JP2018509524A - 銀被覆銅フレーク及びその製造方法 - Google Patents
銀被覆銅フレーク及びその製造方法 Download PDFInfo
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- JP2018509524A JP2018509524A JP2017536565A JP2017536565A JP2018509524A JP 2018509524 A JP2018509524 A JP 2018509524A JP 2017536565 A JP2017536565 A JP 2017536565A JP 2017536565 A JP2017536565 A JP 2017536565A JP 2018509524 A JP2018509524 A JP 2018509524A
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- silver
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- flakes
- copper flakes
- polyamine
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
- B22F1/145—Chemical treatment, e.g. passivation or decarburisation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
Description
銅フレークの表面洗浄は、600cm3のビーカー内で実施され、以下の二工程からなっていた。(a)酸によるすすぎとそれに続いて行われる(b)アミン処理。
移動反応を、激しく混合しながら2 dm3のビーカー内において実施した(1900rpmでの中プロペラ)。
無電解めっき反応を、2dm3のビーカー内において、1900rpmでの中プロペラを用いる極めて強い撹拌下で実施した。
10.75gのAgNO3(6.8gのAg)を、30cm3のDI H2Oに溶解させた。PdNO3の溶液を、銀の量に基づいて0.1%、0.5%又は1.0%のPdを有する最終溶液を形成する量で加えた。これら溶液の各々を用いて、上述の移動により、銀を含有する銅フレークを調製した。Pdをまったく含まない溶液も使用した。Pdを用いる移動反応により生成された銅フレークの上に、次いで上述の無電解反応を用いて追加の銀を堆積させた。その結果得られた銀被覆銅フレークを、次いでFESEM及びTGAにより分析した。
Claims (20)
- 銀で被覆された一又は複数の銅フレークを含み、銀が、銅の周囲の気密に閉じた金属シェル内に存在する、組成物。
- 堆積された層内の銀の粒子サイズが、電界放出走査型電子顕微鏡(FESEM)により測定して約40nm以下である、請求項1に記載の組成物。
- 堆積された層内の銀の粒子サイズが、電界放出走査型電子顕微鏡(FESEM)により測定して約15nm以下である、請求項1又は2に記載の組成物。
- シェル中に銀の約1重量%以下の量のパラジウムをさらに含む、請求項1から3のいずれか一項に記載の組成物。
- 気密に閉じた金属シェルが、100℃未満の温度において少なくとも365日の期間にわたり銅の酸化を制限する、請求項1から4のいずれか一項に記載の組成物。
- 銅フレークが、少なくとも200℃の温度に到達するまで酸化しない、請求項1から5のいずれか一項に記載の組成物。
- 気密に閉じた金属シェルが、250℃未満の温度において、コアフレークから銀シェルへの銅の移行を制限する、請求項1から6のいずれか一項に記載の組成物。
- 銅フレークを酸で処理して酸処理銅フレークを形成すること、酸処理銅フレークをポリアミンで処理してポリアミン処理銅フレークを形成すること、ポリアミン処理銅フレーク上に銀を堆積させて、銀堆積物を含む銅フレークを形成すること、及び銀堆積物を含む銅フレーク上に銀を堆積させることを含む、銀で被覆された銅フレークの製造方法。
- ポリアミン処理銅フレーク上に銀を堆積させて、銀堆積物を含む銅フレークを形成する工程が、電子移動によって実施される、請求項8に記載の方法。
- 銀堆積物を含む銅フレーク上に銀を堆積させる工程が、無電解めっきによって実施される、請求項8又は9に記載の方法。
- 無電解めっきによる、銀堆積物を含む銅フレーク上に銀を堆積させる工程が、銀ジアミン複合体を含む銀溶液を用いる、請求項10に記載の方法。
- 無電解めっきによる、銀堆積物を含む銅フレーク上に銀を堆積させる工程が、還元剤として糖を用いる、請求項10又は11に記載の方法。
- 糖がデキストロース又はグルコースである、請求項12に記載の方法。
- ポリアミンが、長鎖線状アミン又は短鎖長と長鎖長とを有する線状ポリアミンの混合物を含む、請求項8から13のいずれか一項に記載の方法。
- ポリアミンが、トリエチレンテトラミン(TETA)、テトラエチレンペンタミン(TEPA)、トリエチレンテトラミン(TETA)とエチレンジアミン(EDA)との混合物、ジエチレントリアミン(DETA)及びペンタエチレンヘキサミン(PEHA)のうちの少なくとも一を含む、請求項8から13のいずれか一項に記載の方法。
- ポリアミンが、ペンタエチレンヘキサミン(PEHA)又はトリエチレンテトラミン(TETA)とエチレンジアミン(EDA)との混合物である、請求項15に記載の方法。
- TETA/EDAの混合物の重量比が80/20である、請求項16に記載の方法。
- 銅フレークを酸で処理して酸処理銅フレークを形成する工程が、アルコール中で実施される、請求項8から17のいずれか一項に記載の方法。
- ポリアミン処理フレーク上に銀を堆積させる工程が、一又は複数の分散剤の存在下で実施される、請求項8から18のいずれか一項に記載の方法。
- 分散剤が、DAXAD 11D、アラビアゴム、ポリビニルピロリドン/PVP又はアルギン酸ナトリウムを含む、請求項19に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562101447P | 2015-01-09 | 2015-01-09 | |
US62/101,447 | 2015-01-09 | ||
PCT/US2016/012299 WO2016112081A1 (en) | 2015-01-09 | 2016-01-06 | Silver coated copper flakes and methods of their manufacture |
Publications (1)
Publication Number | Publication Date |
