法、該銀コート銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路
KR101307238B1 (ko) * 2011-12-09 2013-09-11 (주)선경에스티 전자파 차폐용 은코팅 구리분말 제조 방법
JPWO2014054618A1 (ja) * 2012-10-03 2016-08-25 戸田工業株式会社 銀ハイブリッド銅粉とその製造法、該銀ハイブリッド銅粉を含有する導電性ペースト、導電性接着剤、導電性膜、及び電気回路
JP5785532B2 (ja) * 2012-11-30 2015-09-30 三井金属鉱業株式会社 銀コート銅粉及びその製造方法
JP6210723B2 (ja) * 2013-05-08 2017-10-11 三井金属鉱業株式会社 銀コートニッケル粒子及びその製造方法
JP6309758B2 (ja) * 2013-12-26 2018-04-11 三井金属鉱業株式会社 銀コート銅粉及びその製造方法
JP2018509524A (ja) * 2015-01-09 2018-04-05 クラークソン ユニバーシティ 銀被覆銅フレーク及びその製造方法
JP6715588B2 (ja) * 2015-10-26 2020-07-01 Ｄｏｗａエレクトロニクス株式会社 金属複合粉末の製造方法
CN105921737B (zh) * 2016-04-28 2018-01-19 中南大学 一种铜银复合粉的制备方法和导电胶
JP2019206760A (ja) * 2019-07-03 2019-12-05 Ｄｏｗａエレクトロニクス株式会社 金属複合粉末およびその製造方法
JP7414421B2 (ja) * 2019-08-05 2024-01-16 田中貴金属工業株式会社 金粉末及び該金粉末の製造方法並びに金ペースト
KR20230057342A (ko) * 2020-08-26 2023-04-28 미쓰이금속광업주식회사 은 피복 플레이크상 구리 분말 및 그 제조 방법
WO2023074580A1 (ja) * 2021-10-25 2023-05-04 トッパン・フォームズ株式会社 焼結材、金属焼結体、焼結材の製造方法、接合体の製造方法、及び接合体
CN114226724B (zh) * 2021-12-22 2024-01-16 合肥工业大学 一种铜@银核壳结构颗粒及相关制备方法和应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133006A (ja) * 1989-10-18 1991-06-06 Asahi Chem Ind Co Ltd 銀銅合金系導電性ペーストならびに該ペーストを用いた導電体
JPH06128609A (ja) * 1992-10-15 1994-05-10 Daido Steel Co Ltd Ａｇ−Ｃｕ系合金粉の製造方法
JPH07331360A (ja) * 1994-06-06 1995-12-19 Asahi Chem Ind Co Ltd 新規な銅合金粉末及びその製造方法
JPH11310806A (ja) * 1998-04-28 1999-11-09 Fukuda Metal Foil & Powder Co Ltd 導電ペースト用銅銀複合粉の製造方法
JP3874634B2 (ja) * 2001-08-10 2007-01-31 福田金属箔粉工業株式会社 導体ペースト用のフレーク状銀粉及びそれを用いた導体ペースト
JP2005060831A (ja) * 2003-07-29 2005-03-10 Mitsubishi Materials Corp 複合金属粉末とその製造方法、および銀粘土
JP4047304B2 (ja) * 2003-10-22 2008-02-13 三井金属鉱業株式会社 微粒銀粒子付着銀粉及びその微粒銀粒子付着銀粉の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556257B (zh) * 2013-08-07 2016-11-01 Mitsui Mining & Smelting Co Composite copper particles and methods for producing the same

Also Published As

Publication number Publication date
WO2007040195A1 (ja) 2007-04-12
JP2007100155A (ja) 2007-04-19
KR101301634B1 (ko) 2013-08-29
KR20080052646A (ko) 2008-06-11
JP5080731B2 (ja) 2012-11-21
TW200714392A (en) 2007-04-16

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