TW200714392A - Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder - Google Patents

Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder

Info

Publication number
TW200714392A
TW200714392A TW095136215A TW95136215A TW200714392A TW 200714392 A TW200714392 A TW 200714392A TW 095136215 A TW095136215 A TW 095136215A TW 95136215 A TW95136215 A TW 95136215A TW 200714392 A TW200714392 A TW 200714392A
Authority
TW
Taiwan
Prior art keywords
silver
composite powder
copper composite
production
copper
Prior art date
Application number
TW095136215A
Other languages
Chinese (zh)
Other versions
TWI304003B (en
Inventor
Takaya Sasaki
Takahiko Sakaue
Takashi Fujimoto
Kathiko Yoshimaru
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200714392A publication Critical patent/TW200714392A/en
Application granted granted Critical
Publication of TWI304003B publication Critical patent/TWI304003B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape

Abstract

Disclosed is a silver-copper composite powder having a silver microparticle attached thereto, which is finely granulated, has an even particle size, is excellent in low temperature sintering property and can be used for a wide variety of application purposes. Also disclosed is a method of production of the silver-copper composite powder. The silver-copper composite powder comprises a silver-copper composite powder and a silver microparticle attached onto the composite powder. The method of production of the silver-copper composite powder comprises the steps of: contacting a silver-copper composite powder with a solution containing a silver complex, wherein the solution is prepared by mixing and dissolving silver nitrate and a complexing agent while stirring; and adding a reducing agent to the resulting solution to thereby cause the precipitation of a silver microparticle onto the surface of a silver-copper powder.
TW095136215A 2005-10-03 2006-09-29 Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder TW200714392A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005289930A JP5080731B2 (en) 2005-10-03 2005-10-03 Fine silver particle-attached silver-copper composite powder and method for producing the fine silver particle-attached silver-copper composite powder

Publications (2)

Publication Number Publication Date
TW200714392A true TW200714392A (en) 2007-04-16
TWI304003B TWI304003B (en) 2008-12-11

Family

ID=37906236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136215A TW200714392A (en) 2005-10-03 2006-09-29 Silver-copper composite powder having silver microparticule attached thereto, and method of production of the silver-copper composite powder

Country Status (4)

Country Link
JP (1) JP5080731B2 (en)
KR (1) KR101301634B1 (en)
TW (1) TW200714392A (en)
WO (1) WO2007040195A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453076B (en) * 2009-02-11 2014-09-21 Univ Nat Cheng Kung Synthesis of nanosize-controllable core-shell materials
TWI763637B (en) * 2015-10-26 2022-05-11 日商同和電子科技有限公司 Metal composite powder and method for producing same

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009116349A1 (en) * 2008-03-21 2009-09-24 旭硝子株式会社 Copper nanoparticle-coated copper filler, method for producing the same, copper paste, and article having metal film
US8999206B2 (en) * 2008-08-11 2015-04-07 Osaka Municipal Technical Research Institute Composite nanoparticles and manufacturing method thereof
KR101101359B1 (en) * 2009-11-30 2012-01-02 주식회사 지오션 Copper flake powder for silver coated and manufacturing method
WO2012133627A1 (en) * 2011-03-31 2012-10-04 戸田工業株式会社 Silver-coated copper powder and method for producing same, silver-coated copper powder-containing conductive paste, conductive adhesive agent, conductive film, and electric circuit
KR101307238B1 (en) * 2011-12-09 2013-09-11 (주)선경에스티 Method for producing silver coated copper powder
CN104797360A (en) * 2012-10-03 2015-07-22 户田工业株式会社 Silver hybrid copper powder, method for producing same, conductive paste containing silver hybrid copper powder, conductive adhesive, conductive film and electrical circuit
JP5785532B2 (en) * 2012-11-30 2015-09-30 三井金属鉱業株式会社 Silver-coated copper powder and method for producing the same
JP6210723B2 (en) * 2013-05-08 2017-10-11 三井金属鉱業株式会社 Silver-coated nickel particles and method for producing the same
JP2015034309A (en) * 2013-08-07 2015-02-19 三井金属鉱業株式会社 Composite copper particles and method for manufacturing the same
JP6309758B2 (en) * 2013-12-26 2018-04-11 三井金属鉱業株式会社 Silver-coated copper powder and method for producing the same
WO2016112081A1 (en) * 2015-01-09 2016-07-14 Clarkson University Silver coated copper flakes and methods of their manufacture
CN105921737B (en) * 2016-04-28 2018-01-19 中南大学 The preparation method and conducting resinl of a kind of cuprum argentum composite powder
JP2019206760A (en) * 2019-07-03 2019-12-05 Ｄｏｗａエレクトロニクス株式会社 Metal composite powder and manufacturing method thereof
JP7414421B2 (en) * 2019-08-05 2024-01-16 田中貴金属工業株式会社 Gold powder, method for producing the gold powder, and gold paste
EP4205886A4 (en) * 2020-08-26 2024-01-24 Mitsui Mining & Smelting Co Ltd Silver-coated flake-form copper powder, and method for manufacturing same
WO2023074580A1 (en) * 2021-10-25 2023-05-04 トッパン・フォームズ株式会社 Sintered material, metal sintered compact, manufacturing method for sintered material, manufacturing method for joined body, and joined body
CN114226724B (en) * 2021-12-22 2024-01-16 合肥工业大学 Copper@silver core-shell structure particle and related preparation method and application

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03133006A (en) * 1989-10-18 1991-06-06 Asahi Chem Ind Co Ltd Silver-copper alloy group conductive paste and conductor using same
JPH06128609A (en) * 1992-10-15 1994-05-10 Daido Steel Co Ltd Production of ag-cu alloy powder
JPH07331360A (en) * 1994-06-06 1995-12-19 Asahi Chem Ind Co Ltd New copper alloy powder and its production
JPH11310806A (en) * 1998-04-28 1999-11-09 Fukuda Metal Foil & Powder Co Ltd Production of copper-silver composite powder for electrically conductive paste
JP3874634B2 (en) * 2001-08-10 2007-01-31 福田金属箔粉工業株式会社 Flake-like silver powder for conductor paste and conductor paste using the same
JP2005060831A (en) * 2003-07-29 2005-03-10 Mitsubishi Materials Corp Composite metal powder and its production method, and silver clay
JP4047304B2 (en) * 2003-10-22 2008-02-13 三井金属鉱業株式会社 Fine silver particle-attached silver powder and method for producing the fine silver particle-attached silver powder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI453076B (en) * 2009-02-11 2014-09-21 Univ Nat Cheng Kung Synthesis of nanosize-controllable core-shell materials
TWI763637B (en) * 2015-10-26 2022-05-11 日商同和電子科技有限公司 Metal composite powder and method for producing same

Also Published As

Publication number Publication date
KR20080052646A (en) 2008-06-11
JP2007100155A (en) 2007-04-19
TWI304003B (en) 2008-12-11
KR101301634B1 (en) 2013-08-29
JP5080731B2 (en) 2012-11-21
WO2007040195A1 (en) 2007-04-12

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MM4A Annulment or lapse of patent due to non-payment of fees