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JP2018509524A true JP2018509524A (ja) | 2018-04-05 |
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JP2017536565A Pending JP2018509524A (ja) | 2015-01-09 | 2016-01-06 | 銀被覆銅フレーク及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180264548A1 (ja) |
JP (1) | JP2018509524A (ja) |
KR (1) | KR20170102977A (ja) |
TW (1) | TW201641698A (ja) |
WO (1) | WO2016112081A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110927231B (zh) * | 2019-12-31 | 2022-08-19 | 嘉兴学院 | 一种离子色谱安培检测用银电极的处理方法 |
CN113913797A (zh) * | 2021-09-17 | 2022-01-11 | 金华职业技术学院 | 一种化学镀粉末烘干保护的方法 |
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CN102773475B (zh) * | 2012-07-31 | 2014-06-11 | 东南大学 | 一种导电浆料用抗氧化铜银复合粉及其制备方法 |
US9700940B2 (en) * | 2012-09-27 | 2017-07-11 | Lockheed Martin Corporation | Metal nanoparticles formed around a nucleus and scalable processes for producing same |
JP5785532B2 (ja) * | 2012-11-30 | 2015-09-30 | 三井金属鉱業株式会社 | 銀コート銅粉及びその製造方法 |
US20150176137A1 (en) * | 2013-12-20 | 2015-06-25 | University Of Connecticut | Methods for preparing substrate cored-metal layer shelled metal alloys |
KR20150145892A (ko) * | 2014-06-19 | 2015-12-31 | (주)바이오니아 | 은 코팅 구리 나노 와이어 및 이의 제조 방법 |
JPWO2016031860A1 (ja) * | 2014-08-28 | 2017-06-15 | 石原産業株式会社 | 金属質銅粒子及びその製造方法 |
EP3192597A4 (en) * | 2014-09-12 | 2018-06-06 | Sumitomo Metal Mining Co., Ltd. | Silver-coated copper powder, and conductive paste, conductive coating material and conductive sheet, each of which uses said silver-coated copper powder |
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2016
- 2016-01-06 WO PCT/US2016/012299 patent/WO2016112081A1/en active Application Filing
- 2016-01-06 JP JP2017536565A patent/JP2018509524A/ja active Pending
- 2016-01-06 US US15/542,174 patent/US20180264548A1/en not_active Abandoned
- 2016-01-06 KR KR1020177022158A patent/KR20170102977A/ko unknown
- 2016-01-08 TW TW105100601A patent/TW201641698A/zh unknown
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JPH03264678A (ja) * | 1990-03-15 | 1991-11-25 | Showa Denko Kk | 導電性ペースト用銅粉 |
JPH0480303A (ja) * | 1990-07-24 | 1992-03-13 | Mitsui Mining & Smelting Co Ltd | 銀被覆銅粉の製造方法 |
JPH10212501A (ja) * | 1997-01-28 | 1998-08-11 | Dowa Mining Co Ltd | 被覆粉体、銀被覆銅粉及びその製造方法、導電性ペースト並びに導電膜 |
JP2006161081A (ja) * | 2004-12-03 | 2006-06-22 | Dowa Mining Co Ltd | 銀被覆銅粉およびその製造方法並びに導電ペースト |
JP2007100155A (ja) * | 2005-10-03 | 2007-04-19 | Mitsui Mining & Smelting Co Ltd | 微粒銀粒子付着銀銅複合粉及びその微粒銀粒子付着銀銅複合粉製造方法 |
JP2010174311A (ja) * | 2009-01-28 | 2010-08-12 | Nippon Mining & Metals Co Ltd | 銀メッキ銅微粉及び銀メッキ銅微粉を用いて製造した導電ペースト並びに銀メッキ銅微粉の製造方法 |
CN101709461A (zh) * | 2009-11-06 | 2010-05-19 | 广东工业大学 | 一种铜粉置换化学镀银的方法 |
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KR20170102977A (ko) | 2017-09-12 |
US20180264548A1 (en) | 2018-09-20 |
TW201641698A (zh) | 2016-12-01 |
WO2016112081A1 (en) | 2016-07-14 |
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